High-stability wafer test fixture

Abstract

The utility model provides a high-stability wafer test fixture, which comprises a bottom plate, inserting rods are fixedly connected to four corners of the top end of the bottom plate, extension plates are arranged in the middles of the four inserting rods, transverse plates are fixedly connected to one side walls of the four extension plates, vertical rods are fixedly connected to the bottom ends of the four transverse plates, and the vertical rods are fixedly connected to the bottom ends of the vertical rods. The bottom ends of the four vertical rods are fixedly connected with ink blocks, recording paper is arranged under the four ink blocks, one side walls of the four extension plates are fixedly connected with a lamination plate, a groove is formed in the top end of the lamination plate, an adsorption disc is arranged in the middle of the groove, a wafer is placed in the adsorption disc, and a notch is formed in one side wall of the adsorption disc. According to the utility model, a series of structures are arranged, so that the chuck of the clamp is prevented from being directly pressed and contacted on the wafer, the probability of wafer damage is reduced, the operation steps are simplified, the wafer can be conveniently taken out from the clamp, the probability of deviation of the clamp on a detection machine is reduced, and the interference of the deviation of the clamp on a wafer detection result is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing, in particular to a high-stability wafer testing fixture. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its starting material is silicon and it is typically used to make chips. Wafer inspection involves performing probe tests on each individual crystal on the wafer. Because the inspection probes are thin and need to contact the contacts on the crystals, wafer inspection requires high stability. To maintain the stability of the wafer on the inspection machine during testing, tools such as fixtures are used to clamp the wafer. However, existing fixtures typically use a chuck to directly press the wafer. Due to the thinness of the wafer, the chuck can easily break the wafer due to excessive pressure. Furthermore, removal requires the chuck to be removed, which is cumbersome and difficult to perform. Furthermore, when the wafer is fixed to the inspection machine with a fixture, since the fixture and wafer are fixed and kept relatively stationary, any deviation of the fixture on the machine is difficult to detect immediately, making the wafer inspection results more susceptible to interference from fixture deviation. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the utility model provides a highly stable wafer testing fixture.

[0004] The technical solution adopted by the present invention to solve the above technical problems is:

[0005] A highly stable wafer testing fixture comprises a base plate, wherein the four corners of the top of the base plate are fixedly connected to insertion rods, the middle parts of the four insertion rods are provided with extension plates, one side wall of the four extension plates is fixedly connected to a horizontal plate, the bottom ends of the four horizontal plates are fixedly connected to vertical rods, the bottom ends of the four vertical rods are fixedly connected to ink blocks, recording paper is provided directly below the four ink blocks, one side wall of the four extension plates is fixedly connected to a stacking plate, the top of the stacking plate is provided with a groove, the middle part of the groove is provided with an adsorption disk, a wafer is placed inside the adsorption disk, one side wall of the adsorption disk is provided with a notch, the other side wall of the adsorption disk is fixedly connected to a horizontal rod, and an electrostatic generator is installed inside the stacking plate.

[0006] Furthermore, two clamping blocks are provided on the outer side of the adsorption disk, two hydraulic rods are installed on the inner walls on both sides of the groove, and the output ends of the four hydraulic rods are fixedly connected to the two clamping blocks respectively.

[0007] Furthermore, the two clamping blocks are movably connected to the groove via a hydraulic rod, the two clamping blocks are movably connected to the adsorption plate, and the adsorption plate is fixedly connected to the groove via the clamping blocks.

[0008] Furthermore, the top ends of the four extension plates are each provided with an insertion hole, and the four insertion rods are movably connected to the four extension plates through the insertion holes.

[0009] Furthermore, both side walls of the groove are provided with a card slot, and the two card slots are internally movably connected with a card plate, and the card plate is fitted with one end portion of the cross bar.

[0010] Furthermore, a clamping block is fixedly connected to the inner wall of the groove, the notch is movably engaged with the clamping block, and the adsorption plate is movably engaged with the clamping block via the notch.

[0011] Furthermore, the four recording papers are all connected with the bottom plate by snapping, and the four recording papers are movably connected with the ink block through an extension plate.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The high-stability wafer test fixture of the present application, through the setting of the suction plate and the notch, allows the wafer to be attracted to the fixture by the static electricity generated by the electrostatic generator and the suction plate when it is fixed on the fixture, avoiding the clamp head from directly pressing and contacting the wafer, reducing the probability of damage to the wafer, and then through the notch, cross bar and groove, the wafer can be quickly separated from the fixture by pulling it out, simplifying the operation steps, thereby facilitating the removal of the wafer from the fixture.

[0014] 2. The high-stability wafer test fixture of the present application, through the arrangement of stacking plates, base plates and insertion rods, allows the bottom of the fixture to be fixed more firmly to the top of the detection machine, reducing the probability of the fixture being offset on the detection machine. Combined with the ink block and recording paper, when the part of the fixture holding the wafer is offset from the bottom machine, the ink block will move in line with the recording paper and leave a movement track, so that the operator can detect the offset of the fixture in time through the marks on the recording paper, thereby reducing the interference of the fixture offset on the wafer detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the hydraulic rod and electrostatic generator of the utility model;

[0017] Figure 3 This is a schematic diagram of the notch and crossbar structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the block and groove structure of the utility model;

[0019] Figure 5 This is a schematic diagram of the grinding block and recording paper structure of the utility model.

[0020] In the figure: 1. stacking plate; 2. adsorption plate; 3. wafer; 4. clamping block; 5. card plate; 6. extension plate; 7. bottom plate; 8. insertion rod; 9. hydraulic rod; 10. electrostatic generator; 11. notch; 12. cross bar; 13. card block; 14. groove; 15. card slot; 16. jack; 17. cross plate; 18. vertical rod; 19. ink block; 20. recording paper. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings below.

[0022] like Figure 1-5As shown, a highly stable wafer test fixture comprises a base plate 7, which is fixed on the platform of the wafer inspection machine, and the stacking plate 1 is fixed to the insertion rod 8 on the base plate 7 through the insertion hole 16 on the extension plate 6, so that the fixture can be easily removed from the inspection machine; the four corners of the top of the base plate 7 are fixedly connected with the insertion rod 8, and the height of the four insertion rods 8 is the same and greater than the thickness of the stacking plate 1, so that the extension plate 6 can be smoothly put on the insertion rod 8 for clamping and fixing; the middle part of the four insertion rods 8 is provided with an extension plate 6, and the side wall of the four extension plates 6 is fixedly connected with a horizontal The bottom ends of the four horizontal plates 17 are fixedly connected with vertical rods 18. The horizontal plates 17 and the vertical rods 18 are made of high-strength plastic material and are not easy to deform, thereby achieving stable support for the ink block 19, which is conducive to the movement of the ink block 19 with the movement of the stacked plate 1; the bottom ends of the four vertical rods 18 are fixedly connected with ink blocks 19. The ink blocks 19 are cylindrical and have a smooth bottom surface. When they move in contact with the recording paper 20, they can leave clear black marks on the recording paper 20; There is a recording paper 20 directly below the four ink blocks 19. The recording paper 20 is also a round piece of paper, preferably with a White paper of a certain thickness is stuck in the limiting groove provided on the bottom plate 7, which is convenient for replacing the recording paper 20; one side wall of the four extension plates 6 is fixedly connected with a stacking plate 1, and a groove 14 is provided on the top of the stacking plate 1. The groove 14 is an irregular-shaped groove with an opening on one side, so that the adsorption plate 2 can be pushed into one side of the groove 14, thereby facilitating the removal of the adsorption plate 2 from the groove 14, and facilitating the removal of the wafer after inspection from the fixture; an adsorption plate 2 is provided in the middle of the groove 14, and the top of the adsorption plate 2 is also concave downward, so that when the wafer 3 is placed on the adsorption plate 2, the top is in contact with the adsorption plate 2. The top of the adsorption plate 2 is flush, which is conducive to the contact between the probe needle and the wafer 3; the wafer 3 is placed inside the adsorption plate 2, and a notch 11 is opened on one side wall of the adsorption plate 2. The other side wall of the adsorption plate 2 is fixedly connected to a cross bar 12, and the length of the cross bar 12 is fixed to play a limiting role; an electrostatic generator 10 is installed inside the stacking plate 1. After the electrostatic generator 10 is powered on, it can generate an electrostatic field at the bottom of the groove 14, so that the wafer 3 placed in the groove 14 is adsorbed and fixed, thereby avoiding direct pressing contact of the clamp's chuck on the wafer 3, and reducing the probability of damage to the wafer 3.

[0023] Specifically, two clamping blocks 4 are provided on the outside of the adsorption disk 2, and two hydraulic rods 9 are installed on the inner walls on both sides of the groove 14. The output ends of the four hydraulic rods 9 are fixedly connected to the two clamping blocks 4 respectively. The sizes of the two hydraulic rods 9 are adapted to the sizes of the stacking plate 1. The force generated at the same time can make the curved side of the clamping block 4 tightly adhere to the side of the adsorption disk 2 which is also a circular arc, thereby achieving clamping and fixation of the adsorption disk 2 and the stacking plate 1.

[0024] Furthermore, the two clamping blocks 4 are movably connected to the groove 14 through the hydraulic rod 9, the two clamping blocks 4 are movably connected to the adsorption plate 2, and the adsorption plate 2 is fixedly connected to the groove 14 through the clamping blocks 4. This design method can improve the stability of the clamp in clamping and fixing the wafer while realizing the disassembly of the clamp structure.

[0025] Furthermore, the tops of the four extension plates 6 are each provided with a socket 16, and the four insertion rods 8 are movably connected to the four extension plates 6 through the socket 16. The inner diameter of the socket 16 is larger than the outer diameter of the insertion rod 8, so that the insertion rod 8 can be fixed to the extension plate 6 by inserting into the socket 16, thereby realizing the snap-fit ​​fixation of the stacking plate 1 and the bottom plate 7, and at the same time facilitating the disassembly of the stacking plate 1 and the bottom plate 7.

[0026] Furthermore, both side walls of the groove 14 are provided with a card slot 15, and the two card slots 15 are internally movably connected with a card plate 5, and the card plate 5 is fitted with one end of the cross bar 12. The card slot 15 is provided on the inner wall of the opening on one side of the groove 14, so that the card plate 5 can be fixed on the groove 14 and fit tightly with one end of the cross bar 12, so that the four sides of the adsorption plate 2 are fixed in the groove 14, thereby increasing the stability of the test fixture.

[0027] Furthermore, a block 13 is fixedly connected to the inner wall of the groove 14, and the notch 11 is movably engaged with the block 13. The adsorption plate 2 is movably engaged with the block 13 through the notch 11. The docking of the notch 11 and the block 13 can enable the adsorption plate 2 to be quickly positioned in the groove 14, making it more convenient and quick to place the adsorption plate 2 in the groove 14, saving the operator's time.

[0028] Furthermore, the four recording papers 20 are all engaged and connected with the bottom plate 7, and the four recording papers 20 are movably connected with the ink block 19 through the extension plate 6. The recording papers 20 are all disc-shaped, and the center point of the recording paper 20 and the center point of the ink block 19 are located on the same vertical line, so that when the ink block 19 moves in contact with the recording paper 20, the starting point is the center point of the recording paper 20, which prevents the ink block 19 from slipping out of the recording paper 20, thereby facilitating the ink block 19 to leave a black mark on the recording paper 20.

[0029] The method of using this embodiment is as follows: before using this high-stability wafer test fixture, it is necessary to first fix the base plate 7 on the platform of the wafer inspection machine, and then align the extension plates 6 on both sides of the stack 1 with the insertion rods 8 on the base plate 7, so that the extension plates 6 are inserted into the insertion rods 8 through the circular holes, and at the same time, the ink block 19 is located directly above the center point of the recording paper 20; then the wafer 3 can be placed on the adsorption plate 2, and the power of the electrostatic generator 10 is turned on, so that an electrostatic field is generated at the top of the groove 14 on the adsorption plate 2, and the wafer 3 is electrostatically adsorbed and fixed; then the wafer 3 can be inspected. If during the inspection process, the stack 1 is offset from the base plate 7 by external force and is invisible to the naked eye, the extension plate 6 will drive the horizontal plate 17, the vertical rod 18 and the ink block 19 to slide along the recording paper 20, leaving a black mark on the recording paper 20. After completing the inspection, it is necessary to inspect the traces on the recording paper 20 at the same time. If no black sliding marks are left on the recording paper 20, it means that the inspection result is credible. When taking out the wafer 3, the stack 1 can be lifted to separate the stack 1 from the base plate 7, cut off the power supply of the electrostatic generator 10, and then pull the card plate 5 out of the card slot 15, pinch the cross bar 12 and pull it toward the opening direction of the groove 14 on one side, pull the adsorption plate 2 out of the groove 14 on the top of the stack 1, and then flip the adsorption plate 2 over to pour the wafer 3 out of the adsorption plate 2.

[0030] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art may modify or substitute equivalents for the technical solutions described in the aforementioned embodiments. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high-stability wafer test fixture, comprising a base plate (7), characterized in that: The four corners of the top of the bottom plate (7) are fixedly connected with an insertion rod (8), the middle of the four insertion rods (8) are provided with an extension plate (6), the side walls of the four extension plates (6) are fixedly connected with a horizontal plate (17), the bottom ends of the four horizontal plates (17) are fixedly connected with a vertical rod (18), the bottom ends of the four vertical rods (18) are fixedly connected with an ink block (19), and recording paper (20) is provided directly below the four ink blocks (19). The side walls of the four extension plates (6) are fixedly connected with a stacking plate (1), the top of the stacking plate (1) is provided with a groove (14), the middle of the groove (14) is provided with an adsorption disk (2), a wafer (3) is placed inside the adsorption disk (2), a notch (11) is provided on one side wall of the adsorption disk (2), the other side wall of the adsorption disk (2) is fixedly connected with a horizontal rod (12), and an electrostatic generator (10) is installed inside the stacking plate (1).

2. The high-stability wafer testing fixture according to claim 1, wherein: Two clamping blocks (4) are provided on the outside of the adsorption disk (2), and two hydraulic rods (9) are installed on the inner walls of both sides of the groove (14), and the output ends of the four hydraulic rods (9) are fixedly connected to the two clamping blocks (4) respectively.

3. The high-stability wafer testing fixture according to claim 2, wherein: The two clamping blocks (4) are movably connected to the groove (14) via a hydraulic rod (9), the two clamping blocks (4) are movably connected to the adsorption plate (2), and the adsorption plate (2) is fixedly connected to the groove (14) via the clamping blocks (4).

4. The high-stability wafer testing fixture according to claim 1, wherein: The top ends of the four extension plates (6) are each provided with a socket (16), and the four insertion rods (8) are movably connected to the four extension plates (6) through the socket (16).

5. The high-stability wafer testing fixture according to claim 1, wherein: Both side walls of the groove (14) are provided with a clamping slot (15), and a clamping plate (5) is movably engaged and connected inside the two clamping slots (15), and the clamping plate (5) is fitted with one end of the cross bar (12).

6. The high-stability wafer testing fixture according to claim 1, wherein: A clamping block (13) is fixedly connected to the inner wall of the groove (14), the notch (11) is movably engaged with the clamping block (13), and the adsorption disk (2) is movably engaged with the clamping block (13) via the notch (11).

7. The high-stability wafer testing fixture according to claim 1, wherein: The four recording papers (20) are all connected to the bottom plate (7) by snapping, and the four recording papers (20) are movably connected to the ink block (19) via the extension plate (6).

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