Chip substrate taking device

Abstract

The utility model provides a chip substrate taking device, and belongs to the technical field of chip substrates. The chip substrate taking device comprises a first adjusting assembly and a second adjusting assembly, the first adjusting assembly comprises a moving seat, a connecting plate, a bidirectional lead screw, a motor and a moving block, the connecting plate is arranged at the bottom of the moving seat, and the second adjusting assembly comprises a connecting block, an air cylinder and a suction cup. The connecting blocks are arranged at the bottoms of the moving blocks in a sliding mode, the air cylinders are arranged at the bottoms of the moving blocks, the moving seats, the connecting plates, the two-way lead screws, the motors and the moving blocks are arranged, the motors drive the two-way lead screws to rotate, the two-way lead screws synchronously drive the two moving blocks to move to adjust the positions, manual contact adjustment is not needed, and the adjusting efficiency is improved; and through the arrangement of the connecting block, the air cylinder and the suction cup, the suction cup is further rapidly adjusted in the other direction, so that adjustment, adsorption and material taking are conducted on different chip substrates at different positions, and the adjustment efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of chip substrates, and more specifically, to a chip substrate retrieving device. Background Art

[0002] A chip is a silicon wafer containing integrated circuits. In electronics, it's a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. To house, secure, seal, and protect the chip, enhance its electrical and thermal performance, and connect internal and external circuits, the chip is typically packaged using a packaging substrate. This involves soldering the chip to the packaging substrate to form a chip substrate.

[0003] Announcement No. CN 219652183 U discloses a material picking mechanism and a chip substrate picking device. When transferring the chip substrate, the chip substrate picking device can quickly adjust the position of the corresponding suction component according to the suckable position of the chip substrate, thereby stably sucking and transferring the chip substrate. The entire device has a simple structure, good stability and high reliability.

[0004] However, there are some defects in the above solution: the adjustment of the above suction cup is achieved by moving each moving block and then fixing it with screws. The adjustment process requires manual operation of the moving blocks and screws, which is cumbersome and time-consuming, resulting in low work efficiency. Utility Model Content

[0005] In order to make up for the above deficiencies, the present application provides a chip substrate taking device, which aims to improve the problems raised in the above background technology.

[0006] An embodiment of the present application provides a chip substrate picking device including a first adjustment component and a second adjustment component.

[0007] The first adjustment component includes a moving seat, a connecting plate, a bidirectional screw, a motor and a moving block. The connecting plate is arranged at the bottom of the moving seat, the bidirectional screw is rotatably arranged in the connecting plate, the motor is installed on the outside of the connecting plate and is transmission-connected to the bidirectional screw, and the moving block is threadedly sleeved on the bidirectional screw.

[0008] The second adjustment component includes a connecting block, a cylinder and a suction cup. The connecting block is slidably arranged at the bottom of the moving block. The cylinder is arranged at the bottom of the moving block and connected to the connecting block. The suction cup is installed at the bottom of the connecting block.

[0009] In a specific embodiment, the connecting plate is U-shaped, and a plurality of mounting grooves are provided on the top of the movable seat.

[0010] In the above implementation process, a U-shaped connecting plate is provided for installing a bidirectional screw rod, a motor and a moving block, and the mounting groove is used for installing it on the material-retrieving robot arm.

[0011] In a specific embodiment, a guide rod is provided in the connecting plate, and the moving block is slidably sleeved on the surface of the guide rod.

[0012] In the above implementation process, a guide rod is provided to guide the sliding of the moving block, limit the rotation of the threaded transmission on the moving block, and guide the linear movement of the moving block.

[0013] In a specific embodiment, a groove block is provided at the bottom of the moving block, the top of the connecting block is slidably provided in the groove block, and the cylinder is installed on the outside of the groove block.

[0014] In the above implementation process, a slot block is provided to install and connect the connecting block and the cylinder.

[0015] In a specific embodiment, a slider is provided on the top of the connecting block, a sliding groove is provided on the slot block, and the slider is slidably arranged in the sliding groove.

[0016] In the above implementation process, the sliding installation of the connecting block is achieved by arranging the slider to slide in the sliding groove.

[0017] In a specific embodiment, the sliding block is trapezoidal, and the slot block and the inner wall of the sliding slot are clearance-fitted.

[0018] In the above implementation process, by providing a trapezoidal slider, a stable connection is maintained while sliding.

[0019] In a specific embodiment, a threaded connector is provided at the bottom of the connection block, and the suction cup is threadedly connected to the threaded connector.

[0020] In the above implementation process, by providing a threaded connector, the suction cup can be easily disassembled and assembled through the threaded connection, and a damaged suction cup can be easily disassembled and assembled and replaced.

[0021] In a specific embodiment, the first adjustment component and the second adjustment component are arranged perpendicular to each other.

[0022] In the above implementation process, a first adjustment component and a second adjustment component arranged vertically are provided to adjust the position of the suction cup in different directions, thereby improving practicality.

[0023] Beneficial effects: The present application provides a chip substrate picking device, which is provided with a movable seat, a connecting plate, a bidirectional screw, a motor and a moving block. The motor drives the bidirectional screw to rotate, and the bidirectional screw synchronously drives the two moving blocks to move and adjust the position. Not only does it not require manual contact adjustment, but it also improves the adjustment efficiency. By providing a connecting block, a cylinder and a suction cup, the suction cup can be further quickly adjusted in another direction, thereby adjusting the adsorption and picking of different chip substrates at different positions, thereby improving the adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the following is a brief introduction to the drawings required for use in the implementation methods. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic structural diagram of a chip substrate retrieving device provided in an embodiment of the present application;

[0026] Figure 2 A schematic diagram of the structure of the mobile seat provided in the embodiment of this application;

[0027] Figure 3 A schematic diagram of the structure of the first adjustment component provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the slot block structure provided in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of the connection block structure provided for the implementation scheme of this application.

[0030] In the figure: 100-first adjustment component; 110-moving seat; 111-mounting slot; 120-connecting plate; 121-guide rod; 130-bidirectional screw; 150-motor; 170-moving block; 180-slot block; 181-slide; 200-second adjustment component; 210-connecting block; 212-slider; 220-cylinder; 240-suction cup; 250-threaded connector. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0032] See also Figure 1-Figure 5 The present application provides a chip substrate picking device including a first adjusting component 100 and a second adjusting component 200 .

[0033] See also Figure 1 、 2 And 3, the first adjustment component 100 includes a moving seat 110, a connecting plate 120, a bidirectional screw rod 130, a motor 150 and a moving block 170, the connecting plate 120 is arranged at the bottom of the moving seat 110, the bidirectional screw rod 130 is rotatably arranged in the connecting plate 120, the motor 150 is installed on the outside of the connecting plate 120 and is transmission-connected to the bidirectional screw rod 130, and the moving block 170 is threadedly sleeved on the bidirectional screw rod 130.

[0034] Among them, the connecting plate 120 is U-shaped, and several installation grooves 111 are opened on the top of the moving seat 110. The U-shaped connecting plate 120 is set to install the bidirectional screw rod 130, the motor 150 and the moving block 170, and the installation groove 111 is used to be installed on the material-retrieving robot arm.

[0035] Specifically, a guide rod 121 is provided in the connecting plate 120, and the moving block 170 is slidably sleeved on the surface of the guide rod 121. The guide rod 121 is provided to guide the sliding of the moving block 170, limit the rotation of the threaded transmission it receives, and guide its linear movement.

[0036] See also Figure 1 、 3 , 4 and 5, the second adjustment assembly 200 includes a connecting block 210, a cylinder 220 and a suction cup 240, the connecting block 210 is slidably arranged at the bottom of the moving block 170, the cylinder 220 is arranged at the bottom of the moving block 170 and connected to the connecting block 210, and the suction cup 240 is installed at the bottom of the connecting block 210.

[0037] Among them, a groove block 180 is set at the bottom of the moving block 170, the top of the connecting block 210 is slidably set in the groove block 180, and the cylinder 220 is installed on the outside of the groove block 180. By setting the groove block 180, it is used to install and connect the connecting block 210 and the cylinder 220.

[0038] Specifically, a slider 212 is provided at the top of the connecting block 210, and a slide groove 181 is opened in the slot block 180. The slider 212 is slidably set in the slide groove 181. By setting the slider 212 to slide in the slide groove 181, the sliding installation of the connecting block 210 is realized.

[0039] It should be noted that the slider 212 is trapezoidal, and the slot block 180 and the inner wall of the slide groove 181 are clearance-matched. By providing the trapezoidal slider 212, a stable connection is maintained while sliding.

[0040] In this embodiment, a threaded connector 250 is provided at the bottom of the connecting block 210, and the suction cup 240 is threadedly connected to the threaded connector 250. By providing the threaded connector 250, the suction cup 240 can be conveniently disassembled and assembled by threaded connection, and the damaged suction cup 240 can be conveniently disassembled and assembled and replaced.

[0041] In a specific embodiment, the first adjustment component 100 and the second adjustment component 200 are arranged perpendicular to each other. By setting the first adjustment component 100 and the second adjustment component 200 arranged perpendicularly, the position of the suction cup 240 can be adjusted in different directions, thereby improving practicality.

[0042] It should be noted that the suction of the suction cup 240 is connected to an external air pump device through a pipeline, and the specific structure and principle are not described in detail here.

[0043] The working principle of the chip substrate picking device is as follows: when in use, the adsorption position of different chip substrates is adjusted by controlling the starting motor 150, the motor 150 drives the bidirectional screw 130 to rotate, the bidirectional screw 130 drives the moving block 170 to move, and the two moving blocks 170 move synchronously to adjust the position, the moving block 170 drives the connecting block 210, the cylinder 220 and the suction cup 240 to move, and at the same time, the connecting block 210 can be driven to slide by controlling the extension and contraction of the cylinder 220, and the connecting block 210 drives the suction cup 240 to move, and the two adjustment directions are perpendicular to each other, so that the position of the suction cup 240 can be quickly adjusted without manual contact adjustment, which greatly improves the adjustment efficiency. Furthermore, by setting the threaded connector 250, the suction cup 240 can be conveniently disassembled and assembled by threaded connection, and the damaged suction cup 240 can be conveniently disassembled and assembled and replaced.

[0044] It should be noted that the specific models and specifications of the motor 150 and the cylinder 220 need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0045] The power supply and principle of the motor 150 and the cylinder 220 are clear to those skilled in the art and will not be described in detail here.

[0046] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A chip substrate taking device, characterized in that: include A first adjustment component (100), comprising a movable seat (110), a connecting plate (120), a bidirectional screw rod (130), a motor (150) and a movable block (170), wherein the connecting plate (120) is arranged at the bottom of the movable seat (110), the bidirectional screw rod (130) is rotatably arranged in the connecting plate (120), the motor (150) is installed on the outside of the connecting plate (120) and is transmission-connected to the bidirectional screw rod (130), and the movable block (170) is threadedly sleeved on the bidirectional screw rod (130); The second adjusting assembly (200) comprises a connecting block (210), a cylinder (220) and a suction cup (240), wherein the connecting block (210) is slidably arranged at the bottom of the moving block (170), the cylinder (220) is arranged at the bottom of the moving block (170) and connected to the connecting block (210), and the suction cup (240) is installed at the bottom of the connecting block (210).

2. The chip substrate taking device according to claim 1, characterized in that: The connecting plate (120) is U-shaped, and a plurality of mounting grooves (111) are provided on the top of the movable seat (110).

3. The chip substrate taking device according to claim 1, characterized in that: A guide rod (121) is provided in the connecting plate (120), and the moving block (170) is slidably sleeved on the surface of the guide rod (121).

4. The chip substrate taking device according to claim 1, characterized in that: A groove block (180) is provided at the bottom of the moving block (170), the top end of the connecting block (210) is slidably arranged in the groove block (180), and the cylinder (220) is installed on the outside of the groove block (180).

5. The chip substrate taking device according to claim 4, characterized in that: The top of the connecting block (210) is provided with a slider (212), the slot block (180) is provided with a slide groove (181), and the slider (212) is slidably arranged in the slide groove (181).

6. The chip substrate taking device according to claim 5, characterized in that: The sliding block (212) is trapezoidal in shape, and the slot block (180) and the inner wall of the sliding slot (181) are clearance-matched.

7. The chip substrate taking device according to claim 1, characterized in that: A threaded connector (250) is provided at the bottom of the connection block (210), and the suction cup (240) is threadedly connected to the threaded connector (250).

8. The chip substrate taking device according to claim 1, characterized in that: The first adjustment component (100) and the second adjustment component (200) are arranged perpendicular to each other.

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