Heat dissipation device and semiconductor laser

Abstract

The utility model relates to the technical field of lasers, in particular to a heat dissipation device and a semiconductor laser. The heat dissipation device comprises a first heat conduction pipe, a second heat conduction pipe and heat dissipation fins, the lower end of the second heat conduction pipe is connected with the heat dissipation fins, the upper end of the second heat conduction pipe is connected with the first heat conduction pipe, and the first heat conduction pipe is connected with the outer bottom wall of the shell. Heat generated when the COS works is transmitted to the base, the base transmits the heat to the first heat conduction pipe located on the outer side of the shell through the bottom wall of the shell, the first heat conduction pipe transmits the heat to the cooling fins through the second heat conduction pipe, the cooling fins make contact with external air for heat exchange, and cooling of the COS is achieved. The first heat conduction pipe and the second heat conduction pipe are arranged on the outer side of the shell, so that the internal space of the shell is not occupied, and miniaturization and integration of the semiconductor laser can be realized.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a heat dissipation device and a semiconductor laser. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, long life, low power consumption, good reliability and small size. Therefore, they are widely used in technical fields such as laser processing of precision mechanical parts, printing industry and medicine.

[0003] The main component of a semiconductor laser is a COS (Chip on Substrate), meaning the laser chip is directly packaged on a heat sink. For the semiconductor laser to function properly, the temperature of the laser chip must be strictly controlled within a certain range; otherwise, the laser chip will not function properly and the desired laser light will not be produced. However, the laser chip generates a large amount of heat during operation. As the semiconductor laser operates, the temperature of the laser chip will continue to rise. If the temperature of the laser chip cannot be effectively reduced, the semiconductor laser will not function.

[0004] Existing semiconductor lasers usually include a shell, a base and a COS. A housing cavity is formed in the shell, the base is arranged in the shell, and the COS is arranged on the base. A heat pipe is arranged in the base. The COS transfers heat to the heat pipe and the shell through the base. The heat pipe is used to dissipate heat from the COS on the base. At the same time, the heat transferred to the shell will also be transferred outside the housing cavity, thereby achieving heat dissipation for the COS.

[0005] However, the above-mentioned heat pipe structure is set in the shell, which occupies a large amount of internal space of the shell, resulting in an increase in the volume of the semiconductor laser, which is not conducive to the integration and miniaturization of the semiconductor laser. At the same time, the existing shell is relatively thick, and the heat is dissipated to the outside through the shell, resulting in poor heat dissipation effect. Utility Model Content

[0006] (1) The technical problem to be solved by the present invention is that the existing semiconductor laser heat dissipation device has a heat pipe arranged on the base inside the shell. The COS transfers heat to the heat pipe and the shell through the base, and dissipates heat to the outside through the heat pipe and the shell. However, the device has the disadvantages of occupying a large space and having a poor heat dissipation effect.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, an embodiment of the present invention provides a heat dissipation device for a semiconductor laser, wherein the semiconductor laser comprises a housing, a COS, and a base. The housing forms a receiving cavity. The base is mounted on the inner bottom wall of the housing and is located in the receiving cavity. The COS is fixed to the base.

[0009] The heat dissipation device includes a first heat conducting pipe, a second heat conducting pipe and heat dissipation fins, the lower end of the second heat conducting pipe is connected to the heat dissipation fins, the upper end of the second heat conducting pipe is connected to the first heat conducting pipe, and the first heat conducting pipe is connected to the outer bottom wall of the shell.

[0010] According to one embodiment of the present invention, the heat dissipation device also includes a heat dissipation plate, the second heat pipe is installed on the upper surface of the heat dissipation plate, and the heat dissipation fins are installed on the lower surface of the heat dissipation plate; the lower surface of the second heat pipe is connected to the heat dissipation fins through the heat dissipation plate.

[0011] According to an embodiment of the present invention, the outer bottom wall of the housing is provided with first mounting grooves corresponding one to one with the first heat conducting pipes, and the first heat conducting pipes are embedded in the first mounting grooves;

[0012] The upper surface of the heat dissipation plate is provided with second mounting grooves corresponding to the second heat conducting pipes on a one-to-one basis, and the second heat conducting pipes are embedded in the second mounting grooves.

[0013] According to an embodiment of the present invention, the lower surface of the first heat pipe is flush with the lower surface of the housing, and the upper surface of the second heat pipe is flush with the upper surface of the heat dissipation plate;

[0014] The lower surface of the shell is pressed against the upper surface of the heat sink, and the shell and the heat sink are detachably connected;

[0015] The length of the heat dissipation plate along the first direction is greater than the length of the housing along the first direction.

[0016] According to one embodiment of the present invention, the first heat conducting tube and the second heat conducting tube are strip-shaped, the length direction of the first heat conducting tube extends along a first direction, the length direction of the second heat conducting tube extends along a second direction, and the first direction is perpendicular to the second direction.

[0017] According to an embodiment of the present invention, a plurality of first heat conducting pipes are provided, and the plurality of first heat conducting pipes are arranged at intervals along the first direction and are parallel to each other;

[0018] A plurality of the second heat conducting pipes are provided, and the second heat conducting pipes are arranged at intervals along the second direction and are parallel to each other.

[0019] According to an embodiment of the present invention, the semiconductor laser includes a plurality of COSs, each COS is provided with a corresponding first heat pipe on its lower side, and the length direction of the COS extends along the first direction.

[0020] According to an embodiment of the present invention, a plurality of COSs are spaced apart along the second direction on the same base and arranged in a stepped manner.

[0021] According to an embodiment of the present invention, a base is provided on the lower side of each COS, a plurality of the bases are arranged in sequence along the second direction, and a plurality of the COSs are arranged in a stepped manner along the second direction.

[0022] Another embodiment of the present invention provides a semiconductor laser, comprising the heat dissipation device described in any one of the above embodiments.

[0023] Beneficial effects of the present invention: The heat dissipation device provided by the present invention includes a first heat pipe, a second heat pipe and heat dissipation fins, the lower end of the second heat pipe is connected to the heat dissipation fins, the upper end of the second heat pipe is connected to the first heat pipe, and the first heat pipe is connected to the outer bottom wall of the shell. The heat generated by the COS during operation is transferred to the base, and the base transfers the heat to the first heat pipe located outside the shell through the bottom wall of the shell. The first heat pipe transfers the heat to the second heat pipe, and the second heat pipe is connected to the heat dissipation fins. The heat dissipation fins are in contact with the air for heat exchange, thereby achieving heat dissipation for the COS. The heat dissipation fins increase the area in contact with the air, thereby increasing the heat dissipation area and improving the heat dissipation efficiency. Since the first heat pipe and the second heat pipe are arranged on the outside of the shell, they do not occupy the space inside the shell, so the miniaturization and integration of the semiconductor laser can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A three-dimensional diagram of a semiconductor laser provided in one embodiment of the present utility model;

[0026] Figure 2 for Figure 1 A magnified view of part A;

[0027] Figure 3 for Figure 1 A magnified view of part B;

[0028] Figure 4 A top view of a semiconductor laser provided in one embodiment of the present utility model;

[0029] Figure 5 for Figure 4 AA cross-sectional view;

[0030] Figure 6 A three-dimensional diagram of a heat dissipation device provided in one embodiment of the present utility model;

[0031] Figure 7 A three-dimensional diagram of a housing provided in one embodiment of the present invention from one viewing angle;

[0032] Figure 8 A three-dimensional view of a housing provided in another embodiment of the present invention.

[0033] Icons: 1-semiconductor laser; 11-housing; 111-first mounting groove; 112-mounting ear; 1121-through hole; 12-accommodating cavity; 13-base; 14-COS;

[0034] 2-heat dissipation device; 21-heat dissipation plate; 211-threaded hole; 212-second mounting slot; 213-heat dissipation fin; 22-first heat pipe; 23-second heat pipe. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above-mentioned purposes, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] like Figures 1 to 8 As shown, one embodiment of the present invention provides a heat dissipation device 2 for a semiconductor laser 1, wherein the semiconductor laser 1 includes a housing 11, a COS 14 and a base 13, wherein an accommodating cavity 12 is formed in the housing 11, the base 13 is mounted on the inner bottom wall of the housing 11 and is located in the accommodating cavity 12, and the COS 14 is fixed on the base 13; the heat dissipation device 2 includes a first heat pipe 22, a second heat pipe 23 and heat dissipation fins 213, wherein the upper end of the second heat pipe 23 is connected to the heat dissipation fins 213, the lower end of the second heat pipe 23 is connected to the first heat pipe 22, and the first heat pipe 22 is connected to the outer bottom wall of the housing 11.

[0037] The heat dissipation device 2 provided by the present invention includes a first heat conducting pipe 22, a second heat conducting pipe 23 and heat dissipation fins 213, the upper end of the second heat conducting pipe 23 is connected to the heat dissipation fins 213, the lower end of the second heat conducting pipe 23 is connected to the first heat conducting pipe 22, and the first heat conducting pipe 22 is connected to the outer bottom wall of the shell 11. The heat generated by the COS14 during operation is transferred to the base 13, and the base 13 transfers the heat to the first heat pipe 22 located outside the shell 11 through the bottom wall of the shell 11. The first heat pipe 22 transfers the heat to the second heat pipe 23. The second heat pipe 23 is connected to the heat dissipation fins 213. The heat dissipation fins 213 are in contact with the air for heat exchange to achieve heat dissipation for the COS. The heat dissipation fins 213 increase the area in contact with the air, thereby increasing the heat dissipation area and improving the heat dissipation efficiency. Since the first heat pipe 22 and the second heat pipe 23 are arranged on the outside of the shell 11, they do not occupy the space inside the shell 11. The COS14 can be installed in a small space, thereby realizing miniaturization and integration of the semiconductor laser 1. In addition, in the present application, the bottom wall of the shell 11 is made of a low-density material, so the weight of the shell 11 can be reduced. At the same time, the bottom wall of the shell 11 is thin, and the heat is more efficiently transferred to the first heat pipe 22 located on the lower side of the shell 11 through the bottom wall of the shell 11, thereby achieving better heat dissipation effect for the COS14.

[0038] According to one embodiment of the present invention, Figure 1 and Figure 6 As shown, the first heat conducting pipe 22 and the second heat conducting pipe 23 are arranged to cross each other, that is, the first heat conducting pipe 22 and the second heat conducting pipe 23 are not parallel; wherein the length direction of the COS14 is the same as the length direction of the first heat conducting pipe 22, and the first heat conducting pipe 22 is correspondingly arranged on the lower side of the COS14. In this way, the heat generated by the COS14 is directly transferred to the first heat conducting pipe 22 located on the lower side through the base 13 and the shell 11, and the heat transfer efficiency is higher, thereby improving the heat dissipation effect of the COS14.

[0039] According to one embodiment of the present invention, Figure 1 and Figure 6 As shown, the first heat pipe 22 and the second heat pipe 23 are strip-shaped. The length of the first heat pipe 22 extends along a first direction, and the length of the second heat pipe 23 extends along a second direction, with the first direction being perpendicular to the second direction. In this embodiment, the housing 11 is rectangular, the first direction is the width of the housing 11, the second direction is the length of the housing 11, and the length of the COS 14 extends along the first direction. The first heat pipe 22 and the second heat pipe 23 are perpendicular to each other. Therefore, when heat from the first heat pipe 22 is transferred to the second heat pipe 23, the heat transfer efficiency is higher.

[0040] Optional, such as Figure 1 and Figure 6 As shown, a plurality of first heat pipes 22 are provided, spaced apart and parallel to each other along the first direction; a plurality of second heat pipes 23 are provided, spaced apart and parallel to each other along the second direction. In this embodiment, the first and second heat pipes 22, 23 intersect and are arranged in a grid pattern. Therefore, each first heat pipe 22 is connected to a plurality of second heat pipes 23. Heat from the first heat pipe 22 is transferred to the plurality of second heat pipes 23, improving heat transfer efficiency and, in turn, the heat dissipation efficiency of the COS 14.

[0041] According to one embodiment of the present invention, Figure 1 、 Figure 2 and Figure 7 As shown, the semiconductor laser 1 includes a plurality of COSs 14, each of which is provided with a first heat pipe 22 on the underside thereof. The length of the COS 14 extends along the first direction. In this embodiment, the first heat pipes 22 are provided in a one-to-one correspondence with the COSs 14. The heat generated by each COS 14 can be transferred to the corresponding first heat pipe 22 through the base 13 and the bottom wall of the housing 11. This improves the heat transfer efficiency from the COS 14 to the first heat pipe 22, thereby improving the heat dissipation efficiency.

[0042] According to one embodiment of the present invention, the base 13 is arranged obliquely along the second direction, and the plurality of COS 14 are arranged on the base 13 at intervals along the second direction and arranged in a stepped manner. In this embodiment, the base 13 is an integral structure, and the upper surface of the base 13 is inclined relative to the horizontal plane. The COS 14 are sequentially arranged on the base 13 at intervals along the second direction and arranged in a stepped manner. In this way, the lasers emitted by the laser chips of the plurality of COS 14 will not interfere with each other. Figure 1 As shown, the COS14 is a side-light-emitting structure, and the light-emitting direction of the COS14 is along the first direction. A fast-axis collimator, a slow-axis collimator, and a reflector are sequentially arranged on one side of the light-emitting direction of each COS14. The light-emitting directions of the multiple COS14 are parallel to each other. The laser emitted by each COS14 is reflected 90° by the corresponding reflector, and then focused by the focusing mirror provided at the light outlet position and transmitted through the optical fiber. Since the multiple COS14 are arranged in a stepped shape, the lasers reflected by the reflector will not overlap in the height direction.

[0043] According to another embodiment of the present invention, each of the COS14 is provided with a base 13 on the lower side, and the multiple bases 13 are arranged in sequence along the second direction, and the multiple COS14 are arranged in a stepped manner along the second direction. In this embodiment, bases 13 corresponding to the number of COS14 are provided, wherein the multiple bases 13 can be arranged at intervals or in contact with each other. At the same time, similar to the above embodiment, all the bases 13 are arranged in a stepped shape as a whole, that is, multiple COS14 are arranged in a stepped shape, so as to avoid interference between the lasers emitted by multiple COS14 when they are transmitted to the focusing mirror through the reflector; at the same time, since each laser chip corresponds to a base 13, the laser chip and the base 13 can be quickly installed. When the laser chip fails, the corresponding base 13 can be directly disassembled and replaced, so as to achieve rapid disassembly and maintenance of the laser chip. Figure 4 and Figure 7 As shown, the plurality of COS 14 are arranged in two rows along the first direction, and the plurality of COS 14 in the two rows are sequentially spaced apart along the second direction.

[0044] According to one embodiment of the present invention, the base 13 is made of a highly thermally conductive material, such as a copper base or a gold base. Because the base 13 is made of a highly thermally conductive material, the heat generated by the laser chip is transferred more efficiently through the base 13 to the bottom wall of the housing 11. Since the base 13 is made of a low-density material and the bottom wall of the housing 11 is relatively thin, the heat from the base 13 is transferred more efficiently through the housing 11 to the first heat pipe 22. This improves the heat transfer efficiency from the COS 14, the base 13, and the bottom wall of the housing 11 to the first heat pipe 22. This reduces the weight of the housing 11 and further improves the heat dissipation efficiency of the COS 14.

[0045] According to one embodiment of the present invention, Figure 1 and Figure 6 As shown, the heat dissipation device 2 further includes a heat dissipation plate 21, the second heat conduction pipe 23 is installed on the upper surface of the heat dissipation plate 21, and the heat dissipation fins 213 are installed on the lower surface of the heat dissipation plate 21; the second heat conduction pipe 23 is connected to the first heat conduction pipe 22 through the heat dissipation plate 21. Figure 1 and Figure 6 As shown, a plurality of heat dissipation fins 213 are provided, and the plurality of heat dissipation fins 213 are arranged at intervals and parallel to each other. The heat generated by COS14 is transferred to the first heat pipe 22 on the lower side thereof through the base 13 and the shell 11. The first heat pipe 22 transfers the heat to the second heat pipe 23. The heat of the second heat pipe 23 is transferred to the heat dissipation fins 213 through the heat dissipation plate 21. The heat dissipation fins 213 increase the contact area with the gas, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0046] According to one embodiment of the present invention, Figure 8 As shown, the outer bottom wall of the shell 11 is provided with a first installation groove 111 corresponding to the first heat pipe 22, and the first heat pipe 22 is embedded in the first installation groove 111; Figure 3 、 Figure 5 and Figure 6 As shown, the upper surface of the heat sink 21 is provided with a second mounting groove 212 corresponding one-to-one with the second heat pipe 23, and the second heat pipe 23 is embedded in the mounting groove. In this embodiment, the first heat pipe 22 is embedded in the first mounting groove 111, and the upper side of each first heat pipe 22 corresponds to a COS 14. Since the first mounting groove 111 is provided on the outer bottom wall of the housing 11, the thickness of the bottom wall of the housing 11 corresponding to the COS 14 is thinner, and the heat transfer efficiency from the housing 11 to the first heat pipe 22 is better, which can further improve the heat dissipation efficiency. In addition, the upper surface of the heat sink 21 is provided with a second mounting groove 212. The thickness of the heat sink 21 at the location of the second mounting groove 212 is thinner, and the heat transfer efficiency of the second heat pipe 23 to the heat dissipation fin 213 on the lower side of the heat sink 21 is higher, thereby improving the heat dissipation efficiency. The first and second heat pipes 22 and 23 are fixed by the first and second mounting grooves 111 and 212, and the two are fixed more firmly and assembled more easily. In this embodiment, the first heat pipe 22 can be fixed in the first mounting groove 111 by thermally conductive adhesive, or can be soldered in the first mounting groove 111. The second heat pipe 23 can be fixed in the second mounting groove 212 by thermally conductive adhesive, or can be soldered in the second mounting groove 212.

[0047] like Figure 1 、 Figure 4 and Figure 6 As shown, in this embodiment, the heat sink 21 is rectangular, the width of the heat sink 21 extends along the first direction, the length of the heat sink 21 extends along the second direction, the width of the heat sink 21 is greater than the width of the shell 11, the length of the heat sink 21 is greater than the length of the shell 11, and the projection of the shell 11 in the vertical direction falls on the heat sink 21; the outer bottom wall of the shell 11 is in contact with the upper surface of the heat sink 21, so that the heat of the bottom wall of the shell 11 is not only transferred to the heat sink 21 through the first heat pipe 22 and the second heat pipe 23, but the entire bottom wall of the shell 11 is in contact with the heat sink 21 for heat transfer. The bottom wall of the shell 11 as a whole can also transfer heat to the heat sink 21, thereby increasing the heat transfer area and thereby improving the heat dissipation efficiency.

[0048] In this embodiment, the lower surface of the first heat pipe 22 is flush with the lower surface of the outer bottom wall of the shell 11, and the upper surface of the second heat pipe 23 is flush with the upper surface of the heat dissipation plate 21, so that the first heat pipe 22 is in contact with the second heat pipe 23 while the lower surface of the outer bottom wall of the shell 11 is in contact with the upper surface of the heat dissipation plate 21.

[0049] It should be noted that, in the above embodiment, the lower surface of the first heat pipe 22 may also protrude from the first mounting groove 111, that is, the lower surface of the first heat pipe 22 is located below the lower surface of the outer bottom wall of the shell 11; the upper surface of the second heat pipe 23 may also protrude from the second mounting groove 212, that is, the upper surface of the second heat pipe 23 is located above the upper surface of the heat sink 21. Of course, in this embodiment, the first heat pipe 22 may protrude from the first mounting groove 111, and the upper surface of the second heat pipe 23 may be flush with the upper surface of the heat sink 21, or the second heat pipe 23 may protrude from the second mounting groove 212, and the lower surface of the first heat pipe 22 may be flush with the lower surface of the outer bottom wall of the shell 11. All of the above solutions can achieve heat transfer from the first heat pipe 22 to the second heat pipe 23.

[0050] like Figure 6 As shown, the distance between the outer edges of the two second heat pipes 23 located at the edge is greater than or equal to the length of the first heat pipe 22 along the first direction. The edge of each first heat pipe 22 can contact a second heat pipe 23, thereby improving the heat transfer efficiency.

[0051] like Figure 1 As shown, the heat sink 21 is detachably connected to the bottom wall of the housing 11, which facilitates the assembly and disassembly of the heat sink 2 and the semiconductor laser 1; preferably, as Figure 1 、 Figure 4 and Figure 7 As shown, the housing 11 is provided with mounting ears 112 on both side walls along the length direction. Preferably, in this embodiment, two mounting ears 112 are provided on each side wall, and the mounting ears 112 are arranged near the bottom wall of the housing 11. The mounting ears 112 are provided with through holes 1121, and the heat sink 21 is provided with threaded holes 211. The housing 11 and the heat sink 21 are fixed together by screws.

[0052] In the description of this utility model, it should be noted that the terms "upper" and "lower" and other terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device is applied to a semiconductor laser, which comprises a housing (11), a COS (14) and a base (13); a housing cavity (12) is formed in the housing (11); the base (13) is mounted on the inner bottom wall of the housing (11) and is located in the housing cavity (12); and the COS (14) is fixed on the base (13); The heat dissipation device comprises a first heat conducting pipe (22), a second heat conducting pipe (23) and heat dissipation fins (213); the lower end of the second heat conducting pipe (23) is connected to the heat dissipation fins (213); the upper end of the second heat conducting pipe (23) is connected to the first heat conducting pipe (22); and the first heat conducting pipe (22) is connected to the outer bottom wall of the shell (11).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a heat dissipation plate (21), the second heat conducting pipe (23) is mounted on the upper surface of the heat dissipation plate (21), and the heat dissipation fins (213) are mounted on the lower surface of the heat dissipation plate (21); the lower surface of the second heat conducting pipe (23) is connected to the heat dissipation fins (213) through the heat dissipation plate (21).

3. The heat dissipation device according to claim 2, characterized in that: The outer bottom wall of the shell (11) is provided with a first installation groove (111) corresponding to the first heat-conducting pipe (22) on a one-to-one basis, and the first heat-conducting pipe (22) is embedded in the first installation groove (111); The upper surface of the heat dissipation plate (21) is provided with a second installation groove (212) corresponding one-to-one to the second heat conducting pipe (23), and the second heat conducting pipe (23) is embedded in the second installation groove (212).

4. The heat dissipation device according to claim 3, characterized in that: The lower surface of the first heat-conducting pipe (22) is flush with the lower surface of the housing (11), and the upper surface of the second heat-conducting pipe (23) is flush with the upper surface of the heat dissipation plate (21); The lower surface of the housing (11) is pressed against the upper surface of the heat dissipation plate (21), and the housing (11) and the heat dissipation plate (21) are detachably connected; The length of the heat dissipation plate (21) along the first direction is greater than the length of the housing (11) along the first direction.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The first heat conducting tube (22) and the second heat conducting tube (23) are strip-shaped, the length direction of the first heat conducting tube (22) extends along a first direction, the length direction of the second heat conducting tube (23) extends along a second direction, and the first direction is perpendicular to the second direction.

6. The heat dissipation device according to claim 5, characterized in that: There are a plurality of the first heat conducting pipes (22), and the plurality of the first heat conducting pipes (22) are arranged at intervals along the first direction and are parallel to each other; A plurality of the second heat-conducting pipes (23) are provided, and the second heat-conducting pipes (23) are arranged at intervals along the second direction and are parallel to each other.

7. The heat dissipation device according to claim 5, characterized in that: The semiconductor laser comprises a plurality of COSs (14), each COS (14) is provided with a corresponding first heat pipe (22) on the lower side thereof, and the length direction of the COS (14) extends along the first direction.

8. The heat dissipation device according to claim 7, characterized in that: A plurality of COSs (14) are arranged on the same base (13) at intervals along the second direction and arranged in a stepped manner.

9. The heat dissipation device according to claim 7, characterized in that: A base (13) is provided on the lower side of each COS (14), a plurality of bases (13) are sequentially arranged along the second direction, and a plurality of COS (14) are arranged in a stepped manner along the second direction.

10. A semiconductor laser, characterized in that: The heat dissipation device comprises the heat dissipation device according to any one of claims 1 to 9.

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