Efficient refrigerating unit for waste heat recovery

Abstract

The utility model relates to the technical field of refrigerating units, and discloses a waste heat recovery efficient refrigerating unit which comprises a machine shell, a condenser is fixedly installed at the position, close to the front end of the left side, of the inner bottom of the machine shell, and evenly-distributed heat absorption pieces are inserted into fin gaps of the condenser. A heat dissipation plate is fixedly connected between the rear ends of the heat absorption pieces, a heat conduction plate is fixedly installed at the rear end of the heat dissipation plate through bolts, a semiconductor thermoelectric power generation piece is installed between the front end of the heat conduction plate and the heat dissipation plate, and a semiconductor refrigeration piece is installed at the rear end of the heat conduction plate. A storage battery is arranged at the rear end, close to the right side, of the inner bottom of the machine shell. According to the device, through the ingenious design of integrating the semiconductor thermoelectric power generation sheet and the semiconductor refrigeration sheet, originally wasted heat energy is converted into electric energy, the electric energy is stored in the storage battery to provide power support for subsequent system operation, the energy utilization rate is increased, and energy conservation and emission reduction in the operation process of the refrigeration unit are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration units, in particular to a high-efficiency refrigeration unit with waste heat recovery. Background Art

[0002] In the existing refrigeration technology field, refrigeration units, as important heat management and temperature control devices, are widely used in various fields, including industrial cooling, air conditioning systems, and refrigerated transportation. Traditional refrigeration units primarily use a compressor to compress the refrigerant into a high-temperature, high-pressure gas. This is then dissipated through a condenser and condensed into a high-pressure liquid, completing the refrigeration cycle. However, during this process, a large amount of waste heat released by the condenser is often directly discharged into the environment, resulting in not only energy waste but also potential thermal pollution.

[0003] In addition, traditional refrigeration units mostly rely on heat exchange fans for air convection heat dissipation. Although this method is simple and direct, its heat dissipation efficiency is limited. Especially in high temperature or high humidity environments, the heat dissipation effect will be greatly reduced, which in turn affects the overall performance and operating efficiency of the refrigeration unit.

[0004] Thermoelectric conversion technology, particularly based on semiconductor thermoelectric cells, can directly generate electricity by utilizing temperature differences between objects. This offers a new approach to recycling waste heat from refrigeration units. Therefore, developing a high-efficiency refrigeration unit that can effectively recover condenser waste heat and convert it into electricity for auxiliary cooling and system power supply has become a pressing technical challenge in the field of refrigeration technology. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the present invention provides a high-efficiency refrigeration unit with waste heat recovery, which has the advantages of converting thermal energy into electrical energy for storage and power supply, and solves some problems raised in the background technology.

[0006] The utility model provides the following technical solution: a high-efficiency refrigeration unit for waste heat recovery, comprising a casing, a condenser fixedly installed at the front end position near the left side of the inner bottom of the casing, uniformly distributed heat-absorbing plates are inserted into the fin gaps of the condenser, a heat sink is fixedly connected between the rear ends of the heat-absorbing plates, a heat conduction plate is fixedly installed at the rear end of the heat sink by bolts, a semiconductor thermoelectric power generation plate is installed between the front end of the heat conduction plate and the heat sink, the semiconductor thermoelectric power generation plate is fitted between the heat dissipation plate and the heat conduction plate, a semiconductor refrigeration plate is installed at the rear end of the heat conduction plate, the front cold end of the semiconductor refrigeration plate is fitted between the heat conduction plate, a battery is provided at the rear end position near the right side of the inner bottom of the casing, and the battery is electrically connected to the semiconductor thermoelectric power generation plate and the semiconductor refrigeration plate.

[0007] Furthermore, a copper tube is provided inside the condenser, and a compressor is fixedly installed on the right side of the condenser at the inner bottom of the casing. The compressor and the copper tube are fixedly connected and communicated, and the refrigerant is transported to the condenser outside the compressor through the copper tube for heat release operation, in preparation for subsequent heat absorption.

[0008] Furthermore, the heat absorbing plate is provided with a socket adapted to the copper tube, the copper tube passes through the inside of the socket, the heat absorbing plate is in contact with the fins of the condenser, and the copper tube passing through the socket can also fix the heat absorbing plate.

[0009] Furthermore, a heat dissipation fin is fixedly installed at the rear end of the semiconductor refrigeration plate, and a heat dissipation fan is fixedly installed at the rear end of the heat dissipation fin. The air outlet of the heat dissipation fan passes through and is fixedly installed at the rear end of the casing, thereby ensuring the heat dissipation effect of the semiconductor refrigeration plate and allowing the generated heat to be discharged outside the casing.

[0010] Furthermore, evenly distributed thermal bridge holes are provided between the front and back faces of the heat conducting plate, and evenly distributed cold air holes are provided between the four sides of the heat conducting plate. The cold air holes and the thermal bridge holes are staggered. The provision of the cold air holes can improve the cooling effect of the cooling end of the semiconductor refrigeration plate at the periphery of the heat conducting plate, that is, increase the contact area with the air.

[0011] Furthermore, a heat exchange fan is provided at the front end of the casing corresponding to the condenser, retaining the conventional heat dissipation structure.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The utility model realizes the recycling of a large amount of waste heat released during the condensation process of the refrigeration unit by integrating semiconductor thermoelectric power generation chips. When the refrigerant flows through the condenser and the copper tube, the released high-temperature heat is effectively absorbed by the heat-absorbing chip and conducted to the heat sink, and then supplied to the semiconductor thermoelectric power generation chip as the hot end. At the same time, the cold end of the semiconductor refrigeration chip absorbs heat to achieve the purpose of cooling, so that the temperature of the rear end of the semiconductor thermoelectric power generation chip is reduced, and finally a temperature difference is generated between the front and rear ends of the semiconductor thermoelectric power generation chip, so that the semiconductor thermoelectric power generation chip generates current. This design enables the heat energy that was originally wasted to be converted into electrical energy, and stored in the battery through the intelligent control system to provide power support for subsequent system operation. This beneficial effect not only significantly improves the energy utilization rate and reduces the dependence on traditional electricity, but also realizes energy conservation and emission reduction during the operation of the refrigeration unit, with significant economic and environmental benefits.

[0014] 2. The utility model introduces a semiconductor refrigeration plate as an auxiliary refrigeration element. Its cold end is connected to the rear end of the semiconductor thermoelectric power generation plate through a heat conduction plate, forming an efficient heat conduction path. During the operation of the refrigeration unit, the semiconductor refrigeration plate works under the power supply of the battery, and its cold end continuously absorbs heat, effectively reducing the temperature of the surrounding environment, especially the temperature inside the casing and around the condenser. This cooling effect not only enhances the heat dissipation capacity of the condenser and accelerates the condensation process of the refrigerant, but also reduces the problem of decreased operating efficiency of the unit caused by high temperature environment. Therefore, compared with traditional refrigeration units that only rely on heat exchange fans for heat dissipation, the utility model performs well in improving condensation efficiency and enhancing refrigeration effect, further improving the overall performance and service life of the refrigeration unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the internal structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 3 It is a partial cross-sectional structural schematic diagram of the utility model;

[0018] Figure 4 This is a schematic diagram of the sampling state structure of the utility model.

[0019] In the figure: 1. Casing; 2. Condenser; 3. Copper tube; 4. Compressor; 5. Heat absorber; 6. Jack; 7. Heat sink; 8. Heat conducting plate; 9. Semiconductor thermoelectric generator; 10. Semiconductor refrigeration plate; 11. Heat sink fin; 12. Cooling fan; 13. Battery; 14. Thermal bridge hole; 15. Air conditioning hole; 16. Heat exchange fan. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-Figure 3The heat dissipation device 10 is a heat dissipation device 10 for cooling the heat dissipation device 10 and cooling the heat dissipation device 10. The heat dissipation device 10 is a heat dissipation device 10 for cooling the heat dissipation device 10. The heat dissipation device 10 is a heat dissipation device 10 for cooling the heat dissipation device 10. The heat dissipation device 10 is a heat dissipation device 10 for cooling the heat dissipation device 10. Through the action of the heat conducting plate 8, the heat at the rear end of the semiconductor thermoelectric power generation plate 9 can flow to the front cold end of the semiconductor refrigeration plate 10 until the two reach thermal equilibrium, thereby lowering the rear end temperature of the semiconductor thermoelectric power generation plate 9, and finally achieving a temperature difference between the front and rear ends of the semiconductor thermoelectric power generation plate 9, thereby causing the semiconductor thermoelectric power generation plate 9 to generate current, and through intelligent control such as the controller, the current is stored in the battery 13, thereby converting part of the heat released by the refrigerant into electrical energy, achieving the purpose of waste heat recovery. The battery 13 can not only provide electricity to structures such as the semiconductor refrigeration plate 10 and the heat dissipation fan 12, saving electricity consumption, but also greatly reduce the temperature inside the casing 1 through the cooling effect of the cold end of the semiconductor refrigeration plate 10. Compared with the traditional refrigeration unit that only dissipates heat through the heat exchange fan 16, this device effectively improves the heat dissipation and condensation effect of the condenser 2 on the refrigerant, thereby improving the use effect of the refrigeration unit and making it more efficient.

[0022] See also Figure 1 The inner bottom of the casing 1 is provided with a compressor 4 on the right side of the condenser 2. The compressor 4 and the copper tube 3 are fixedly connected and communicated with each other. The heat absorption plate 5 is provided with a socket 6 adapted to the copper tube 3. The copper tube 3 passes through the inside of the socket 6, and the heat absorption plate 5 is in contact with the fins of the condenser 2. When in use, the refrigerant is compressed into a high-temperature and high-pressure gas in the compressor 4, dissipates heat through the condenser 2 and is condensed into a high-pressure liquid. In this process, the high-temperature and high-pressure refrigerant will continuously release heat to the outside world while flowing through the inside of the copper tube 3, and the fins of the condenser 2 will absorb a large amount of heat. The heat absorption plate 5 of the device is in direct contact with the copper tube 3 and the fins of the condenser 2, which can effectively absorb the heat on the copper tube 3 and the fins and conduct it to the heat sink 7, so that the front end of the semiconductor thermoelectric power generation sheet 9 contacts the hot end.

[0023] See also Figure 1 A heat dissipation fin 11 is fixedly installed at the rear end of the semiconductor refrigeration plate 10, and a heat dissipation fan 12 is fixedly installed at the rear end of the heat dissipation fin 11. The air outlet of the heat dissipation fan 12 passes through and is fixedly installed at the rear end of the casing 1. The heat dissipation fin 11 and the heat dissipation fan 12 can be used to dissipate the heat of the hot end of the semiconductor refrigeration plate 10 to avoid damage due to high temperature.

[0024] See also Figure 3 Evenly distributed thermal bridge holes 14 are provided between the front and back surfaces of the heat conducting plate 8, and evenly distributed cooling holes 15 are provided between the four sides of the heat conducting plate 8. The cooling holes 15 and the thermal bridge holes 14 are staggered, that is, through these thermal bridge holes 14, the heat transfer performance of the heat conducting plate 8 can be maintained while the area is increased to improve the conduction effect.

[0025] See also Figure 1 A heat exchange fan 16 is provided at the front end of the casing 1 corresponding to the condenser 2 for discharging the hot air in the casing 1.

[0026] Working principle: When in use, the refrigerant is compressed into a high-temperature and high-pressure gas in the compressor 4, and dissipates heat through the condenser 2 and condenses it into a high-pressure liquid. In this process, the high-temperature and high-pressure refrigerant will continuously release heat to the outside world while flowing through the inside of the copper tube 3. The fins of the condenser 2 will absorb a large amount of heat. The heat-absorbing plate 5 of this device is in direct contact with the copper tube 3 and the fins of the condenser 2, which can effectively absorb the heat on the copper tube 3 and the fins and conduct it to the heat sink 7, so that the front end of the semiconductor thermoelectric power generation plate 9 is in contact with the hot end. At the same time, the battery 13 provides electricity to the semiconductor refrigeration plate 10 to make it In operation, the front end of the semiconductor refrigeration plate 10 is the cold end, so that the heat at the rear end of the semiconductor thermoelectric power generation plate 9 can flow to the front cold end of the semiconductor refrigeration plate 10 through the action of the heat conducting plate 8, so that the rear end temperature of the semiconductor thermoelectric power generation plate 9 is reduced, and finally a temperature difference is generated between the front and rear ends of the semiconductor thermoelectric power generation plate 9, so that the semiconductor thermoelectric power generation plate 9 generates current, and the current is intelligently controlled by structures such as a controller to store the current in the battery 13, and then a part of the heat released by the refrigerant is converted into electrical energy. At the same time, the cooling effect of the cold end of the semiconductor refrigeration plate 10 can greatly reduce the temperature inside the casing 1.

Claims

1. A high-efficiency refrigeration unit for waste heat recovery, comprising a housing (1), characterized in that: A condenser (2) is fixedly mounted on the inner bottom of the casing (1) at a front end position near the left side, and uniformly distributed heat absorbing sheets (5) are inserted into the fin gaps of the condenser (2). A heat sink (7) is fixedly connected between the rear ends of the heat absorbing sheets (5), and a heat conducting plate (8) is fixedly mounted on the rear end of the heat conducting plate (7) by bolts. A semiconductor thermoelectric generating sheet (9) is mounted between the front end of the heat conducting plate (8) and the heat dissipating plate (7), and the semiconductor thermoelectric generating sheet (9) is fitted between the heat dissipating plate (7) and the heat conducting plate (8). A semiconductor cooling sheet (10) is mounted on the rear end of the heat conducting plate (8), and the front cold end of the semiconductor cooling sheet (10) is fitted between the heat conducting plate (8). A storage battery (13) is arranged on the inner bottom of the casing (1) at a rear end position near the right side, and the storage battery (13) is electrically connected to the semiconductor thermoelectric generating sheet (9) and the semiconductor cooling sheet (10).

2. The high-efficiency refrigeration unit for waste heat recovery according to claim 1, characterized in that: A copper tube (3) is provided inside the condenser (2), and a compressor (4) is fixedly installed on the inner bottom of the casing (1) on the right side of the condenser (2), and the compressor (4) and the copper tube (3) are fixedly connected and communicated.

3. The high-efficiency refrigeration unit with waste heat recovery according to claim 1, characterized in that: The heat absorbing plate (5) is provided with a socket (6) adapted to the copper tube (3), the copper tube (3) passes through the interior of the socket (6), and the heat absorbing plate (5) is in contact with the fins of the condenser (2).

4. The high-efficiency refrigeration unit with waste heat recovery according to claim 1, characterized in that: A heat dissipation fin (11) is fixedly mounted on the rear end of the semiconductor refrigeration plate (10), a heat dissipation fan (12) is fixedly mounted on the rear end of the heat dissipation fin (11), and an air outlet of the heat dissipation fan (12) passes through and is fixedly mounted on the rear end of the casing (1).

5. The high-efficiency refrigeration unit with waste heat recovery according to claim 1, characterized in that: Evenly distributed thermal bridge holes (14) are provided between the front and rear faces of the heat conducting plate (8), evenly distributed cooling holes (15) are provided between the four side faces of the heat conducting plate (8), and the cooling holes (15) and the thermal bridge holes (14) are staggered.

6. The high-efficiency refrigeration unit with waste heat recovery according to claim 1, characterized in that: A heat exchange fan (16) is provided at the front end of the casing (1) corresponding to the condenser (2).

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