Positioning device

Abstract

The utility model discloses a positioning device which comprises a frame body, a placing assembly, a plurality of groups of positioning assemblies and a detection assembly, and the frame body is provided with a mounting plate; the placing assembly comprises a first rotating shaft which rotatably penetrates through the mounting plate, and a loading table which is connected to the top of the first rotating shaft and is used for placing wafers; the multiple sets of positioning assemblies are arranged in the circumferential direction of the loading table, each positioning assembly comprises a second rotating shaft rotationally arranged on the mounting plate in a penetrating mode and a positioning column arranged at the top of the second rotating shaft, the second rotating shafts are parallel to the axes of the positioning columns, and the second rotating shafts are rotated to drive the positioning columns to be close to and away from the loading table; the center of the wafer is positioned on the axis of the loading table; the detection assembly is mounted on the mounting plate, and the detection assembly is provided with a sensor for detecting the flat edge and / or the notch of the wafer, so that the wafer is accurately positioned on the loading table, and the device can be provided for positioning the wafer and then carrying the wafer to the processing loading table, so that the quality and the qualified rate of wafer grinding are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a positioning device. Background Art

[0002] In order to achieve the goals of reducing the chip package volume, improving heat diffusion efficiency, and mechanical and electrical performance, the wafer will be thinned. Generally, before the wafer thinning process, it is necessary to use a robot to move it to the processing carrier, and then use vacuum adsorption to fix it, and finally process it. However, the wafers in the wafer box are not placed concentrically. Generally, the notch or flat edge of the semiconductor wafer are not aligned. If the robot directly moves it to the processing carrier, it is easy to cause the wafer to be fixed eccentrically on the carrier, resulting in uneven grinding, affecting the surface quality and pass rate.

[0003] Therefore, designing a device to position the wafer and then transport it to the processing platform to improve the quality and pass rate of wafer grinding is a technical problem that technical personnel in this field currently need to solve. Utility Model Content

[0004] The purpose of the utility model is to provide a device for positioning a wafer and then transporting it to a processing platform, so as to improve the quality and pass rate of wafer grinding.

[0005] To achieve the above-mentioned purpose, the present invention provides a positioning device, comprising:

[0006] A frame body, provided with a mounting plate;

[0007] A placement assembly, comprising a first rotating shaft rotatably disposed on the mounting plate, and a loading platform connected to the top of the first rotating shaft for placing wafers;

[0008] Multiple positioning assemblies are arranged along the circumference of the loading platform, and the positioning assemblies include a second rotating shaft rotatably passed through the mounting plate, and a positioning post arranged on the top of the second rotating shaft. The axes of the second rotating shaft and the positioning post are parallel. The positioning post is driven toward and away from the loading platform by rotating the second rotating shaft, so that the center of the wafer is positioned on the axis of the loading platform;

[0009] The detection component is mounted on the mounting plate and is provided with a sensor for detecting the flat edge and / or the cut of the wafer.

[0010] Preferably, the loading platform is provided with a first through hole, the first rotating shaft is a hollow structure connected to the first through hole, a rotary joint is provided at the bottom of the first rotating shaft, the rotary joint is connected to the first rotating shaft of the hollow structure, and the rotary joint is externally connected to a vacuum machine, which can enable the loading platform to vacuum adsorb the centrally positioned wafer.

[0011] Preferably, the frame further includes a fixed plate spaced apart and arranged below the mounting plate, and a first power assembly capable of driving the first rotating shaft to rotate around its own axis is installed on the fixed plate, and the first power assembly includes:

[0012] A first power source, the output end of which is provided with a first transmission member capable of synchronous rotation;

[0013] The second transmission member is arranged on the outer periphery of the first rotating shaft. The first transmission member and the second transmission member are arranged at the same height and are connected by the first connecting member.

[0014] Preferably, a third transmission member is provided at the bottom of the second rotating shaft, and at least one third transmission member is connected to a second power component that can drive the second rotating shaft to rotate around its own axis. The second power component includes a second power source and a fourth transmission member connected to the second power source and capable of driving the third transmission member to rotate.

[0015] Preferably, the detection component further comprises:

[0016] Bracket;

[0017] The cylinder is connected to the bracket through a mounting base, which is provided with a plurality of limiting holes. The sensor is arranged at the piston end of the cylinder. The cylinder can drive the sensor to move toward and away from the loading platform.

[0018] The knob plunger is detachably mounted on the limiting hole to adjust the position of the fixed end of the cylinder on the mounting seat.

[0019] Preferably, the sensor is a through-beam sensor, which includes a transmitting module and a receiving module located on the upper and lower sides of the wafer.

[0020] Preferably, the axes of the first rotating shaft and the second rotating shaft are parallel to each other.

[0021] Preferably, a first shell is provided outside the frame body, and a second shell is provided outside the bracket.

[0022] Preferably, the first power source is connected to the bottom of the fixed plate through a connecting frame, a first sleeve is provided between the first rotating shaft and the mounting plate, and the first rotating shaft and the first sleeve are rotatably connected through a first bearing and a second bearing.

[0023] Preferably, the third transmission members are all located between the mounting plate and the fixed plate, and all the third transmission members are arranged at the same height. A second sleeve is provided between the second rotating shaft and the mounting plate, and the second sleeve and the second rotating shaft are rotatably connected through the third bearing and the fourth bearing.

[0024] Compared with the above-mentioned background technology, the positioning device provided by the present invention includes a frame, a placement component, multiple groups of positioning components and a detection component. The frame is provided with a mounting plate; the placement component includes a first rotating shaft rotatably passed through the mounting plate, and a loading platform connected to the top of the first rotating shaft for placing wafers; multiple groups of positioning components are arranged along the circumference of the loading platform, the positioning component includes a second rotating shaft rotatably passed through the mounting plate, and a positioning column arranged on the top of the second rotating shaft, the axes of the second rotating shaft and the positioning column are parallel, and the positioning column is driven close to and away from the loading platform by rotating the second rotating shaft so that the center of the wafer is positioned on the axis of the loading platform; the detection component is installed on the mounting plate, and the detection component is provided with a sensor to detect the flat edge and / or cut of the wafer.

[0025] Specifically, the wafer placed on the loading platform is driven by the second rotating shaft to move the positioning column located on its top close to the loading platform so that the center of the wafer is positioned on the axis of the loading platform. Then the second rotating shaft drives the positioning column away from the loading platform, and the transfer platform drives the wafer to rotate under the drive of the first rotating shaft until the sensor in the detection component detects the flat edge and / or cut of the wafer, so that the wafer is accurately positioned on the loading platform. Such a setting can provide a device to position the wafer before transporting it to the processing carrier, so as to improve the quality and pass rate of wafer grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0027] Figure 1 A schematic structural diagram of a positioning device provided in an embodiment of the present utility model;

[0028] Figure 2 A cross-sectional view of the structure of the positioning device provided by an embodiment of the utility model;

[0029] Figure 3 This is a structural schematic diagram of the positioning device provided by an embodiment of the utility model from another perspective.

[0030] in:

[0031] 110 - mounting plate, 120 - fixing plate, 130 - first power source, 133 - first connecting member, 134 - connecting frame;

[0032] 210 - first rotating shaft, 220 - loading platform, 230 - rotary joint, 240 - first sleeve, 250 - first bearing, 260 - second bearing;

[0033] 310 - second rotating shaft, 320 - positioning column, 330 - third transmission member, 340 - second power source, 350 - second sleeve, 360 - third bearing, 370 - fourth bearing, 380 - oil seal;

[0034] 410-sensor, 420-bracket, 430-cylinder, 440-knob plunger, 450-speed control valve;

[0035] 500-first shell;

[0036] 600-Second shell. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0039] In the description of the present invention, it should be understood that the terms "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the position or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation of the present invention.

[0040] The purpose of the utility model is to provide a device for positioning a wafer and then transporting it to a processing platform, so as to improve the quality and pass rate of wafer grinding.

[0041] See also Figures 1 to 3 To achieve the above-mentioned purpose, the present invention provides a positioning device, including a frame, a placement component, multiple groups of positioning components and a detection component.

[0042] The frame is provided with a mounting plate 110, which is a disc-shaped plate structure; the placement assembly includes a first rotating shaft 210 rotatably provided through the mounting plate 110, and a loading platform 220 connected to the top of the first rotating shaft 210 for placing wafers. The loading platform 220 can rotate synchronously with the first rotating shaft 210;

[0043] Multiple groups of positioning components are arranged along the circumference of the loading platform 220. The positioning components include a second rotating shaft 310 rotatably passed through the mounting plate 110, and a positioning column 320 arranged on the top of the second rotating shaft 310. The positioning column 320 can also be connected to the second rotating shaft 310 through a connecting plate. The axes of the second rotating shaft 310 and the positioning column 320 are parallel (different lines). By rotating the second rotating shaft 310, the positioning column 320 is driven close to and away from the loading platform 220 so that the center of the wafer is positioned on the axis of the loading platform 220. The axes of the first rotating shaft 210 and the second rotating shaft 310 are parallel to each other and both extend vertically.

[0044] In this embodiment, there are five groups of positioning components, which are evenly arranged along the circumference of the loading platform 220. All the positioning columns 320 are close to the loading platform 220 at the same time, so that the axis of the wafer is consistent with the axis of the loading platform 220. The number of positioning components can also be adjusted according to actual conditions as long as the above purpose can be achieved.

[0045] The detection assembly is mounted on mounting plate 110 and includes a sensor 410 for detecting the flat edge and / or notch of the wafer. Sensor 410 can be a photoelectric sensor 410, i.e., sensor 410 includes a transmitting module and a receiving module located on the upper and lower sides of the wafer. The location of the flat edge and / or notch can be determined by transmitting and receiving photoelectric signals. Alternatively, sensor 410 can be a capacitive sensor 410, etc., as long as it can achieve the above-mentioned purpose.

[0046] It should be noted that a notch is a V-shaped cutout intentionally formed on a wafer, and is generally used for wafers sized 8 inches, 12 inches, and above. A flat edge is also called a positioning edge, and is a flat edge cut out of a wafer, and is generally used for wafers sized 6 inches and below.

[0047] The wafer placed on the loading platform 220 is driven by the second rotating shaft 310 to move the positioning column 320 located on its top close to the loading platform 220 so that the center of the wafer is positioned on the axis of the loading platform 220. Then the second rotating shaft 310 drives the positioning column 320 away from the loading platform 220. The transfer platform drives the wafer to rotate under the drive of the first rotating shaft 210 until the sensor 410 in the detection component detects the flat edge and / or cut of the wafer, so that the wafer is accurately positioned on the loading platform 220. Such a setting can provide a device to position the wafer before transporting it to the processing carrier, so as to improve the quality and pass rate of wafer grinding.

[0048] In this embodiment, the loading platform 220 is provided with a first through hole, the first rotating shaft 210 is a hollow structure connected to the first through hole, a rotary joint 230 is provided at the bottom of the first rotating shaft 210, the rotary joint 230 is connected to the first rotating shaft 210 of the hollow structure, and the rotary joint 230 is externally connected to a vacuum machine, which can enable the loading platform 220 to vacuum adsorb the centrally positioned wafer.

[0049] The wafer transferred to the loading platform 220 by the robot is brought close to the loading platform 220 on the positioning column 320 so that the center of the wafer is positioned on the axis of the loading platform 220. Then, a vacuum machine is used to make the rotary joint 230, the inside of the first rotating shaft 210 and the first through hole all have a negative pressure environment, so that the loading platform 220 can adsorb the wafer to prevent the center of the wafer from deviating from the axis of the loading platform 220 during the subsequent rotation of the loading platform 220.

[0050] The frame also includes a fixed plate 120 arranged at intervals below the mounting plate 110, the first rotating shaft 210 is passed through the fixed plate 120, and a first power component is installed on the fixed plate 120, which can drive the first rotating shaft 210 to rotate around its own axis. The first power component includes a first power source 130, a first transmission member and a second transmission member. The output end of the first power source 130 is provided with a first transmission member that can rotate synchronously; the second transmission member is arranged on the outer periphery of the first rotating shaft 210, and the first transmission member and the second transmission member are arranged at the same height and are connected by a first connecting member 133.

[0051] It should be noted that the first power source 130 can adopt a servo motor and a stepper motor, and the first transmission member is driven to rotate synchronously by the servo motor or the stepper motor, and the second transmission member rotates with the first transmission member under the drive of the first connecting member 133, so as to realize that the first rotating shaft 210 drives the loading platform 220 to rotate. The first transmission member and the second transmission member can use pulleys of different sizes to achieve different transmission ratios. In addition, the first transmission member and the second transmission member can also adopt gears, and the transmission effect can also be achieved through the meshing action of the gears.

[0052] In this embodiment, a third transmission member 330 is provided at the bottom of the second rotating shaft 310, and at least one third transmission member 330 is connected to a second power component that can drive the second rotating shaft 310 to rotate around its own axis. The second power component includes a second power source 340 and a fourth transmission member connected to the second power source 340 and capable of driving the third transmission member 330 to rotate.

[0053] When only one third transmission member 330 is connected to the second power assembly, the remaining third transmission members 330 should be connected to the third transmission member 330 through the second connecting member to achieve the effect of synchronous transmission. Using one second power source 340, all positioning columns 320 can be rotated close to the wafer for center positioning, realizing multi-directional control of a single second power source 340, reducing manufacturing costs. The third transmission member 330 connected to the second power assembly can also be directly mounted on the output end of the second power source 340 to reduce the setting of the fourth transmission member and reduce the maintenance cost of the equipment; when there are multiple third transmission members 330 connected to the second power assembly, it is only necessary to ensure that the operation of the second power source 340 is consistent. The second power source 340 can use a servo motor and a stepper motor. The third transmission member 330 and the fourth transmission member can both use pulleys, and the above-mentioned transmission process is completed through a synchronous belt. The third transmission member 330 and the fourth transmission member can also use gears, and the transmission effect can also be achieved through the meshing action of the gears. No further details are given here.

[0054] The detection component also includes a bracket 420, a cylinder 430 and a knob plunger 440. The cylinder 430 is connected to the bracket 420 through a mounting base. The mounting base is provided with multiple limit holes. The sensor 410 is arranged at the piston end of the cylinder 430. The cylinder 430 can drive the sensor 410 to move closer to and away from the loading platform 220. The bracket 420 is also provided with a speed regulating valve 450; the knob plunger 440 can be detachably installed in the limit hole to adjust the position of the fixed end of the cylinder 430 on the mounting base.

[0055] See also Figure 3 , A is an 8-in wafer sensor, B is a 6-in wafer sensor, C is a 5-in wafer sensor, and D is a 4-in wafer sensor. When wafers of different sizes need to be centered, the multiple fixed positions of the cylinder 430 can be adjusted by the knob plunger 440, and the approaching position of the positioning column 320 can be specified in the system to achieve centering and edge finding of wafers of multiple sizes.

[0056] A first shell 500 is provided on the outside of the frame, a second shell 600 is provided on the outside of the bracket 420, the first power source 130 is connected to the bottom of the fixed plate 120 through the connecting frame 134, and a first sleeve 240 is provided between the first rotating shaft 210 and the mounting plate 110. The first rotating shaft 210 and the first sleeve 240 are rotatably connected through the first bearing 250 and the second bearing 260. The first bearing 250 is located at the top of the first sleeve 240, and the second bearing 260 is located at the bottom of the first sleeve 240.

[0057] In addition, the third transmission members 330 are all located between the mounting plate 110 and the fixed plate 120, and all the third transmission members 330 are set at the same height. A second sleeve 350 is provided between the second rotating shaft 310 and the mounting plate 110, and the second sleeve 350 and the second rotating shaft 310 are rotatably connected through the third bearing 360 and the fourth bearing 370. The fourth bearing 370 is located at the bottom of the second sleeve 350, and the third bearing 360 is located at the top of the second sleeve 350, and an oil seal 380 is provided at the third bearing 360.

[0058] In summary, a positioning device includes a first rotating shaft 210, a loading platform 220, a second rotating shaft 310, a positioning column 320, a rotary joint 230, a first power source 130, a second power source 340 and a detection component. The transmission structure between the first power source 130 and the first rotating shaft 210 and between the second power source 340 and the second rotating shaft 310 can be a synchronous pulley or a gear transmission; the first power source 130 and the second power source 340 can both adopt servo motors or stepper motors; the sensor 410 is not limited to a photoelectric sensor 410, a capacitive sensor 410 or other non-contact sensor 410; The whole process is as follows: the robot takes out the wafer from the wafer box; the robot places the wafer on the loading table 220 of the device; the second power source 340 drives multiple positioning pins 320 to approach the wafer to center the wafer; the loading table 220 turns on the vacuum to adsorb and fix the wafer; the second power source 340 drives the positioning pins 320 away from the wafer; the cylinder 430 drives the sensor 410 to reach the specified position; the first power source 130 drives the loading table 220 to rotate; the sensor 410 detects the flat edge or notch of the wafer, and the loading table 220 stops rotating; the robot moves to the loading table 220 to pick up the wafer and transport it to the processing position.

[0059] When it is necessary to center wafers of different sizes, the multiple fixed positions of the cylinder 430 can be adjusted, and the position of the positioning column 320 can be specified in the system to achieve centering and edge finding of wafers of multiple sizes. A second power source 340 is used to rotate the multiple positioning columns 320 to approach the wafer for center positioning, realizing multi-directional control of a single motor and reducing manufacturing costs. At the same time, a cylinder 430 with adjustable position is designed to achieve positioning of wafers of various sizes without replacing device parts.

[0060] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0061] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0062] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A positioning device, characterized in that: include: A frame body, provided with a mounting plate; A placement assembly, comprising a first rotating shaft rotatably disposed on the mounting plate, and a loading platform connected to the top of the first rotating shaft for placing wafers; Multiple positioning assemblies are arranged along the circumference of the loading platform, and the positioning assemblies include a second rotating shaft rotatably passed through the mounting plate, and a positioning post provided on the top of the second rotating shaft, wherein the axes of the second rotating shaft and the positioning post are parallel, and the positioning post is driven toward and away from the loading platform by rotating the second rotating shaft, so that the center of the wafer is positioned on the axis of the loading platform; A detection component is mounted on the mounting plate, and the detection component is provided with a sensor to detect the flat edge and / or the cut of the wafer.

2. The positioning device according to claim 1, characterized in that The loading platform is provided with a first through hole, the first rotating shaft is a hollow structure connected to the first through hole, a rotary joint is provided at the bottom of the first rotating shaft, the rotary joint is connected to the first rotating shaft of the hollow structure, and the rotary joint is externally connected to a vacuum machine, and the vacuum machine can enable the loading platform to vacuum adsorb the centrally positioned wafer.

3. The positioning device according to claim 1, characterized in that The frame further includes a fixing plate spaced apart below the mounting plate, wherein a first power assembly capable of driving the first rotating shaft to rotate around its own axis is mounted on the fixing plate, and the first power assembly includes: A first power source, the output end of which is provided with a first transmission member capable of synchronous rotation; The second transmission member is arranged on the outer periphery of the first rotating shaft. The first transmission member and the second transmission member are arranged at the same height and are connected by a first connecting member.

4. The positioning device according to claim 3, characterized in that A third transmission member is provided at the bottom of the second rotating shaft, and at least one of the third transmission members is connected to a second power component that can drive the second rotating shaft to rotate around its own axis. The second power component includes a second power source and a fourth transmission member connected to the second power source and capable of driving the third transmission member to rotate.

5. The positioning device according to claim 1, characterized in that The detection component also includes: Bracket; A cylinder is connected to the bracket via a mounting base, the mounting base is provided with a plurality of limiting holes, the sensor is provided at the piston end of the cylinder, and the cylinder can drive the sensor to approach and move away from the loading platform; The knob plunger is detachably mounted on the limiting hole to adjust the position of the fixed end of the cylinder on the mounting seat.

6. The positioning device according to claim 1, characterized in that The sensor is specifically a through-beam sensor, and the sensor includes a transmitting module and a receiving module located on the upper and lower sides of the wafer.

7. The positioning device according to claim 1, characterized in that Axes of the first rotating shaft and the second rotating shaft are parallel to each other.

8. The positioning device according to claim 5, characterized in that A first shell is provided outside the frame, and a second shell is provided outside the bracket.

9. The positioning device according to claim 3, characterized in that The first power source is connected to the bottom of the fixed plate through a connecting frame. A first sleeve is provided between the first rotating shaft and the mounting plate. The first rotating shaft and the first sleeve are rotatably connected through a first bearing and a second bearing.

10. The positioning device according to claim 4, characterized in that The third transmission members are all located between the mounting plate and the fixed plate, and all the third transmission members are arranged at the same height. A second sleeve is provided between the second rotating shaft and the mounting plate, and the second sleeve and the second rotating shaft are rotatably connected through a third bearing and a fourth bearing.

Images