Uniform positioning device of laser wafer cutting machine

Abstract

The utility model discloses a uniform positioning device of a laser wafer cutting machine, which belongs to the technical field of positioning devices and comprises a frame provided with a plurality of filter holes. The positioning mechanism comprises an annular frame, a rotating ring, a sliding block, an extrusion spring, a connecting block, an extrusion block and an electric telescopic rod, the annular frame is fixedly connected to the rack, a plurality of filtering holes are formed in the annular frame, and the rotating ring is coaxially and rotatably connected to the interior of the annular frame. The output end of an electric telescopic rod extends to drive a rotating ring to rotate, the rotating ring rotates to enable a plurality of sliding blocks to synchronously move in corresponding radial grooves through a plurality of curved grooves, and then a plurality of extrusion blocks are synchronously driven to extrude and abut against the peripheral side of a wafer by extruding springs and connecting blocks. Therefore, a uniform extruding and fixing effect can be conveniently formed on the wafers with different diameters, and the stability of the wafers in the cutting process is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of positioning devices, and in particular relates to a uniform positioning device for a laser wafer cutting machine. Background Art

[0002] A wafer refers to the silicon chip used to manufacture silicon semiconductor integrated circuits. During the wafer cutting process, wafer laser cutting equipment is often used to cut and manufacture the wafer.

[0003] Chinese utility model application number CN202222285400.4 discloses a positioning device for a laser wafer cutting machine, which drives the piston rod at its output end to extend and retract through two No. 1 hydraulic cylinders, thereby moving the U-shaped clamping frame to form an extrusion, clamping and fixation on both sides of the wafer. This fixing method uses the extrusion and fixation effect of the wafer from both sides, which easily leads to uneven distribution of the extrusion force on the wafer, affecting the clamping and fixing effect of the wafer, and is not conducive to improving the stability of the wafer during the cutting process. Utility Model Content

[0004] The purpose of the utility model is to propose a uniform positioning device for a laser wafer cutting machine to solve the problem that the traditional technology of squeezing and fixing the wafer from both sides easily leads to uneven distribution of the squeezing force on the wafer, affecting the clamping and fixing effect of the wafer.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A uniform positioning device for a laser wafer cutting machine, comprising:

[0007] A frame, wherein a plurality of filter holes are formed on the frame;

[0008] The positioning mechanism includes an annular frame, a rotating ring, a sliding block, an extrusion spring, a connecting block, an extrusion block and an electric telescopic rod. The annular frame is fixedly connected to the frame, wherein a plurality of filter holes are located inside the annular frame, and a rotating ring is coaxially rotatably connected inside the annular frame. A plurality of curved grooves are provided on the rotating ring, and a plurality of radial grooves are provided on the annular frame. The plurality of curved grooves correspond one-to-one to the plurality of radial grooves, and the corresponding curved grooves and radial grooves are slidably connected with the same sliding block, and a connecting block is slidably connected in the radial groove. An extrusion spring is fixedly connected between the sliding block and the connecting block, and an end of the connecting block away from the extrusion spring is fixedly connected to the extrusion block, and an electric telescopic rod is rotatably installed on the outer peripheral side of the annular frame, and the output end of the electric telescopic rod is rotatably connected to the outer side of the rotating ring.

[0009] Preferably, a collection box is slidably connected in the frame, and the top of the collection box is connected to a plurality of filter holes.

[0010] Preferably, an annular groove is coaxially opened on the inner circumference of the annular frame, the rotating ring is coaxially rotatably connected in the annular groove, and the plurality of radial grooves are connected to the bottom of the annular groove.

[0011] Preferably, the plurality of curved grooves are distributed on the rotating ring in a circular array with the center of the rotating ring as the center, wherein one end of the curved groove is close to the inner circumference of the rotating ring and the other end is close to the outer circumference of the rotating ring, and the radial groove is axially arranged along the radial direction of the annular frame.

[0012] Preferably, the extrusion block is arc-shaped, and an arc-shaped groove is coaxially opened on the side away from the connection block, and the arc-shaped groove is engaged with the outer peripheral side of the wafer.

[0013] Preferably, a protective pad is fixedly connected in the arc-shaped groove, and the protective pad is made of rubber.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] In the utility model, a positioning mechanism is provided, and the output end of the electric telescopic rod is extended to drive the rotating ring to rotate. The rotating ring rotates through multiple curved grooves to enable multiple sliding blocks to move synchronously in the corresponding radial grooves, and then the multiple extrusion blocks are synchronously driven to press against the outer peripheral side of the wafer through the extrusion spring and the connecting block, thereby facilitating a uniform extrusion and fixing effect on wafers of different diameters, thereby improving the stability during the wafer cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the horizontal cross-sectional structure of the rotating ring of the present invention;

[0018] Figure 3 This is a schematic diagram of the horizontal cross-sectional structure of the bottom of the annular frame of the present invention.

[0019] In the figure: 1 frame, 2 filter hole, 3 annular frame, 4 rotating ring, 5 curved groove, 6 radial groove, 7 sliding block, 8 extrusion spring, 9 connecting block, 10 extrusion block, 11 arc groove, 12 protective pad, 13 electric telescopic rod, 14 collection box. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Reference Figure 1-Figure 3 , a uniform positioning device for a laser wafer cutting machine, comprising:

[0022] The frame 1 is provided with a plurality of filter holes 2, a collection box 14 is slidably connected inside the frame 1, and the top of the collection box 14 is connected with the plurality of filter holes 2. The waste generated by cutting falls into the collection box 14 through the filter holes 2, which is convenient for subsequent unified treatment of the waste.

[0023] The positioning mechanism includes an annular frame 3, a rotating ring 4, a sliding block 7, an extrusion spring 8, a connecting block 9, an extrusion block 10 and an electric telescopic rod 13. The annular frame 3 is fixedly connected to the frame 1, wherein multiple filter holes 2 are located inside the annular frame 3, and the rotating ring 4 is coaxially rotatably connected inside the annular frame 3. A plurality of curved grooves 5 are provided on the rotating ring 4, and a plurality of radial grooves 6 are provided on the annular frame 3. The plurality of curved grooves 5 correspond one-to-one to the plurality of radial grooves 6, and the corresponding curved grooves 5 and radial grooves 6 are slidably connected with the same sliding block 7, and the connecting block 9 is slidably connected in the radial groove 6. An extrusion spring 8 is fixedly connected between the sliding block 7 and the connecting block 9, and the connecting block 9 is fixedly connected to the extrusion block 10 at one end away from the extrusion spring 8. The electric telescopic rod 13 is rotatably installed on the outer peripheral side of the annular frame 3, and the output end of the electric telescopic rod 13 is rotatably connected to the outer side of the rotating ring 4.

[0024] The extrusion spring 8 enables the sliding block 7 to form an elastic clamping effect on the peripheral side of the wafer through the connecting block 9 and the extrusion block 10 when moving, effectively avoiding damage to the wafer caused by excessive extrusion.

[0025] An annular groove is coaxially opened on the inner circumference of the annular frame 3, and the rotating ring 4 is coaxially rotatably connected in the annular groove. A plurality of radial grooves are connected to the bottom of the annular groove.

[0026] Multiple curved grooves 5 are distributed in a circular array on the rotating ring 4 with the center of the rotating ring 4 as the center, wherein one end of the curved groove 5 is close to the inner circumference of the rotating ring 4, and the other end is close to the outer circumference of the rotating ring 4, and the radial groove 6 is axially arranged along the radial direction of the annular frame 3.

[0027] The extrusion block 10 is arc-shaped, and an arc groove 11 is coaxially opened on the side away from the connecting block 9. The arc groove is engaged with the outer peripheral side of the wafer. The arc groove 11 improves the contact effect between the extrusion block 10 and the wafer, thereby improving the extrusion and fixing effect of the wafer.

[0028] The frame 1 is fixedly connected with a plurality of support columns, the top of which is flush with the bottom of the arc groove 11, so that the arc groove 11 can quickly clamp the wafer placed on the support column when it moves with the extrusion block 10, without the need for manual assistance, thereby improving processing efficiency.

[0029] A protective pad 12 is fixedly connected in the arc groove 11. The protective pad 12 is made of rubber. The protective pad 12 further improves the contact effect between the arc groove 11 and the wafer, thereby improving the stability of wafer fixation.

[0030] The operating principle of the present invention is now described as follows:

[0031] When laser cutting the wafer, the wafer is placed on the frame 1, the electric telescopic rod 13 is started, the output end of the electric telescopic rod 13 is extended, driving the rotating ring 4 to rotate, and the rotation of the rotating ring 4 causes the curved groove 5 to rotate accordingly. Under the restriction of the radial groove 6, the sliding block 7 moves from the curved groove 5 close to the outer end of the rotating ring 4 to the curved groove 5 close to the inner end of the rotating ring 4. At the same time, the sliding block 7 moves in the radial groove 6, and the extrusion block 10 is pushed close to the outer peripheral side of the wafer by the extrusion spring 8 and the connecting block 9. Multiple extrusion blocks 10 are synchronously driven to be extruded against the outer peripheral side of the wafer, thereby facilitating the formation of a uniform extrusion and fixing effect on wafers of different diameters, thereby improving the stability during the wafer cutting process.

[0032] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A uniform positioning device for a laser wafer cutting machine, characterized in that: include: A frame (1), wherein a plurality of filter holes (2) are provided on the frame (1); A positioning mechanism, comprising an annular frame (3), a rotating ring (4), a sliding block (7), an extrusion spring (8), a connecting block (9), an extrusion block (10) and an electric telescopic rod (13), wherein the annular frame (3) is fixedly connected to a frame (1), wherein a plurality of filter holes (2) are located inside the annular frame (3), a rotating ring (4) is coaxially connected to the annular frame (3), a plurality of curved grooves (5) are provided on the rotating ring (4), a plurality of radial grooves (6) are provided on the annular frame (3), and a plurality of the curved grooves (5) are provided on the annular frame (3). ) correspond one to one with a plurality of radial grooves (6), and the corresponding curved grooves (5) and radial grooves (6) are slidably connected to the same sliding block (7), a connecting block (9) is slidably connected in the radial groove (6), an extrusion spring (8) is fixedly connected between the sliding block (7) and the connecting block (9), an extrusion block (10) is fixedly connected to one end of the connecting block (9) away from the extrusion spring (8), an electric telescopic rod (13) is rotatably installed on the outer peripheral side of the annular frame (3), and the output end of the electric telescopic rod (13) is rotatably connected to the outer side of the rotating ring (4).

2. The uniform positioning device for a laser wafer cutting machine according to claim 1, characterized in that: in: A collecting box (14) is slidably connected inside the frame (1), and the top of the collecting box (14) is connected to a plurality of filter holes (2).

3. The uniform positioning device for a laser wafer cutting machine according to claim 1, characterized in that: in: An annular groove is coaxially provided on the inner circumference of the annular frame (3), the rotating ring (4) is coaxially rotatably connected in the annular groove, and a plurality of radial grooves are connected to the bottom of the annular groove.

4. The uniform positioning device for a laser wafer cutting machine according to claim 3, characterized in that: in: The plurality of curved grooves (5) are distributed on the rotating ring (4) in a circular array with the center of the rotating ring (4) as the center, wherein one end of the curved groove (5) is close to the inner circumference of the rotating ring (4) and the other end is close to the outer circumference of the rotating ring (4), and the radial groove (6) is axially arranged along the radial direction of the annular frame (3).

5. The uniform positioning device for a laser wafer cutting machine according to claim 1, characterized in that: in: The extrusion block (10) is arc-shaped, and is coaxially provided with an arc groove (11) on a side away from the connection block (9), and the arc groove is engaged with the outer peripheral side of the wafer.

6. The uniform positioning device for a laser wafer cutting machine according to claim 5, characterized in that: in: A protective pad (12) is fixedly connected in the arc-shaped groove (11), and the protective pad (12) is made of rubber.

Images