Tin plating jig beneficial to improving FPC double-face welding efficiency

Abstract

The utility model relates to a tin plating jig helpful for improving FPC double-sided welding efficiency, which comprises a bottom plate and a carrier plate, the middle part of the upper surface of the bottom plate is a positioning area for placing the carrier plate, an FPC whole plate is fixed on the carrier plate, and the FPC whole plate is provided with a plurality of FPC single sheets and a plurality of product positioning holes which are distributed side by side; the upper surface of each FPC single sheet is provided with a DIP part, the lower surface of each FPC single sheet is provided with a reinforcing sheet at a relative position, and a group of pins are densely distributed on each reinforcing sheet; the carrier plate is provided with carrier plate positioning holes in one-to-one correspondence with the product positioning holes in position and receding holes corresponding to the reinforcing pieces, positioning pins penetrating through the carrier plate positioning holes and the product positioning holes at the same time are arranged in the positioning area, and each receding hole only surrounds one set of pins. According to the jig, the reinforcing sheet and the DIP part on the FPC can be subjected to tin brushing and synchronous installation at the same time and then pass through the same welding furnace, and a reflow soldering furnace and a wave soldering furnace are not needed, so that the equipment is saved, the jig is simplified, the operation is convenient, the working time is shortened, and the product quality can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive connection, in particular to a tin-coated jig which helps to improve the double-sided welding efficiency of an FPC. Background Art

[0002] With the continuous advancement of technology, electronic products have gradually occupied the entire lifestyle. Small and exquisite appearance has become an inevitable trend of development. In order to make the products more accurate and exquisite, the precision requirements of assembly are essential. The precision of electronic mounting directly affects the assembly requirements of customers.

[0003] Typically, FPCs (flexible printed circuits) are soldered with a reinforcement sheet and DIP components. The reinforcement sheet is located on the back of the FPC, while the DIP components are located on the front of the FPC. These components are soldered separately. This means that the reinforcement sheet is first placed on the SMT machine, then soldered in a reflow oven. After the initial soldering process is complete, the DIP process begins, where the DIP components are installed and then soldered in a wave soldering oven. This method has the following drawbacks:

[0004] 1. Traditional welding process requires two different sets of equipment, which is very costly.

[0005] 2. Normal tinning is done on the gold surface. It is necessary to turn the product with the tin side facing down and put it into the carrier avoidance slot, and then insert the DIP parts on it, which increases the operation process and wastes working hours;

[0006] 3. The two welding methods require the development of corresponding aluminum plate carriers and DIP parts furnace carriers, which increases the cost of the fixtures;

[0007] 4. FPC is heated for a long time, which not only increases energy consumption but also has an adverse effect on product quality.

[0008] Therefore, it is necessary to improve the fixture structure to solve the above problems. Summary of the Invention

[0009] The main purpose of the utility model is to provide a tinning jig, which can simplify the tinning operation and help improve the double-sided soldering efficiency of FPC.

[0010] The utility model achieves the above-mentioned purpose through the following technical solutions: a tin-coated jig that helps to improve the double-sided welding efficiency of FPC, comprising a base plate and a carrier plate, the middle part of the upper surface of the base plate is a positioning area for placing the carrier plate, the entire FPC board is fixed on the carrier plate, and the entire FPC board has multiple FPC single pieces distributed side by side and multiple product positioning holes; the upper surface of each FPC single piece is provided with a DIP part, and the lower surface is provided with a reinforcement sheet at a relative position, and the reinforcement sheet is densely covered with a group of pins; the carrier plate is provided with carrier plate positioning holes corresponding to the positions of the product positioning holes and avoidance holes corresponding to each reinforcement sheet, the positioning area is provided with positioning pins that pass through the carrier plate positioning holes and the product positioning holes at the same time, and each avoidance hole only surrounds one group of pins.

[0011] Specifically, an L-shaped limiting protrusion is provided at each of the four corners of the upper surface of the bottom plate, and the positioning area is formed by being surrounded by the four L-shaped limiting protrusions.

[0012] Specifically, separation notches are provided on both sides of the bottom plate, and the innermost points of the separation notches are located within the lower projection range of the carrier plate.

[0013] Specifically, the upper surface of the carrier plate is provided with an avoidance groove corresponding to the position of the reinforcing sheet, the depth of the avoidance groove is not less than the thickness of the reinforcing sheet, and the avoidance holes are all located in the area of ​​the avoidance groove.

[0014] Specifically, long double-sided adhesive grooves are provided on both sides of the upper surface of the carrier board, and the long double-sided adhesive grooves are located within the lower projection range of the entire FPC board when it is in place.

[0015] Furthermore, a separation groove is provided on one side of the upper surface of the carrier board, and the separation groove extends inwardly to the bottom of the entire FPC board.

[0016] Specifically, a plurality of heat dissipation holes are provided in the middle of the carrier board.

[0017] The beneficial effects of the technical solution of this utility model are:

[0018] This fixture allows the reinforcing sheet and DIP parts on the FPC to be tinned and installed synchronously at the same time, and then pass through the same soldering furnace without the need for a separate reflow furnace and wave soldering furnace. This not only saves equipment and simplifies the fixture, but also facilitates operation, shortens working hours, and ensures product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 An exploded view of the tinning fixture and FPC in the embodiment;

[0020] Figure 2 A top view of the tinning fixture and FPC in the embodiment;

[0021] Figure 3This is a bottom view of the inspection board and FPC single piece;

[0022] Figure 4 This is a partial cross-sectional view of the carrier board and the FPC chip near the avoidance hole.

[0023] The numbers in the figure represent:

[0024] 11- bottom plate, 111- L-shaped limiting protrusion, 112- positioning pin, 113- separation notch;

[0025] 12-carrier board, 121-carrier board positioning hole, 122-avoidance hole, 123-avoidance groove, 124-long groove for double-sided tape, 125-long hole for double-sided tape, 126-heat dissipation hole;

[0026] 2-FPC whole board, 21-FPC single piece, 211-DIP parts, 212-reinforcement sheet, 213-pin, 22-product positioning hole. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below with reference to specific embodiments.

[0028] Example:

[0029] like Figures 1 to 4 As shown, the utility model is a tin-coated jig that helps to improve the double-sided welding efficiency of FPC, including a base plate 11 and a carrier plate 12. The middle part of the upper surface of the base plate 11 is a positioning area for placing the carrier plate 12. The FPC whole board 2 is fixed on the carrier plate 12. The FPC whole board 2 has multiple FPC single pieces 21 distributed side by side and multiple product positioning holes 22; the upper surface of each FPC single piece 21 is provided with a DIP part 211, and the lower surface is provided with a reinforcing piece 212 at a relative position, and the reinforcing piece 212 is densely covered with a group of pins 213; the carrier plate 12 is provided with carrier plate positioning holes 121 corresponding to the positions of the product positioning holes 22 and avoidance holes 122 corresponding to each reinforcing piece 212, and the positioning area is provided with positioning pins 112 that pass through the carrier plate positioning holes 121 and the product positioning holes 22 at the same time, and each avoidance hole 122 only surrounds a group of pins 11.

[0030] The base plate 11, carrier plate 12, and FPC board 2 are stacked from bottom to top. The positioning pins 112 are thin cylindrical bodies whose dimensions match the product positioning holes 22 and carrier plate positioning holes 121, so they can help the carrier plate 12 and the FPC board 2 to be positioned relative to each other in the horizontal plane. This fixture does not have a cover plate, so the top of the FPC board 2 is open, and the upper surfaces of all DIP components 211 are side by side and exposed, while only the pins 11 are exposed from the avoidance holes 122 below. The pins 11 in this embodiment are arranged in two rows, with each row having multiple pins 11, so the avoidance holes 122 are also long hole structures. When the alignment is completed, all DIP components 211 can be directly coated with solder paste from above, and a space for solder paste to be filled is formed between the reinforcement plate 212 and the avoidance holes 122. When the solder paste from below is filled into this space, a thin layer will adhere to the pins 11, and the excess solder paste will flow away under the action of gravity. In other words, the upper and lower sides of the FPC sheet 21 can be assembled simultaneously, and then passed through the soldering furnace together to complete the soldering of both sides. This jig allows the FPC reinforcement sheet and DIP components to be soldered and installed simultaneously, and then passed through the same soldering furnace, eliminating the need for separate reflow and wave soldering furnaces. This not only saves equipment and simplifies the jig, but also facilitates operation, shortens working hours, and ensures product quality.

[0031] like Figure 1 and Figure 2 As shown, an L-shaped limiting protrusion 111 is provided at each of the four corners of the upper surface of the bottom plate 11 , and the positioning area is formed by being surrounded by the four L-shaped limiting protrusions 111 .

[0032] Because each positioning pin 112 is relatively thin, it is easy to be knocked crooked if it deviates too much from the avoidance hole 122 at the beginning. The L-shaped limiting protrusion 111 has the function of initially positioning the four corners of the carrier board 12, so that the positioning pin 112 is easier to find the position of the avoidance hole 122, ensuring a longer service life.

[0033] like Figure 1 and Figure 2 As shown, separation notches 113 are provided on both sides of the bottom plate 11 , and the innermost points of the separation notches 113 are located within the lower projection range of the carrier plate 12 .

[0034] The base plate 11 is only useful during the positioning phase of the carrier board 12 and the FPC board 2. Once the carrier board 12 and the FPC board 2 are secured, the base plate 11 needs to be separated from the carrier board 12. Separation notches 12 facilitate separation of the base plate 11 and carrier board 12. To do this, place your fingers in the two separation notches 113, grip the opposing sides of the carrier board 12, and then lift upward.

[0035] like Figures 1 to 4As shown, the upper surface of the carrier plate 12 is provided with an avoidance groove 123 corresponding to the position of the reinforcing sheet 212 . The depth of the avoidance groove 123 is not less than the thickness of the reinforcing sheet 212 , and the avoidance holes 122 are all located in the area of ​​the avoidance groove 123 .

[0036] Because the FPC sheets 21 are arranged side by side on the entire FPC board 2, all the reinforcing sheets 212 are also positioned side by side. To ensure that the flexible portion of the FPC sheets 21 can be in close contact with the top surface of the carrier board 12, space must be left for the reinforcing sheets 212. Therefore, the avoidance groove 123 is a strip-shaped recessed area, which not only accommodates the reinforcing sheets 212 but also facilitates processing.

[0037] like Figure 1 As shown, long double-sided adhesive grooves 124 are provided on both sides of the upper surface of the carrier board 12 , and the long double-sided adhesive grooves are located within the lower projection range when the FPC board 2 is in place.

[0038] When applying solder paste to the lower surface, the FPC board 2 needs to maintain its relative position to the carrier board 12, so the FPC board 2 needs to be attached to the carrier board 12 using double-sided tape. The double-sided tape has a certain thickness. To ensure that the flexible portion of the FPC board 2 is in close contact with the upper surface of the carrier board 12, the double-sided tape must be located within the double-sided tape attachment slot 124, with the upper surface of the double-sided tape being substantially flush with the upper surface of the carrier board 12. This allows the FPC board 2 to be laid out more smoothly.

[0039] like Figure 1 As shown, a separation groove 125 is provided on one side of the upper surface of the carrier board 12 , and the separation groove 125 extends inwardly to the bottom of the FPC board 2 .

[0040] The separation groove 125 enables a worker's fingernail to move under the edge of the FPC board 2 , thereby facilitating the peeling of the FPC board 2 adhered by the double-sided tape from the front surface of the carrier board 12 .

[0041] like Figure 1 As shown, a plurality of heat dissipation holes 126 are defined in the middle of the carrier board 12 .

[0042] The heat dissipation holes 126 can facilitate hot air to pass through the carrier board 12 and blow to the lower surface of the FPC board 2, so that the FPC board 2 is heated evenly, which is beneficial to improving the welding effect.

[0043] The above descriptions are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A tinning fixture that helps improve the efficiency of double-sided soldering of FPC, characterized by: It includes a base plate and a carrier plate. The middle part of the upper surface of the base plate is a positioning area for placing the carrier plate. The FPC board is fixed on the carrier plate. The FPC board has multiple FPC sheets distributed side by side and multiple product positioning holes. The upper surface of each FPC sheet is provided with a DIP part, and the lower surface is provided with a reinforcement sheet at a relative position. The reinforcement sheet is densely covered with a group of pins. The carrier plate is provided with carrier plate positioning holes corresponding to the positions of the product positioning holes and avoidance holes corresponding to each reinforcement sheet. The positioning area is provided with positioning pins that pass through the carrier plate positioning holes and the product positioning holes at the same time, and each avoidance hole only surrounds one group of pins.

2. The tinning fixture for improving the double-sided soldering efficiency of FPC according to claim 1, characterized in that: An L-shaped limiting protrusion is respectively provided at the four corners of the upper surface of the bottom plate, and the positioning area is formed by being surrounded by the four L-shaped limiting protrusions.

3. The tinning fixture for improving double-sided soldering efficiency of FPC according to claim 1, characterized in that: Separation notches are provided on both sides of the bottom plate, and the innermost points of the separation notches are located within the lower projection range of the carrier plate.

4. The tinning fixture for improving the double-sided soldering efficiency of FPC according to claim 1, characterized in that: Double-sided adhesive tape grooves are provided on both sides of the upper surface of the carrier board, and the double-sided adhesive tape grooves are located within the lower projection range of the FPC when the entire board is in place.

5. The tinning fixture for improving the double-sided soldering efficiency of FPC according to claim 4, characterized in that: A separation groove is provided on one side of the upper surface of the carrier board, and the separation groove extends inwardly to the bottom of the FPC board.

6. The tinning fixture for improving the double-sided soldering efficiency of FPC according to claim 1, characterized in that: A plurality of heat dissipation holes are provided in the middle of the carrier board.

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