Heat dissipation structure, functional module and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure, a functional module and electronic equipment, the heat dissipation structure comprises a shell, a capillary part, a supporting part and a thermal shrinkage and cold expansion part, and the shell is provided with an evaporation surface and a condensation surface which are arranged back to back. Wherein the capillary part is located between the evaporation surface and the condensation surface, and a condensation cavity is defined by the capillary part and the condensation surface. The supporting part is located in the condensation cavity and connected with the capillary part and the condensation face. And the thermal shrinkage and cold expansion part is connected with the outer side of the supporting part. The heat dissipation effect can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, a functional module and an electronic device. Background Art

[0002] A heat sink is a structure used to conduct heat. It is generally used to conduct the heat generated by functional modules such as the central processing unit to other locations to achieve the function of heat dissipation.

[0003] A heat sink typically consists of an evaporator, a condenser, and an adiabatic section. The condensate at the evaporator absorbs heat from the functional modules and evaporates to form steam. The steam then flows through the adiabatic section into the condenser, where it condenses to form liquid. This liquid is then drawn back through the adiabatic section to the evaporator, creating a cooling effect.

[0004] In the related art, the space for steam circulation in the insulation section is small, which reduces the heat dissipation effect. Utility Model Content

[0005] In view of this, the present application provides a heat dissipation structure, a functional module and an electronic device to improve the heat dissipation effect.

[0006] Specifically, the following technical solutions are included:

[0007] The first aspect of the present application provides a heat dissipation structure, comprising a housing, a capillary portion, a support portion, and a thermally shrinkable and thermally expanded portion, wherein the housing has an evaporation surface and a condensation surface disposed opposite to each other.

[0008] The capillary portion is located between the evaporation surface and the condensation surface, and forms a condensation cavity with the condensation surface.

[0009] The supporting portion is located in the condensation chamber and connects the capillary portion and the condensation surface.

[0010] The thermally shrinkable and thermally expandable portion is connected to the outer side of the supporting portion.

[0011] Optionally, the thermally shrinkable and thermally expanding portion extends along the circumference of the support portion.

[0012] Optionally, the support portion is cylindrical, one end of the support portion is connected to the capillary portion, and the other end of the support portion is connected to the condensation surface, and the diameter of the support portion ranges from 0.3 to 0.5 mm.

[0013] Optionally, the thermally shrinkable and cold-expandable portion is annular, the support portion is located inside the thermally shrinkable and cold-expandable portion, and the diameter of the thermally shrinkable and cold-expandable portion ranges from 0.8 to 1.2 mm.

[0014] Optionally, the capillary portion has capillary pores, and the capillary pores penetrate the capillary portion along the arrangement direction of the evaporation surface and the condensation surface, and are communicated with the condensation chamber.

[0015] Optionally, the material of the thermally shrinkable and thermally expandable portion includes gallium.

[0016] Optionally, there are multiple supporting parts, there are multiple thermally shrinkable and thermally expandable parts, and at least one thermally shrinkable and thermally expandable part is connected to the outer side of at least one supporting part.

[0017] Optionally, the housing includes a shell and a cover plate, the shell has the condensation surface, the cover plate has the evaporation surface, and a receiving cavity is formed between the shell and the cover plate, and the capillary part, the supporting part and the thermal shrinkage and thermal expansion part are all located in the receiving cavity.

[0018] Optionally, the shell and the support portion are integrally formed.

[0019] A second aspect of the present application provides a functional module, which includes a heat source and a heat dissipation structure as described in the above technical solution, wherein the heat source is located on a side of the evaporation surface away from the capillary portion.

[0020] A third aspect of the present application provides an electronic device, which includes the functional module described in the above technical solution.

[0021] The beneficial effects of the technical solution provided by the embodiment of the present application include at least the following: the evaporation surface can be in contact with the heat-generating component, so that the condensate located in the shell is evaporated by the heat to form steam, and enters the condensation chamber through the capillary portion. The steam in the condensation chamber is cooled and condensed to form liquid, and under the action of the capillary portion, it approaches the evaporation surface, and heat is dissipated in this cycle. The support portion connects the capillary portion and the condensation surface, which can support the condensation chamber and reduce the deformation of the condensation chamber due to squeezing. The thermally shrinkable and cold-expandable portion is connected to the outer side of the support portion, which is beneficial to improving the supporting effect of the support portion. The thermally shrinkable and cold-expandable portion can change its volume with the heat dissipation effect of the condensate, and then adjust the volume of the condensation chamber, so that the heat dissipation structure of the present application can be adapted to actual working requirements and improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 An exploded schematic diagram of a heat dissipation structure provided in an embodiment of the present application;

[0024] Figure 2 A cross-sectional schematic diagram of a functional module provided in an embodiment of the present application.

[0025] The reference numerals in the figures represent:

[0026] 100, accommodating cavity;

[0027] 1. Shell; 11. Housing; 12. Cover; 111. Evaporation surface; 112. Condensation surface; 101. Condensation chamber;

[0028] 2. capillary part; 201. capillary pores;

[0029] 3. Support part;

[0030] 4. Thermal contraction and thermal expansion part;

[0031] 5. Heat source.

[0032] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] The directional nouns involved in the embodiments of this application, such as "upper", "lower", "side", etc., are generally expressed in the form of Figure 1 The relative relationships shown in the figure are used as a reference, and these directional terms are used only to more clearly describe the relationship between structures, not to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "up" and "down" may be interchangeable.

[0035] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those skilled in the art.

[0036] In order to make the technical solutions and advantages of the present application clearer, the implementation methods of the present application will be described in further detail below with reference to the accompanying drawings.

[0037] The first aspect of the present application provides a heat dissipation structure, such as Figure 1 and Figure 2As shown, the heat dissipation structure includes a housing 1, a capillary portion 2, a support portion 3 and a thermally shrinkable and thermally expanded portion 4. The housing 1 has an evaporation surface 111 and a condensation surface 112 that are arranged in opposite directions.

[0038] The capillary portion 2 is located between the evaporation surface 111 and the condensation surface 112 , and forms a condensation chamber 101 with the condensation surface 112 .

[0039] The supporting portion 3 is located in the condensation chamber 101 and connects the capillary portion 2 and the condensation surface 112 .

[0040] The thermally shrinkable and thermally expanding portion 4 is connected to the outer side of the supporting portion 3 .

[0041] It is understandable that the evaporation surface 111 can be in contact with the heat-generating components, so that the condensate located in the housing 1 is evaporated by the heat to form steam, and enters the condensation chamber 101 through the capillary portion 2. The steam in the condensation chamber 101 is cooled and condensed to form liquid, and under the action of the capillary portion 2, it approaches the evaporation surface 111, and heat is dissipated in this cycle. The support portion 3 connects the capillary portion 2 and the condensation surface 112, which can support the condensation chamber 101 and reduce the situation where the condensation chamber 101 is squeezed and deformed. The heat shrinkage and cold expansion portion 4 is connected to the outside of the support portion 3, which is conducive to improving the supporting effect of the support portion 3. The heat shrinkage and cold expansion portion 4 can change its volume with the heat dissipation effect of the condensate, and then adjust the volume of the condensation chamber 101, so that the heat dissipation structure of the present application can be adapted to actual working requirements and improve the heat dissipation effect.

[0042] In this embodiment of the present application, the housing 1 is used to protect and accommodate the capillary portion 2, the support portion 3, and the thermally contracting and thermally expanding portion 4. The housing 1 can be made of a thermally conductive metal such as copper or aluminum, or an alloy containing a thermally conductive metal. The evaporation surface 111 and the condensation surface 112 of the housing 1 can be flat or curved.

[0043] In the embodiment of the present application, the capillary portion 2 achieves a circulating heat dissipation effect by causing the condensed liquid to move closer to the evaporation surface 111 through capillary action. The capillary portion 2 can be connected to the housing 1 by bonding, welding, etc., and remains located between the evaporation surface 111 and the condensation surface 112.

[0044] In the embodiment of the present application, the support portion 3 is used to maintain the volume and shape of the condensation chamber 101, which is conducive to maintaining the heat dissipation effect of the heat dissipation structure of the present application. In the embodiment of the present application, the support portion 3 can be integrally formed with a portion of the housing 1. This helps to improve the connection performance between the support portion 3 and the housing 1, thereby improving the support effect. The support portion 3 and the capillary portion 2 can be connected by abutment, bonding, etc.

[0045] In the embodiment of the present application, the thermally shrinkable and cold-expandable part 4 may refer to a component whose volume shrinks when heated and increases when cooled. The thermally shrinkable and cold-expandable part 4 can achieve the effect of thermally shrinking and cold-expanding by its own material properties. When the evaporation surface 111 is heated, the condensate in the outer shell 1 evaporates to generate steam. The steam enters the condensation chamber 101 through the capillary portion 2, causing the thermally shrinkable and cold-expandable part 4 to shrink in volume due to the heat, and the volume of the condensation chamber 101 increases. This can buffer the sudden change in air pressure caused by the steam entering the condensation chamber 101, while helping to increase the steam flow rate, promote steam circulation and improve the heat dissipation effect. When the evaporation surface 111 is cooled, the temperature of the condensation chamber 101 drops. At this time, the volume of the thermally shrinkable and cold-expandable part 4 expands, the volume of the condensation chamber 101 decreases, the steam flow rate decreases, and the internal air pressure is gradually balanced to achieve a suitable heat dissipation effect.

[0046] In the embodiment of the present application, the thermally shrinkable and cold-expandable portion 4 can also be connected to the outer side of the support portion 3 to improve the structural strength of the support portion 3 and provide auxiliary support for the support portion 3. The thermally shrinkable and cold-expandable portion 4 can be connected to the support portion 3 by bonding using its own material properties.

[0047] In the embodiment of the present application, a cavity can be formed between the capillary portion 2 and the evaporation surface 111. The cavity can accommodate condensed liquid that enters the cavity due to capillary action, and the condensed liquid can be reused to achieve a heat dissipation effect.

[0048] In the embodiment of the present application, the capillary portion 2 may be attached to the housing 1 to help the condensed liquid approach the evaporation surface 111 through capillary action.

[0049] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the thermally shrinkable and cold-expandable portion 4 extends along the circumferential direction of the support portion 3 .

[0050] It can be understood that the thermally shrinkable and thermally expandable portions 4 extending along the circumference of the support portion 3 can be formed at multiple positions of the support portion 3 , which is beneficial for improving the support stability of the support portion 3 .

[0051] In the embodiment of the present application, the thermally shrinkable and thermally expandable portion 4 completely wraps the support portion 3 , and may also wrap a portion of the support portion 3 .

[0052] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the support portion 3 is cylindrical, one end of the support portion 3 is connected to the capillary portion 2, and the other end of the support portion 3 is connected to the condensation surface 112. The diameter of the support portion 3 ranges from 0.3 to 0.5 mm.

[0053] It can be understood that the cylindrical support portion 3 has better supporting performance, can withstand the pressure from the housing 1 , and maintain the shape and volume of the condensation chamber 101 .

[0054] In an embodiment of the present application, the diameter of the support portion 3 may be 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.37 mm, 0.38 mm, 0.39 mm, 0.40 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.47 mm, 0.48 mm, 0.49 mm or 0.5 mm, or other values ​​between 0.3 and 0.5 mm.

[0055] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the thermal shrinkage and cold expansion portion 4 is annular, the support portion 3 is located inside the thermal shrinkage and cold expansion portion 4, and the diameter of the thermal shrinkage and cold expansion portion 4 ranges from 0.8 to 1.2 mm.

[0056] It can be understood that the annular heat shrinkage and cold expansion portion 4 can form a stable support for the support portion 3, thereby improving the supporting effect of the support portion 3.

[0057] In the embodiment of the present application, the diameter of the thermally shrinkable and cold-expandable portion 4 ranges from 0.8 mm, 0.82 mm, 0.84 mm, 0.86 mm, 0.88 mm, 0.90 mm, 0.92 mm, 0.94 mm, 0.96 mm, 0.98 mm, 0.1 mm, or 1.2 mm, and may also be other values ​​between 0.8 and 1.2 mm.

[0058] In the embodiment of the present application, the diameter of the thermally shrinkable and cold-expandable portion 4 may refer to the distance between two opposite poles.

[0059] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the capillary portion 2 has a capillary pore 201 , which penetrates the capillary portion 2 along the arrangement direction of the evaporation surface 111 and the condensation surface 112 and communicates with the condensation chamber 101 .

[0060] It is understood that the diameter of the capillary portion 2 is small enough to allow the condensate in the condensation chamber 101 to generate a capillary effect due to its own material properties. The capillary effect can move the condensate from the condensation chamber 101 to the evaporation surface 111, thereby achieving repeated heat dissipation.

[0061] In the embodiment of the present application, the capillary portion 2 may be a mesh structure, with at least 200 capillary pores 201 per square inch of the capillary portion 2, so as to enable the condensate to produce a capillary action.

[0062] In some embodiments of the present application, the material of the thermally shrinkable and thermally expandable portion 4 includes gallium.

[0063] As can be understood, gallium has a low melting point and is solid below 30°C. This facilitates the thermally shrinkable and cold-expandable portion 4 to assist the support portion 3 in supporting the condensation chamber 101, resulting in a larger volume. Within the temperature range of 30°C to 60°C, gallium is molten and has a small volume, allowing the thermally shrinkable and cold-expandable portion 4 to exhibit the "heat shrinks and cold expands" characteristic, which is suitable for its working state.

[0064] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, there are multiple support parts 3 and multiple thermally shrinkable and thermally expanding parts 4 , and at least one thermally shrinkable and thermally expanding part 4 is connected to the outer side of at least one support part 3 .

[0065] It is understandable that, according to the needs of the working environment, an appropriate number of thermally shrinkable and cold-expandable parts 4 and supporting parts 3 are arranged in the housing 1, thereby reducing the production cost of the heat dissipation structure of the present application.

[0066] In the embodiment of the present application, the number of the thermal expansion and contraction parts 4 and the number of the support parts 3 can both be 16, and each support part 3 has a thermal expansion and contraction part connected to its outer side.

[0067] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the housing 1 includes a shell 11 and a cover plate 12, the cover plate 12 has a condensation surface 112, and the shell 11 has an evaporation surface 111. The shell 11 and the cover plate 12 form an accommodating cavity 100, and the capillary part 2, the supporting part 3 and the thermal shrinkage and cold expansion part 4 are all located in the accommodating cavity 100.

[0068] It can be understood that the shell 11 uses the accommodating cavity 100 to accommodate the capillary part 2, the supporting part 3 and the thermal shrinkage and cold expansion part 4. The accommodating cavity 100 is also conducive to the outer shell 1 forming a sealed condensation cavity 101, reducing the leakage of the condensate in the condensation cavity 101.

[0069] In the implementation of this application, the shell 11 and the cover plate 12 can be connected by welding, bonding, etc.

[0070] In some embodiments of the present application, the housing 11 and the support portion 3 are integrally formed.

[0071] It is understandable that a stable connection can be formed between the integrally formed support portion 3 and the shell 11 , so as to improve the supporting effect of the support portion 3 on the condensing chamber 101 .

[0072] In the embodiment of the present application, the support portion 3 can be etched on the substrate, and the remaining portion of the substrate serves as the shell 11 , thereby achieving integral molding of the shell 11 and the support portion 3 .

[0073] The second aspect of the present application provides a functional module, such as Figure 2 As shown, the functional module includes a heat source 5 and the heat dissipation structure as described in the above embodiment. The heat source 5 is located on the side of the evaporation surface 111 away from the capillary portion 2.

[0074] It can be understood that due to the adoption of the heat dissipation structure of the above embodiment, the functional module of the present application has the same technical effect as the above embodiment, which will not be repeated here.

[0075] In the embodiment of the present application, the heat source 5 can be a heat-generating component such as a CPU or a GPU.

[0076] A third aspect of the present application provides an electronic device, which includes the functional module as described in the above embodiment.

[0077] It can be understood that due to the adoption of the functional modules of the above embodiments, the electronic device of the present application has the same technical effects as the above embodiments, which will not be described in detail here.

[0078] In the embodiment of the present application, the electronic device may be a smart phone, a tablet computer, or the like.

[0079] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0080] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the present invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only.

[0081] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure comprises a housing (1), a capillary portion (2), a support portion (3), and a thermally shrinkable and thermally expanded portion (4); the housing (1) has an evaporation surface (111) and a condensation surface (112) disposed opposite to each other, wherein: The capillary portion (2) is located between the evaporation surface (111) and the condensation surface (112), and forms a condensation cavity (101) with the condensation surface (112); The supporting portion (3) is located in the condensation chamber (101) and connects the capillary portion (2) and the condensation surface (112); The thermally shrinkable and cold-expandable portion (4) is connected to the outer side of the supporting portion (3).

2. The heat dissipation structure according to claim 1, characterized in that: The thermally shrinkable and cold-expandable portion (4) extends along the circumference of the support portion (3).

3. The heat dissipation structure according to claim 1, characterized in that: The support portion (3) is cylindrical, one end of the support portion (3) is connected to the capillary portion (2), and the other end of the support portion (3) is connected to the condensation surface (112), and the diameter of the support portion (3) ranges from 0.3 to 0.5 mm.

4. The heat dissipation structure according to claim 3, characterized in that: The thermally shrinkable and cold-expandable portion (4) is annular in shape, the support portion (3) is located inside the thermally shrinkable and cold-expandable portion (4), and the diameter of the thermally shrinkable and cold-expandable portion (4) ranges from 0.8 to 1.2 mm.

5. The heat dissipation structure according to claim 1, characterized in that: The capillary portion (2) has a capillary pore (201), and the capillary pore (201) passes through the capillary portion (2) along the arrangement direction of the evaporation surface (111) and the condensation surface (112), and is communicated with the condensation chamber (101).

6. The heat dissipation structure according to claim 1, characterized in that: The material of the thermally shrinkable and cold-expandable portion (4) includes gallium.

7. The heat dissipation structure according to claim 1, characterized in that: There are multiple support parts (3), and there are multiple thermally shrinkable and thermally expanding parts (4). At least one thermally shrinkable and thermally expanding part (4) is connected to the outer side of at least one support part (3).

8. The heat dissipation structure according to claim 1, characterized in that: The housing (1) comprises a shell (11) and a cover plate (12); the cover plate (12) has the condensation surface (112); the shell (11) has the evaporation surface (111); a receiving cavity (100) is formed between the shell (11) and the cover plate (12); the capillary portion (2), the support portion (3) and the thermal contraction and cold expansion portion (4) are all located in the receiving cavity (100).

9. The heat dissipation structure according to claim 8, characterized in that: The housing (11) and the support portion (3) are integrally formed.

10. A functional module, characterized in that: The functional module comprises a heat source (5) and a heat dissipation structure according to any one of claims 1 to 9, wherein the heat source (5) is located on a side of the evaporation surface (111) away from the capillary portion (2).

11. An electronic device, characterized in that: The electronic device includes the functional module according to claim 10.

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