Heat dissipation device and semiconductor laser

Abstract

The utility model discloses a heat dissipation device and a semiconductor laser, and relates to the field of lasers. The heat dissipation device comprises a device body and a water cooling module, the device body is provided with a water inlet channel and a water outlet channel, the water cooling module is connected with the device body to form at least two water cooling channels opposite in flow direction, and any two water cooling channels are arranged between the water inlet channel and the water outlet channel in parallel. The heat dissipation device provided by the utility model has a better heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the field of lasers, and in particular to a heat dissipation device and a semiconductor laser. Background Art

[0002] Semiconductor lasers on the market are usually equipped with a heat sink, and the laser chip is assembled on the heat sink to achieve heat dissipation of the laser chip.

[0003] Heat dissipation devices are commonly water-cooled, featuring multiple fins that exchange heat with water. These fins are arranged in a series of water-cooling channels between the device's water inlet and outlet. In practice, cooling water flows sequentially through these channels, resulting in a single, long path and poor heat dissipation. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation device, which has the characteristic of better heat dissipation effect.

[0005] Another object of the present invention is to provide a semiconductor laser having a better heat dissipation effect.

[0006] The embodiment of the present utility model provides a technical solution:

[0007] A heat dissipation device comprises a device body and a water cooling module; the device body has a water inlet channel and a water outlet channel; the water cooling module is connected to the device body and forms at least two water cooling channels with opposite flow directions, and any two of the water cooling channels are connected in parallel to the water inlet channel and the water outlet channel.

[0008] In an optional embodiment, the device body is provided with a limited surface; the water cooling module includes a water cooling plate and a fin array; the device body is provided with a limited surface; the water cooling plate has a mounting surface and a heat exchange surface that are opposite to each other; the mounting surface is used to install devices; one end of the fin array is connected to the heat exchange surface, and the other end of the fin array extends into the interior of the device body and is connected to the limiting surface; any two adjacent fins in the fin array and the limiting surface form the water cooling channel.

[0009] In an optional embodiment, the fins in the fin array are arranged at intervals along the second direction; the fin array includes a first fin array and a second fin array arranged at intervals along the first direction; a diversion gap is formed between the first fin array and the second fin array, one end of the diversion gap is connected to the water inlet channel, and the other end of the diversion gap is connected to the water inlet end of any one of the water-cooling channels.

[0010] In an optional embodiment, the water inlet channel includes a flow groove connecting the diversion gap and the water inlet channel, and the water inlet channel extends along the second direction.

[0011] In an optional embodiment, the device body also includes a return water channel, and the return water channel includes a first return water channel and a second return water channel; the water outlet end of any water cooling channel in the first fin array is connected to the water outlet channel through the first return water channel; the water outlet end of any water cooling channel in the second fin array is connected to the water outlet channel through the second return water channel.

[0012] In an optional embodiment, the water cooling module, the water inlet channel, and the water outlet channel are sequentially arranged along the third direction on the device body, and the water inlet channel and the water outlet channel extend along the second direction.

[0013] In an optional embodiment, the water inlet ends of the water inlet channel and the water outlet channel are both opened on the top wall of the device body;

[0014] Two assembly ring grooves are arranged on the top wall of the device body, and the two assembly ring grooves are respectively arranged around the ports of the water inlet channel and the water outlet channel.

[0015] In an optional embodiment, the first water return channel and the second water return channel are respectively arranged on both sides of the water inlet channel, extend along the third direction and communicate with the water outlet channel.

[0016] In an optional embodiment, a plurality of partitions are provided in the return water channel, and the plurality of partitions divide the return water channel into a plurality of sub-channels arranged in sequence in the vertical direction.

[0017] In an optional embodiment, the water inlet channel and the water outlet channel are in an annular column shape.

[0018] An embodiment of the present utility model further provides a semiconductor laser, comprising a laser chip and the aforementioned heat dissipation device, wherein the heat dissipation device comprises a device body and a water cooling module, wherein the device body has a water inlet channel and a water outlet channel, wherein the water cooling module is connected to the device body and forms at least two water cooling channels with opposite flow directions, wherein all the water cooling channels are arranged in parallel between the water inlet channel and the water outlet channel, and wherein the laser chip is mounted on the water cooling module.

[0019] Compared to existing technologies, the heat dissipation device provided by this utility model utilizes all water cooling channels formed between the water cooling module and the device body, arranged in parallel between the water inlet and outlet channels. This achieves multi-path heat dissipation, shortens the cooling water path, and improves heat dissipation efficiency and uniformity. Furthermore, the cooling water flowing in opposite directions in the cooling channels does not affect each other's heat dissipation capacity, further enhancing the heat dissipation effect. Therefore, the heat dissipation device provided by this utility model has the following advantages: improved heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be considered as limiting the scope of the present invention. Those skilled in the art can also derive other relevant drawings based on these drawings without inventive effort.

[0021] Figure 1 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present utility model;

[0022] Figure 2 A cross-sectional view of a heat dissipation device provided in an embodiment of the present utility model;

[0023] Figure 3 for Figure 1 Schematic diagram of the structure of the water cooling module;

[0024] Figure 4 for Figure 1 A cross-sectional view of the device body;

[0025] Figure 5 Another cross-sectional view of the heat dissipation device provided in an embodiment of the present utility model;

[0026] Figure 6 Another cross-sectional view of the heat dissipation device provided in an embodiment of the present utility model.

[0027] Icons: 100-heat dissipation device; 110-device body; 111-water inlet channel; 112-water outlet channel; 1121-return water hole; 113-limiting surface; 114-flow groove; 115-first return water channel; 1151-partitioning piece; 116-assembly ring groove; 117-second return water channel; 120-water cooling module; 121-water cooling plate; 1211-mounting surface; 1212-heat exchange surface; 122-fin; 123-first fin array; 124-diversion gap; 125-second fin array; 130-water cooling channel. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present invention. It should be understood that the described embodiments are only a portion of the embodiments of the present invention, not all of them. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0031] In the description of the present utility model, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the utility model product is usually placed when in use, or are directions or positional relationships commonly understood by those skilled in the art. These directions or positional relationships are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present utility model.

[0032] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0033] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0034] The specific implementation of the present invention is described in detail below with reference to the accompanying drawings.

[0035] Example

[0036] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. 1 is a schematic structural diagram of the heat dissipation device 100 provided in this embodiment. Figure 2 FIG. 1 is a cross-sectional view of the heat dissipation device 100 .

[0037] The heat dissipation device 100 provided in this embodiment includes a device body 110 and a water-cooling module 120. The water-cooling module 120 is connected to the device body 110. The water-cooling module 120 is used to install a laser chip. The device body 110 is used to introduce cooling water to exchange heat with the water-cooling module 120, thereby achieving cooling and heat dissipation of the laser chip.

[0038] Specifically, the device body 110 has a water inlet channel 111 and a water outlet channel 112 , and the water cooling module 120 and the device body 110 form at least two water cooling channels 130 with opposite flow directions, and all water cooling channels 130 are connected in parallel to the water inlet channel 111 and the water outlet channel 112 .

[0039] In fact, in this embodiment, there are multiple water cooling channels 130, and the multiple water cooling channels 130 have two opposite flow directions. The two flow directions are defined as a first flow direction and a second flow direction. Then, a portion of the multiple water cooling channels 130 has the first flow direction, and the remaining portion has the second flow direction.

[0040] It can be understood that in actual applications, the cooling water flowing into the water inlet channel 111 is diverted, a part of it flows into the multiple water cooling channels 130 in the first flow direction, and the remaining part flows into the multiple water cooling channels 130 in the second flow direction. After completing the heat dissipation with the heat dissipation device, it converges in the water outlet channel 112 and flows out of the device body 110.

[0041] Please refer to Figure 3 and Figure 4 , Figure 3 FIG. 1 is a schematic structural diagram of the water cooling module 120. Figure 4 A cross-sectional view of the device body 110 is shown.

[0042] In this embodiment, the water cooling module 120 includes a water cooling plate 121 and a plurality of fins 122. The water cooling plate 121 has a mounting surface 1211 and a heat exchange surface 1212 that are opposite to each other. The mounting surface 1211 is used for mounting devices. The plurality of fins 122 are arranged at intervals on the heat exchange surface 1212 and extend into the front end of the device body 110. The gap between any two adjacent fins 122 serves as a water cooling channel 130.

[0043] It can be understood that when the cooling water flows through multiple water-cooling channels 130, on the one hand, it exchanges heat with the water-cooling plate 121 through the corresponding two fins 122, and on the other hand, it directly exchanges heat with the water-cooling plate 121 through the heat exchange surface 1212, thereby realizing heat exchange with the components installed on the mounting surface 1211, taking away the heat of the components, and realizing heat dissipation of the components.

[0044] A limited position surface 113 is set at the front end of the device body 110, and a plurality of fins 122 are arranged at intervals along the second direction to form a fin array. The fin array includes a first fin array 123 and a second fin array 125 arranged at intervals along the first direction, and a diversion gap 124 is formed between the first fin array 123 and the second fin array 125, and the water inlet channel 111 is connected to the diversion gap 124.

[0045] Figure 2 The Y arrow in the middle indicates a first direction, which can be understood as a direction from right to left; the Z arrow indicates a second direction, which can be understood as a direction from top to bottom; and the X arrow indicates a third direction, which can be understood as a direction from front to back.

[0046] In actual application, the cooling water in the water inlet channel 111 first flows into the diversion gap 124 between the first fin array 123 and the second fin array 125, and then is diverted into two parts to enter the first fin array 123 and the second fin array 125, and flows in reverse directions in the left and right directions under the guidance of multiple water-cooling channels 130 corresponding to the first fin array 123 and the second fin array 125. In this process, heat exchange with the water-cooled plate 121 is completed, and finally flows into the water outlet channel 112.

[0047] In other words, the first flow direction is from left to right, and the second flow direction is from right to left. In this embodiment, the water cooling module 120, the water inlet channel 111, and the water outlet channel 112 are arranged in sequence along the third direction on the device body 110, that is, from front to back.

[0048] The device body 110 also includes a return water channel, which includes a first return water channel 115 and a second return water channel 117. The first return water channel 115 and the second return water channel 117 both extend in the front-to-back direction and are respectively located on both sides of the water inlet channel 111 in the first direction.

[0049] The water outlet end of any water cooling channel 130 in the first fin array 123 is connected to the water outlet channel 112 through the first return water channel 115; the water outlet end of any water cooling channel 130 in the second fin array 125 is connected to the water outlet channel 112 through the second return water channel 117.

[0050] In this embodiment, the water inlet channel 111 and the water outlet channel 112 both extend in the second direction, i.e., in the vertical direction. The first water return channel 115 and the second water return channel 117 also have a certain depth in the vertical direction. The end of the multiple water cooling channels 130 in the first fin array 123 away from the diverter gap 124 is connected to the front end of the first water return channel 115. The end of the multiple water cooling channels 130 in the second fin array 125 away from the diverter gap 124 is connected to the front end of the second water return channel 117. The rear ends of the first and second water return channels 115, 117 are both connected to the water outlet channel 112.

[0051] In order to increase the cooling water flow rate and thus improve the heat dissipation efficiency, in this embodiment, an overflow groove 114 is opened on the front channel wall of the water inlet channel 111. The length of the overflow groove 114 extends in the vertical direction, and its depth extends forward to the area of ​​the limiting surface 113 corresponding to the diversion gap 124, so as to connect the diversion gap 124 with the water inlet channel 111.

[0052] In actual application, the cooling water flowing into the water inlet channel 111 flows into the diversion gap 124 through the flow groove 114, and is diverted to the left and right in the diversion gap 124 to enter the first fin array 123 and the second fin array 125 respectively. After passing through the multiple water cooling channels 130 corresponding to the first fin array 123 and the second fin array 125, it flows into the first return water channel 115 and the second return water channel 117 respectively, and flows backward along the first return water channel 115 and the second return water channel 117 into the water outlet channel 112, and finally flows out of the device body 110 along the water outlet channel 112.

[0053] Please refer to Figure 5 and Figure 6 , Figure 5 FIG. 1 is another cross-sectional view of the heat dissipation device 100 . Figure 6 FIG. 1 is another cross-sectional view of the heat dissipation device 100 .

[0054] To reduce cooling water flow resistance, in this embodiment, the multiple fins 122 are all flat plates parallel to the horizontal plane, forming multiple horizontally extending water cooling channels 130. Furthermore, to further improve cooling water flow efficiency, multiple first return water channels 115 and second return water channels 117 are provided.

[0055] In another embodiment of this embodiment, to improve the flow efficiency of the cooling water, a plurality of partitions 1151 are provided in each of the first return water channel 115 and the second return water channel 117. The plurality of partitions 1151 respectively divide the first return water channel 115 and the second return water channel 117 into a plurality of sub-channels arranged in sequence in the vertical direction. It is understood that in actual applications, the cooling water entering the first return water channel 115 and the second return water channel 117 is diverted by the plurality of partitions 1151. The plurality of partitions 1151 provide segmented support for the cooling water flow in the vertical direction, thereby improving the flow efficiency of the cooling water and further improving the heat dissipation efficiency.

[0056] Furthermore, in order to reduce the flow resistance of the cooling water, the inner wall surfaces of the first water return channel 115 , the second water return channel 117 and the sub-channels are curved.

[0057] In this embodiment, to further reduce the flow resistance of the cooling water, the water inlet channel 111 and the water outlet channel 112 are both annular and cylindrical. Guided by the arc-shaped channel walls of the water inlet channel 111 and the water outlet channel 112, the cooling water can flow rapidly, encountering less resistance and flowing at a faster rate, thereby further improving heat dissipation efficiency. Multiple return holes 1121 are provided on both the left and right channel walls of the water outlet channel 112. The multiple return holes 1121 on the left channel wall of the water outlet channel 112 are vertically spaced apart, connecting the rear ends of the multiple sub-channels on the left side of the water inlet channel 111 to the water outlet channel 112. The multiple return holes 1121 on the right channel wall of the water outlet channel 112 are vertically spaced apart, connecting the rear ends of the multiple sub-channels on the right side of the water inlet channel 111 to the water outlet channel 112.

[0058] In order to achieve centralized arrangement of pipelines and valves and facilitate operation, in this embodiment, the water inlet end of the water inlet channel 111 and the water outlet end of the water outlet channel 112 are both opened on the top wall of the device body 110, and the other ends of both extend vertically downward to the interior of the device body 110. In other words, the openings of the water inlet channel 111 and the water outlet channel 112 are both opened on the top wall of the device body 110.

[0059] To facilitate pipe connection and improve pipe sealing, in this embodiment, two mounting grooves 116 are recessed on the top wall of the device body 110. The two mounting grooves 116 are respectively arranged around the ends of the water inlet channel 111 and the water outlet channel 112. In actual use, the end of the pipe for water inlet is inserted into the mounting groove 116 around the opening of the water inlet channel 111, and the end of the pipe for water discharge is inserted into the mounting groove 116 around the opening of the water outlet channel 112.

[0060] In summary, the heat dissipation device 100 provided in this embodiment forms two water-cooling channels 130 with opposite flow directions, realizing independent heat exchange of different areas on the water-cooling module 120 without affecting each other, improving the heat dissipation efficiency and heat dissipation uniformity, and achieving better heat dissipation effect.

[0061] In addition, this embodiment further provides a semiconductor laser, including a laser chip and the aforementioned heat dissipation device 100 . The laser chip is mounted on a water cooling module 120 , and is actually mounted on a mounting surface 1211 of a water cooling plate 121 .

[0062] Benefiting from the beneficial effects of the heat dissipation device 100 , the semiconductor laser provided in this embodiment also has the characteristic of better heat dissipation effect.

[0063] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that: It comprises a device body (110) and a water cooling module (120); The device body (110) has a water inlet channel (111) and a water outlet channel (112); The water cooling module (120) is connected to the device body (110) to form at least two water cooling channels (130) with opposite flow directions, and any two of the water cooling channels (130) are connected in parallel to the water inlet channel (111) and the water outlet channel (112).

2. The heat dissipation device according to claim 1, characterized in that: The device body (110) is provided with a finite surface (113); The water cooling module (120) comprises a water cooling plate (121) and a fin array, wherein the water cooling plate (121) has a mounting surface (1211) and a heat exchange surface (1212) that are separated from each other; The mounting surface (1211) is used for mounting devices; One end of the fin array is connected to the heat exchange surface (1212), and the other end of the fin array extends into the interior of the device body (110) and is connected to the limiting surface (113); Any two adjacent fins (122) in the fin array and the limiting surface (113) form the water cooling channel (130).

3. The heat dissipation device according to claim 2, characterized in that: The fins (122) in the fin array are arranged at intervals along a second direction; The fin array comprises a first fin array (123) and a second fin array (125) arranged at intervals along a first direction; A diversion gap (124) is formed between the first fin array (123) and the second fin array (125); One end of the diversion gap (124) is in communication with the water inlet channel (111), and the other end of the diversion gap (124) is in communication with the water inlet end of any one of the water cooling channels (130).

4. The heat dissipation device according to claim 3, characterized in that: The water inlet channel (111) comprises a flow groove (114) connecting the diversion gap (124) and the water inlet channel (111); The water inlet channel (111) extends along the second direction.

5. The heat dissipation device according to claim 3, characterized in that: The device body (110) further includes a water return channel; The return water channel includes a first return water channel (115) and a second return water channel (117); The water outlet end of any of the water cooling channels (130) in the first fin array (123) is connected to the water outlet channel (112) through the first water return channel (115); The water outlet end of any one of the water cooling channels (130) in the second fin array (125) is connected to the water outlet channel (112) through the second water return channel (117).

6. The heat dissipation device according to claim 1, characterized in that: The water cooling module (120), the water inlet channel (111), and the water outlet channel (112) are sequentially arranged along a third direction on the device body (110); The water inlet channel (111) and the water outlet channel (112) extend along a second direction.

7. The heat dissipation device according to claim 6, characterized in that: The water inlet end of the water inlet channel (111) and the water outlet end of the water outlet channel (112) are both opened on the top wall of the device body (110); Two assembly ring grooves (116) are provided on the top wall of the device body (110), and the two assembly ring grooves (116) are respectively arranged around the ports of the water inlet channel (111) and the water outlet channel (112).

8. The heat dissipation device according to claim 6, characterized in that: The device body (110) further includes a first water return channel (115) and a second water return channel (117); The first water return channel (115) and the second water return channel (117) are respectively arranged on both sides of the water inlet channel (111), extending along a third direction and communicating with the water outlet channel (112).

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that: The water inlet channel (111) and the water outlet channel (112) are in an annular column shape.

10. A semiconductor laser, characterized in that: It comprises a laser chip and the heat dissipation device (100) according to any one of claims 1 to 9, wherein the laser chip is mounted on the water cooling module (120).

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