Automatic degumming device for semiconductor wafer

Abstract

The utility model discloses an automatic degumming device for semiconductor wafers, which belongs to the technical field of mechanical degumming and comprises a processing box and an L-shaped connecting rod, the L-shaped connecting rod is fixedly connected to the rear of the processing box, a first telescopic cylinder is fixedly connected to one side of the bottom of the L-shaped connecting rod, and a first telescopic rod is arranged in the first telescopic cylinder. A second telescopic cylinder is fixedly connected to the other side of the bottom of the L-shaped connecting rod, a second telescopic rod is arranged in the second telescopic cylinder, a filter box is arranged at the bottom of the first telescopic rod and the bottom of the second telescopic rod, the two telescopic rods are moved in the telescopic cylinder, the telescopic rods are moved upwards, and the degummed raw materials are driven to be separated from the treatment box; the position of a first telescopic rod in a first telescopic cylinder is moved, a filter box is inclined, the treated wafer is poured out, collection work is achieved, and degummed semiconductor wafers can be conveniently collected; a first baffle and a second baffle are arranged to prevent the wafers from falling off during collection, and an air heater is arranged to enable the degummed wafers to be quickly dried.

Description

Technical Field

[0001] The utility model belongs to the technical field of mechanized degumming, and in particular relates to an automatic degumming device for semiconductor wafers. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced ​​to form silicon wafers, also known as wafers. Domestic wafer production lines primarily focus on 8-inch and 12-inch wafers.

[0003] The semiconductor wafers are cut into pieces and transported to the degumming machine for degumming. During the degumming process, the crystal drag and the wafer are separated. The crystal drag falls off naturally in the heating pool and remains in the heating pool. The workpiece is then transported out of the heating pool by conveying.

[0004] At present, the existing automated degumming device for semiconductor wafers still has some defects. It is often inconvenient to collect the degummed semiconductor wafers, and manual collection is required, which is time-consuming and labor-intensive, affecting the collection efficiency. For this reason, we propose an automated degumming device for semiconductor wafers. Utility Model Content

[0005] The purpose of the present invention is to provide an automated degumming device for semiconductor wafers, so as to solve the problem in the above-mentioned background technology that it is inconvenient to collect the degummed semiconductor wafers, and manual collection is required, which is time-consuming and labor-intensive and affects the collection efficiency.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automated degumming device for semiconductor wafers, comprising a processing box and an L-shaped connecting rod, a heater is provided inside the processing box, an L-shaped connecting rod is fixedly connected to the rear of the processing box, a No. 1 telescopic cylinder is fixedly connected to one side of the bottom of the L-shaped connecting rod, a No. 1 telescopic rod is provided inside the No. 1 telescopic cylinder, the No. 1 telescopic rod is movably connected to the inside of the No. 1 telescopic cylinder, a No. 2 telescopic cylinder is fixedly connected to the other side of the bottom of the L-shaped connecting rod, a No. 2 telescopic rod is provided inside the No. 2 telescopic cylinder, the No. 2 telescopic rod is movably connected to the inside of the No. 2 telescopic cylinder, a filter box is provided at the bottom of the No. 1 telescopic rod and the No. 2 telescopic rod, and the filter box is rotatably connected to the bottom of the No. 1 telescopic rod and the No. 2 telescopic rod.

[0007] Preferably, electric push rods are provided inside the No. 1 telescopic cylinder and the No. 2 telescopic cylinder, the tops of the electric push rods are fixedly connected to the tops of the No. 1 telescopic cylinder and the No. 2 telescopic cylinder, and the bottoms of the electric push rods are fixedly connected to the tops of the No. 1 telescopic rod and the No. 2 telescopic rod.

[0008] Preferably, the bottoms of the No. 1 telescopic rod and the No. 2 telescopic rod are fixedly connected with movable parts, and the top of the filter box is provided with two movable blocks, and the movable blocks are rotatably connected inside the movable parts.

[0009] Preferably, a slide is fixedly connected to the front of the processing box, a baffle No. 1 is fixedly connected to both sides of the slide, a baffle No. 2 is movably connected below the baffle No. 1, a collection area is fixedly connected to the front of the slide, and a collection box is movably connected inside the collection area.

[0010] Preferably, a hot air blower is provided inside the first baffle, and the hot air blower is fixedly connected inside the first baffle.

[0011] Preferably, a slot is provided at the lower interior of the first baffle, and the second baffle is snapped into the slot.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The liquid is heated by a heater to separate the crystal drag and the wafer. After separation, the two telescopic rods are moved inside the telescopic cylinder. The telescopic rods are moved upward to drive the filter box and the debonded raw materials above to separate from the processing box. After filtering the water for a period of time, the No. 1 telescopic rod is moved inside the No. 1 telescopic cylinder, the filter box is tilted, and the processed wafers are poured out to realize the collection work, which is convenient for collecting the debonded semiconductor wafers, saving time and effort and improving collection efficiency.

[0014] 2. By starting two electric push rods at the same time, the filter box can be moved upward. Starting the rear electric push rod, the No. 1 telescopic rod is moved inside the No. 1 telescopic cylinder, and the angle of the filter storage box is tilted, which facilitates the automated movement of the filter box. The No. 1 and No. 2 baffles are set to prevent the wafers from falling during collection. The hot air blower can quickly dry the wafers after degumming. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the separation structure of the second baffle and the first baffle of the present invention;

[0017] Figure 3 This is a schematic cross-sectional structural diagram of a No. 1 telescopic rod and a No. 1 telescopic cylinder of the present invention.

[0018] In the figure: 1. Processing box; 2. L-shaped connecting rod; 3. Telescopic cylinder No. 1; 4. Telescopic rod No. 1; 5. Telescopic cylinder No. 2; 6. Telescopic rod No. 2; 7. Filter box; 8. Electric push rod; 9. Movable part; 10. Movable block; 11. Slide; 12. Baffle No. 1; 13. Baffle No. 2; 14. Collection area; 15. Collection box; 16. Hot air blower; 17. Card slot. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-3 The utility model provides a technical solution for an automated degumming device for semiconductor wafers: it includes a processing box 1 and an L-shaped connecting rod 2, a heater is provided inside the processing box 1, an L-shaped connecting rod 2 is fixedly connected to the rear of the processing box 1, a No. 1 telescopic cylinder 3 is fixedly connected to one side of the bottom of the L-shaped connecting rod 2, a No. 1 telescopic cylinder 3 is provided inside the No. 1 telescopic cylinder 3, the No. 1 telescopic rod 4 is movably connected to the inside of the No. 1 telescopic cylinder 3, a No. 2 telescopic cylinder 5 is fixedly connected to the other side of the bottom of the L-shaped connecting rod 2, a No. 2 telescopic cylinder 5 is provided inside the No. 2 telescopic cylinder 5, the No. 2 telescopic rod 6 is movably connected to the inside of the No. 2 telescopic cylinder 5, a filter box 7 is provided at the bottom of the No. 1 telescopic rod 4 and the No. 2 telescopic rod 6, and the filter box 7 is rotatably connected to the bottom of the No. 1 telescopic rod 4 and the No. 2 telescopic rod 6.

[0021] Specifically, an electric push rod 8 is provided inside the No. 1 telescopic cylinder 3 and the No. 2 telescopic cylinder 5. The top of the electric push rod 8 is fixedly connected to the top of the No. 1 telescopic cylinder 3 and the No. 2 telescopic cylinder 5, and the bottom of the electric push rod 8 is fixedly connected to the top of the No. 1 telescopic rod 4 and the No. 2 telescopic rod 6.

[0022] Specifically, the bottoms of the No. 1 telescopic rod 4 and the No. 2 telescopic rod 6 are fixedly connected with a movable part 9 , and the top of the filter box 7 is provided with two movable blocks 10 , which are rotatably connected to the inside of the movable part 9 .

[0023] Specifically, a slide 11 is fixedly connected to the front of the processing box 1, a baffle No. 12 is fixedly connected to both sides of the slide 11, a baffle No. 2 is movably connected below the baffle No. 12, a collection area 14 is fixedly connected to the front of the slide 11, and a collection box 15 is movably connected inside the collection area 14.

[0024] Specifically, a hot air blower 16 is provided inside the first baffle 12 , and the hot air blower 16 is fixedly connected inside the first baffle 12 .

[0025] Specifically, a slot 17 is provided at the lower portion of the first baffle 12 , and the second baffle 13 is snapped into the slot 17 .

[0026] In this embodiment, when the degumming device is used, the wafer raw material is poured onto the filter box 7, the filter box 7 is deeply inserted into the processing box 1, the degumming liquid is added, and the liquid is heated by the heater to separate the crystal drag and the wafer. After separation, the two telescopic rods are moved inside the telescopic cylinder, and the telescopic rods are moved upward to drive the filter box 7 and the degummed raw material above to separate from the processing box 1. After filtering the water for a period of time, the No. 1 telescopic rod 4 is moved to the position inside the No. 1 telescopic cylinder 3, the filter box 7 is tilted, and the processed wafers are poured out to realize the collection work, which is convenient for collecting the degummed semiconductor wafers, saving time and effort, and improving the collection efficiency.

[0027] By simultaneously starting the two electric push rods 8, the filter box 7 can be moved upward. By starting the rear electric push rod 8, the No. 1 telescopic rod 4 can be moved inside the No. 1 telescopic cylinder 3, and the angle of the filter box 7 can be tilted, which facilitates the automated movement of the filter box 7. The No. 1 baffle 12 and the No. 2 baffle 13 are provided to prevent the wafers from falling during collection, and the provided hot air blower 16 can quickly dry the debonded wafers.

[0028] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprise," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations. The phrase "includes an element defined by..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated debonding device for semiconductor wafers, comprising a processing box (1) and an L-shaped connecting rod (2), characterized in that: A heater is provided inside the processing box (1), and an L-shaped connecting rod (2) is fixedly connected to the rear of the processing box (1), and a first telescopic cylinder (3) is fixedly connected to one side of the bottom of the L-shaped connecting rod (2), and a first telescopic rod (4) is provided inside the first telescopic cylinder (3), and the first telescopic rod (4) is movably connected inside the first telescopic cylinder (3), and a second telescopic cylinder (5) is fixedly connected to the other side of the bottom of the L-shaped connecting rod (2), and a second telescopic rod (6) is provided inside the second telescopic cylinder (5), and the second telescopic rod (6) is movably connected inside the second telescopic cylinder (5), and a filter box (7) is provided at the bottom of the first telescopic rod (4) and the second telescopic rod (6), and the filter box (7) is rotatably connected to the bottom of the first telescopic rod (4) and the second telescopic rod (6).

2. The automated debonding device for semiconductor wafers according to claim 1, wherein: The first telescopic cylinder (3) and the second telescopic cylinder (5) are both provided with electric push rods (8), the tops of the electric push rods (8) are respectively fixedly connected to the tops of the first telescopic cylinder (3) and the second telescopic cylinder (5), and the bottoms of the electric push rods (8) are respectively fixedly connected to the tops of the first telescopic rod (4) and the second telescopic rod (6).

3. The automated debonding device for semiconductor wafers according to claim 1, wherein: The bottoms of the first telescopic rod (4) and the second telescopic rod (6) are fixedly connected with movable parts (9), and the top of the filter box (7) is provided with two movable blocks (10), and the movable blocks (10) are rotatably connected inside the movable parts (9).

4. The automated debonding device for semiconductor wafers according to claim 1, wherein: The front of the processing box (1) is fixedly connected to a slide (11), both sides of the slide (11) are fixedly connected to a first baffle (12), a second baffle (13) is movably connected below the first baffle (12), the front of the slide (11) is fixedly connected to a collection area (14), and a collection box (15) is movably connected inside the collection area (14).

5. The automated debonding device for semiconductor wafers according to claim 4, characterized in that: A hot air blower (16) is provided inside the first baffle (12), and the hot air blower (16) is fixedly connected inside the first baffle (12).

6. The automated debonding device for semiconductor wafers according to claim 4, characterized in that: A slot (17) is provided at the lower interior of the first baffle (12), and the second baffle (13) is snap-connected to the interior of the slot (17).

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