Chip transfer correction device and chip transfer chamber

Abstract

The utility model discloses a wafer conveying correction device and a wafer conveying cavity. The wafer conveying correction device comprises a detection assembly and a correction assembly. The detection assembly is installed on the cavity wall of the wafer conveying cavity, connected with the upper computer and used for emitting a detection light beam and determining the position of the wafer based on shielding information of the detection light beam. And the correction assembly is arranged on the cavity wall of the wafer conveying cavity, is connected with the upper computer, and is used for driving the wafer to rotate so as to correct the position of the wafer. In addition, process adjustment is added to the wafer conveying correction device, angular displacement deviation of the wafer is corrected in the wafer conveying process, an external manipulator, a vacuum manipulator and a wafer moving table do not need to be changed, and the change cost is low. The wafer conveying correction device comprises a detection assembly and a correction assembly, the detection assembly can detect the actual position of the wafer in the wafer conveying cavity, and the correction assembly can correct the position of the wafer under the control of the upper computer, so that errors caused by an external manipulator can be at least partially eliminated, the wafer conveying precision is improved, and the equipment index is improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a film transmission calibration device and a film transmission chamber. Background Art

[0002] The Critical Dimension Scanning Electron Microscope (CD-SEM) is a crucial instrument in the front-end process of semiconductor manufacturing, playing a crucial role in verifying the rationality and reliability of front-end process parameter settings. CD-SEMs are used to inspect chip performance and defects, and they must be maintained in a high vacuum environment to protect wafer inspection from other factors.

[0003] In the prior art, an external robot retrieves a wafer and places it in a transfer chamber. A vacuum robot then removes the wafer from the transfer chamber and places it on a wafer motion stage for feature size scanning electron microscope inspection. However, when transferring wafers between the external robot and the vacuum robot, the transfer accuracy between the two is difficult to guarantee. Utility Model Content

[0004] An embodiment of the present application provides a film transmission correction device and a film transmission chamber, wherein the film transmission correction device can improve the film transmission accuracy.

[0005] In the first aspect, an embodiment of the present application provides a wafer transmission correction device, which includes a detection component and a correction component; the detection component is installed on the cavity wall of the wafer transmission chamber and is connected to the host computer, and is used to emit a detection beam and determine the position of the wafer based on the occlusion information of the detection beam; the correction component is installed on the cavity wall of the wafer transmission chamber and is connected to the host computer, and is used to drive the wafer to rotate to correct the position of the wafer.

[0006] Optionally, the detection component includes a transmitter and a receiver; the transmitter is installed on the outside of the cavity wall of the film transmission chamber, located below the film transmission chamber, and connected to the host computer for emitting a detection beam; the receiver is installed on the outside of the cavity wall of the film transmission chamber, located above the film transmission chamber, and connected to the host computer for receiving the detection beam so that the host computer can determine the position of the wafer based on the occlusion information of the detection beam.

[0007] Optionally, the film transmission correction device also includes a first adjustment component, which includes a first mounting seat and a first adjustment member; the first mounting seat includes a first vertical plate and a first horizontal plate, the first vertical plate is connected to the first horizontal plate, the transmitter is installed on the first vertical plate, the first horizontal plate is installed on the wall of the film transmission chamber, and a first adjustment gap is provided between the first horizontal plate and the wall of the film transmission chamber; the first adjustment member is threadedly connected to the first horizontal plate and abuts against the wall of the film transmission chamber at one end, and there are multiple first adjustment members for adjusting the width of each part of the first adjustment gap.

[0008] Optionally, the film transmission correction device also includes a second adjustment component, which includes a second mounting seat, a second longitudinal adjustment member and a second transverse adjustment member; the second mounting seat includes a second vertical plate and a second transverse plate, the second vertical plate is connected to the second transverse plate, the receiver is mounted on the second vertical plate, the second transverse plate is mounted on the wall of the film transmission chamber, and a second adjustment gap is provided between the second transverse plate and the film transmission chamber; the second longitudinal adjustment member is threadedly connected to the second transverse plate and abuts against the wall of the film transmission chamber at one end, and there are multiple second longitudinal adjustment members for adjusting the width of the second adjustment gap at various locations; the second transverse adjustment member is vertically arranged to the second longitudinal adjustment member, the second transverse adjustment member is threadedly connected to the second vertical plate and abuts against the receiver at one end for adjusting the position of the receiver.

[0009] Optionally, the correction component includes a driving member and a supporting member; the driving member is installed on the outside of the cavity wall of the film transmission chamber and extends into the film transmission chamber below the film transmission chamber, and the driving member is connected to the host computer and is used to rotate under the control of the host computer; the supporting member is located in the film transmission chamber and is connected to the driving member, and is used to drive the wafer to rotate under the drive of the driving member.

[0010] Optionally, the film transmission correction device also includes a third adjustment component, and the third adjustment component includes a third mounting seat and a third adjustment member; the driving member is mounted on the third mounting seat, and the third mounting seat is mounted on the cavity wall of the film transmission chamber, and a third adjustment gap is provided between the third mounting seat and the cavity wall of the film transmission chamber; the third adjustment member is threadedly connected to the third mounting seat and abuts against the cavity wall of the film transmission chamber at one end, and there are multiple third adjustment members for adjusting the width of the third adjustment gap.

[0011] Optionally, the driving member is a servo motor; the supporting member includes a wafer tray and an anti-slip structure; the wafer tray is installed on the driving member and is used to rotate under the drive of the driving member; the anti-slip structure is installed on the wafer tray and is used to prevent the wafer from sliding.

[0012] Optionally, the anti-slip structure is a friction column installed on the top surface of the wafer tray; and / or the anti-slip structure is a rubber ring installed on the top surface of the wafer tray.

[0013] Optionally, there is one anti-slip structure, and the axis of the anti-slip structure coincides with the axis of the wafer carrier; or there are multiple anti-slip structures, and they are distributed in an array with the axis of the wafer carrier as the center.

[0014] In a second aspect, an embodiment of the present application provides a film transmission chamber, which includes the film transmission correction device described in the above technical solution.

[0015] The embodiments of the present application provide a wafer conveyor correction device and wafer conveyor chamber. The wafer conveyor correction device adds process adjustment to correct the angular displacement deviation of the wafer during the wafer conveying process, without requiring modifications to the external manipulator, vacuum manipulator, or wafer motion stage, resulting in low modification costs. The wafer conveyor correction device includes a detection component and a correction component. The detection component can detect the actual position of the wafer in the wafer conveyor chamber, and the correction component can correct the position of the wafer under the control of a host computer, thereby at least partially eliminating the errors caused by the external manipulator, improving wafer conveying accuracy, and enhancing equipment specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic diagram of the installation of the film transmission calibration device according to some embodiments of the present application;

[0018] Figure 2 A schematic diagram of a wafer inspection device according to some embodiments of the present application;

[0019] Figure 3 This is a schematic diagram of the connection of the transmitter in the first adjustment component in some embodiments of the present application;

[0020] Figure 4 Schematic diagram of the connection between the receiver and the second regulating component in some embodiments of the present application

[0021] Figure 5 This is a schematic diagram of the connection between the correction component and the third adjustment component in some embodiments of the present application.

[0022] In the attached figure:

[0023] 1-receiver; 2-correction assembly; 21-carrying member; 211-anti-slip structure; 22-driving member; 23-coupling; 3-second adjustment assembly; 31-second longitudinal adjustment member; 32-second transverse adjustment member; 33-second mounting seat; 331-second vertical plate; 332-second horizontal plate; 34-third protective plate; 4-film transmission chamber; 41-second protective plate; 42-first protective plate; 5-transmitter; 6-first adjustment assembly; 61-first mounting seat; 611-first vertical plate; 612-first horizontal plate; 62-first adjustment member; 7-detection beam; 8-third adjustment assembly; 81-third mounting seat; 82-third adjustment member; 9-wafer. DETAILED DESCRIPTION

[0024] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0025] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0026] CD-SEM equipment is a critical component of the front-end semiconductor manufacturing process and plays a crucial role in verifying the rationality and reliability of front-end process parameter settings. CD-SEM equipment is used to inspect wafer performance and defects, and must always be in a high vacuum environment during inspection to ensure that wafer inspection is unaffected by other factors. When wafers are delivered to the CD-SEM, an external robot removes the wafer from the cassette and places it in a designated location within the transfer chamber. Once the transfer chamber establishes a vacuum, the vacuum robot removes the wafer from the transfer chamber and places it on the wafer motion stage for defect detection.

[0027] After being removed by an external robot, the wafer is placed in the wafer transfer chamber. From there, the wafer is placed on the wafer motion stage by a vacuum robot. During this process, wafer transfer accuracy depends on the precision of each module involved (e.g., the external robot and vacuum robot). Both the external robot and the vacuum robot have certain errors, and the wafer motion stage also has positioning errors, making it difficult to improve wafer transfer accuracy.

[0028] The inventors discovered that, due to factors such as cost and R&D difficulty, errors in the external robot, vacuum robot, and wafer motion stage cannot be eliminated. These errors accumulate, significantly reducing wafer transfer accuracy. However, the inventors discovered that wafer transfer accuracy can be improved by improving the accuracy of wafer transfer between the external robot and vacuum robot. The cost of this improvement is highly cost-effective compared to the improvement in wafer transfer accuracy.

[0029] In view of this, the present application provides a film transmission correction device and a film transmission chamber, which can improve the film transmission accuracy.

[0030] Please refer to Figures 1 to 5 ,in, Figure 1 This is a schematic diagram of the installation of the film transmission calibration device according to some embodiments of the present application; Figure 2 A schematic diagram of a wafer inspection device according to some embodiments of the present application; Figure 3 This is a schematic diagram of the connection of the transmitter in the first adjustment component in some embodiments of the present application; Figure 4 A schematic diagram of the connection between the receiver and the second regulating component in some embodiments of the present application; Figure 5 This is a schematic diagram of the connection between the correction component and the third adjustment component in some embodiments of the present application.

[0031] First, as Figure 1 and Figure 2 As shown, an embodiment of the present application provides a film transmission correction device, which includes a detection component and a correction component 2; the detection component is installed on the cavity wall of the film transmission chamber 4 and is connected to the host computer; the correction component 2 is installed on the cavity wall of the film transmission chamber 4 and is connected to the host computer.

[0032] The detection component can emit a detection beam 7 and determine the position of the wafer 9 based on the occlusion information of the detection beam 7. The detection component emits a detection beam 7, and the detection beam 7 is blocked by the wafer 9. The blocked detection beam 7 is received by the detection component, and the optical signal is converted into an electrical signal, which is obtained by the host computer, and the host computer can determine the actual position of the wafer 9.

[0033] Under the control of the host computer, the correction component 2 can drive the wafer 9 to rotate and adjust the position of the wafer 9, thereby correcting the angular deviation of the wafer 9 transmitted by the external robot. The wafer 9 has a notch. The detection beam 7 emitted by the detection component is received after being irradiated on the notch, converted into an electrical signal, and then acquired by the host computer. The host computer compares the actual detected notch position with the preset notch position to determine the angular displacement deviation of the wafer 9, and controls the correction component 2 to drive the wafer 9 to rotate and correct the angular displacement deviation.

[0034] The deviations generated when the external robot drives the wafer 9 to move are linear displacement deviation and angular displacement deviation. The correction component 2 only corrects the angular displacement deviation of the wafer 9, while the linear displacement deviation of the wafer 9 can be compensated by the upper computer controlling the vacuum robot arm and the wafer motion table when transferring the wafer 9.

[0035] In the technical solution of the above-described embodiment, the wafer transfer correction device adds process adjustment to correct the angular displacement deviation of wafer 9 during the wafer transfer process, eliminating the need to modify the external robot, vacuum robot, or wafer motion stage, resulting in low modification costs. The detection component can detect the actual position of wafer 9 within wafer transfer chamber 4, and the correction component 2 can correct the angular displacement deviation of wafer 9 under the control of the host computer, thereby at least partially eliminating the errors caused by the external robot, improving wafer transfer accuracy, and enhancing equipment performance.

[0036] In some embodiments of the present application, Figure 2 As shown, the detection component includes a transmitter 5 and a receiver 1; the transmitter 5 is installed on the outside of the cavity wall of the film transmission chamber 4, located below the film transmission chamber 4, and connected to the host computer; the receiver 1 is installed on the outside of the cavity wall of the film transmission chamber 4, located above the film transmission chamber 4, and connected to the host computer.

[0037] The transmitter 5 is mounted on the outside of the cavity wall of the transmission chamber 4. The transmitter 5 can be mounted on the outside of the transmission chamber 4, but the transmitter head extends into the transmission chamber 4. Alternatively, the transmitter 5 can be located entirely outside the transmission chamber 4. The portion of the transmission chamber 4 corresponding to the transmitter head is made of a transparent material, which does not affect the transmitter 5 from emitting the detection light beam 7. The transparent material can be glass, acrylic, etc. The receiver 1 is mounted on the outside of the cavity wall of the transmission chamber 4. The receiver 1 can be mounted on the outside of the cavity wall of the transmission chamber 4, but the transmitter head extends into the transmission chamber 4. Alternatively, the receiver 1 can be located entirely outside the transmission chamber 4. The portion of the transmission chamber 4 corresponding to the transmitter head is made of glass, which does not affect the receiver 1 from receiving the detection light beam 7. The receiver 1 converts the signal of the blocked detection light beam 7 into an electrical signal for the host computer to determine the actual position of the wafer 9 based on the blocking information of the detection light beam 7.

[0038] In the technical solution of the above embodiment, the transmitter 5 and the receiver 1 are both installed on the outside of the cavity wall of the wafer transmission chamber 4, and do not occupy the space of the wafer transmission chamber 4, so as not to reduce the performance indicators of the wafer transmission chamber 4 (for example, it will not affect the time for the wafer transmission chamber 4 to establish vacuum, and will not reduce the efficiency of wafer 9 detection), and will not have a negative impact on the wafer transmission chamber 4 while improving the wafer transmission accuracy.

[0039] In some embodiments of the present application, Figure 3 As shown, the film transmission correction device also includes a first adjustment component 6, which includes a first mounting seat 61 and a first adjustment member 62; the first mounting seat 61 includes a first vertical plate 611 and a first horizontal plate 612, the first vertical plate 611 is connected to the first horizontal plate 612, the transmitter 5 is installed on the first vertical plate 611, and the first horizontal plate 612 is installed on the cavity wall of the film transmission chamber 4, and a first adjustment gap is provided between the first horizontal plate 612 and the cavity wall of the film transmission chamber 4; the first adjustment member 62 is threadedly connected to the first horizontal plate 612, and abuts against the cavity wall of the film transmission chamber 4 at one end, and there are multiple first adjustment members 62 for adjusting the width of each part of the first adjustment gap.

[0040] In the wafer transfer calibration device, the emitter 5 is mounted on a first adjustment assembly 6, which is mounted outside the wall of the wafer transfer chamber 4 and located below the chamber. The first adjustment assembly 6 provides a mounting position for the emitter 5 and allows for adjustment of its position. For example, in the case of wafer 9 being transferred on a horizontal surface, the first transverse plate 612 is positioned horizontally, while the first vertical plate 611 is positioned vertically. To save space, one end of the first vertical plate 611 is connected to one end of the first transverse plate 612. The emitter 5 is mounted on the first vertical plate 611. The emitter 5 is required to emit the detection beam 7 vertically. However, during actual installation, there are assembly errors in the first transverse plate 612, as well as errors in the installation of the emitter 5 on the first vertical plate 611. This creates a first adjustment gap between the first transverse plate 612 and the wall of the wafer transfer chamber 4. To ensure that the emitter 5 emits the detection beam 7 vertically, leveling is required to ensure that the first transverse plate 612 is positioned horizontally. During adjustment, the first adjusting member 62 is rotated in the threaded direction. One end of the first adjusting member 62 is unscrewed from the first transverse plate 612 and abuts against the wall of the film transmission chamber 4. Twisting the first adjusting member 62 adjusts the first adjustment gap, thereby increasing or decreasing the width of the first adjustment gap at the location of the first adjusting member 62. There are multiple, at least three, first adjusting members 62 (using the principle of three points defining a plane).

[0041] When the first adjusting member 62 presses against the film transmission chamber 4, it will leave marks on its wall surface, damaging the wall of the film transmission chamber 4. To this end, a first protective plate 42 can be set between the first adjusting component 6 and the film transmission chamber 4, and the first transverse plate 612 is installed on the first protective plate 42 to serve as a protective layer for the wall of the film transmission chamber 4. At this time, the first adjustment gap between the first transverse plate 612 and the film transmission chamber 4 is between the first transverse plate 612 and the first protective plate 42. When leveling the transmitter 5, one end of the first adjusting member 62 rests on the first protective plate 42, squeezing the surface of the first protective plate 42, thereby adjusting the width of the first adjustment gap. Holes can be set on the first transverse plate 612 and the first protective plate 42 to avoid interference with the detection light beam 7.

[0042] In the technical solution of the above embodiment, the wafer correction device can not only provide an installation position for the emitter 5 by setting a first adjustment component 6, but also level the emitter 5 so that the detection light beam 7 is emitted perpendicular to the surface of the wafer 9, thereby improving the detection accuracy.

[0043] In some embodiments of the present application, Figure 4 As shown, the film transmission correction device also includes a second adjustment component 3, which includes a second mounting seat 33, a second longitudinal adjustment piece 31 and a second transverse adjustment piece 32; the second mounting seat 33 includes a second vertical plate 331 and a second transverse plate 332, the second vertical plate 331 is connected to the second transverse plate 332, the receiver 1 is installed on the second vertical plate 331, and the second transverse plate 332 is installed on the cavity wall of the film transmission chamber 4, and a second adjustment gap is provided between the second transverse plate 332 and the cavity wall of the film transmission chamber 4; the second longitudinal adjustment piece 31 is threadedly connected to the second transverse plate 332, and abuts against the cavity wall of the film transmission chamber 4 at one end, and there are multiple second longitudinal adjustment pieces 31, which are used to adjust the width of the second adjustment gap at various locations; the second transverse adjustment piece 32 is vertically arranged to the second longitudinal adjustment piece 31, and the second transverse adjustment piece 32 is threadedly connected to the second vertical plate 331, and abuts against the receiver 1 at one end, and can cooperate with the second longitudinal adjustment piece 31 to adjust the position of the receiver 1.

[0044] In the film transmission correction device, the second adjustment component 3 is installed on the cavity wall of the film transmission chamber 4, and the receiver 1 is installed on the second adjustment component 3. The second adjustment component 3 can realize the leveling of the receiver 1 so that the receiving surface of the receiver 1 is set perpendicular to the detection light beam 7. When adjusting the receiver 1 so that the receiving surface of the receiver 1 is perpendicular to the detection light beam 7, the second longitudinal adjustment member 31 is rotated to adjust the width of each part of the second adjustment gap, thereby leveling the receiver 1. When the transmitter 5 and the receiver 1 cooperate to detect the position of the wafer 9, the center of the transmitter 5 and the center of the receiver 1 need to coincide. The second transverse adjustment member 32 is set perpendicular to the second longitudinal adjustment member 31. The second transverse adjustment member 32 can squeeze the receiver 1 when rotating, thereby adjusting the transverse position of the receiver 1, so that the center of the transmitter 5 coincides with the center of the receiver 1.

[0045] A second protective plate 41 can also be provided on the film transmission chamber 4, and a third protective plate 34 can also be provided on the second adjustment assembly 3. The second protective plate 41 is mounted on the wall of the film transmission chamber 4, the second transverse plate 332 is mounted on the second protective plate 41, the receiver 1 is mounted on the third protective plate 34, and the third protective plate 34 is mounted on the second vertical plate 331. A second adjustment gap is formed between the second transverse plate 332 and the second protective plate 41, and the second transverse adjustment member 32 presses against the third protective plate 34. Holes can also be provided in the second protective plate 41 and the second transverse plate 332 to prevent interference with the detection beam 7.

[0046] In the technical solution of the above embodiment, the film correction device can not only provide an installation position for the receiver 1 by setting the second adjustment component 3, but also level the receiver 1 and align the center of the receiver 1 and the transmitter 5, thereby improving the detection accuracy.

[0047] In some embodiments of the present application, Figure 2 As shown, the correction component 2 includes a driving member 22 and a supporting member 21; the driving member 22 is installed on the outer side of the cavity wall of the film transmission chamber 4, and extends into the film transmission chamber 4 below the film transmission chamber 4, and the driving member 22 is connected to the upper computer; the supporting member 21 is located in the film transmission chamber 4 and is connected to the driving member 22.

[0048] The driver 22 acts as a power element, providing power to rotate the carrier 21. The carrier 21 serves as a carrier for the wafer 9, providing a placement position for the wafer 9 within the wafer transfer chamber 4. Once the wafer 9 is placed on the carrier 21, the placement angle of the wafer 9 can be adjusted. The driver 22 is connected to a host computer. After receiving detection information from the detection assembly, the host computer controls the driver 22 to rotate the carrier 21, thereby correcting the angular displacement deviation of the wafer 9.

[0049] In the technical solution of the above-described embodiment, the driver 22 of the calibration assembly 2, after being connected to a host computer, can drive the carrier 21 to rotate under the control of the host computer, thereby adjusting the angular displacement deviation of the wafer 9 and improving wafer transfer accuracy. The driver 22 is located outside the wafer transfer chamber 4 and does not occupy the internal space of the wafer transfer chamber 4. This improves wafer transfer accuracy without negatively affecting the original performance of the wafer transfer chamber 4.

[0050] In some embodiments of the present application, Figure 5 As shown, the film transmission correction device also includes a third adjustment component 8, and the third adjustment component 8 includes a third mounting seat 81 and a third adjustment member 82; the driving member 22 is mounted on the third mounting seat 81, and the third mounting seat 81 is mounted on the film transmission chamber 4, and a third adjustment gap is provided between the third mounting seat 81 and the cavity wall of the film transmission chamber 4; the third adjustment member 82 is threadedly connected to the third mounting seat 81, and abuts against the cavity wall of the film transmission chamber 4 at one end. There are multiple third adjustment members 82, which can adjust the width of the third adjustment gap at various locations.

[0051] The third mounting seat 81 is mounted on the wall of the wafer transfer chamber 4, and the driver 22 is mounted on the third mounting seat 81. The drive shaft of the driver 22 passes through the third mounting seat 81 and the wall of the wafer transfer chamber 4 before entering the wafer transfer chamber 4. A third adjustable gap is defined between the third mounting seat 81 and the wall of the wafer transfer chamber 4. The third adjusting member 82 is used to adjust the width of the third gap at various locations to level the surface of the carrier 21 that receives the wafer 9.

[0052] For example, when the first horizontal plate 612, the second horizontal plate 332, and the third mounting seat 81 are connected to the wall of the transmission chamber 4, they can all be bolted to the wall of the transmission chamber 4. The transmitter 5 can be bolted to the first vertical plate 611, and the receiver 1 can be bolted to the second vertical plate 331 or the third protective plate 34. The first adjustment member 62, the second transverse adjustment member 32, the second longitudinal adjustment member 31, and the third adjustment member 82 can all be screwed. The number of the first adjustment member 62, the second transverse adjustment member 32, and the third adjustment member 82 can all be three, and the number of the second transverse adjustment member 32 can be two.

[0053] In the technical solution of the above embodiment, the film transmission correction device can realize the leveling of the carrier 21 by setting a third adjustment component 8, so that the plane where the transmitter 5 emits the detection light beam 7, the plane where the receiver 1 receives the detection light beam 7, and the plane where the carrier 21 places the wafer 9 are parallel, thereby improving the detection accuracy and thus improving the film transmission accuracy of the wafer 9.

[0054] In some embodiments of the present application, Figure 5As shown, the driving member 22 is a servo motor; the supporting member 21 includes a wafer receiving plate and an anti-slip structure 211; the wafer receiving plate is mounted on the driving member 22, and the anti-slip structure 211 is mounted on the wafer receiving plate.

[0055] The driving member 22 is a servo motor. After being connected to the host computer, the servo motor can rotate under the control of the host computer to form a closed-loop regulation. The servo motor can be connected to the wafer tray through a coupling 23, thereby realizing synchronous rotation with the wafer tray. The anti-skid structure 211 is installed on the wafer tray. As a structure that directly contacts the wafer 9, it plays a role in suppressing the sliding of the wafer 9 and avoiding sliding friction between the wafer 9 and the anti-skid structure 211. The anti-skid structure 211 can be any structure that can increase friction but does not damage the wafer 9.

[0056] In the technical solution of the above embodiment, the driving member 22 is a servo motor that can achieve precise adjustment to correct the angular displacement deviation of the wafer 9. The carrier 21 is provided with an anti-slip structure 211 to prevent the wafer 9 from sliding relative to the wafer tray during correction, thereby improving the correction accuracy.

[0057] In some embodiments of the present application, Figure 5 As shown, the anti-skid structure 211 is a friction column installed on the top surface of the wafer tray; and / or the anti-skid structure 211 is a rubber ring installed on the top surface of the wafer tray.

[0058] The anti-slip structure 211 can be a friction column mounted on the top surface of the wafer tray, a rubber ring mounted on the top surface of the wafer tray, or both a friction column and a rubber ring. The surface of the friction column that contacts the wafer 9 can be made of magnetic fluid material. The rubber ring can be an O-ring.

[0059] In the technical solutions of the above embodiments, the anti-slip structure 211 may be a variety of structures, or a combination of a variety of structures, thereby enriching the options of the anti-slip structure 211 .

[0060] In some embodiments of the present application, Figure 5 As shown, there is one anti-skid structure 211, and the axis of the anti-skid structure 211 coincides with the axis of the wafer tray; or there are multiple anti-skid structures 211, and they are distributed in an array with the axis of the wafer tray as the center.

[0061] The top surface of the wafer tray can be provided with a single friction post or a single rubber ring. When there is only one friction post or rubber ring, the axis of the friction post or rubber ring coincides with the axis of the wafer tray. The top surface of the wafer tray can also be provided with multiple friction posts or multiple rubber rings. When there are multiple friction posts or multiple rubber rings, they are arranged in an array. The top surface of the wafer tray can also be provided with multiple friction posts and multiple rubber rings simultaneously. The multiple friction posts are arranged in a circular array around the axis of the wafer tray, and the multiple rubber rings are arranged in a circular array around the axis of the wafer tray.

[0062] In the technical solution of the above embodiment, the number of anti-slip structures 211 can be flexibly selected. When the number of anti-slip structures 211 is one, the axis of the anti-slip structure 211 coincides with the axis of the wafer supporting plate, so that the wafer 9 can be subjected to balanced force; when the number of anti-slip structures 211 is multiple, the multiple anti-slip structures 211 are distributed in an array with the axis of the wafer supporting plate as the center, so that the wafer 9 can be subjected to balanced force.

[0063] In a second aspect, an embodiment of the present application provides a film transmission chamber 4, which includes the film transmission correction device of any of the above embodiments.

[0064] The wafer transfer chamber 4 can be set in the core area of ​​the semiconductor process equipment, especially in the processing of wafers, as a transmission channel for the wafers in the equipment, facilitating the interaction of wafers in environments with different air pressures (for example, the interaction of wafers between an atmospheric pressure environment and a vacuum environment). The wafer transfer chamber 4 can be used in equipment for processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation (Implant), and wet etching. For example, the wafer transfer chamber 4 can serve as a channel for the characteristic size scanning electron microscope to interact with the outside world, and the position of the wafer can be corrected during the interaction.

[0065] The film transmission chamber 4 provided in the embodiment of the present application has all the beneficial effects of the film transmission correction device of the first aspect mentioned above. For details, please refer to the specific description of the film transmission correction device in the above embodiments, and this embodiment will not be repeated here.

[0066] In some embodiments of the present application, Figures 1 to 5 As shown, the film transmission correction device includes a detection component and a correction component 2. The detection component includes a transmitter 5 and a receiver 1. The transmitter 5 and the receiver 1 are both installed on the outside of the cavity wall of the film transmission chamber 4. The transmitter 5 is located below the film transmission chamber 4, and the receiver 1 is installed above the film transmission chamber 4. The transmitter 5 is installed on the first adjustment component 6, and the receiver 1 is installed on the second adjustment component 3. The transmitter 5 can be leveled by the first adjustment component 6, and the receiver 1 can be leveled by the second adjustment component 3. The correction component 2 includes a driving member 22 and a supporting member 21. The driving member 22 is a servo motor. The supporting member 21 includes a supporting plate and an anti-slip structure 211. The correction component 2 is installed on the third adjustment component 8. The third adjustment component 8 can be used to level the surface of the supporting member 21 carrying the wafer 9.

[0067] The transmitter 5 and the receiver 1 are both located outside the wall of the film transmission chamber 4 and do not occupy the internal space of the film transmission chamber 4. The carrier 21 is located in the center of the film transmission chamber 4 and the wafer 9 is connected. The servo motor drives the carrier 21 to drive the wafer 9 to rotate, and the angular displacement deviation of the wafer 9 can be corrected. Under the control of the host computer, the wafer 9 is rotated to a predetermined angle according to the incision angle (actual angle) of the wafer 9 output by the detection component. After correcting the angular displacement deviation of the wafer 9, the host computer can calculate the compensation value (compensation line displacement deviation) of the wafer motion stage handover according to the wafer 9 offset output by the detection component, so that the wafer motion stage hands over the wafer 9 at the compensation position. The wafer 9 contacts the friction column and / or the sealing ring on the carrier 21 and will not slide during rotation, thereby ensuring accuracy.

[0068] In the technical solution of the above embodiment, by setting a detection component in the wafer transfer chamber 4, the offset of the wafer 9 before it is handed over to the wafer motion stage can be calculated, so that the wafer motion stage can be compensated according to the calculated offset. By setting a correction component 2 in the wafer transfer chamber 4, the angular displacement deviation of the wafer 9 can be corrected before the vacuum manipulator takes the wafer, thereby eliminating part of the error in the wafer transfer process. The detection component and the drive member 22 do not occupy the internal space of the wafer transfer chamber and do not affect the time it takes to establish the vacuum environment. In the original wafer transfer structure, the wafer transfer accuracy of the atmospheric manipulator is ±100μm, the wafer transfer accuracy of the vacuum manipulator is ±20μm, and the positioning accuracy of the wafer motion stage is at the nanometer level. The fitting deviation of the detection component of this embodiment is ≤10μm. Under the premise that the accuracy of the atmospheric manipulator, vacuum manipulator and wafer motion stage remains unchanged, the cumulative wafer transfer error is reduced to about 10%. Although the equipment cost has increased to a certain extent, the resulting accuracy improvement is obviously very cost-effective. The first adjustment component 6 can level the transmitter 5, the second adjustment component 3 can level the receiver 1, and the third adjustment component 8 can level the carrier 21. On the one hand, it can ensure the installation and use requirements of related components, and on the other hand, it can ensure the reliability of detection and correction.

[0069] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A film transmission correction device, characterized in that: include: The detection component is installed on the wall of the wafer transmission chamber and is connected to the host computer. It is used to emit a detection beam and determine the position of the wafer based on the occlusion information of the detection beam; The correction component is installed on the cavity wall of the wafer transfer chamber and is connected to the host computer, and is used to drive the wafer to rotate to correct the position of the wafer.

2. The film transmission correction device according to claim 1, characterized in that: The detection component includes a transmitter and a receiver; The transmitter is installed on the outer side of the cavity wall of the film transmission chamber, located below the film transmission chamber, and connected to the host computer for emitting a detection light beam; The receiver is installed on the outside of the cavity wall of the wafer transmission chamber, located above the wafer transmission chamber, and connected to the host computer for receiving the detection light beam so that the host computer can determine the position of the wafer based on the occlusion information of the detection light beam.

3. The film transmission correction device according to claim 2, characterized in that: Also included is a first adjustment assembly, the first adjustment assembly including a first mounting seat and a first adjustment member; The first mounting base includes a first vertical plate and a first horizontal plate, the first vertical plate is connected to the first horizontal plate, the transmitter is mounted on the first vertical plate, the first horizontal plate is mounted on the cavity wall of the film transmission chamber, and a first adjustment gap is provided between the first horizontal plate and the cavity wall of the film transmission chamber; The first adjusting member is threadedly connected to the first transverse plate and abuts against the cavity wall of the film transmission chamber at one end. There are multiple first adjusting members for adjusting the width of each location of the first adjusting gap.

4. The film transmission correction device according to claim 2, characterized in that: Also included is a second adjustment assembly, the second adjustment assembly including a second mounting seat, a second longitudinal adjustment member, and a second lateral adjustment member; The second mounting base includes a second vertical plate and a second horizontal plate, the second vertical plate is connected to the second horizontal plate, the receiver is mounted on the second vertical plate, the second horizontal plate is mounted on the cavity wall of the film transmission chamber, and a second adjustment gap is provided between the second horizontal plate and the cavity wall of the film transmission chamber; The second longitudinal adjustment member is threadedly connected to the second transverse plate and abuts against the wall of the film transmission chamber at one end. There are multiple second longitudinal adjustment members for adjusting the width of each location of the second adjustment gap. The second transverse adjusting member is vertically arranged with respect to the second longitudinal adjusting member. The second transverse adjusting member is threadedly connected to the second vertical plate and abuts against the receiver at one end for adjusting the position of the receiver.

5. The film transmission correction device according to claim 1, characterized in that: The correction assembly includes a driving member and a bearing member; The driving member is installed on the outer side of the cavity wall of the film transmission chamber and extends into the film transmission chamber below the film transmission chamber. The driving member is connected to the host computer and is used to rotate under the control of the host computer; The carrier is located in the wafer conveying chamber and is connected to the driving member, and is used for driving the wafer to rotate under the driving of the driving member.

6. The film transmission correction device according to claim 5, characterized in that: Also included is a third adjustment assembly, the third adjustment assembly including a third mounting seat and a third adjustment member; The driving member is mounted on the third mounting seat, and the third mounting seat is mounted on the cavity wall of the film transmission chamber, and a third adjustment gap is provided between the third mounting seat and the cavity wall of the film transmission chamber; The third adjusting member is threadedly connected to the third mounting seat and abuts against the cavity wall of the film transmission chamber at one end. There are multiple third adjusting members for adjusting the width of each location of the third adjustment gap.

7. The film transmission correction device according to claim 5, characterized in that: The driving member is a servo motor; The carrier includes a sheet-carrying plate and an anti-slip structure; The wafer receiving plate is mounted on the driving member and is configured to rotate under the driving of the driving member; The anti-slip structure is installed on the wafer tray to prevent the wafer from sliding.

8. The film transmission correction device according to claim 7, characterized in that: The anti-slip structure is a friction column installed on the top surface of the wafer tray; and / or The anti-slip structure is a rubber ring installed on the top surface of the wafer tray.

9. The film transmission correction device according to claim 8, characterized in that: There is one anti-slip structure, and the axis of the anti-slip structure coincides with the axis of the wafer receiving plate; or There are multiple anti-slip structures, which are distributed in an array with the axis of the wafer tray as the center.

10. A film transmission chamber, characterized in that: It comprises the film transmission correction device as described in any one of claims 1 to 9.

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