Cooling device for cover tape pressing plate of semiconductor test sorting machine

Abstract

The utility model relates to the technical field of semiconductor test sorting machines, in particular to a semiconductor test sorting machine cover belt pressing plate cooling device which comprises a pressing plate body, and an air inlet and an air outlet are formed in the front end and the rear end of the interior of the pressing plate body respectively. A heat dissipation shaft is fixedly mounted on the inner side of the pressing plate body and located between the air inlet and the air outlet, connectors are movably mounted at the front end and the rear end of the heat dissipation shaft and located on the inner sides of the air inlet and the air outlet, and operation handles are fixedly connected to the outer sides of the two connectors; the cover tape pressing plate cooling device comprises a heat dissipation shaft, an operation handle is arranged on the heat dissipation shaft, a reset spring is fixedly connected between the operation handle and the heat dissipation shaft, a heat dissipation through groove is formed in the inner side of the heat dissipation shaft, and heat dissipation fins are fixedly connected to the outer side of the heat dissipation shaft. And meanwhile, the cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor test and sorting machines, in particular to a semiconductor test and sorting machine cover belt pressure plate cooling device. Background Art

[0002] When the semiconductor sorting machine is plastic-sealing, the sealing knife works for a long time. When the sealing knife is close to the cover plate, the heat is transferred to the cover plate, causing the cover tape to stick to the cover plate during movement and cause burns. Then, when the sorting machine is taping and plastic-sealing, the cover tape is burned and the product is exposed.

[0003] After searching, publication number CN220823582U discloses a semiconductor test and sorting machine cover belt pressure plate cooling device, which includes a pressure plate body, a thermocouple is disposed inside the pressure plate body, a temperature control meter is disposed outside the pressure plate body, a horizontal axis is disposed between the support ears on both sides of the pressure plate body, a through hole is formed inside the horizontal axis, an air inlet is formed on the support ear on one side of the pressure plate body, and an air outlet is formed on the support ear on the other side of the pressure plate body, and a solenoid valve is disposed inside the air inlet;

[0004] The above-mentioned device is provided with a pressure plate body, a temperature control meter, a horizontal axis, a through hole, an air inlet, an air outlet, a solenoid valve and a thermocouple. The temperature is monitored in real time by the temperature control meter. When the temperature control meter senses high temperature, the solenoid valve is started, so that the solenoid valve opens the air inlet, which is conducive to cooling through airflow, avoiding burns when the pressure plate body contacts the cover tape. However, in actual use, the horizontal axis may be damaged or its performance degraded after long-term use, and it needs to be disassembled and replaced to ensure its normal operation and efficiency. The pressure plate body and the horizontal axis are an integrated structure, resulting in the pressure plate body or the horizontal axis being replaced as a whole if damaged, which greatly increases the production cost. At the same time, it is difficult to cool down quickly by relying solely on the airflow, and the cooling effect is limited.

[0005] Therefore, it is particularly important to design a semiconductor test and sorting machine cover belt pressure plate cooling device to solve the above defects. Utility Model Content

[0006] In response to the shortcomings of the existing technology, the utility model designs a semiconductor test and sorting machine cover with a pressure plate cooling device. The device aims to solve the technical problems in the existing technology that the semiconductor test and sorting machine cover with a pressure plate cooling device is damaged and needs to be replaced as a whole, which greatly increases the production cost, and has a limited cooling effect.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A semiconductor test and sorting machine cover with a pressure plate cooling device includes a pressure plate body, wherein the front and rear ends of the pressure plate body are respectively provided with an air inlet and an air outlet, a heat dissipation shaft is fixedly installed on the inner side of the pressure plate body and located between the air inlet and the air outlet, and connecting heads are movably installed on the front and rear ends of the heat dissipation shaft and located on the inner sides of the air inlet and the air outlet, the outer sides of two groups of the connecting heads are fixedly connected with operating handles, a reset spring is fixedly connected between the operating handle and the heat dissipation shaft, a heat dissipation groove is provided on the inner side of the heat dissipation shaft, and a heat sink is fixedly connected to the outer side of the heat dissipation shaft.

[0009] As a preferred solution of the present invention, a temperature control meter is fixedly installed on the front of the pressure plate body, a thermocouple is fixedly installed inside the pressure plate body, and the bottom end of the thermocouple extends to the inner side of the air outlet, and the thermocouple is electrically connected to the temperature control meter.

[0010] As a preferred solution of the present invention, a solenoid valve is fixedly installed inside the air inlet, a filter head is threadedly connected to the bottom end of the air inlet and located at the bottom of the solenoid valve, and a filter screen is movably installed inside the filter head.

[0011] As a preferred solution of the present invention, the ends of the two groups of connectors that are away from each other are provided with plug-in grooves, and the outer sides of the two groups of connectors are sleeved with multiple groups of sealing rings.

[0012] As a preferred solution of the present invention, a movable groove is provided on the outer side of the heat dissipation shaft at a position corresponding to the operating handle, the operating handle is slidably connected to the movable groove, and the reset spring is located inside the movable groove.

[0013] As a preferred solution of the present invention, multiple groups of heat sinks are located outside the heat sink axis and are evenly spaced. Heat conducting rods are fixedly connected to positions inside the heat sink groove corresponding to the multiple groups of heat sinks.

[0014] As a preferred solution of the present invention, both upper and lower ends of the heat-conducting rod are fixedly connected to the heat sink, and multiple groups of heat-conducting columns are fixedly connected to the outer side of the heat-conducting rod.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. In the present invention, through the coordinated design of the heat dissipation shaft, the connecting head, the operating handle and the reset spring, when the heat dissipation shaft is damaged or the performance is degraded, the operating handle inside the sliding groove can be slid to retract the connecting head into the interior of the heat dissipation shaft, so that the two sets of connecting heads are respectively moved out from the inside of the air inlet and the air outlet, and the heat dissipation shaft is removed from the inside of the pressure plate body for replacement, so that the pressure plate body and the heat dissipation shaft can be replaced separately, thereby reducing production costs.

[0017] 2. In the present invention, through the coordinated design of the heat dissipation shaft, the heat dissipation groove and the heat sink, the air flow circulates inside the heat dissipation groove. During this process, the heat-conducting rod and multiple groups of heat-conducting columns can transfer part of the heat to the heat sink. The multiple groups of heat sinks on the outside of the heat dissipation shaft can assist in heat dissipation, thereby achieving the purpose of rapid cooling, thereby improving the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a cross-sectional view of the internal structure of the pressure plate body and the heat dissipation shaft of the utility model;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 for Figure 2 Enlarged view of point B in the middle.

[0022] In the figure: 1. Pressure plate body; 101. Temperature control meter; 102. Thermocouple; 2. Air inlet; 201. Solenoid valve; 202. Filter head; 203. Filter screen; 3. Air outlet; 4. Heat dissipation shaft; 5. Connector; 501. Plug slot; 502. Sealing ring; 6. Operating handle; 601. Moving slot; 7. Reset spring; 8. Heat dissipation slot; 9. Heat sink; 901. Heat-conducting rod; 902. Heat-conducting column. DETAILED DESCRIPTION

[0023] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] Example:

[0025] See also Figures 1-4 , the utility model provides a technical solution:

[0026] A semiconductor test and sorting machine cover with a pressure plate cooling device includes a pressure plate body 1, with an air inlet 2 and an air outlet 3 respectively provided at the front and rear ends inside the pressure plate body 1, a heat dissipation shaft 4 is fixedly installed on the inner side of the pressure plate body 1 and located between the air inlet 2 and the air outlet 3, and connecting heads 5 are movably installed at the front and rear ends of the heat dissipation shaft 4 and located on the inner sides of the air inlet 2 and the air outlet 3, the outer sides of the two groups of connecting heads 5 are fixedly connected to operating handles 6, a reset spring 7 is fixedly connected between the operating handle 6 and the heat dissipation shaft 4, a heat dissipation groove 8 is provided on the inner side of the heat dissipation shaft 4, and a heat sink 9 is fixedly connected to the outer side of the heat dissipation shaft 4.

[0027] First, a temperature controller 101 is fixedly installed on the front of the pressure plate body 1, and a thermocouple 102 is fixedly installed inside the pressure plate body 1, and the bottom end of the thermocouple 102 extends to the inner side of the air outlet 3. The thermocouple 102 is electrically connected to the temperature controller 101, and the temperature is monitored in real time through the thermocouple 102 and displayed through the temperature controller 101.

[0028] Furthermore, a solenoid valve 201 is fixedly installed inside the air inlet 2, and a filter head 202 is threadedly connected to the bottom end of the air inlet 2 and located at the bottom of the solenoid valve 201. A filter screen 203 is movably installed on the inside of the filter head 202. When the temperature control meter 101 senses high temperature, the solenoid valve 201 is controlled to start so that the air inlet 2 is opened, and the air flow is introduced into the interior of the heat dissipation shaft 4 through the air inlet 2, and the air flow is then discharged through the air outlet 3, thereby achieving the purpose of cooling. When the air flow enters, it is filtered by the filter screen 203 inside the filter head 202 to prevent impurities in the air flow from entering and affecting the cooling effect.

[0029] Then, the two sets of connectors 5 are provided with a plug-in groove 501 at the ends away from each other, and multiple sets of sealing rings 502 are sleeved on the outside of the two sets of connectors 5. When the heat dissipation shaft 4 is installed on the inner side of the pressure plate body 1, the connector 5 can be conveniently inserted into the inner side of the air inlet 2 and the air outlet 3 through the plug-in groove 501. At the same time, after the heat dissipation shaft 4 is installed, the sealing ring 502 can be used to ensure the sealing of the connection.

[0030] Secondly, a movable groove 601 is opened at the position on the outside of the heat dissipation shaft 4 corresponding to the operating handle 6. The operating handle 6 is slidably connected to the movable groove 601, and the return spring 7 is located inside the movable groove 601. When the heat dissipation shaft 4 is installed on the inner side of the pressure plate body 1, the return spring 7 continuously acts on the operating handle 6, so that the connecting head 5 can be tightly inserted into the inner side of the air inlet 2 and the air outlet 3, thereby ensuring the fixing effect of the heat dissipation shaft 4. When the heat dissipation shaft 4 is damaged or the performance is degraded, the operating handle 6 inside the sliding movable groove 601 can be slid to retract the connecting head 5 into the interior of the heat dissipation shaft 4, so that the two groups of connecting heads 5 are respectively moved out from the inner side of the air inlet 2 and the air outlet 3, and the heat dissipation shaft 4 is removed from the inner side of the pressure plate body 1 for replacement, so that the pressure plate body 1 and the heat dissipation shaft 4 can be replaced separately, thereby reducing production costs.

[0031] Finally, multiple groups of heat sinks 9 are located on the outside of the heat dissipation shaft 4 and are distributed at equal intervals. Heat-conducting rods 901 are fixedly connected to the positions inside the heat dissipation groove 8 corresponding to the multiple groups of heat sinks 9. The upper and lower ends of the heat-conducting rods 901 are fixedly connected to the heat sink 9. Multiple groups of heat-conducting columns 902 are fixedly connected to the outside of the heat-conducting rods 901. When the heat dissipation shaft 4 is cooled by internal air flow, the air flow circulates inside the heat dissipation groove 8. During this process, the heat-conducting rods 901 and the multiple groups of heat-conducting columns 902 can transfer part of the heat to the heat sink 9. The multiple groups of heat sinks 9 on the outside of the heat dissipation shaft 4 can assist in heat dissipation, thereby achieving the purpose of rapid cooling, thereby improving the cooling effect.

[0032] In this embodiment, the implementation scenario is specifically as follows: the temperature is monitored in real time by the thermocouple 102 and displayed by the temperature controller 101. When the temperature controller 101 senses high temperature, the solenoid valve 201 is controlled to start so that the air inlet 2 is opened, and the air flow is introduced into the interior of the heat dissipation shaft 4 through the air inlet 2. The air flow circulates inside the heat dissipation groove 8. During this process, the heat-conducting rod 901 and the multiple groups of heat-conducting columns 902 can transfer part of the heat to the heat sink 9. The multiple groups of heat sinks 9 on the outside of the heat dissipation shaft 4 can assist in heat dissipation to achieve the purpose of rapid cooling. The air flow is finally discharged through the air outlet 3. When the heat dissipation shaft 4 is installed on the inner side of the pressure plate body 1, the return spring 7 continues to act on the operation The handle 6 enables the connector 5 to be tightly inserted into the inner side of the air inlet 2 and the air outlet 3, thereby ensuring the fixing effect of the heat dissipation shaft 4. When the heat dissipation shaft 4 is damaged or the performance is degraded, the operating handle 6 on the inner side of the sliding movable groove 601 can be used to retract the connector 5 into the interior of the heat dissipation shaft 4, so that the two groups of connectors 5 are respectively moved out from the inner side of the air inlet 2 and the air outlet 3, and the heat dissipation shaft 4 is removed from the inner side of the pressure plate body 1 for replacement, so that the pressure plate body 1 and the heat dissipation shaft 4 can be replaced separately. The entire operation process is simple and convenient. Compared with the existing semiconductor test and sorting machine cover with pressure plate cooling device, the utility model can reduce production costs through design while improving the cooling effect.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor test and sorting machine cover with a pressure plate cooling device, comprising a pressure plate body (1), characterized in that: The front and rear ends of the pressure plate body (1) are respectively provided with an air inlet (2) and an air outlet (3); a heat dissipation shaft (4) is fixedly installed on the inner side of the pressure plate body (1) and located between the air inlet (2) and the air outlet (3); connecting heads (5) are movably installed on the front and rear ends of the heat dissipation shaft (4) and located on the inner sides of the air inlet (2) and the air outlet (3); the outer sides of the two groups of connecting heads (5) are fixedly connected with operating handles (6); a return spring (7) is fixedly connected between the operating handle (6) and the heat dissipation shaft (4); a heat dissipation groove (8) is provided on the inner side of the heat dissipation shaft (4); and a heat sink (9) is fixedly connected to the outer side of the heat dissipation shaft (4).

2. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 1, characterized in that: A temperature control meter (101) is fixedly installed on the front of the pressure plate body (1), a thermocouple (102) is fixedly installed inside the pressure plate body (1), and the bottom end of the thermocouple (102) extends to the inner side of the air outlet (3), and the thermocouple (102) is electrically connected to the temperature control meter (101).

3. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 1, characterized in that: A solenoid valve (201) is fixedly installed inside the air inlet (2), a filter head (202) is threadedly connected to the bottom end of the air inlet (2) and located at the bottom of the solenoid valve (201), and a filter screen (203) is movably installed inside the filter head (202).

4. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 1, characterized in that: The ends of the two groups of connectors (5) that are away from each other are both provided with a plug-in slot (501), and the outer sides of the two groups of connectors (5) are both sleeved with multiple groups of sealing rings (502).

5. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 1, characterized in that: A movable groove (601) is provided on the outer side of the heat dissipation shaft (4) at a position corresponding to the operating handle (6), the operating handle (6) is slidably connected to the movable groove (601), and the return spring (7) is located inside the movable groove (601).

6. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 1, characterized in that: The plurality of groups of heat sinks (9) are distributed at equal intervals outside the heat dissipation shaft (4), and heat conducting rods (901) are fixedly connected to positions corresponding to the plurality of groups of heat sinks (9) inside the heat dissipation groove (8).

7. The semiconductor test and sorting machine cover belt pressure plate cooling device according to claim 6, characterized in that: The upper and lower ends of the heat-conducting rod (901) are fixedly connected to the heat sink (9), and the outer side of the heat-conducting rod (901) is fixedly connected to multiple groups of heat-conducting columns (902).

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