Wafer cleaning and polishing device

Abstract

The wafer cleaning and polishing device comprises a workbench, a polishing mechanism and a wafer limiting and fastening mechanism are arranged on the workbench, the wafer limiting and fastening mechanism is arranged below the polishing mechanism, the wafer limiting and fastening mechanism comprises a clamping seat, the clamping seat is in a big-end-up cone shape, an opening is formed in the upper side of the clamping seat, and the wafer limiting and fastening mechanism is arranged below the polishing mechanism. A limiting seat is arranged on the periphery of the top of the clamping seat, and the wafer limiting and fastening mechanism is movably connected with a cleaning mechanism. The cleaning mechanism is ingeniously and additionally arranged at the wafer limiting and fastening mechanism, effective clamping of the wafer is not affected, cleaning can be directly started after polishing is finished, and using is more flexible and convenient. And secondly, water after annular cleaning can enter the clamping seat and flow out from the lower part of the clamping seat, and a small part of water can also directly seep out from the inner edge of the wafer and the open seat joint to form a water outlet flow channel, and forms water circulation for cleaning the wafer with the water inlet flow channel.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer cleaning and polishing device. Background Art

[0002] The silicon wafer production process involves polishing and cleaning of the silicon wafer, including single-sided front and back polishing and edge polishing of the wafer, which is used to eliminate defects in the wafer itself caused by production. During the wafer polishing process, special polishing liquid is required to assist processing to achieve the effect of grinding and polishing. However, during the polishing process, the polishing liquid and its polishing debris will inevitably remain on the wafer adsorption chuck, and will contaminate the chuck after crystallization. The water spray device of the chuck itself cannot eliminate the crystallization.

[0003] The existing method of removing burrs from wafers is to transfer the wafer to a nearby rinsing station after polishing using a robotic arm or manual labor. By rotating the wafer, pure water rinses the edge of the wafer, removing the burrs from the wafer. This requires additional machinery and equipment, making it more complicated to use and more expensive.

[0004] This case was created to solve the above problems. Utility Model Content

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a wafer cleaning and polishing device, which solves the problems raised in the above-mentioned background technology.

[0007] (2) Technical solution

[0008] To achieve the above purpose, the utility model is implemented through the following technical solutions: a wafer cleaning and polishing device, including a workbench, a polishing mechanism and a wafer limiting and fastening mechanism are provided on the workbench, the wafer limiting and fastening mechanism is arranged below the polishing mechanism, the wafer limiting and fastening mechanism includes a clamping seat, which is a cone-shaped body with a larger upper portion and a smaller lower portion and an opening formed on the upper side, a limiting seat is provided on the top periphery of the clamping seat, a cleaning mechanism is movably connected to the wafer limiting and fastening mechanism, and the cleaning mechanism includes a clamping seat adapted to fit the limiting seat A ring seat of matching size is provided, and a nozzle is connected to the circumference of the ring seat. The spray direction of the nozzle is inclined downward and aimed at the outer periphery of the wafer. A water pump is arranged below to supply water to form an inlet channel. A through groove is provided on the limit seat, and a branch pipe is connected to the through groove. The lower end of the branch pipe is connected to the hollow clamping seat so that the cleaned water can flow out. The remaining cleaned water directly seeps down from the inner edge of the junction of the wafer and the open seat to the bottom of the clamping seat and flows out. The above two form a water outlet channel and a water inlet channel to form a water circulation for cleaning the wafer.

[0009] Preferably, the annular seat is higher than the open seat to form a water collecting space, and after flushing, part of the water flows and gathers at the limiting seat that abuts the open seat on the periphery.

[0010] Preferably, a water tank is provided in the workbench, one side of the water tank is connected to a water pump, the water outlet of the water pump is connected to a long tube, the long tube passes through the top of the workbench and is connected to a hose, and the hose is connected to the water inlet pipe to form a water inlet channel.

[0011] Preferably, the bottom of the clamping seat is connected to a flow tube, the lower end of the flow tube is connected to the water tank, and a filter assembly is provided on the flow tube.

[0012] (3) Beneficial effects

[0013] After adopting the above technical solution, the present invention has the following advantages over the existing technology: The present invention is a wafer cleaning and polishing device that cleverly adds a cleaning mechanism to the wafer limit fastening mechanism, which does not affect the effective clamping of the wafer and allows cleaning to begin directly after polishing, making it more flexible and convenient to use. Secondly, the water after the annular cleaning can enter the clamping seat and flow out from below it, and a small amount of water will also seep out directly from the inner edge of the junction between the wafer and the open seat to form a water outlet channel, which forms a water circulation for cleaning the wafer together with the water inlet channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the utility model;

[0015] Figure 2 For this utility model Figure 1 A magnified schematic diagram of the local structure at center A;

[0016] Figure 3 This is a disassembly diagram of the wafer limiting and fastening mechanism of the utility model;

[0017] Figure 4 This is a schematic diagram of the connection between the cleaning mechanism of the utility model and the wafer limiting and fastening mechanism;

[0018] Figure 5 It is a cross-sectional schematic diagram of the cleaning mechanism of the present invention.

[0019] In the figure: 1. Workbench; 2. Base; 3. Clamping seat; 4. Open seat; 5. Limit seat; 6. Enclosure; 7. Threaded seat; 8. Rod 1; 9. Rod 2; 10. Air suction port; 11. Polishing mechanism; 12. Water inlet pipe; 13. Long pipe; 14. Hose; 15. Flow pipe; 16. Nozzle; 17. Branch pipe; 18. Ring seat; 19. Branch pipe; 20. Water pump; 21. Water tank; 22. Filter assembly. DETAILED DESCRIPTION

[0020] The present invention will be further described in detail below through the accompanying drawings and examples.

[0021] like Figure 1-2 The figure shows a wafer cleaning and polishing device, comprising a workbench 1, on which is provided a polishing mechanism 11 and a wafer limiting and fastening mechanism, the wafer limiting and fastening mechanism being arranged below the polishing mechanism 11. This solution cleverly adds a cleaning mechanism to the wafer limiting and fastening mechanism, which does not affect the effective clamping of the wafer and allows cleaning to start directly after polishing, making it more flexible and convenient to use.

[0022] The wafer position-limiting and fastening mechanism, which is not considered an innovative feature of this application, specifically comprises a base 2, on which is fixedly mounted a hollow clamping seat 3, with an opening formed on the upper side of the clamping seat 3. The clamping seat 3 is conical in shape, with a larger top and a smaller bottom. The opening is larger than the radial dimension of the wafer to accommodate and directly embed the wafer and limit its circumferential displacement due to force.

[0023] The upper surface of the wafer needs to be exposed to the top of the clamping seat 3, which places great demands on the size adaptation of the opening of the clamping seat 3. Figure 3 As shown, this embodiment decomposes the top of the clamping seat 3 into a plurality of independent open seats 4 in sequence, so as to adapt and replace the application according to the wafer size. Secondly, considering the problem of fixing the open seat 4, this embodiment adopts a flexible limiting method, which is convenient for removal or installation switching, and can also be quickly assembled. Specifically, a limiting seat 5 is set on the outer periphery of the top of the clamping seat 3. The groove opened on the inner side of the limiting seat 5 is adapted to the outer dimensions of the clamping seat 3 and the open seat 4. A height adjustment member is provided at the bottom of the limiting seat 5, so that the open seat 4 is always against the outer periphery of the clamping seat 3 to prevent it from moving under force.

[0024] The height adjustment member includes a rod 1 8 and a rod 2 9 arranged in the vertical direction. Both rods have threaded grooves on their inner sides and are threadedly connected to the threaded seat 7. The height of the limit seat 5 can be changed by rotating the threaded seat 7.

[0025] Furthermore, a suction port 10 is provided around the bottom of the clamping base 3, and a baffle 6 is provided on the base 2 to seal the suction port and collect air. A vacuum pump is used to evacuate the outside of the baffle 6. The provision of the suction port 10 further assists in limiting the wafer position, making the polishing process more stable.

[0026] The cleaning mechanism includes an annular seat 18, which is sized to fit the retaining seat 5 and is flexibly connected via a plug-in mechanism (quickly disassembled when not in use). A nozzle 16 is circumferentially connected to the annular seat 18. The nozzle's spray is angled downward and aimed at the wafer's periphery, displacing burrs and surface crystals. A water inlet pipe 12 is located above the annular seat 18. This water inlet pipe 12 is connected to the annular seat 18 and to the nozzle 16 via a branch pipe 17.

[0027] See attached Figure 4-5 As shown, a water tank 21 is provided in the workbench 1, and a water pump 20 is provided on one side of the water tank 21. The water outlet end of the water pump 20 is connected to a long tube 13. The long tube 13 passes through the top of the workbench 1 and is connected to a hose 14. The hose 14 is connected to the water inlet pipe 12 to form a water inlet channel.

[0028] The annular seat 18 is higher than the open seat 4, forming a water collection space. Since the wafer is placed on top of the open seat 4, some of the water after rinsing flows and converges at the limit seat 5 on the outside of the open seat 4. Therefore, a through groove is opened in the limit seat 5, which is connected to a branch pipe 19. The lower end of the branch pipe 19 is connected to the hollow clamping seat 3, allowing the cleaned water to enter the clamping seat 3 and flow out from below. Secondly, a small amount of water will also seep directly from the inner edge where the wafer meets the open seat 4 and flow out from below the clamping seat 3. The above two forms a water outlet and water inlet channel, forming a water circulation for cleaning the wafers.

[0029] Furthermore, a flow tube 15 is connected to the bottom of the clamping seat 3, and the lower end of the flow tube 15 is connected to the water tank 21 to form a water circulation with the water inlet channel. At the same time, a conventional filter component 22 is provided on the flow tube 15, so that the water entering the water tank 21 can be reused for wafer washing.

[0030] The above description is based on the embodiments for inspiration. Through the above description, relevant personnel can make various changes and modifications without departing from the scope of the invention. The technical scope of this new type of use is not limited to the content of the specification, and its protection scope must be determined according to the scope of the claims.

Claims

1. A wafer cleaning and polishing device, comprising a workbench, a polishing mechanism and a wafer limiting and fastening mechanism provided on the workbench, the wafer limiting and fastening mechanism being provided below the polishing mechanism, the wafer limiting and fastening mechanism comprising a clamping seat, which is conical in shape with a larger top and a smaller bottom and an open top, a limiting seat provided on the top periphery of the clamping seat, and characterized in that: The wafer limiting and fastening mechanism is movably connected to a cleaning mechanism, and the cleaning mechanism includes an annular seat of a size matching the limiting seat, and a nozzle is circumferentially connected to the annular seat. The spray direction of the nozzle is inclined downward and aimed at the outer periphery of the wafer. A water pump is arranged below to supply water to form an inlet channel. A through groove is provided on the limiting seat, and a branch pipe is connected to the through groove. The lower end of the branch pipe is connected to the hollow clamping seat so that the cleaned water can flow out. The remaining cleaned water directly seeps down from the inner edge of the junction of the wafer and the open seat to the bottom of the clamping seat and flows out. The above two form a water outlet channel and a water inlet channel to form a water circulation for cleaning the wafer.

2. The wafer cleaning and polishing device according to claim 1, characterized in that: The annular seat is higher than the open seat to form a water collecting space, and after flushing, part of the water flows and gathers at the limiting seat that abuts the open seat on the periphery.

3. The wafer cleaning and polishing device according to claim 1, characterized in that: A water tank is provided in the workbench, one side of the water tank is connected to a water pump, the water outlet of the water pump is connected to a long tube, the long tube passes through the top of the workbench and is connected to a hose, and the hose is connected to the water inlet pipe to form a water inlet channel.

4. The wafer cleaning and polishing device according to claim 3, characterized in that: The bottom of the clamping seat is connected with a flow pipe, the lower end of the flow pipe is connected to the water tank, and a filter component is provided on the flow pipe.

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