Chip ceramic heater

Abstract

The utility model provides a chip ceramic heater, which comprises a heater ceramic main body and pin wire holes, the pin wire holes are positioned at the end part of the main body and penetrate through a main body shell on one side and each functional layer, the heater main body further comprises a heating wire layer and an RTD layer, heating resistance wires are distributed on the heating wire layer, the heating wire layer is divided into more than two independent areas, and the RTD layer is arranged in the heating wire layer. Each area forms an independent path, so that independent temperature control is realized, thermistor wires are distributed on the RTD layer, temperature change can be monitored, and the RTD layer is also partitioned in cooperation with region division of the heating wire layer, so that the effects of partitioned temperature control, accurate temperature control and rapid temperature measurement are realized, and novel chip test requirements are met.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a chip heater. Background Art

[0002] Temperature control and heat dissipation are frequently used technologies in the semiconductor industry. For example, thermal heads are used in semiconductor chip packaging and testing, ATE automated test equipment, and SLT system-level testing. These require precise, zoned, and uniform temperature control, as well as rapid response to temperature changes.

[0003] In the back-end packaging test of semiconductors, such as ATE automatic test equipment, SLT (system level test) or Burn In test, the heater module on the thermal head is the main module used for temperature control. Its main purpose is to maintain a stable test temperature.

[0004] With the adoption of innovative packaging technologies such as SOC, SIP, and chiplet advanced packaging, chips are becoming larger, more powerful, and more complex in structure and functionality. A single chip may integrate multiple small chips with different functions, performance, and processes. These chips vary in thickness and heat dissipation. The emergence of these innovative chips places higher demands on traditional chip back-end testing: for example, requirements for uniform temperature across the chip interface (heat from the heating module is evenly distributed across the interface), high heat dissipation, compact footprint, high heat transfer efficiency, and temperature sensors that can sense the entire surface rather than a single point.

[0005] However, existing heaters have many problems. For example, the power of the heater cannot meet the requirements of novel chip testing, especially high-power heating chips such as AI chips; the heater can only achieve overall heating of the chip, but cannot heat each area of ​​the chip separately according to its function. Summary of the Invention

[0006] Based on this, the present invention aims to overcome the defects of the prior art and provide a chip ceramic heater with zoned temperature control.

[0007] A chip ceramic heater comprises a heater body formed by bonding and sintering a plurality of ceramic layers realizing corresponding functions; a lead wire hole penetrating at least one side of the shell and allowing the wires of each layer to be led out for external connection.

[0008] The heater body includes an upper outer shell, a heating wire layer, and a lower outer shell in sequence, wherein the heating wire layer includes a heating wire functional layer. The heating wire functional layer is divided into two or more areas, on which heating resistance wires are distributed. The heating resistance wires in a single area form an independent circuit, and the circuits between the areas are not interconnected.

[0009] Furthermore, the heater body has two or more heating wire functional layers.

[0010] Furthermore, the heating wire layer also includes a heating wire lead layer, which has grooves for accommodating metal wires. The grooves are distributed along the wire ends of each area of ​​the heating wire functional layer toward the pin wire holes, where the metal wires form passages and are externally connected at the pin wire holes.

[0011] Furthermore, an RTD layer is provided between the upper shell and the lower shell, and the RTD layer includes an RTD functional layer on which thermistor wires are distributed.

[0012] Furthermore, the RTD functional layer cooperates with the heating wire functional layer to divide the areas, and the two are consistent. The thermistor wires in a single area form an independent circuit, and the areas are not interconnected; or, the RTD functional layer and the heating wire functional layer are not completely consistent in dividing the areas. The thermistor wires in a single area form an independent circuit, and the areas are not interconnected.

[0013] Furthermore, the RTD layer also includes an RTD lead layer, which has grooves for accommodating metal wires. The grooves are distributed along the ends of the wires in each area of ​​the RTD functional layer toward the pin wire holes, where the metal wires form passages and are externally connected at the pin wire holes.

[0014] The advantages of this application over the prior art are:

[0015] The utility model provides a chip ceramic heater, on which the heating wire functional layer is divided into multiple areas, the heating resistance wires in a single area are independently distributed, and the passages in each area can be independently controlled to be on and off. Such a setting can realize independent temperature control of each area and meet the requirements of different testing methods for precise and regional temperature control.

[0016] Compared with conventional ceramic heaters, the thickness of this ceramic heater can be made very thin, ranging from 0.3mm to 4mm, and preferably equal to 1mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of a chip ceramic heater.

[0018] Figure 2 Schematic diagram of the layered structure of the heater body.

[0019] Figure 3This is a schematic diagram of the specific structure of the heating wire layer of the heater.

[0020] Figure 4 Schematic diagram of the heating wire functional layer structure.

[0021] Figure 5 Schematic diagram of the specific structure of the RTD layer of the heater.

[0022] Figure 6 Schematic diagram of the regional distribution of the heating wire functional layer of the heater in one embodiment.

[0023] Figure 7 Schematic diagram of the regional distribution of the heating wire functional layer of the heater in another embodiment.

[0024] Figure 8 Schematic diagram of the regional distribution of the heating wire functional layer of the heater in another embodiment. Description of the drawings:

[0026] 1. Heater body; 2. Lead wire holes; 11. Upper shell; 12. Lower shell; 13. RTD layer; 14. Heating wire layer; 141. Heating wire first functional layer; 142. Heating wire second functional layer; 143. Heating wire layer lead layer; 141A, inner heating zone; 141B, outer heating zone; 31. Inner zone lead hole; 32. Outer zone lead hole; 131. RTD functional layer; 132. RTD lead layer DETAILED DESCRIPTION

[0027] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0028] As an embodiment, the present application provides a chip ceramic heater, such as Figure 1 As shown, it includes a ceramic heater body 1 and a plurality of lead wire holes 2 located at the end of the heater body 1, wherein the lead wire holes 2 are used to lead out the wires of each functional layer for external connection.

[0029] The heater body 1 is formed by stacking and sintering multiple ceramic functional layers. After sintering and bonding, there is no gap between the layers. For illustration, the function and connection relationship of each layer are decomposed as shown in the following figure. Figure 2 As shown, from top to bottom are an upper shell 11 , an RTD (Resistance Temperature Detector) layer 13 , a heating wire layer 14 , and a lower shell 12 .

[0030] The heating wire functional layer can be one or more layers. In the first embodiment, as Figure 3 , Figure 4 shown, the heating wire layer 14 includes a first heating wire functional layer 141, a second heating wire functional layer 142, and a heating wire lead layer 143. The function of the heating wire lead layer 143 is to extend the metal wire led out from the functional layer lead hole to the end pin hole 2 and lead it outwards. The heating wire functional layer is divided into an inner heating area 141A and an outer heating area 141B, on which heating rods / heating resistance wires ( Figure 3 not shown) are distributed. The inner heating area 141A includes an inner area lead hole 31, and the outer heating area 141B includes an outer area lead hole 32. The heating rods in a single area are connected in series, and their wires are led out through the lead holes and externally connected.

[0031] The first heating wire functional layer 141 and the second heating wire functional layer 142 have the same structure. The same areas in different functional layers are connected in series with each other, but the circuits between different areas are not interconnected. The purpose of this setting is to achieve independent temperature control of different areas, and the superposition of multiple heating wire functional layers is to achieve a sufficiently high heating power at a lower voltage.

[0032] As Figure 5 shown, the RTD layer 13 includes an RTD functional layer 131 and an RTD lead layer 132. The function of the RTD lead layer 132 is to extend the metal wire led out from the functional layer lead hole to the end pin hole 2 and lead it outwards. The RTD functional layer 131 contains a thermistor wire PT100, and its distribution can be partitioned according to the positions of each area of the heating wire functional layers 141 and 142. Similarly, it is divided into inner and outer areas, and the resistance wires in each area form independent circuits, so that the temperature of different heating areas can be monitored separately.

[0033] As an embodiment, the heating rods of the heating wire functional layer form a "concave" - shaped partition as Figure 6 shown. The inner and outer circuits are independent of each other and not interconnected, enabling separate temperature control. The RTD functional layer is partitioned in coordination with the heating wire functional layer to achieve separate monitoring.

[0034] As an embodiment, the heating rods of the heating wire functional layer form a left - right type partition as Figure 7 shown. The left and right circuits are independent of each other and not interconnected, enabling separate temperature control. The RTD functional layer is partitioned in coordination with the heating wire functional layer to achieve separate monitoring.

[0035] As an embodiment, the heating rods of the heating wire functional layer form a "field" - shaped partition as Figure 8 (heating resistance wire not shown) shown. The circuits of the four areas are independent of each other and not interconnected, enabling separate temperature control. The RTD functional layer is partitioned in coordination with the heating wire functional layer to achieve separate monitoring.

[0036] In other embodiments, the partitions of the heating wire functional layer and the RTD functional layer may be modified to be slightly inconsistent or completely inconsistent according to specific design requirements.

[0037] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A chip ceramic heater, characterized in that, include: The heater body is made of multiple ceramic layers sintered and bonded together, including an upper shell, a heating wire layer, and a lower shell. The heating wire layer includes a heating wire functional layer, which is divided into two or more regions with heating resistors distributed on them. The heating resistors in each region form independent circuits, and the circuits between the regions are not interconnected. The pin hole passes through at least one side of the shell and can lead the wires of each layer to external connections.

2. A chip ceramic heater according to claim 1, characterized in that: The heater body has two or more heating wire functional layers.

3. A chip ceramic heater according to claim 1, characterized in that: The heating wire layer also includes a heating wire lead layer, which has grooves for accommodating metal wires. The grooves are distributed along the wire ends of each area of ​​the heating wire functional layer toward the pin wire holes, where the metal wires form passages and are externally connected at the pin wire holes.

4. A chip ceramic heater as claimed in claim 3, characterized in that: An RTD layer is further provided between the upper shell and the lower shell. The RTD layer includes an RTD functional layer on which thermistor wires are distributed.

5. A chip ceramic heater as claimed in claim 4, characterized in that: The RTD functional layer cooperates with the heating wire functional layer to divide the area, and the two are consistent. The thermistor wire in a single area forms an independent circuit, and the areas are not interconnected.

6. A chip ceramic heater as claimed in claim 4, characterized in that: The RTD functional layer and the heating wire functional layer are not divided into completely consistent areas. The thermistor wires in a single area form an independent circuit, and the areas are not interconnected.

7. A chip ceramic heater according to any one of claims 4 to 6, characterized in that: The RTD layer also includes an RTD lead layer, which has grooves for accommodating metal wires. The grooves are distributed along the wire ends of each area of ​​the RTD functional layer toward the pin wire holes, where the metal wires form pathways and are externally connected at the pin wire holes.

8. The chip ceramic heater according to claim 7, characterized in that: The thickness of this ceramic heater ranges from 0.3mm to 4mm.

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