Semiconductor cleaning equipment

Abstract

The utility model belongs to the technical field of semiconductors, and provides semiconductor cleaning equipment which comprises a box body separation part, a dry cleaning part and a wet cleaning part, the box body separation part is used for separating a box cover and a base of a to-be-cleaned test piece, and an ultraviolet radiation device, a first input port and a second input port are arranged in the dry cleaning part; the ultraviolet radiation device is used for generating ultraviolet light to irradiate a to-be-washed test piece, the first input port is used for introducing ozone to oxidize and decompose organic impurities on the surface of the to-be-washed test piece, the second input port is used for introducing a cooling agent to cool and solidify the reacted impurities, and the wet cleaning part is used for providing cleaning liquid to clean the reacted, cooled and solidified impurities; according to the semiconductor cleaning equipment, the cleaning efficiency and the cleaning effect are effectively improved, and the risk that the semiconductor processing and manufacturing process is affected due to the fact that the cleanliness of the to-be-cleaned test piece is insufficient is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor cleaning device. Background Art

[0002] The transportation of semiconductor devices is crucial to semiconductor manufacturing. Their production and transportation typically require sealed, dust-free conditions. Consequently, SMIF technology is widely used in semiconductor manufacturing. SMIF, also known as Standard Mechanical Interface (SMIF), is centered around the concept of "isolation technology." Its primary purpose is to prevent product contamination by enclosing semiconductor devices in an ultra-clean environment while relaxing cleanliness requirements outside this enclosed space.

[0003] SMIF includes a SMIF cassette for storing and transporting photomasks. During the semiconductor manufacturing process, impurities such as particles and photoresist often remain on the SMIF cassette. Therefore, the SMIF cassette needs to be cleaned before use. Currently, in the cleaning method of SMIF cassettes, a spray device is used to clean the SMIF cassette to remove surface impurities. The spray device is effective in cleaning impurities such as particles, but its cleaning capacity for residual organic impurities such as photoresist is insufficient. During the cleaning process, photoresist often remains, and this residual photoresist can affect the processing and manufacturing of wafers. Therefore, a new semiconductor cleaning equipment is urgently needed to solve the above problems. Utility Model Content

[0004] The purpose of the present application is to provide a semiconductor cleaning device for cleaning a SMIF mask box, so as to improve the cleaning effect of the SMIF mask box and reduce the risk of mask contamination caused by insufficient cleanliness of the SMIF mask box.

[0005] To achieve the above-mentioned and other related purposes, the present application provides a semiconductor cleaning device for cleaning a test piece to be cleaned, wherein the test piece to be cleaned comprises a base and a box cover covering the base, comprising:

[0006] A box body separation part, used for separating the box cover and the base of the test piece to be washed;

[0007] A dry cleaning section, wherein the dry cleaning section is provided with an ultraviolet radiation device, a first input port, and a second input port, wherein the first input port is used to introduce ozone, the ultraviolet radiation device is used to generate ultraviolet light and irradiate the test piece to be cleaned, and the second input port is used to introduce a coolant;

[0008] The wet cleaning part is used to provide cleaning liquid to clean the test piece to be cleaned.

[0009] Optionally, the dry cleaning unit includes:

[0010] A dry cleaning chamber body, wherein a dry cleaning chamber is formed in the dry cleaning chamber body, the ultraviolet radiation device is connected to the top of the dry cleaning chamber, and a first opening for taking and placing the test piece to be cleaned is provided on the side wall of the dry cleaning chamber;

[0011] a dry cleaning seal, used for covering the first opening to form a sealed space in the dry cleaning chamber;

[0012] The second carrier is connected to the bottom of the dry cleaning chamber and is arranged opposite to the ultraviolet radiation device, and is used for placing the test piece to be cleaned.

[0013] Optionally, the coolant is liquid nitrogen, and the dry cleaning section further includes a second nozzle, a second valve and a second transfer pipe. The second nozzle is located at the top of the dry cleaning chamber and is arranged opposite to the second carrier, and is connected to the second transfer pipe, and sprays the liquid nitrogen onto the test piece to be cleaned through the second input port. The second valve is connected to the second transfer pipe and is located outside the dry cleaning chamber.

[0014] Optionally, when the ultraviolet radiation device is turned on and ozone is introduced into the working chamber, the second valve is closed;

[0015] When the second valve is opened, the ultraviolet radiation device is turned off and the supply of ozone to the working chamber is stopped.

[0016] Optionally, the dry cleaning section further includes a third valve, which is connected to the second transmission pipe and is located between the second valve and the second input port. When the pressure in the second transmission pipe reaches the first pressure, the third valve opens.

[0017] Optionally, a temperature sensor is further provided in the dry cleaning chamber for monitoring the temperature of the dry cleaning chamber.

[0018] Optionally, the dry cleaning chamber body is further provided with a first output port for discharging the coolant and ozone in the dry cleaning portion.

[0019] Optionally, the ultraviolet radiation device includes a first ultraviolet lamp, which can emit first ultraviolet light, and the first ultraviolet light can decompose ozone in the dry cleaning part into oxygen and atomic oxygen.

[0020] Optionally, the ultraviolet radiation device includes a second ultraviolet lamp, which can emit a second ultraviolet light, and the second ultraviolet light can decompose oxygen in the dry cleaning part to produce ozone and atomic oxygen.

[0021] Optionally, a first carrier and a first nozzle are provided in the wet cleaning section. The first carrier is arranged opposite to the first nozzle. The first carrier is used to carry the test piece to be cleaned after being cleaned in the dry cleaning section, and the first nozzle is used to spray the cleaning liquid onto the test piece to be cleaned.

[0022] The semiconductor cleaning equipment provided by this application has at least the following beneficial effects:

[0023] The semiconductor cleaning equipment of the present application includes a box body separation part, a dry cleaning part and a wet cleaning part. The box body separation part can separate the base and the box cover of the test piece to be cleaned. The dry cleaning part is provided with an ultraviolet radiation device, a first input port and a second input port. The first ultraviolet light emitted by the ultraviolet radiation device cooperates with the ozone introduced into the first input port to oxidatively decompose organic impurities such as photoresist on the surface of the test piece to be cleaned. The coolant introduced into the second input port can cool and solidify the impurities after the reaction, thereby improving the cleaning effect and cleaning efficiency of the impurities on the surface of the test piece to be cleaned; the second ultraviolet light emitted by the ultraviolet radiation device can decompose oxygen into ozone and oxygen atoms, which can improve the oxidative decomposition effect of impurities; the dry cleaning part includes a second nozzle, a second valve, a second transmission pipe and a third valve. The second nozzle can spray the coolant onto the surface of the test piece to be cleaned, and the second nozzle can spray high-speed coolant through the third valve, thereby improving the cooling effect and cleaning effect of the impurities after the reaction. When the semiconductor cleaning equipment of the present application is used to clean a SMIF mask box, the cleaning effect of the SMIF mask box can be effectively improved, and the risk of mask contamination due to insufficient cleanliness of the SMIF mask box can be greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 Shown is a schematic structural diagram of the semiconductor cleaning equipment provided by this application.

[0026] Figure 2 Display as Figure 1 The schematic diagram of the structure of the dry cleaning section in the semiconductor cleaning equipment is shown.

[0027] Reference numerals:

[0028] 11. Base; 12. Box cover; 21. Box body separation part; 22. Dry cleaning part; 221. Dry cleaning chamber body; 222. Dry cleaning chamber; 223. Second supporting rack; 224. Ultraviolet radiation device; 2251. First input port; 2252. Ozone generator; 2261. Second input port; 2262. Second valve; 2263. Liquid nitrogen generator; 2264. Third valve; 2265. Second nozzle; 2271. First output port; 2272. First valve; 23. Wet cleaning part; 231. Wet cleaning chamber body; 232. Wet cleaning chamber; 233. First supporting rack; 234. First nozzle. DETAILED DESCRIPTION

[0029] To make the technical objectives, technical solutions, and technical effects of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Generally, the components of the embodiments of this application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but rather merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application without creative effort are within the scope of protection of this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0031] In the description of this application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. In addition, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the implementation or example are included in at least one implementation or example of this application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable scheme.

[0033] Example 1

[0034] This embodiment provides a semiconductor cleaning device for cleaning a test piece to be cleaned, wherein the test piece to be cleaned comprises a base 11 and a box cover 12, wherein the box cover 12 covers the base 11. Optionally, the test piece to be cleaned may be a SMIF mask box. Figure 1 The semiconductor cleaning equipment of this embodiment includes a box separation unit 21, a dry cleaning unit 22 and a wet cleaning unit 23.

[0035] Reference Figure 2 The box body separation part 21 is used to separate the box cover 12 and the base 11 of the test piece to be cleaned to expose impurities in the base 11 and the box cover 12. Optionally, the box body separation part 21 includes a box opener, which is used to separate the box cover 12 from the base 11; the dry cleaning part 22 is provided with an ultraviolet radiation device 224, a first input port 2251, and a second input port 2261. Ozone can be introduced into the dry cleaning part 22 through the first input port 2251, and a coolant can be introduced into the dry cleaning part 22 through the second input port 2261. The ultraviolet radiation device 224 is used to generate ultraviolet light and irradiate the test piece to be cleaned; the wet cleaning part 23 can provide cleaning liquid to clean the test piece to be cleaned.

[0036] In some specific embodiments, the box cover 12 and the base 11 can be manually transferred from the box body separation section 21 to the dry cleaning section 22, or from the dry cleaning section 22 to the wet cleaning section 23; the box cover 12 and the base 11 can also be transferred from the box body separation section 21 to the dry cleaning section 22, or from the dry cleaning section 22 to the wet cleaning section 23 by a robotic arm. When the cover 12 and base 11 are transferred to the dry cleaning section 22, ozone is introduced into the dry cleaning section 22 through the first input port 2251, and the ultraviolet radiation device 224 is simultaneously activated, thereby oxidizing and decomposing organic matter such as photoresist in the cover 12 and base 11. After the ultraviolet radiation device 224 is activated for a first predetermined time, the ultraviolet radiation device 224 is deactivated and the ozone supply to the dry cleaning section 22 is stopped. Simultaneously, a coolant is introduced into the dry cleaning section 22 through the second input port 2261 to freeze and solidify impurities on the surfaces of the cover 12 and base 11. After the coolant has been introduced for a second predetermined time, the cover 12 and base 11 are transferred to the wet cleaning section 23 for wet cleaning. The oxidative decomposition of organic impurities by ultraviolet light and ozone improves the cleaning effect, and the cooling and solidification of the reacted impurities by the coolant further enhances the cleaning effect, thereby effectively cleaning impurities such as photoresist on the surface of the SMIF mask pod, significantly reducing the risk of mask contamination due to insufficient cleanliness of the SMIF mask pod.

[0037] In this embodiment, refer to Figure 2 The dry cleaning section 22 includes a dry cleaning chamber body 221, a dry cleaning seal, and a second carrier 223. A dry cleaning chamber 222 is formed within the dry cleaning chamber body 221. The dry cleaning chamber 222 has a top, a bottom, and side walls. An ultraviolet radiation device 224 is connected to the top of the dry cleaning chamber 222. The side wall of the dry cleaning chamber 222 is provided with a first opening through which a test piece to be cleaned can be taken and placed. Optionally, the ultraviolet radiation device 224 includes at least one ultraviolet lamp, which can be arranged at the top of the dry cleaning chamber 222 according to actual irradiation requirements. The dry cleaning seal can cover the first opening to form a closed space in the dry cleaning chamber 222. Optionally, the dry cleaning seal can be a door-type structure, one side of which is hinged to the dry cleaning chamber body 221. The dry cleaning seal can also be of other acceptable structures. The second carrier 223 is connected to the bottom of the dry cleaning chamber 222 and is disposed opposite to the ultraviolet radiation device 224 , and is used for placing the box cover 12 and the base 11 of the test piece to be cleaned.

[0038] In some specific embodiments, the second carrier 223 in the dry cleaning section 22 is a stepped frame structure, and the stepped inclined surface of the stepped frame structure of the second carrier 223 is inclined from the central area of ​​the dry cleaning section 22 to the side wall. The ultraviolet radiation device 224 includes a plurality of ultraviolet lamps, which are respectively arranged in the central area of ​​the top of the dry cleaning chamber 222 and the area close to the side wall. When in use, the box covers 12 and bases 11 of multiple SMIF mask boxes are placed at intervals on the stepped frame structure of the second carrier 223, and the openings of the box covers 12 and the base 11 are facing upward. After the ultraviolet radiation device 224 is turned on, the emitted ultraviolet light can irradiate the inner surfaces of the box cover 12 and the base 11, and oxidize and decompose the organic impurities on the surface of the box cover 12 and the base 11 through ozone.

[0039] In this embodiment, the ultraviolet radiation device 224 includes a first ultraviolet lamp, which can emit a first ultraviolet light. The first ultraviolet light can decompose impurities such as photoresist, and the first ultraviolet light can decompose the ozone in the dry cleaning chamber 222 into oxygen and atomic oxygen. The atomic oxygen can oxidize the decomposed impurities such as photoresist, thereby achieving the purpose of removing organic matter such as photoresist.

[0040] In this embodiment, the ultraviolet radiation device 224 also includes a second ultraviolet lamp, which can emit a second ultraviolet light. The second ultraviolet light can decompose the oxygen in the dry cleaning chamber 222 into ozone and atomic oxygen. Specifically, ozone produces atomic oxygen and oxygen under the action of the first ultraviolet light, and the produced oxygen can be decomposed into atomic oxygen and ozone by the second ultraviolet light. Through the coordinated use of the first ultraviolet lamp and the second ultraviolet lamp, the concentration of atomic oxygen in the dry cleaning chamber 222 is effectively improved, the recycling of oxygen in the dry cleaning chamber 222 is realized, the removal efficiency of organic impurities such as photoresist is improved, and the cost is reduced.

[0041] In some specific embodiments, the first ultraviolet lamp and the second ultraviolet lamp each include multiple first ultraviolet lamps and multiple second ultraviolet lamps are spaced apart at the top of the dry cleaning chamber 222 to fully irradiate the base 11 of the test piece to be cleaned and the inner surface of the box cover 12.

[0042] In this embodiment, a first output port 2271 is further provided on the dry cleaning chamber body 221, through which the coolant and ozone in the dry cleaning section 22 can be discharged. Optionally, the dry cleaning section 22 also includes a first valve 2272, which is connected to the first output port 2271. When the pressure in the dry cleaning chamber 222 is greater than or equal to the second pressure, the first valve 2272 opens to discharge the gas in the dry cleaning chamber 222 to prevent the pressure in the dry cleaning chamber 222 from being too high. Furthermore, the second pressure can be taken as one atmospheric pressure, at which time the first valve 2272 is in a normally open state.

[0043] In some specific embodiments, the first input port 2251 is located on a sidewall of the dry cleaning chamber 222; the first output port 2271 is disposed opposite the first input port 2251 and is located in an area of ​​the sidewall of the dry cleaning chamber 222 near the top, or in an area of ​​the top of the dry cleaning chamber 222 near the oriental arborvitae; and the second input port 2261 is located in the center of the top of the dry cleaning chamber 222. Alternatively, the first input port 2251 may be located at the top of the dry cleaning chamber 222, the first output port 2271 may be located at the top of the dry cleaning chamber 222 away from the first input port, and the second input port 2261 may be located in other areas of the top of the dry cleaning chamber 222 or on a sidewall of the dry cleaning chamber 222.

[0044] In some specific embodiments, the coolant is liquid nitrogen, the first input port 2251 is connected to the ozone generator 2252 through a first transmission pipe, and the second input port 2261 is connected to the liquid nitrogen generator 2263. After the base 11 and the box cover 12 of the test piece to be cleaned are placed in the dry cleaning chamber 222, the ultraviolet radiation device 224 is turned on and ozone is introduced using the ozone generator 2252. After the ultraviolet radiation device 224 is turned on for a first preset time, the ultraviolet radiation device 224 is turned off and the introduction of ozone is stopped. Then, liquid nitrogen is introduced into the dry cleaning chamber 222 through the liquid nitrogen generator 2263 to freeze and solidify the impurities after the reaction.

[0045] In this embodiment, refer to Figure 1 The wet cleaning section 23 is provided with a first carrier 233 and a first nozzle 234. The first carrier 233 is arranged opposite to the first nozzle 234. The first carrier 233 is used to carry the test piece to be cleaned after being cleaned in the dry cleaning section 22. The first nozzle 234 can spray the cleaning liquid onto the test piece to be cleaned. Optionally, the wet cleaning section 23 includes a wet cleaning chamber body 231 and a wet cleaning seal. A wet cleaning chamber 232 is formed in the wet cleaning chamber body 231. The wet cleaning chamber 232 has a top, a bottom and a side wall. The side wall of the wet cleaning chamber 232 is provided with a second opening. The wet cleaning seal can cover the second opening. One or more bases 11 and box covers 12 can be placed on the first carrier, and the first carrier 233 can rotate so that the cleaning liquid sprayed by the first nozzle 234 can cover the surface of the base 11 and the box cover 12.

[0046] In some specific embodiments, a coolant is introduced into the dry cleaning section 22, and impurities on the surfaces of the base 11 and the cover 12 of the SMIF mask box are cooled and solidified. After the coolant is introduced for a second preset time, the introduction of the coolant into the dry cleaning section 22 is stopped, and within a certain period of time, the base 11 and the cover 12 of the test piece to be cleaned are transferred to the wet cleaning section 23 for wet cleaning. The impurities that react and cool and solidify on the surfaces of the base 11 and the cover 12 are cleaned by the cleaning liquid. Compared with direct cleaning with the cleaning liquid, the cleaning efficiency and cleaning effect of organic impurities such as photoresist and particulate impurities are greatly improved, and the mask contamination caused by residual impurities is effectively prevented.

[0047] In summary, the semiconductor cleaning equipment of this embodiment is provided with a dry cleaning section 22, wherein the first ultraviolet light emitted by the ultraviolet radiation device 224 is combined with ozone to oxidatively decompose organic impurities such as photoresist on the surface of the test piece to be cleaned, and the second ultraviolet light can decompose oxygen into ozone and oxygen atoms, thereby improving the cleaning efficiency and cleaning effect of the impurities, and the coolant can cool and solidify the reacted impurities, and the wet cleaning section 23 is used to wet clean the reacted and cooled and solidified impurities, thereby effectively improving the cleaning effect of the SMIF mask box, and greatly reducing the risk of mask contamination due to insufficient cleanliness of the SMIF mask box, and by controlling the coolant to be input into the dry cleaning chamber 222 after the impurities are oxidatively decomposed, it is possible to avoid the influence of the ultraviolet radiation device 224 and the organic decomposition process of the organic impurities due to the low temperature of the dry cleaning chamber 222, thereby ensuring that the dry cleaning effect of the test piece to be cleaned is not affected by low temperature.

[0048] Example 2

[0049] This embodiment provides another semiconductor cleaning device, which also includes a box separation unit 21, a dry cleaning unit 22 and a wet cleaning unit 23. The same points as those in the first embodiment will not be repeated here, and the differences are as follows.

[0050] Reference Figure 2In the semiconductor cleaning equipment of this embodiment, the dry cleaning section 22 further includes a second nozzle 2265, a second valve 2262, and a second transfer pipe. The second transfer pipe is used to transfer coolant. The second nozzle 2265 is located in the dry cleaning chamber 222. The second nozzle 2265 is located at the top of the dry cleaning chamber 222 and is arranged opposite the second carrier 233. The second nozzle 2265 is connected to the second transfer pipe to spray the coolant onto the test piece to be cleaned through the second inlet 2261. The second valve 2262 is connected to the second transfer pipe and is located outside the dry cleaning chamber 222. It is used to control the flow of liquid nitrogen in the second transfer pipe. Optionally, the coolant is liquid nitrogen, and the second transfer pipe is connected to the liquid nitrogen generator 2263. Furthermore, there can be multiple second nozzles 2265, each connected to the liquid nitrogen generator 2263 via the second transfer pipe. By providing multiple second nozzles 2265, the coverage of the sprayed liquid nitrogen on the surface of the test piece to be cleaned can be improved. In this embodiment, the second nozzle 2265 is provided to spray the cooling liquid onto the surface of the test piece to be cleaned, thereby improving the cooling effect on impurities on the surface of the test piece to be cleaned.

[0051] In some specific embodiments, the test piece to be cleaned is a SMIF mask box. After the base 11 and the cover 12 of the SIMIF wafer box are placed in the dry cleaning chamber 222, the second valve 2262 is closed, the ultraviolet radiation device 224 is turned on and ozone is introduced through the first input port 2251. After a first preset time, the ultraviolet radiation device 224 is turned off and the introduction of ozone through the first input port 2251 is stopped, and the second valve 2262 is opened to introduce coolant into the dry cleaning cavity.

[0052] In this embodiment, the dry cleaning section 22 further includes a third valve 2264 connected to the second transmission pipe. When the pressure in the second transmission pipe reaches the first pressure, the third valve 2264 opens, allowing the coolant to be sprayed at high speed onto the surface of the specimen to be cleaned. When exposed to the outside world, the coolant quickly vaporizes and absorbs heat, generating a heat exchange phenomenon with the surface of the specimen to be cleaned, causing the impurities after the surface reaction to quickly cool and solidify. Due to the different expansion coefficients of the impurities and the attached specimen to be cleaned, the solidified impurities will automatically peel off. The impact between the high-speed coolant and the surface of the specimen to be cleaned will also cause some of the solidified impurities to fall off, thereby improving the cleaning effect. Optionally, the third valve 2264 is a pressure control valve, located between the second valve 2262 and the second nozzle 2265. Through the interaction between the second valve 2262 and the third valve 2264, the pressure on the side of the third valve 2264 closest to the second valve 2262 can be kept below the maximum pressure threshold, thereby preventing damage to the surface of the specimen to be cleaned or movement of the specimen to be cleaned. Furthermore, the third valve 2264 is located between the second valve 2262 and the second input port 2261 .

[0053] In some specific embodiments, a temperature sensor is further provided in the dry cleaning chamber 222 for detecting the temperature of the dry cleaning chamber 222 to ensure that the dry cleaning chamber 222 has a suitable temperature when the organic impurities are oxidatively decomposed, thereby preventing the temperature from being too low and having an adverse effect on the test piece to be cleaned, the ultraviolet radiation device 224 and the oxidative decomposition process.

[0054] The semiconductor cleaning apparatus of this embodiment also includes a cassette separation unit 21, a dry cleaning unit 22, and a wet cleaning unit 23, and thus exhibits the same beneficial effects as the first embodiment. Furthermore, the dry cleaning unit 22 of this embodiment utilizes a second nozzle to spray coolant onto the surface of the test piece to be cleaned, thereby enhancing the cooling effect. A third valve 2264 enables the second nozzle to emit high-speed coolant, further enhancing the cleaning effect of impurities on the surface of the test piece to be cleaned. A temperature sensor is provided to monitor the temperature of the dry cleaning chamber 222 to prevent excessively low temperatures from adversely affecting the cleaning process.

[0055] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify, alter, or combine the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or variations accomplished by a person of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A semiconductor cleaning device for cleaning a test piece to be cleaned, wherein the test piece to be cleaned comprises a base and a box cover covering the base, characterized in that: include: A box body separation part, used for separating the box cover and the base of the test piece to be washed; A dry cleaning section, wherein an ultraviolet radiation device, a first input port, and a second input port are arranged at intervals in the dry cleaning section. The first input port is used to introduce ozone. The ultraviolet radiation device is used to generate ultraviolet light to irradiate the test piece to be cleaned. The second input port is used to introduce a coolant. The dry cleaning section includes a second valve, a second transmission pipe, and a third valve. The second transmission pipe is used to transmit the coolant. The second valve and the third valve are both connected to the second transmission pipe. The third valve is located between the second valve and the second input port. The wet cleaning part is used to provide cleaning liquid to clean the test piece to be cleaned.

2. The semiconductor cleaning equipment according to claim 1, characterized in that The dry cleaning department includes: A dry cleaning chamber body, wherein a dry cleaning chamber is formed in the dry cleaning chamber body, the ultraviolet radiation device is connected to the top of the dry cleaning chamber, and a first opening for taking and placing the test piece to be cleaned is provided on the side wall of the dry cleaning chamber; a dry cleaning seal, used for covering the first opening to form a sealed space in the dry cleaning chamber; The second carrier is connected to the bottom of the dry cleaning chamber and is arranged opposite to the ultraviolet radiation device, and is used for placing the test piece to be cleaned.

3. The semiconductor cleaning equipment according to claim 2, characterized in that The coolant is liquid nitrogen, and the dry cleaning section also includes a second nozzle, which is located at the top of the dry cleaning chamber and opposite to the second carrier, and is connected to the second transmission pipe to spray the liquid nitrogen onto the test piece to be cleaned through the second input port. The second valve is located outside the dry cleaning chamber.

4. The semiconductor cleaning equipment according to claim 3, characterized in that When the ultraviolet radiation device is turned on and ozone is introduced into the dry cleaning chamber, the second valve is closed; When the second valve is opened, the ultraviolet radiation device is turned off and the supply of ozone to the dry cleaning chamber is stopped.

5. The semiconductor cleaning equipment according to claim 3, characterized in that When the pressure in the second transmission pipe reaches the first pressure, the third valve opens.

6. The semiconductor cleaning equipment according to claim 3, characterized in that A temperature sensor is also provided in the dry cleaning chamber for monitoring the temperature of the dry cleaning chamber.

7. The semiconductor cleaning equipment according to claim 2, characterized in that The dry cleaning chamber body is further provided with a first output port for discharging the coolant and ozone in the dry cleaning portion.

8. The semiconductor cleaning equipment according to claim 1, wherein The ultraviolet radiation device includes a first ultraviolet lamp, which can emit first ultraviolet light. The first ultraviolet light decomposes ozone in the dry cleaning part into oxygen and atomic oxygen.

9. The semiconductor cleaning equipment according to claim 1 or 8, characterized in that: The ultraviolet radiation device includes a second ultraviolet lamp capable of emitting second ultraviolet light, and the second ultraviolet light decomposes oxygen in the dry cleaning portion to generate ozone and atomic oxygen.

10. The semiconductor cleaning equipment according to claim 1, wherein The wet cleaning section is provided with a first carrier and a first nozzle. The first carrier is arranged opposite to the first nozzle. The first carrier is used to carry the test piece to be cleaned after being cleaned in the dry cleaning section. The first nozzle is used to spray the cleaning liquid onto the test piece to be cleaned.

Images