High-temperature-resistant integrated circuit chip of mobile power supply
By adopting a multi-layer thermal conductivity structure in the mobile power integrated circuit chip, including the combination of thermally conductive aluminum plates and aluminum fin plates and thermally conductive copper plates, the problem of poor heat dissipation is solved, and efficient heat conduction and dissipation is achieved, protecting the chip structure.
Patent Information
- Application Number
- CN202422685210.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-11-05
AI Technical Summary
The existing mobile power supply has poor heat dissipation effect. A single heat dissipation structure such as simple aluminum plates or copper plates cannot effectively and quickly conduct and disperse the heat generated by the chip, resulting in local accumulation of heat.
A multi-layer thermal conductivity structure is adopted, including opening grooves at the bottom of the integrated chip, installing the first thermal conductivity aluminum plate and aluminum fin plate, combining the second thermal conductivity aluminum plate and thermal conductivity copper plate, enhancing the thermal conductivity effect through silicon grease, and setting grid holes on the thermal conductivity copper plate to enhance heat dissipation performance.
It improves the heat dissipation efficiency of the chip under high temperature conditions, maintains the temperature stability, reduces thermal stress, and protects the internal structure of the chip.
Smart Images
Figure CN223274273U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit chips, in particular to a high-temperature resistant mobile power integrated circuit chip. Background Art
[0002] In the use of mobile power supplies, the heat dissipation of internal integrated chips has always been a concern. Since integrated chips generate a lot of heat when working, if the heat cannot be dissipated in a timely and effective manner, the chip temperature will be too high.
[0003] What technologies are needed in practical applications:
[0004] In actual applications, chips require heat dissipation technologies such as heat conduction, heat convection, and heat radiation, such as the use of high thermal conductivity materials, air cooling and liquid cooling, to ensure that the chip temperature is appropriate.
[0005] It is necessary to have reasonable heat dissipation structure design technology, including optimizing the radiator structure and system-level heat dissipation layout to improve heat dissipation efficiency.
[0006] Thermal management and monitoring technologies are essential. Through temperature monitoring and heat dissipation strategy regulation, heat dissipation measures can be flexibly adjusted according to chip operating conditions.
[0007] Current mobile power supplies have poor heat dissipation effects. Some rely solely on a single heat dissipation structure, such as a simple aluminum or copper plate, which cannot quickly conduct and dissipate the heat generated by the chip, and heat easily accumulates locally. Utility Model Content
[0008] (1) Technical problems solved
[0009] In response to the shortcomings of the existing technology, the utility model provides a high-temperature resistant mobile power integrated circuit chip to solve the technical problem that the current mobile power supply has poor heat dissipation effect. Some rely only on a single heat dissipation structure, such as a simple aluminum plate or copper plate, which cannot quickly conduct and dissipate the heat generated by the chip, and the heat is easily accumulated locally.
[0010] (2) Technical solution
[0011] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:
[0012] A high-temperature resistant mobile power integrated circuit chip includes a power circuit board, an integrated chip is provided on the power circuit board, mounting pins are provided on both sides of the integrated chip, the mounting pins on both sides of the integrated chip are connected to the circuit on the power circuit board by welding, a groove is provided at the lower end of the integrated chip, a first heat-conducting aluminum plate is provided in the groove provided in the integrated chip, an aluminum fin plate is fixedly installed at the lower end of the first heat-conducting aluminum plate, and a second heat-conducting aluminum plate is fixedly installed at the lower end of the aluminum fin plate.
[0013] Preferably, silicone grease is provided between the first heat-conducting aluminum plate and the top of the groove opened by the integrated chip, a heat-conducting copper plate is fixedly installed in the groove opened by the integrated chip, and silicone grease is provided between the second heat-conducting aluminum plate and the heat-conducting copper plate.
[0014] Preferably, grid holes are provided on both side ends of the heat-conducting copper plate, and the shape of the heat-conducting copper plate is arc-shaped.
[0015] (3) Beneficial effects
[0016] 1. This novel design uses a groove opened at the bottom of the integrated chip and connects the first heat-conducting aluminum plate, the aluminum fin plate and the second heat-conducting aluminum plate, and then connects the second heat-conducting aluminum plate to the heat-conducting copper plate. This allows the integrated chip to initially dissipate its internal heat when in use, preventing all the heat from accumulating in one place and being unable to be discharged. The heat is then dissipated secondary through the heat-conducting copper plate, greatly improving the cooling efficiency of the integrated chip under high temperature conditions. Good heat dissipation can keep the chip temperature relatively stable, reduce the generation of thermal stress, and thus protect the internal structure of the chip.
[0017] 2. This new type of device adds silicone grease between the first heat-conducting aluminum plate and the integrated chip, and between the second heat-conducting aluminum plate and the heat-conducting copper plate, thereby improving the heat conduction effect between the first heat-conducting aluminum plate, the second heat-conducting aluminum plate and the integrated chip, and the heat-conducting copper plate, making it easier to transfer heat from the integrated chip to the heat-conducting copper plate, further improving the heat dissipation effect of the integrated chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.
[0019] Figure 1 It is a structural diagram of the entire utility model;
[0020] Figure 2 This is a structural diagram of the heat-conducting copper plate of the utility model;
[0021] Figure 3 This is a structural diagram of the second heat-conducting aluminum plate of the utility model;
[0022] Figure 4 This is a structural diagram of the first heat-conducting aluminum plate of the utility model.
[0023] Legend: 11. First thermally conductive aluminum plate; 12. Aluminum fin plate; 13. Second thermally conductive aluminum plate; 21. Thermally conductive copper plate; 22. Grid holes; 31. Integrated chip; 32. Mounting pins; 33. Power supply circuit board. DETAILED DESCRIPTION
[0024] The embodiments of the present application provide a high-temperature resistant mobile power integrated circuit chip, which effectively solves the technical problem that current mobile power supplies have poor heat dissipation effect. Some rely only on a single heat dissipation structure, such as a simple aluminum plate or copper plate, which cannot quickly conduct and dissipate the heat generated by the chip, and the heat is easily accumulated locally.
[0025] Example
[0026] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the technical solution in the embodiments of the present application is to effectively solve the technical problem that the heat dissipation effect of the current mobile power supply is poor. Some rely only on a single heat dissipation structure, such as a simple aluminum plate or copper plate, which cannot quickly conduct and dissipate the heat generated by the chip, and the heat is easily accumulated locally. The overall idea is as follows:
[0027] In response to the problems existing in the prior art, the present invention provides a high-temperature resistant mobile power integrated circuit chip, including a power circuit board 33, an integrated chip 31 is provided on the power circuit board 33, and mounting pins 32 are provided on both sides of the integrated chip 31. The mounting pins 32 on both sides of the integrated chip 31 are connected to the circuit on the power circuit board 33 by welding, a groove is provided at the lower end of the integrated chip 31, a first heat-conducting aluminum plate 11 is provided in the groove provided by the integrated chip 31, an aluminum fin plate 12 is fixedly installed at the lower end of the first heat-conducting aluminum plate 11, and a second heat-conducting aluminum plate 13 is fixedly installed at the lower end of the aluminum fin plate 12. The integrated chip 31 in the device is installed in a mobile power supply and will generate high temperature during use. When the integrated chip 31 is in use, the heat emitted from the inside will be conducted to the first heat-conducting aluminum plate 11 at its lower end. Since silicone grease is provided between the first heat-conducting aluminum plate 11 and the integrated chip 31, the heat conduction effect is better. At this time, the heat is conducted through the first heat-conducting aluminum plate 11 and the second heat-conducting aluminum plate 13. The aluminum fins 12 between the plates 13 can initially dissipate heat. Since there are a large number of aluminum fins 12 and there are large gaps between each aluminum fin 12, the heat can be initially dissipated from each aluminum fin 12 and then dissipated from both sides of the integrated chip 31. The heat that is not dissipated will continue to be conducted to the second thermally conductive aluminum plate 13 through the aluminum fins 12. At this time, the silicone grease between the second thermally conductive aluminum plate 13 and the thermally conductive copper plate 21 can allow the heat on the second thermally conductive aluminum plate 13 to be quickly transferred to the thermally conductive copper plate 21. At this time, due to the characteristics of the material of the thermally conductive copper plate 21, it can quickly conduct heat from the higher temperature area (which can be regarded as the middle heat absorption part) to the lower temperature area (the position of the grid holes 22 on both sides of the thermally conductive copper plate 21). Since the number of grid holes 22 opened on the thermally conductive copper plate 21 is large, multiple heat dissipating fins are formed, so that the remaining heat can be dissipated from the integrated chip 31, thereby improving the heat dissipation performance of the integrated chip 31.
[0028] Silicone grease is provided between the first heat-conducting aluminum plate 11 and the top of the groove opened by the integrated chip 31. A heat-conducting copper plate 21 is fixedly installed in the groove opened by the integrated chip 31. Silicone grease is provided between the second heat-conducting aluminum plate 13 and the heat-conducting copper plate 21. Grid holes 22 are provided on both sides of the heat-conducting copper plate 21. The shape of the heat-conducting copper plate 21 is arc-shaped. The present invention connects the second heat-conducting aluminum plate 13 to the heat-conducting copper plate 21 through the groove opened at the bottom of the integrated chip 31, the first heat-conducting aluminum plate 11, the aluminum fin plate 12 and the second heat-conducting aluminum plate 13, so that the integrated chip 31 can initially dissipate the heat inside it when in use, thereby preventing all the heat from accumulating in one place and being unable to be discharged. Then, secondary heat dissipation is performed through the thermal copper plate 21, which greatly improves the cooling efficiency of the integrated chip 31 under high temperature conditions. Good heat dissipation can keep the chip temperature relatively stable, reduce the generation of thermal stress, and thus protect the internal structure of the chip. The new type adds silicone grease between the first thermal aluminum plate 11 and the integrated chip 31 and between the second thermal aluminum plate 13 and the thermal copper plate 21, so that the thermal conductivity between the first thermal aluminum plate 11, the second thermal aluminum plate 13 and the integrated chip 31, and the thermal copper plate 21 is better, and the heat on the integrated chip 31 is more easily transferred to the thermal copper plate 21, further improving the heat dissipation effect of the integrated chip 31.
[0029] Working principle: The integrated chip 31 in the device is installed in the mobile power supply. When in use, high temperature will occur. When the integrated chip 31 is in use, the heat emitted from its interior will be conducted to the first heat-conducting aluminum plate 11 at its lower end. Since silicone grease is provided between the first heat-conducting aluminum plate 11 and the integrated chip 31, the heat conduction effect is better. At this time, the heat can be initially dissipated through the aluminum fins 12 between the first heat-conducting aluminum plate 11 and the second heat-conducting aluminum plate 13. Since there are a large number of aluminum fins 12 and there are large gaps between each aluminum fin 12, the heat can be initially dissipated. The heat is dissipated from each aluminum fin 12 and then dissipated from both sides of the integrated chip 31. The heat that is not dissipated will continue to be conducted to the second heat-conducting aluminum plate 13 through the aluminum fin 12. At this time, the silicone grease between the second heat-conducting aluminum plate 13 and the heat-conducting copper plate 21 can allow the heat on the second heat-conducting aluminum plate 13 to be quickly transferred to the heat-conducting copper plate 21. At this time, due to the characteristics of the material of the heat-conducting copper plate 21, it can quickly conduct heat from the area with higher temperature (which can be regarded as the middle heat-absorbing part) to the area with lower temperature (the grid holes 22 are opened on both sides of the heat-conducting copper plate 21). The number of grid holes 22 opened in 1 is large, forming multiple heat dissipation fins, so that the remaining heat can be dissipated from the integrated chip 31, thereby improving the heat dissipation performance of the integrated chip 31. The present invention uses the grooves opened at the bottom of the integrated chip 31 and the first heat-conducting aluminum plate 11, the aluminum fin plate 12 and the second heat-conducting aluminum plate 13, and then connects the second heat-conducting aluminum plate 13 to the heat-conducting copper plate 21, so that when the integrated chip 31 is in use, the internal heat can be initially dissipated to avoid all the heat accumulating in one place and being unable to be discharged, and then the heat is dissipated again through the heat-conducting copper plate 21, which greatly improves the heat dissipation performance. The efficiency of cooling the integrated chip 31 under high temperature conditions is improved. Good heat dissipation can keep the chip temperature relatively stable, reduce the generation of thermal stress, and thus protect the internal structure of the chip. The new type adds silicone grease between the first thermally conductive aluminum plate 11 and the integrated chip 31 and between the second thermally conductive aluminum plate 13 and the thermally conductive copper plate 21, so that the thermal conductivity between the first thermally conductive aluminum plate 11, the second thermally conductive aluminum plate 13 and the integrated chip 31 and the thermally conductive copper plate 21 is better, and the heat on the integrated chip 31 is more easily transferred to the thermally conductive copper plate 21, thereby further improving the heat dissipation effect of the integrated chip 31.
[0030] Finally, it should be noted that the above embodiments are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to enumerate all embodiments here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.
Claims
1. A high-temperature resistant mobile power integrated circuit chip, comprising a power circuit board (33), characterized in that: An integrated chip (31) is provided on the power circuit board (33), and mounting pins (32) are provided on both sides of the integrated chip (31), and the mounting pins (32) on both sides of the integrated chip (31) are connected to the circuit on the power circuit board (33) by welding; A groove is provided at the lower end of the integrated chip (31), a first heat-conducting aluminum plate (11) is provided in the groove provided in the integrated chip (31), an aluminum fin plate (12) is fixedly installed at the lower end of the first heat-conducting aluminum plate (11), and a second heat-conducting aluminum plate (13) is fixedly installed at the lower end of the aluminum fin plate (12).
2. The high-temperature resistant mobile power integrated circuit chip according to claim 1, characterized in that: Silicone grease is provided between the first heat-conducting aluminum plate (11) and the top of the groove formed by the integrated chip (31).
3. The high-temperature resistant mobile power integrated circuit chip according to claim 2, characterized in that: A heat-conducting copper plate (21) is fixedly installed in the groove formed in the integrated chip (31).
4. The high-temperature resistant mobile power integrated circuit chip according to claim 3, characterized in that: Silicone grease is provided between the second heat-conducting aluminum plate (13) and the heat-conducting copper plate (21).
5. The high-temperature resistant mobile power integrated circuit chip according to claim 4, characterized in that: Grid holes (22) are provided on both side ends of the heat-conducting copper plate (21).
6. The high-temperature resistant mobile power integrated circuit chip according to claim 5, characterized in that: The heat-conducting copper plate (21) is in an arc shape.