Edge grinding device for semiconductor processing

Abstract

The utility model provides an edge grinding device for semiconductor processing, which comprises a semiconductor processing table and further comprises a moving structure arranged on the semiconductor processing table. And the rotating structure is arranged on the moving structure. A second rotating motor rotates to drive a first square rod, a second square rod, a third square rod and a fourth square rod to synchronously rotate, four polishers are driven to rotate, the polishing angles of the four polishers are synchronously adjusted, the polishing angles of the four polishers are conveniently and synchronously adjusted according to the polishing requirement, and the polishing efficiency is improved. The first rotating motor rotates to drive the first threaded rod, the second threaded rod, the third threaded rod and the fourth threaded rod to rotate synchronously, the four polishers are driven to move, the four side faces of a semiconductor can be conveniently and synchronously polished, and the polishing efficiency of the semiconductor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an edge grinder for semiconductor processing. Background Art

[0002] Semiconductors are materials with electrical conductivity intermediate between conductors and insulators. Their conductivity at room temperature lies between conductors and insulators, making them crucial in the electronics industry. Components and integrated circuits made from semiconductor materials are fundamental to the electronics industry and widely used in all aspects of electronic technology. Semiconductor processing often requires edge grinding.

[0003] Among existing Chinese utility models, publication number CN220592589U discloses a semiconductor silicon wafer chamfering and edge grinding machine, comprising a frame and a semiconductor silicon wafer. The frame is internally provided with a lateral movement mechanism for moving the semiconductor silicon wafer, and a stepper motor is fixedly mounted on the bottom surface of the moving portion of the lateral movement mechanism. The utility model utilizes the lateral movement mechanism to laterally move the semiconductor silicon wafer, causing the rear corners of the semiconductor silicon wafer to contact the surface of a grinding block to chamfer the semiconductor silicon wafer. After a position sensor detects that one side has been chamfered, the stepper motor drives the movable plate and the semiconductor silicon wafer to rotate 90 degrees, causing the other side to be located at the rear. The lateral movement mechanism then moves the semiconductor silicon wafer to chamfer the other side. This reciprocating operation completes the chamfering of the semiconductor silicon wafer's corners.

[0004] Referring to the aforementioned semiconductor silicon wafer chamfering and edge grinding machine, when processing the four sides of a semiconductor, the edge grinding machine needs to first complete the processing of one side, and then after rotating, process the other side of the semiconductor again until all four sides are processed. This means that to complete the processing of one semiconductor, four grindings and three rotations are required, which makes the overall semiconductor edge grinding efficiency relatively slow. Therefore, how to better synchronously grind the four sides of a semiconductor and improve the efficiency of semiconductor grinding is an important issue that needs to be solved in the design of semiconductor processing edge grinding machines. Utility Model Content

[0005] The utility model provides an edge grinder for semiconductor processing in order to solve the problem that the efficiency of the overall edge grinding process of a semiconductor is relatively low.

[0006] The utility model solves the above technical problems through the following technical solutions:

[0007] The utility model provides an edge grinder for semiconductor processing, comprising a semiconductor processing table and further comprising:

[0008] A moving structure, wherein the moving structure is disposed on a semiconductor processing table;

[0009] A rotating structure, wherein the rotating structure is arranged on the moving structure;

[0010] The grinding structure is arranged on the rotating structure, and the rotating structure rotates to synchronously drive the grinding structure to rotate.

[0011] Preferably, a support frame is fixedly connected to the bottom side wall of the semiconductor processing table, an electric push rod three is fixedly connected to the middle of the top inner wall of the support frame, the bottom of the electric push rod three is fixedly connected to a fixing plate three, a fixing pad two is fixedly connected to the bottom side wall of the fixing plate three, and two support plates two are fixedly connected to the bottom side wall of the semiconductor processing table.

[0012] In this technical solution, the support plate 2 supports the semiconductor processing table, the electric push rod 3 extends to push the fixed plate 3 down, and the fixed plate 3 drives the fixed pad 2 to go down.

[0013] Preferably, a support rod is fixedly connected to the middle of the top side wall of the semiconductor processing table, the top of the support rod is fixedly connected to support plate one, a fixed pad one is fixedly connected to the top side wall of support plate one, a sliding frame is fixedly connected to the top side wall of the semiconductor processing table, and sliding grooves are provided on the side walls of the four sides of the semiconductor processing table.

[0014] In this technical solution, the semiconductor to be processed can be placed on the fixing pad 1, and the fixing pad 1 can cooperate with the fixing pad 2 to fix the semiconductor.

[0015] Preferably, the movable structure includes a support block 1, a threaded rod 1, a threaded rod 2, a threaded rod 3, a rotating connecting rod 1, a rotating motor 1, a rotating gear 1 and a threaded rod 4. The support block 1 is fixedly connected to the side walls of the four sides of the semiconductor processing table at equal distances. The threaded rod 1, the threaded rod 2, the threaded rod 3 and the two ends of the threaded rod 3 are fixedly connected with the rotating connecting rod 1. The rotating connecting rod 1 is rotatably connected to the side wall of the support block 1. The ends of the rotating connecting rod 1 at both ends of the threaded rod 3 and the threaded rod 4 are fixedly connected to the rotating gear 1. The ends of the rotating connecting rod 1 at one end of the threaded rod 1 and the threaded rod 2 are fixedly connected to the rotating gear 1. The rotating motor 1 is fixedly connected to the side wall of the support block 1. The rotating end of the rotating motor 1 is fixedly connected to the rotating connecting rod 1 at the other end of the threaded rod 2.

[0016] Preferably, two adjacent rotating gears on the rotating connecting rod are meshed with each other.

[0017] In this technical solution, the rotating motor 1 drives the rotating connecting rod 1 to rotate, the rotating connecting rod 1 drives the threaded rod 2 to rotate, the threaded rod 2 drives the threaded rod 4, the threaded rod 3 and the threaded rod 1 to rotate in sequence through the rotating gear 1, and the threaded rod 1, the threaded rod 2, the threaded rod 3 and the threaded rod 4 rotate synchronously.

[0018] Preferably, the movable structure includes a movable block and a movable frame, and the threaded rod one, threaded rod two, threaded rod three and threaded rod four are all threadedly connected with a movable block, the movable block is slidably connected in the sliding groove, the end of the movable block is fixedly connected to the movable frame, and the movable frame is slidably connected to the sliding frame.

[0019] In this technical solution, threaded rod one, threaded rod two, threaded rod three and threaded rod four rotate synchronously to drive four moving blocks to move simultaneously, and the moving blocks drive the moving frame to move.

[0020] Preferably, the rotating structure includes support block two, square rod one, square rod two, square rod three, square rod four, rotating connecting rod two, rotating motor two, rotating gear one and threaded rod four, the support block two is fixedly connected to the top side wall of the sliding frame at equal distances, the two ends of the square rod one, square rod two, square rod three and square rod four are fixedly connected with rotating connecting rod two, the rotating connecting rod two is rotatably connected to the side wall of the support block two, the ends of the rotating connecting rod two at both ends of the square rod one and square rod four are fixedly connected with rotating gear two, the rotating connecting rod two at one end of the square rod two and square rod four is fixedly connected with rotating gear two, the rotating motor two is fixedly connected to the side wall of the support block two, and the rotating end of the rotating motor two is fixedly connected to the rotating connecting rod two at the other end of the square rod three.

[0021] Preferably, the two adjacent rotating gears 2 on the rotating connecting rod 2 are meshed with each other.

[0022] In this technical solution, the rotating motor 2 rotates to drive the rotating connecting rod 2 to rotate, the rotating connecting rod 2 drives the square rod 3 to rotate, and the square rod 3 drives the square rod 4, square rod 1 and square rod 2 to rotate in sequence through the rotating gear 2, and the square rod 1, square rod 2, square rod 3 and square rod 4 rotate synchronously.

[0023] Preferably, the rotating structure includes a connecting frame and a rotating block, the connecting frame is fixedly connected to the top side wall of the movable frame, the internal rotation of the connecting frame is connected to the rotating block, and the rotating block is respectively slidably connected to the side walls of square rod one, square rod two, square rod three and square rod four.

[0024] In this technical solution, the synchronous rotation of the square rods 1, 2, 3 and 4 drives the four rotating blocks to rotate inward synchronously.

[0025] Preferably, the grinding structure includes a fixed plate 1, an electric push rod 1, a sliding rod, a fixed plate 2, a grinder, a support block 3 and an electric push rod 2, the electric push rod 2 is fixedly connected to the top side wall of the rotating block, the top of the electric push rod 2 is fixedly connected to the support block 3, the support block 3 is slidably connected to the sliding rod, one end of the sliding rod is fixedly connected to the fixed plate 1, the electric push rod 1 is fixedly connected between the fixed plate 1 and the support block 3, the other end of the sliding rod is fixedly connected to the fixed plate 2, and the grinder is fixedly connected to the side wall of the fixed plate 2.

[0026] In this technical solution, the extension of electric push rod 2 can push the grinder up, and the extension of electric push rod 1 can push the grinder to move. The grinder is adjusted by electric push rod 1 and electric push rod 2 so that the four grinders are respectively attached to the four sides of the semiconductor.

[0027] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present utility model.

[0028] The positive progress effect of this utility model is:

[0029] 1. By rotating the motor 2, the connecting rod 2 is driven to rotate, and the connecting rod 2 drives the square rod 3 to rotate. The square rod 3 drives the square rod 4, square rod 1 and square rod 2 in sequence by rotating the gear 2. The square rod 1, square rod 2, square rod 3 and square rod 4 rotate synchronously, driving the four rotating blocks to rotate synchronously inward. The rotation of the rotating block drives the grinder to rotate, and the grinding angles of the four grinders are synchronously adjusted, so that the grinding angles of the four grinders can be synchronously adjusted according to the needs of grinding.

[0030] 2. By rotating the motor 1, the rotating connecting rod 1 is driven to rotate, the rotating connecting rod 1 drives the threaded rod 2 to rotate, the threaded rod 2 drives the threaded rod 4, the threaded rod 3 and the threaded rod 1 in sequence by rotating the gear 1, the threaded rod 1, the threaded rod 2, the threaded rod 3 and the threaded rod 4 rotate synchronously, driving the four moving blocks to move simultaneously, the moving block drives the moving frame to move, the moving frame drives the connecting frame to move, the connecting frame drives the rotating block to move, and the rotating block drives the grinder to move, so as to facilitate the synchronous grinding of the four sides of the semiconductor and improve the efficiency of the semiconductor grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model.

[0032] Figure 2 It is a schematic diagram of the overall internal structure of the utility model.

[0033] Figure 3 This is a schematic diagram of the internal structure of the utility model as a whole from a top view.

[0034] Description of Reference Numerals

[0035] 1. Semiconductor processing table; 2. Support frame; 3. Moving structure; 301. Support block 1; 302. Threaded rod 1; 303. Threaded rod 2; 304. Threaded rod 3; 305. Rotating connecting rod 1; 306. Rotating motor 1; 307. Rotating gear 1; 308. Threaded rod 4; 311. Moving block; 312. Moving frame; 4. Sliding slot; 5. Rotating structure; 501. Support block 2; 502. Square rod 1; 503. Square rod 2; 504. Square rod 3; 505. Square rod 4; 506. Rotate connecting rod two; 507, rotate gear two; 508, rotate motor two; 511, connecting frame; 512, rotating block; 6, sliding frame; 7, grinding structure; 701, fixed plate one; 702, electric push rod one; 703, sliding rod; 704, fixed plate two; 705, grinder; 706, support block three; 707, electric push rod two; 8, support rod; 9, support plate one; 10, electric push rod three; 11, fixed plate three; 12, fixed pad one; 13, support plate two; 14, fixed pad two. DETAILED DESCRIPTION

[0036] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0037] like Figure 1-3 As shown, the edge grinder for semiconductor processing includes a semiconductor processing table 1 and further includes:

[0038] A mobile structure 3, wherein the mobile structure 3 is arranged on the semiconductor processing table 1;

[0039] A rotating structure 5, wherein the rotating structure 5 is arranged on the moving structure 3;

[0040] The grinding structure 7 is provided on the rotating structure 5 , and the rotating structure 5 rotates to synchronously drive the grinding structure 7 to rotate.

[0041] The support frame 2 is fixedly connected to the bottom side wall of the semiconductor processing table 1, and the electric push rod 3 10 is fixedly connected to the middle of the top inner wall of the support frame 2. The bottom of the electric push rod 3 10 is fixedly connected to the fixing plate 3 11, and the bottom side wall of the fixing plate 3 11 is fixedly connected to the fixing pad 2 14. The bottom side wall of the semiconductor processing table 1 is fixedly connected to two support plates 2 13.

[0042] The second supporting plate 13 supports the semiconductor processing table 1 , the third electric push rod 10 extends to push the third fixing plate 11 downward, and the third fixing plate 11 drives the second fixing pad 14 downward.

[0043] A support rod 8 is fixedly connected to the middle of the top side wall of the semiconductor processing table 1, the top of the support rod 8 is fixedly connected to a support plate 9, a fixed pad 12 is fixedly connected to the top side wall of the support plate 9, a sliding frame 6 is fixedly connected to the top side wall of the semiconductor processing table 1, and sliding grooves 4 are provided on the side walls of the four sides of the semiconductor processing table 1.

[0044] The semiconductor to be processed can be placed on the fixing pad 12 , and the fixing pad 12 can cooperate with the fixing pad 2 14 to fix the semiconductor.

[0045] The mobile structure 3 includes a support block 1 301, a threaded rod 1 302, a threaded rod 2 303, a threaded rod 304, a rotating connecting rod 1 305, a rotating motor 1 306, a rotating gear 1 307 and a threaded rod 4 308. The support block 1 301 is fixedly connected to the side walls of the four sides of the semiconductor processing table 1 at equal distances. The threaded rod 1 302, the threaded rod 2 303, the threaded rod 304 and the two ends of the threaded rod 304 are fixedly connected to the rotating connecting rod 1 305. The rotating connecting rod 1 305 is rotated. The rotating motor 306 is fixedly connected to the side wall of the support block 1 301, and the ends of the rotating connecting rod 1 305 at both ends of the threaded rod 304 and the threaded rod 4 308 are fixedly connected to the rotating gear 1 307. The ends of the rotating connecting rod 1 305 at one end of the threaded rod 1 302 and the threaded rod 2 303 are fixedly connected to the rotating gear 1 307. The rotating motor 1 306 is fixedly connected to the side wall of the support block 1 301, and the rotating end of the rotating motor 1 306 is fixedly connected to the rotating connecting rod 1 305 at the other end of the threaded rod 2 303.

[0046] The two adjacent rotating gears 1 307 on the rotating connecting rod 1 305 are meshed with each other.

[0047] The rotating motor 1 306 drives the rotating connecting rod 1 305 to rotate, and the rotating connecting rod 1 305 drives the threaded rod 2 303 to rotate. The threaded rod 2 303 drives the threaded rod 4 308, the threaded rod 3 304 and the threaded rod 1 302 to rotate in sequence through the rotating gear 1 307. The threaded rod 1 302, the threaded rod 2 303, the threaded rod 3 304 and the threaded rod 4 308 rotate synchronously.

[0048] The movable structure 3 includes a movable block 311 and a movable frame 312. The threaded rod 1 302, the threaded rod 2 303, the threaded rod 304 and the threaded rod 4 308 are all threadedly connected with the movable block 311. The movable block 311 is slidably connected in the sliding groove 4. The end of the movable block 311 is fixedly connected to the movable frame 312, and the movable frame 312 is slidably connected to the sliding frame 6.

[0049] The threaded rod 1 302 , the threaded rod 2 303 , the threaded rod 304 and the threaded rod 4 308 rotate synchronously to drive the four moving blocks 311 to move simultaneously, and the moving blocks 311 drive the moving frame 312 to move.

[0050] The rotating structure 5 includes a supporting block 2 501, a square rod 1 502, a square rod 2 503, a square rod 3 504, a square rod 4 505, a rotating connecting rod 2 506, a rotating motor 2 508, a rotating gear 1 307 and a threaded rod 4 308. The supporting block 2 501 is fixedly connected to the top side wall of the sliding frame 6 at equal distances. The two ends of the square rod 1 502, the square rod 2 503, the square rod 3 504 and the square rod 4 505 are fixedly connected with the rotating connecting rod 2 506. The rotating connecting rod 2 506 rotates It is dynamically connected to the side wall of the support block 2 501, and the ends of the rotating connecting rod 2 506 at both ends of the square rod 1 502 and the square rod 4 505 are fixedly connected with the rotating gear 2 507, and the rotating connecting rod 2 506 at one end of the square rod 2 503 and the square rod 4 505 is fixedly connected with the rotating gear 2 507, and the rotating motor 2 508 is fixedly connected to the side wall of the support block 2 501, and the rotating end of the rotating motor 2 508 is fixedly connected to the rotating connecting rod 2 506 at the other end of the square rod 3 504.

[0051] The two adjacent second rotating gears 507 on the second rotating connecting rod 506 are meshed with each other.

[0052] The rotating motor 2 508 rotates to drive the rotating connecting rod 2 506 to rotate, and the rotating connecting rod 2 506 drives the square rod 3 504 to rotate. The square rod 3 504 drives the square rod 4 505, square rod 1 502 and square rod 2 503 to rotate in turn through the rotating gear 2 507. The square rod 1 502, square rod 2 503, square rod 3 504 and square rod 4 505 rotate synchronously.

[0053] The rotating structure 5 includes a connecting frame 511 and a rotating block 512. The connecting frame 511 is fixedly connected to the top side wall of the movable frame 312. The internal rotation of the connecting frame 511 is connected to the rotating block 512. The rotating block 512 is respectively slidably connected to the side walls of square rod 1 502, square rod 2 503, square rod 3 504 and square rod 4 505.

[0054] The synchronous rotation of the square rod 1 502 , the square rod 2 503 , the square rod 3 504 and the square rod 4 505 drives the four rotating blocks 512 to rotate inward synchronously.

[0055] The grinding structure 7 includes a fixed plate 1 701, an electric push rod 1 702, a sliding rod 703, a fixed plate 2 704, a grinder 705, a support block 3 706 and an electric push rod 2 707. The electric push rod 2 707 is fixedly connected to the top side wall of the rotating block 512. The top of the electric push rod 2 707 is fixedly connected to the support block 3 706. The sliding rod 703 is slidably connected to the support block 3 706. One end of the sliding rod 703 is fixedly connected to the fixed plate 1 701. The electric push rod 1 702 is fixedly connected between the fixed plate 1 701 and the support block 3 706. The other end of the sliding rod 703 is fixedly connected to the fixed plate 2 704. The grinder 705 is fixedly connected to the side wall of the fixed plate 2 704.

[0056] The extension of the electric push rod 2 707 can push the grinder 705 up, and the extension of the electric push rod 1 702 can push the grinder to move. The grinder 705 is adjusted by the electric push rod 1 702 and the electric push rod 2 707 so that the four grinders 705 are respectively attached to the four sides of the semiconductor.

[0057] When the present invention is in use, the electrical components appearing in the present application are all connected to an external power supply and a control switch. The semiconductor to be processed is placed on the fixing pad 12, and the electric push rod 3 10 extends to push the fixing plate 3 11 downward. The fixing plate 3 11 drives the fixing pad 2 14 downward, so that the fixing pad 2 14 is against the semiconductor and cooperates with the fixing pad 12 to fix the semiconductor.

[0058] The rotation of the second rotating motor 508 drives the second rotating connecting rod 506 to rotate, and the second rotating connecting rod 506 drives the third square rod 504 to rotate. The third square rod 504 drives the fourth square rod 505, the first square rod 502 and the second square rod 503 to rotate in sequence through the second rotating gear 507. The first square rod 502, the second square rod 503, the third square rod 504 and the fourth square rod 505 rotate synchronously, driving the four rotating blocks 512 to rotate synchronously inward. The rotation of the rotating block 512 drives the grinder 705 to rotate, and the grinding angles of the four grinders 705 are synchronously adjusted, so that the grinding angles of the four grinders 705 can be better adjusted synchronously according to the grinding needs.

[0059] After the angle of the grinder 705 is adjusted, the electric push rod 2 707 is extended to push the grinder 705 up, and the electric push rod 1 702 is extended to push the grinder to move. The grinder 705 is adjusted by the electric push rod 1 702 and the electric push rod 2 707 so that the four grinders 705 are respectively attached to the four sides of the semiconductor;

[0060] The rotating motor 1 306 rotates to drive the rotating connecting rod 1 305 to rotate, and the rotating connecting rod 1 305 drives the threaded rod 2 303 to rotate. The threaded rod 2 303 drives the threaded rod 4 308, the threaded rod 304 and the threaded rod 1 302 to rotate in sequence through the rotating gear 1 307. The threaded rod 1 302, the threaded rod 2 303, the threaded rod 304 and the threaded rod 4 308 rotate synchronously to drive the four moving blocks 311 to move simultaneously. The moving block 311 drives the moving frame 312 to move, the moving frame 312 drives the connecting frame 511 to move, the connecting frame 511 drives the rotating block 512 to move, and the rotating block 512 drives the grinder 705 to move. The four grinders 705 move simultaneously to perform synchronous grinding on the four sides of the semiconductor, which can greatly improve the grinding efficiency of the semiconductor.

[0061] The present invention is not limited to the above-described embodiments. Any changes in shape or structure fall within the scope of protection of the present invention. The scope of protection of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications shall fall within the scope of protection of the present invention.

Claims

1. An edge grinder for semiconductor processing, comprising a semiconductor processing table (1), characterized in that: Also includes: A movable structure (3), wherein the movable structure (3) is arranged on the semiconductor processing table (1); A rotating structure (5), wherein the rotating structure (5) is arranged on the moving structure (3); A grinding structure (7), wherein the grinding structure (7) is arranged on the rotating structure (5), and the rotating structure (5) rotates synchronously to drive the grinding structure (7) to rotate; The movable structure (3) comprises a support block 1 (301), a threaded rod 1 (302), a threaded rod 2 (303), a threaded rod 3 (304), a rotating connecting rod 1 (305), a rotating motor 1 (306), a rotating gear 1 (307) and a threaded rod 4 (308), wherein the support block 1 (301) is fixedly connected to the side walls of the four sides of the semiconductor processing table (1) at equal distances, and the threaded rod 1 (302), the threaded rod 2 (303), the threaded rod 3 (304) and the two ends of the threaded rod 3 (304) are fixedly connected with a rotating connecting rod 1 (305), and the rotating connecting rod 1 (305) is fixedly connected to the two ends of the threaded rod 1 (302), the threaded rod 2 (303), the threaded rod 3 (304) and the threaded rod 3 (304). ) are rotatably connected to the side wall of the support block one (301), the ends of the rotating connecting rod one (305) at both ends of the threaded rod three (304) and the threaded rod four (308) are fixedly connected to the rotating gear one (307), the ends of the rotating connecting rod one (305) at one end of the threaded rod one (302) and the threaded rod two (303) are fixedly connected to the rotating gear one (307), the rotating motor one (306) is fixedly connected to the side wall of the support block one (301), and the rotating end of the rotating motor one (306) is fixedly connected to the rotating connecting rod one (305) at the other end of the threaded rod two (303); The rotating structure (5) comprises a supporting block 2 (501), a square rod 1 (502), a square rod 2 (503), a square rod 3 (504), a square rod 4 (505), a rotating connecting rod 2 (506), a rotating motor 2 (508), a rotating gear 1 (307) and a threaded rod 4 (308), wherein the supporting block 2 (501) is fixedly connected to the top side wall of the sliding frame (6) at equal distances, and the two ends of the square rod 1 (502), the square rod 2 (503), the square rod 3 (504) and the square rod 4 (505) are fixedly connected to the rotating connecting rod 2 (506), and the rotating connecting rod 2 (5 06) is rotatably connected to the side wall of the supporting block 2 (501), the ends of the rotating connecting rod 2 (506) at both ends of the square rod 1 (502) and the square rod 4 (505) are fixedly connected to the rotating gear 2 (507), the rotating connecting rod 2 (506) at one end of the square rod 2 (503) and the square rod 4 (505) is fixedly connected to the rotating gear 2 (507), the rotating motor 2 (508) is fixedly connected to the side wall of the supporting block 2 (501), and the rotating end of the rotating motor 2 (508) is fixedly connected to the rotating connecting rod 2 (506) at the other end of the square rod 3 (504); The grinding structure (7) includes a fixed plate (701), an electric push rod (702), a sliding rod (703), a fixed plate (704), a grinder (705), a support block (706) and an electric push rod (707). The electric push rod (707) is fixedly connected to the top side wall of the rotating block (512). The top of the electric push rod (707) is fixedly connected to the support block (706). The support block (706) is slidably connected to the sliding rod (703). One end of the sliding rod (703) is fixedly connected to the fixed plate (701). The electric push rod (702) is fixedly connected between the fixed plate (701) and the support block (706). The other end of the sliding rod (703) is fixedly connected to the fixed plate (704). The side wall of the fixed plate (704) is fixedly connected with the grinder (705).

2. The semiconductor processing edge grinder according to claim 1, wherein: The bottom side wall of the semiconductor processing table (1) is fixedly connected to a support frame (2), the middle of the top inner side wall of the support frame (2) is fixedly connected to an electric push rod three (10), the bottom of the electric push rod three (10) is fixedly connected to a fixed plate three (11), the bottom side wall of the fixed plate three (11) is fixedly connected to a fixed pad two (14), and the bottom side wall of the semiconductor processing table (1) is fixedly connected to two support plates two (13).

3. The semiconductor processing edge grinder according to claim 1, wherein: A support rod (8) is fixedly connected to the middle of the top side wall of the semiconductor processing table (1), the top of the support rod (8) is fixedly connected to a support plate (9), a fixed pad (12) is fixedly connected to the top side wall of the support plate (9), a sliding frame (6) is fixedly connected to the top side wall of the semiconductor processing table (1), and sliding grooves (4) are provided on the side walls of the four sides of the semiconductor processing table (1).

4. The semiconductor processing edge grinder according to claim 1, wherein: The two adjacent rotating gears (307) on the rotating connecting rod (305) are meshed with each other.

5. The semiconductor processing edge grinder according to claim 1, wherein: The movable structure (3) comprises a movable block (311) and a movable frame (312); the threaded rod 1 (302), the threaded rod 2 (303), the threaded rod 3 (304) and the threaded rod 4 (308) are all threadedly connected with the movable block (311); the movable block (311) is slidably connected in the sliding groove (4); the end of the movable block (311) is fixedly connected to the movable frame (312); and the movable frame (312) is slidably connected to the sliding frame (6).

6. The semiconductor processing edge grinder according to claim 1, wherein: The two adjacent rotating gears (507) on the rotating connecting rod (506) are meshed with each other.

7. The semiconductor processing edge grinder according to claim 1, wherein: The rotating structure (5) comprises a connecting frame (511) and a rotating block (512), wherein the connecting frame (511) is fixedly connected to the top side wall of the moving frame (312), the rotating block (512) is rotatably connected inside the connecting frame (511), and the rotating block (512) is slidably connected to the side walls of square rod 1 (502), square rod 2 (503), square rod 3 (504) and square rod 4 (505).

Images