Carrier plate device
By setting up a protruding structure on the carrier plate device tray, the damage to the passivation layer during the TCO film deposition process is solved, the rapid derivation of high-energy particles is achieved, and the process quality and manufacturing efficiency of heterojunction solar cells are improved.
Patent Information
- Application Number
- CN202422708171.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In the prior art, during the deposition of TCO film layer of heterojunction solar cells, high-energy particles are more sensitive to the passivation effect of the amorphous silicon/microcrystalline silicon layer, resulting in a decrease in the conversion efficiency of the battery device, and fewer optimization methods at the carrier plate ends and are prone to other quality problems.
A protruding structure surrounding the placement area is arranged on the front and back of the tray of the carrier plate device, and the tray is grounded so that high-energy charged particles can accumulate and quickly export, reducing damage to the passivation layer.
By adding a protruding structure on the pallet, the chance of damage to the passivation layer during the TCO film deposition process is effectively reduced, the product process quality is improved and the manufacturing process is simplified.
Smart Images
Figure CN223280925U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum coating manufacturing, in particular to a carrier plate device. Background Art
[0002] Magnetron sputtering is often used in mass production of TCO (Transparent Conductive Oxide) film deposition for heterojunction solar cells. The process involves placing silicon wafers, after amorphous silicon / microcrystalline silicon has been deposited on both the front and back sides, onto a carrier in an automated loading area. Due to the carrier's hollow design, the loaded carrier is conveyed into a vacuum chamber where TCO film deposition is completed on both the front and back sides of the substrate. After deposition, the carrier is removed from the vacuum chamber and unloaded in an automated unloading area. The empty carrier is then transported back to the loading area via a conveyor mechanism, completing the cycle.
[0003] However, since the amorphous silicon / microcrystalline silicon layer produced in the previous process serves as a passivation layer, it is very sensitive to damage during the deposition of the TCO film. The high-energy particles during the TCO film deposition process will cause the passivation effect of the amorphous silicon layer to deteriorate, thereby reducing the conversion efficiency of the battery device. In the magnetron sputtering process, due to the presence of the cathode plasma sheath, the charged particles will carry higher energy after being accelerated by it, which increases the probability of damaging the passivation layer. Currently, the industry mainly optimizes this phenomenon at the cathode end. Specifically, by reducing the sheath potential, the energy carried by high-energy particles is reduced, thereby reducing the probability of damage to the passivation layer. In the existing technology, there are few means of optimization at the carrier end. Usually, a bias grid is added, or a negative bias potential is added to the carrier end. However, these methods often require major modifications to the carrier / equipment and are prone to other quality problems.
[0004] Therefore, there is an urgent need for a carrier device that can be simply optimized at the carrier end to reduce damage to the passivation layer during the deposition of the TCO film. Utility Model Content
[0005] The purpose of the utility model is to provide a carrier device with a simple structure and capable of quickly conducting charged particles, thereby reducing the probability of damaging the passivation layer during the deposition of the TCO film layer, which is beneficial to improving the product process quality.
[0006] To achieve this purpose, the present invention adopts the following technical solutions:
[0007] The utility model discloses a plate carrier device, which includes a tray and a support frame. The tray is placed on the support frame. The tray has a placement area for placing a substrate, and the tray is grounded. The tray includes a protruding structure, which is arranged on the front and back sides of the tray and surrounds the placement area. The protruding structure includes at least one end, and the end has an arc structure.
[0008] In some embodiments, the protruding structure includes a plurality of protruding members, and the plurality of protruding members are spaced apart around the placement area.
[0009] In some specific embodiments, each of the protruding members includes a connecting rod, one end of which is connected to the tray; and the end portion is connected to an end of the connecting rod facing away from the tray.
[0010] In some more specific embodiments, the connecting rod and the end portion are an integral structure.
[0011] In some embodiments, the protruding structure includes an annular protrusion extending along an outer contour of the placement area.
[0012] In some specific embodiments, the width of the annular protrusion gradually decreases in a direction away from the tray.
[0013] In some embodiments, the protruding structures on the front and back sides of the tray are symmetrically arranged.
[0014] In some embodiments, the protruding structure protrudes 15 mm to 50 mm from the surface of the tray for supporting the substrate.
[0015] In some embodiments, the protruding structure and the tray are integrally formed; or: the protruding structure is fixedly connected to the tray.
[0016] In some embodiments, the carrier device includes a plurality of first support beams and a plurality of second support beams, the plurality of first support beams are spaced apart along a first direction, the two ends of each second support beam are respectively connected to two first support beams, and the plurality of second support beams are spaced apart along a second direction; the plurality of first support beams and the plurality of second support beams constitute a support frame, the support frame has a plurality of accommodating spaces, and each of the accommodating spaces is provided with a tray.
[0017] The beneficial effects of the present invention are as follows: by arranging protruding structures protruding from the placement area surface around the front and back sides of the tray, high-energy charged particles preferentially accumulate on the added protruding structures when moving to the substrate surface (this is because the protruding structures are higher than the substrate surface and have a pointed structure). Since the tray is grounded, high-energy conductive particles accumulated on the protruding structures can be promptly deflected, significantly reducing the number of high-energy conductive particles bombarding the substrate surface, thereby reducing the probability of damage to the passivation layer during TCO film deposition and improving product process quality. Furthermore, since only the protruding structures are added to the tray, the structure is simple and easy to manufacture.
[0018] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic structural diagram of the first protrusion and the tray in the embodiment of the utility model;
[0020] Figure 2 yes Figure 1 Schematic diagram of the structure shown and the matching structure of the silicon wafer;
[0021] Figure 3 yes Figure 1 A schematic structural diagram of another arrangement of protruding members shown;
[0022] Figure 4 This is a simplified structural diagram of the second protruding member of an embodiment of the present utility model;
[0023] Figure 5 This is a simplified structural diagram of a third protruding member according to an embodiment of the present utility model;
[0024] Figure 6 This is a simplified structural diagram of a fourth protruding member according to an embodiment of the present utility model;
[0025] Figure 7 This is a schematic diagram of the structure of the second protruding structure and the tray in the embodiment of the utility model.
[0026] Figure 8 This is a schematic diagram of the overall structure of the carrier device of an embodiment of the utility model;
[0027] Figure 9 It is a schematic diagram of the exploded structure of the carrier device of an embodiment of the present utility model.
[0028] Reference numerals:
[0029] 100, tray; 110, placement area;
[0030] 210, protruding member; 211, connecting rod; 212, end portion; 213, annular protrusion;
[0031] 300, first support beam;
[0032] 400, second support beam;
[0033] 10. Substrate. DETAILED DESCRIPTION
[0034] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0035] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0037] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0038] Reference below Figures 1-9 The specific structure of the board carrier device disclosed in the utility model is described.
[0039] The utility model discloses a board carrier device, referring to Figure 1 and Figure 2 As shown, the carrier device includes a tray 100 and a support frame. The tray 100 is placed on the support frame. The tray 100 has a placement area 110 for placing the substrate 10. The tray 100 is grounded. The tray 100 includes a protrusion structure. The protrusion structure is provided on the front and back of the tray 100 and surrounds the placement area 110. The protrusion structure includes at least one end 212 with an arc structure. The protrusion structure can collect charged particles and quickly conduct them to the ground. The protrusion structure can include linear and dot structures. The substrate 10 can be a silicon wafer or a glass substrate. It is understandable that the tray 100 of the present invention is grounded, and the specific grounding structure is not limited. It can be directly grounded through a transmission roller and / or grounded through an additional grounding structure, etc., and then the overall structure of the carrier device is not changed. By arranging protruding structures protruding from the surface of the placement area 110 around the placement area 110 on the front and back of the tray 100, when high-energy charged particles move to the surface of the substrate 10, they will preferentially gather on the added protruding structures (this is because the height of the protruding structures is higher than the surface of the substrate 10 and its structure has a pointed end). Then, because the tray 100 is grounded, the high-energy conductive particles accumulated on the protruding structures can be promptly guided out, thereby achieving a significant reduction in the number of high-energy conductive particles bombarding the surface of the substrate 10, thereby reducing the probability of damaging the passivation layer during the deposition of the TCO film layer, which is beneficial to improving the product process quality. At the same time, since only the protruding structures are added to the tray 100, the structure is simple and easy to manufacture.
[0040] refer to Figure 1 As shown, the protrusion structure includes a plurality of protrusions 210, and the plurality of protrusions 210 are arranged at intervals around the placement area 110. It can be understood that splitting the protrusion structure into a plurality of protrusions 210 can, on the one hand, ensure that the high-energy conductive particles are stably and preferentially gathered on the protrusions 210, and on the other hand, facilitate manufacturing. In the actual manufacturing process, the plurality of protrusions 210 can be connected to the tray 100 by bonding or welding. It should be noted that, in general, the substrate 10 is a rectangular sheet, and correspondingly, the placement area 110 is also rectangular. Figure 1 As shown, there are four protrusions 210, and the four protrusions 210 are respectively located at the four corners of the placement area 110. Of course, in an alternative embodiment, the number of the protrusions 210 can also be eight, and the specific distribution method is as follows: Figure 3 As shown. Therefore, the number and specific arrangement of the protruding pieces 210 can be adjusted according to actual needs and are not limited to Figure 1 and Figure 3 The structure shown.
[0041] refer to Figure 2 As shown, each protrusion 210 further includes a connecting rod 211, one end of which is connected to the tray 100, and an end 212 connected to the end of the connecting rod 211 facing away from the tray 100. It will be appreciated that, in a top view, the protrusion 210 is formed into a dot-shaped structure connected to the tray 100. The end 212 of the protrusion 210 is used to accumulate high-energy conductive particles, thereby preventing the formation of a potential difference between the end 212 of the protrusion 210 away from the tray 100 and the substrate 10, which may cause sparks on the surface of the substrate 10 and damage the components on the substrate 10. The provision of the connecting rod 211 ensures that the end 212 is higher than one end of the surface of the substrate 10, thereby ensuring that the high-energy conductive particles can stably and preferentially accumulate on the end 212 during the deposition of the TCO film. Optionally, the end 212 is hemispherical.
[0042] Optionally, the connecting rod 211 and the end portion 212 are an integral structure, thereby facilitating manufacturing.
[0043] It should be noted that, in other embodiments of the present invention, Figure 4 、 Figure 5 and Figure 6 As shown, the protruding piece 210 may also be a structure with a width gradually decreasing in a direction away from the tray 100 , and the end 212 of the protruding piece 210 is formed into an arc-shaped structure.
[0044] refer to Figure 7 The protruding structure may further include an annular protrusion 213 extending along the outer contour of the placement area 110. Compared to splitting the protruding structure into multiple protruding pieces 210, the protruding structure including the annular protrusion 213 is conducive to simplifying the structure of the carrier device and facilitating manufacturing.
[0045] Optionally, the width of the annular protrusion 213 gradually decreases in the direction away from the tray 100. It is understood that, compared to a structure with uniform width, the wedge-shaped structure of the annular protrusion 213 with gradually decreasing width is conducive to the stable aggregation of high-energy conductive particles and preferential aggregation to the end of the annular protrusion 213 facing away from the tray 100, thereby ensuring the annular protrusion 213's ability to aggregate high-energy conductive particles.
[0046] Optionally, the protruding structures on the front and back of the tray 100 are symmetrically arranged. It should be noted that in actual operation, both the front and back sides of the substrate 10 placed on the tray 100 will be coated. The symmetrical arrangement of the protruding structures on the front and back sides of the tray 100 ensures that the TCO film layer can be stably deposited on the front and back sides of the substrate 10 on the tray 100, reducing the probability of damage to the silicon-based material layer on the surface of the substrate 10. At the same time, during the coating process on the front and back sides of the substrate 10, the magnetic field difference between the front and back sides of the substrate 10 to be coated is reduced, thereby reducing the difference in TCO film performance between the front and back sides.
[0047] Optionally, the protruding structure is integrally connected to the tray 100. Compared with welding and bonding, the protruding structure can be integrally manufactured with the tray 100 without the need for subsequent connection, which is beneficial for simplifying the structure of the carrier device and facilitating manufacturing.
[0048] Optionally, the protruding structure is fixedly connected to the tray 100. It will be appreciated that during assembly, the protruding structure can be installed in corresponding areas of the tray 100 according to specific needs, ensuring that the protruding structure can stably guide high-energy electrons within the designated area, thereby further reducing the probability of damage to the passivation layer of the substrate 10. The fixed connection method can be welding, bonding, or clamping, and the specific method can be selected according to actual needs.
[0049] Optionally, the height of the surface of the tray 100 for supporting the substrate 10 is 15 mm to 50 mm. Specifically, the height of the surface of the tray 100 for supporting the substrate 10 can be 16 mm, 17 mm, 18 mm, 19 mm, 20 mm, 21 mm, 22 mm, 23 mm, 24 mm, 25 mm, 26 mm, 27 mm, 28 mm, 29 mm, 30 mm, 31 mm, 32 mm, 33 mm, 34 mm, 35 mm, 36 mm, 37 mm, 38 mm, 39 mm, 40 mm, 41 mm, 42 mm, 43 mm, 44 mm, 45 mm, 46 mm, 47 mm, 48 mm, 49 mm, or 50 mm. Of course, the height of the surface of the tray 100 for supporting the substrate 10 can also be other values within the range of 15 mm to 50 mm, and is not limited to the above examples. It is understood that a lower height of the protruding structure protruding from the tray 100 used to support the substrate 10 will increase the probability of high-energy conductive particles contacting the substrate 10. A higher height of the protruding structure protruding from the tray 100 used to support the substrate 10 will easily affect the coating film thickness and cause color difference. In this embodiment, the protruding structure protruding from the tray 100 used to support the substrate 10 is 15mm-50mm. This can ensure that the end 212 of the protruding structure facing away from the tray 100 is sufficiently far from the surface of the substrate 10, reducing the probability of high-energy conductive particles contacting the substrate 10 and ensuring the effect of the protruding structure attracting and extracting charged particles. It can also control and ensure the coating film thickness, avoid color difference, and ensure the normal transportation of the carrier device. If the height of the protruding structure protruding from the tray 100 used to support the substrate 10 is too high, the support frame of the tray 100 also needs to be configured accordingly to ensure stable transmission during the coating process. At the same time, a setting that is too high will increase the manufacturing difficulty of the tray 100. Therefore, preferably, the height of the protruding structure protruding from the tray 100 used to support the substrate 10 is less than 50mm. Of course, in other embodiments of the present invention, the height of the protruding structure protruding from the surface of the tray 100 for carrying the substrate 10 can be adjusted according to actual needs and is not limited to the above definition.
[0050] refer to Figure 8 and Figure 9 As shown, the plate carrier device includes two first support beams 300 and three second support beams 400. The two first support beams 300 are spaced apart along the first direction. The two ends of each second support beam 400 are respectively connected to the two first support beams 300, and the three second support beams 400 are spaced apart along the second direction. The two first support beams 300 and the three second support beams 400 constitute a support frame. The support frame has four accommodating spaces, and each accommodating space is provided with a tray 100. It can be understood that by assembling the support frame with the first support beam 300 and the plurality of second support beams 400, the plurality of trays 100 are combined into a plate carrier device ( Figure 8 In the example, four trays 100 are combined into a carrier assembly. This increases the number of substrates 10 that can be accommodated on a carrier assembly, thereby improving production capacity. Of course, it should be noted that in other embodiments of the present invention, the number of first support beams 300 and second support beams 400 can be set according to actual needs and is not limited to the above-mentioned number.
[0051] Throughout this specification, references to "some embodiments," "other embodiments," and the like indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0052] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A plate carrier device, comprising a tray (100) and a support frame, wherein the tray (100) is placed on the support frame, the tray (100) has a placement area (110) for placing a substrate (10), and the tray (100) is grounded; characterized in that: The tray includes a protruding structure, which is arranged on the front and back of the tray (100) and surrounds the placement area (110). The protruding structure includes at least one end (212), and the end (212) has an arc-shaped structure.
2. The board carrier device according to claim 1, characterized in that: The protruding structure comprises a plurality of protruding members (210), and the plurality of protruding members (210) are arranged at intervals around the placement area (110).
3. The board carrier device according to claim 2, characterized in that: Each protruding member (210) comprises a connecting rod (211), one end of which is connected to the tray (100); and the end portion (212) is connected to the end of the connecting rod (211) facing away from the tray (100).
4. The board carrier device according to claim 3, characterized in that: The connecting rod (211) and the end portion are an integral structure.
5. The board carrier device according to claim 4, characterized in that: The protruding structure comprises an annular protrusion (213), and the annular protrusion (213) is extended along the outer contour of the placement area (110).
6. The board carrier device according to claim 5, characterized in that: In a direction away from the tray (100), the width of the annular protrusion (213) gradually decreases.
7. The board carrier device according to any one of claims 1 to 6, characterized in that: The protruding structures on the front and back sides of the tray (100) are symmetrically arranged.
8. The board carrier device according to any one of claims 1 to 6, characterized in that: The protruding structure protrudes 15 mm to 50 mm from the surface of the tray (100) for supporting the substrate (10).
9. The board carrier device according to any one of claims 1 to 6, characterized in that: The protruding structure is integrally connected to the tray (100); or: The protruding structure is fixedly connected to the tray (100).
10. The board carrier device according to any one of claims 1 to 6, characterized in that: The plate carrier device comprises a plurality of first support beams (300) and a plurality of second support beams (400), wherein the plurality of first support beams (300) are arranged at intervals along a first direction, and both ends of each second support beam (400) are respectively connected to two first support beams (300), and the plurality of second support beams (400) are arranged at intervals along a second direction; the plurality of first support beams (300) and the plurality of second support beams (400) constitute a support frame, and the support frame has a plurality of accommodating spaces, and each of the accommodating spaces is provided with a tray (100).