Cutting equipment for cutting wafer

Abstract

The utility model relates to cutting equipment for cutting wafers, which comprises a base, a mounting frame, an upper side shell plate and a working table, the working table is mounted at the upper end of the base, the mounting frame is positioned at the upper end of the working table, the upper side shell plate is mounted at the upper end of the mounting frame, and the upper side shell plate is positioned at the lower end of the mounting frame. An XY-axis moving structure, two sets of wafer feeding and discharging structures, a reciprocating type moving structure and a laser cutting structure installed on the XY-axis moving structure are installed at the upper end of the working table top, the two sets of wafer feeding and discharging structures take and place wafers respectively, and the wafer feeding and discharging structures take out the wafers and place the wafers on the reciprocating type moving structure. The laser cutting structure cuts the wafer on the reciprocating type moving structure, and the X-axis and Y-axis moving structure drives the laser cutting structure to move in the X-axis direction or the Y-axis direction. The wafer cutting device solves the problems that an existing cutting device for cutting wafers cannot continuously take the wafers, so that the wafers cannot be continuously cut, and the cutting efficiency is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of cutting equipment, in particular to a cutting equipment for cutting wafers. Background Art

[0002] Wafers are the fundamental material for semiconductor manufacturing. They are circular sheets of silicon or other semiconductor materials. Integrated circuits (ICs) on a wafer are manufactured simultaneously across the entire wafer through a series of process steps. However, the final product is a single chip, not an entire wafer. Therefore, each chip on the wafer must be separated by dicing. These separated chips can then be used to manufacture semiconductor products such as diodes. However, existing wafer dicing equipment is inefficient and cannot efficiently and quickly cut the wafer, thus reducing dicing efficiency.

[0003] Therefore, in order to improve the cutting efficiency, Chinese patent CN217701867U, a wafer cutting machine points out that the cleaning and gluing device, the track shrinking device, the first conveying device and the second conveying device are arranged in sequence from bottom to top, and the structural design is reasonable, which can facilitate the orderly transportation, positioning and cleaning and gluing work. The overall structural design of the above-mentioned wafer cutting machine is reasonable, and the cutting process of the wafer workpiece does not require manual intervention. The degree of automation is high, which greatly improves the processing efficiency. Although the above-mentioned patent has improved the wafer cutting efficiency, there are still certain technical problems. It can be seen from the drawings of the above-mentioned patent that the wafer cutting machine can only complete the cutting of one group of wafers and then transport another group of wafers to the positioning position. This method cannot achieve continuity, thereby reducing the wafer cutting efficiency.

[0004] Therefore, in order to achieve continuous placement and removal of wafers and thereby improve the cutting efficiency of the cutting equipment, a cutting equipment for cutting wafers is proposed to solve the technical problems in the above-mentioned prior art. Utility Model Content

[0005] In response to the deficiencies of the prior art, the present invention provides a cutting device for cutting wafers, which solves the problem that the prior cutting device cannot continuously pick up the wafers, making it impossible to cut continuously, thereby reducing the cutting efficiency.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cutting device for cutting wafers, comprising a base, a mounting frame, an upper shell plate, and a work table, wherein the work table is mounted on the upper end portion of the base, the mounting frame is located at the upper end portion of the work table, the upper shell plate is mounted on the upper end of the mounting frame, an XY axis moving structure, two sets of wafer loading and unloading structures, a reciprocating moving structure, and a laser cutting structure mounted on the XY axis moving structure are mounted on the upper end of the work table, the two sets of wafer loading and unloading structures are used to take and place wafers respectively, and the wafer loading and unloading structure takes out the wafers and places them on the reciprocating moving structure. In terms of structure, the laser cutting structure cuts the wafers on the reciprocating moving structure, and the XY-axis moving structure drives the laser cutting structure to move in the X-axis or Y-axis direction. Two groups of wafers can be placed on the reciprocating moving structure. After any group of wafers is cut by the laser cutting structure, the reciprocating moving structure moves in the X-axis so that the uncut wafer corresponds to the laser cutting structure. After the reciprocating moving structure moves, the wafer loading and unloading structure close to the side of the cut wafer takes the wafer and places the uncut wafer onto the reciprocating moving structure. A vacuum pump is also provided in the base, and the vacuum pump is connected to the reciprocating moving structure through a pipe to adsorb the wafer.

[0007] Through the above technical solution, further, the XY-axis moving structure includes a first guide rail, a first motor, a second guide rail, and a second motor; the first guide rail is installed on the upper end of the worktable, and the first motor is installed on the side of the first guide rail. The output end of the first motor is connected to a lead screw and passes through the first guide rail horizontally, and a lead screw slider is provided on the lead screw, and a second guide rail is provided on the lead screw slider. A second motor is provided on one side of the second guide rail, and the output end of the second motor is connected to a lead screw and passes through the second guide rail horizontally. The surface of the lead screw is also provided with a lead screw slider, and a laser cutting structure is provided on the lead screw slider.

[0008] Furthermore, the laser cutting structure includes a connecting seat, a laser fixing part, and a laser head; the connecting seat is installed on the screw slider, a laser fixing part is provided at the end of the connecting seat, and the laser head is clamped in the laser fixing part. The laser head is initially located in the middle of the reciprocating moving structure.

[0009] As a preferred technical solution, the wafer loading and unloading structure includes a hollow tube, a mounting plate, a telescopic motor, a connecting rod, a sliding shaft, a material tray, and a cylinder; the hollow tube is installed on the work surface, the mounting plate is installed on the upper end of the hollow tube and is connected by bolts, and two groups of telescopic motors are symmetrically inverted at the lower end of the mounting plate, and the telescopic end of the telescopic motor located on the right side of the mounting plate is connected to a connecting rod, the upper end of the connecting rod is connected to a sliding shaft and extends upward through the mounting plate, and a material tray is provided at the end of the mounting plate, and an opening is provided on the surface of the material tray, and the other group of telescopic motors is consistent with the structure of the telescopic motor on the right.

[0010] Furthermore, the wafer loading and unloading structure also includes a unloading suction cup, a steering plate, a loading nozzle, and a motor; the cylinder is installed at the upper end of the work table, a flat plate is provided at the upper end of the cylinder, a motor is installed on the flat plate, the output end of the motor is connected to the steering plate, one end of the steering plate is provided with a loading nozzle, and the other end is provided with an unloading suction cup.

[0011] Furthermore, the reciprocating moving structure includes a support tube, a workbench, a third guide rail, a third motor, a vacuum sealing plate, a glass plate, and a vacuum suction tube; the support tube is installed on the workbench surface, a workbench is provided at the upper end of the support tube, a third guide rail is provided on the workbench, a third motor is provided on one side of the third guide rail, a lead screw is connected to the output end of the third motor, a lead screw slider is provided on the surface of the lead screw, a vacuum sealing plate is connected to the end of the slider, a glass plate is provided on the vacuum sealing plate, and a vacuum suction tube connected to a vacuum pump is provided on one side of the vacuum sealing plate.

[0012] As a preferred technical solution, a first slide rail is installed on the work surface, a first slider is movable on the surface of the first slide rail, and the upper end of the first slider is connected to the lower end of the second guide rail.

[0013] Furthermore, a second slide rail is distributed on the mounting plate, a second slider is movably provided on the surface of the second slide rail, and a clamping plate is installed on the second slider, and the clamping plate is retracted inward and extends into the opening of the material tray.

[0014] As a preferred technical solution, a connecting plate is provided on the inner top of the upper shell plate, and a laser cutting camera corresponding to the surface of the glass plate is installed on the connecting plate.

[0015] Compared with the prior art, the present invention provides a cutting device for cutting wafers, which has the following beneficial effects:

[0016] 1. In order to achieve continuous wafer picking and continuous cutting of the wafer by the laser cutting structure, thereby improving the cutting efficiency of the cutting equipment, the cutting equipment is equipped with two sets of wafer loading and unloading structures, and refer to the figure. Figure 3It can be seen that the reciprocating moving structure moves to either side so that it is close to the wafer loading and unloading structure, and then the uncut wafer is placed on the reciprocating moving structure through the wafer loading and unloading structure, and then the reciprocating moving structure moves to the position directly below the laser cutting structure. At this time, another set of wafer loading and unloading structures places the wafer on the reciprocating moving structure, and then the laser cutting structure cuts the wafer. After the cutting is completed, the reciprocating moving structure moves the uncut wafer to directly below the laser cutting structure. At this time, the wafer after cutting moves to the side of the wafer loading and unloading structure, and then the cut wafer and the uncut wafer are taken at the same time, and then the cut wafer is taken, and then the uncut wafer is placed on the reciprocating moving structure again. Therefore, repeated operation realizes continuous taking and continuous cutting, further improving the cutting efficiency of the cutting equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the utility model;

[0018] Figure 2 This is a schematic diagram of the main view of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the installation frame of the utility model;

[0020] Figure 4 For this utility model Figure 3 Schematic diagram of the right side;

[0021] Figure 5 For this utility model Figure 3 The main schematic diagram of

[0022] Figure 6 This is a schematic diagram of the work surface structure of the utility model;

[0023] Figure 7 This is a schematic diagram of the reciprocating moving structure of the utility model;

[0024] Figure 8 This is a schematic diagram of the XY axis moving structure of the utility model;

[0025] Figure 9 This is a schematic diagram of the wafer loading and unloading structure of the utility model;

[0026] Figure 10 For this utility model Figure 9 Schematic diagram of the three-dimensional structure;

[0027] Figure 11 This is a schematic diagram of the structure of the clamping plate of the utility model;

[0028] Figure 12 This is a schematic diagram of the laser cutting camera of the present invention.

[0029] In the figure: 1. Base; 2. Mounting frame; 3. Upper shell plate; 4. Work surface; 5. XY axis moving structure; 501. First guide rail; 502. First motor; 503. Second guide rail; 504. Second motor; 6. Laser cutting structure; 601. Connecting seat; 602. Laser fixing part; 603. Laser head; 7. Wafer loading and unloading structure; 701. Hollow tube; 702. Mounting plate; 703. Unloading suction cup; 704. Telescopic motor; 705. Connecting rod; 706. Sliding shaft; 707, material tray; 708, cylinder; 709, steering plate; 710, loading nozzle; 711, motor; 8, reciprocating moving structure; 801, support tube; 802, workbench; 803, third guide rail; 804, third motor; 805, vacuum sealing plate; 806, glass plate; 807, vacuum suction tube; 9, first slide rail; 10, first slider; 11, second slide rail; 12, second slider; 13, clamping plate; 14, connecting plate; 15, laser cutting camera. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Example

[0032] See also Figure 1-12The utility model provides the following technical solutions: a cutting device for cutting wafers, comprising a base 1, a mounting frame 2, an upper shell plate 3, and a work surface 4, wherein the work surface 4 is mounted on the upper end of the base 1, the mounting frame 2 is located at the upper end of the work surface 4, the upper shell plate 3 is mounted on the upper end of the mounting frame 2, an XY axis moving structure 5, two sets of wafer loading and unloading structures 7, a reciprocating moving structure 8, and a laser cutting structure 6 mounted on the XY axis moving structure 5 are mounted on the upper end of the work surface 4, the two sets of wafer loading and unloading structures 7 are used to take and place wafers respectively, and the wafer loading and unloading structure 7 takes out the wafer and places it on the reciprocating moving structure 8, the laser cutting structure 6 cuts the wafers on the reciprocating moving structure 8, and the XY axis moving structure 5 drives the laser cutting structure 6 to move in the X axis or Y axis direction. Two groups of wafers can be placed on the reciprocating moving structure 8, and after any group of wafers is cut by the laser cutting structure 6, the reciprocating moving structure 8 moves in the X axis so that the uncut wafer corresponds to the laser cutting structure 6. After the reciprocating moving structure 8 moves, the wafer loading and unloading structure 7 close to the side of the cut wafer takes the wafer and places the uncut wafer on the reciprocating moving structure 8. A vacuum pump is also provided in the base 1, and the vacuum pump is connected to the reciprocating moving structure 8 through a pipe to adsorb the wafer.

[0033] In this embodiment, the specific working principle is as follows: first, the staff puts the wafer on the wafer loading and unloading structure 7, and then starts the cutting equipment. At this time, the uncut wafer is placed on the reciprocating moving structure 8 through the action of the wafer loading and unloading structure 7, and then the reciprocating moving structure 8 starts to move so that the wafer is located directly below the laser cutting structure 6, and then the laser cutting structure 6 is used to cut the wafer, and then the XY axis moving structure 5 drives the laser cutting structure 6 to move in the X and Y axis directions, thereby facilitating the laser cutting structure 6 to cut the wafer. While cutting, another group of wafers are cut. The loading and unloading structure 7 places the uncut wafers on the reciprocating movable structure 8. When a group of wafers is cut, the cut wafers are taken by the wafer loading and unloading structure 7 and the uncut wafers are placed on the reciprocating movable structure 8 at the same time. The wafers are adsorbed on the reciprocating movable structure 8 by a vacuum pump to be fixed, and then such operations are repeated, thereby realizing continuous taking of wafers and continuous cutting of wafers, thereby solving the problem that the existing cutting equipment for cutting wafers cannot take wafers continuously, making it impossible to cut continuously, thereby reducing the cutting efficiency.

[0034] According to the above, the XY axis moving structure 5 can be specifically referred to Figure 3 and Figure 8It can be seen that the XY-axis moving structure 5 includes a first guide rail 501, a first motor 502, a second guide rail 503, and a second motor 504; the first guide rail 501 is installed at the upper end of the work table 4, and the first motor 502 is installed on the side of the first guide rail 501, the output end of the first motor 502 is connected to a lead screw and horizontally passes through the first guide rail 501, and a lead screw slider is provided on the lead screw, and a second guide rail 503 is provided on the lead screw slider, and a second motor 504 is provided on one side of the second guide rail 503, and the output end of the second motor 504 is connected to a lead screw and horizontally passes through the second guide rail 503, and the lead screw surface is also provided with a lead screw slider, and a laser cutting structure 6 is provided on the lead screw slider, which mainly drives the lead screw to rotate through the action of the first motor 502 and then drives the second guide rail 503 to move, and then drives the lead screw to rotate through the second motor 504 and then drives the laser cutting structure 6 to realize movement in the X-axis direction and the Y-axis direction, thereby facilitating the laser cutting structure 6 to cut the wafer.

[0035] According to the above, the laser cutting structure 6 can be specifically referred to Figure 6 and Figure 8 It can be seen that the laser cutting structure 6 includes a connecting seat 601, a laser fixing part 602, and a laser head 603; the connecting seat 601 is installed on the screw slider, and a laser fixing part 602 is provided at the end of the connecting seat 601, and a laser head 603 is clamped in the laser fixing part 602. The laser head 603 is initially located in the middle of the reciprocating moving structure 8. When the reciprocating moving structure 8 moves the wafer to directly below the laser head 603, the laser head 603 starts to operate.

[0036] How the wafer loading and unloading structure 7 can put the uncut wafers onto the reciprocating moving structure 8 and how the cut wafers can be taken out at the same time, please refer to Figure 9 and Figure 10 706, a cylinder 708, and a plurality of cylinders 709 are connected to each other through the cylinder 709. Figure 9The tray 707 on the right side can be driven to rise and fall by the telescopic motor 704, thereby facilitating the wafer taking operation.

[0037] In combination with the above, the wafer loading and unloading structure 7 also includes a material unloading suction cup 703, a steering plate 709, a material loading nozzle 710, and a motor 711; its cylinder 708 is installed on the upper end of the work table 4, and a flat plate is provided on the upper end of the cylinder 708, and a motor 711 is installed on the flat plate. The output end of the motor 711 is connected to the steering plate 709, and one end of the steering plate 709 is provided with a material loading nozzle 710 and the other end is provided with a material unloading suction cup 703. When taking the wafer, the motor 711 is used to move the material unloading nozzle 710. The steering plate 709 is driven to rotate so that the loading nozzle 710 is located just above the tray 707. Then, the cylinder 708 is contracted to allow the loading nozzle 710 to pick up the wafer. At this time, the unloading suction cup 703 is located on the reciprocating moving structure 8, above the cut wafer. Then, the cylinder 708 is extended to drive the steering plate 709 to move upward, and then turn 90 degrees clockwise to place the uncut wafer on the reciprocating moving structure 8. The cut wafer is placed in the tray 707 (located at Figure 9 The material tray 707 on the left side) can thus be used for simultaneous picking operations.

[0038] According to the above, the reciprocating moving structure can be specifically referred to Figure 7 It can be seen that the reciprocating movable structure 8 includes a support tube 801, a workbench 802, a third guide rail 803, a third motor 804, a vacuum sealing plate 805, a glass plate 806, and a vacuum extraction tube 807; the support tube 801 is installed on the workbench surface 4, and a workbench 802 is provided at the upper end of the support tube 801, a third guide rail 803 is provided on the workbench 802, and a third motor 804 is provided on one side of the third guide rail 803, and a lead screw is connected to the output end of the third motor 804, a lead screw slider is provided on the surface of the lead screw, and a vacuum sealing plate 805 is connected to the end of the slider, a glass plate 806 is provided on the vacuum sealing plate 805, and a vacuum extraction tube 807 connected to a vacuum pump is provided on one side of the vacuum sealing plate 805.

[0039] In order to maintain the stability of the movement of the XY axis moving structure 5, please refer to Figure 6 and Figure 8 It can be seen that a first slide rail 9 is installed on the work surface 4 , a first slider 10 is movable on the surface of the first slide rail 9 , and the upper end of the first slider 10 is connected to the lower end of the second guide rail 503 .

[0040] In order to clamp the wafer, please refer to Figure 10 and Figure 11It can be seen that a second slide rail 11 is distributed on the mounting plate 702, and a second slider 12 is movably provided on the surface of the second slide rail 11. A clamping plate 13 is installed on the second slider 12, and the clamping plate 13 is retracted inward and extends into the opening of the material tray 707, so that the user only needs to push the holding plate 13 to clamp the wafer.

[0041] In order to improve the cutting accuracy of laser head 603, please refer to Figure 12 A connecting plate 14 is provided on the inner top of the upper shell plate 3 , and a laser cutting camera 15 corresponding to the surface of the glass plate 806 is installed on the connecting plate 14 .

[0042] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A cutting device for cutting wafers, comprising a base (1), a mounting frame (2), an upper shell plate (3), and a work surface (4), wherein the work surface (4) is mounted on the upper end of the base (1), the mounting frame (2) is located on the upper end of the work surface (4), and the upper shell plate (3) is mounted on the upper end of the mounting frame (2), characterized in that: An XY axis moving structure (5), two sets of wafer loading and unloading structures (7), a reciprocating moving structure (8), and a laser cutting structure (6) installed on the XY axis moving structure (5) are installed on the upper end of the work table (4). The two sets of wafer loading and unloading structures (7) are used to take and place wafers respectively. The wafer loading and unloading structures (7) take out the wafers and place them on the reciprocating moving structure (8). The laser cutting structure (6) cuts the wafers on the reciprocating moving structure (8). The XY axis moving structure (5) drives the laser cutting structure (6) to perform X-axis or Y-axis cutting. The reciprocating movable structure (8) moves in the direction of rotation. Two groups of wafers can be placed on the reciprocating movable structure (8). After any one group of wafers is cut by the laser cutting structure (6), the reciprocating movable structure (8) moves in the X-axis so that the uncut wafer corresponds to the laser cutting structure (6). After the reciprocating movable structure (8) moves, the wafer loading and unloading structure (7) close to the side of the cut wafer takes the wafer and places the uncut wafer on the reciprocating movable structure (8). A vacuum pump is also provided in the base (1). The vacuum pump is connected to the reciprocating movable structure (8) through a pipe to adsorb the wafer.

2. The wafer cutting device according to claim 1, wherein: The XY axis moving structure (5) comprises a first guide rail (501), a first motor (502), a second guide rail (503), and a second motor (504); the first guide rail (501) is mounted on the upper end of the work table (4); the first motor (502) is mounted on the side of the first guide rail (501); the output end of the first motor (502) is connected to a lead screw and laterally passes through the first guide rail (501); a lead screw slider is provided on the lead screw; a second guide rail (503) is provided on the lead screw slider; a second motor (504) is provided on one side of the second guide rail (503); the output end of the second motor (504) is connected to a lead screw and laterally passes through the second guide rail (503); the surface of the lead screw is also provided with a lead screw slider; a laser cutting structure (6) is provided on the lead screw slider.

3. The wafer cutting device according to claim 1, wherein: The laser cutting structure (6) comprises a connecting seat (601), a laser fixing member (602), and a laser head (603); the connecting seat (601) is mounted on a lead screw slider, a laser fixing member (602) is provided at the end of the connecting seat (601), a laser head (603) is clamped in the laser fixing member (602), and the laser head (603) is initially located in the middle of the reciprocating movable structure (8).

4. The wafer cutting device according to claim 1, wherein: The wafer loading and unloading structure (7) comprises a hollow tube (701), a mounting plate (702), a telescopic motor (704), a connecting rod (705), a sliding shaft (706), a material tray (707), and a cylinder (708); the hollow tube (701) is mounted on a work surface (4); the mounting plate (702) is mounted on the upper end of the hollow tube (701) and connected by bolts; two groups of telescopic motors (704) are symmetrically inverted at the lower end of the mounting plate (702); the telescopic end of the telescopic motor (704) located on the right side of the mounting plate (702) is connected to a connecting rod (705); the upper end of the connecting rod (705) is connected to a sliding shaft (706) and extends upward through the mounting plate (702); a material tray (707) is provided at the end of the mounting plate (702); an opening is provided on the surface of the material tray (707); and the other group of telescopic motors (704) has the same structure as the telescopic motor (704) on the right side.

5. The wafer cutting device according to claim 4, wherein: The wafer loading and unloading structure (7) further comprises a material unloading suction cup (703), a steering plate (709), a material loading nozzle (710), and a motor (711); the cylinder (708) is mounted on the upper end of the work table (4); a flat plate is provided at the upper end of the cylinder (708); a motor (711) is mounted on the flat plate; the output end of the motor (711) is connected to the steering plate (709); one end of the steering plate (709) is provided with a material loading nozzle (710), and the other end is provided with a material unloading suction cup (703).

6. The wafer cutting device according to claim 1, wherein: The reciprocating movable structure (8) comprises a support tube (801), a workbench (802), a third guide rail (803), a third motor (804), a vacuum sealing plate (805), a glass plate (806), and a vacuum extraction tube (807); the support tube (801) is mounted on the workbench surface (4); a workbench (802) is provided at the upper end of the support tube (801); a third guide rail (803) is provided on the workbench (802); a third motor (804) is provided on one side of the third guide rail (803); a lead screw is connected to the output end of the third motor (804); a lead screw slider is provided on the surface of the lead screw; an end of the slider is connected to the vacuum sealing plate (805); a glass plate (806) is provided on the vacuum sealing plate (805); and a vacuum extraction tube (807) connected to a vacuum pump is provided on one side of the vacuum sealing plate (805).

7. The wafer cutting device according to claim 1, wherein: A first slide rail (9) is installed on the work surface (4), a first slider (10) is movable on the surface of the first slide rail (9), and the upper end of the first slider (10) is connected to the lower end of the second guide rail (503).

8. The wafer cutting device according to claim 4, wherein: A second slide rail (11) is distributed on the mounting plate (702), a second slider (12) is movably provided on the surface of the second slide rail (11), and a clamping plate (13) is installed on the second slider (12), wherein the clamping plate (13) is retracted inward and extends into the opening of the material tray (707).

9. The wafer cutting device according to claim 1, wherein: A connecting plate (14) is provided on the inner top of the upper shell plate (3), and a laser cutting camera (15) corresponding to the surface of the glass plate (806) is installed on the connecting plate (14).

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