Electronic device and sensor assembly

Abstract

The embodiment of the utility model provides electronic equipment and a sensor assembly. The electronic equipment comprises a sensor assembly and a mainboard. The sensor assembly includes a sensor and a first pad. The sensor is at least one of a vibration sensitive sensor or a stress sensitive sensor. The first bonding pad is arranged on the first surface of the sensor and is electrically connected with the sensor. The first bonding pad comprises a buffer connection layer, and the buffer connection layer comprises a flexible material. Wherein the sensor is electrically connected with the mainboard through the first bonding pad. In the embodiment of the invention, the buffer connection layer is arranged between the sensor and the mainboard, and the buffer connection layer comprises the flexible material, so that the buffer connection layer can play a role in buffering vibration of the mainboard and stress brought by the vibration, and the influence of the vibration of the mainboard and the stress brought by the vibration on the sensor is reduced; the accuracy and reliability of the sensor are improved.

Description

Technical Field

[0001] Embodiments of the present application provide an electronic device and a sensor assembly, relating to the technical field of sensors. Background Art

[0002] Electronic devices include a motherboard and sensors, which are electrically connected to the motherboard. The motherboard is also electrically connected to other components, such as capacitors and radio frequency chips. For example, when a capacitor is operating, it exerts force on the motherboard due to electromagnetic induction, causing it to vibrate. This vibration is transmitted to the sensor, affecting its operation and, consequently, its accuracy and reliability. Furthermore, resonance between the motherboard and sensor can easily damage the sensor. Utility Model Content

[0003] Embodiments of the present application provide an electronic device and a sensor assembly for reducing the impact of vibration of a mainboard on a sensor.

[0004] In one aspect, embodiments of the present application provide an electronic device. The electronic device includes a sensor assembly and a mainboard. The sensor assembly includes a sensor and a first solder pad. The sensor is at least one of a vibration-sensitive sensor and a stress-sensitive sensor. The first solder pad is disposed on a first surface of the sensor and is electrically connected to the sensor. The first solder pad includes a buffer connection layer comprising a flexible material. The sensor is electrically connected to the mainboard via the first solder pad.

[0005] In an embodiment of the present application, a buffer connection layer is provided comprising a flexible material, so that when the sensor and the mainboard are electrically connected, the flexible material can be located between the sensor and the mainboard. In this way, when a vibration source on the mainboard drives the mainboard to vibrate, the flexible material disposed between the mainboard and the sensor can buffer the vibration of the mainboard, hindering the transmission of vibration and the stress caused by vibration to the sensor, reducing the vibration energy and stress energy received by the sensor, thereby reducing the impact of the vibration of the mainboard and the stress caused by vibration on the sensor, and improving the accuracy and reliability of the sensor. This also reduces the risk of resonance between the mainboard and the sensor, thereby reducing the risk of damage to the sensor. Furthermore, by using the flexible material to buffer the vibration of the mainboard, there is no need to change the location of the sensor on the mainboard, thereby increasing the flexibility of the placement of the sensor and other components on the mainboard.

[0006] In some possible implementations, the sensor includes at least one of an accelerometer or a gyroscope. This configuration can reduce the impact of motherboard vibration and the stress caused by the vibration on at least one of the accelerometer or gyroscope, improve the accuracy and reliability of at least one of the accelerometer or gyroscope, and reduce the risk of resonance between at least one of the accelerometer or gyroscope and the motherboard, thereby reducing the risk of damage to at least one of the accelerometer or gyroscope.

[0007] In some possible implementations, the flexible material is a flexible conductive material. The flexible conductive material is electrically connected to the sensor. This configuration allows the buffer connection layer to function as both a conductor and a buffer, simplifying the structure of the buffer connection layer and facilitating miniaturization of the sensor assembly.

[0008] In some possible implementations, the flexible conductive material includes at least one of conductive rubber and conductive polymer. This configuration improves the flexibility of the flexible conductive material in material selection.

[0009] In some possible implementations, the flexible material is a flexible insulating material. The buffer connection layer further includes a conductive portion electrically connected to the sensor. This configuration enables electrical signals to be transmitted between the sensor and the mainboard via the conductive portion, minimizing the impact of the flexible insulating material on the electrical connection between the sensor and the mainboard.

[0010] In some possible implementations, the conductive portion is located on the outer periphery of the flexible insulating material and surrounds at least a portion of the flexible insulating material. Compared to embedding the conductive portion within the flexible insulating material, this arrangement can reduce the conductive portion's impact on the flexible insulating material, ensuring that the flexible insulating material effectively buffers the vibration of the mainboard and the stress caused by vibration, thereby reducing the impact of mainboard vibration on the sensor.

[0011] In some possible implementations, the flexible insulating material includes a connection groove extending through the thickness of the flexible insulating material. At least a portion of the conductive portion is embedded in the connection groove. This arrangement eliminates the need for the conductive portion to occupy additional space, facilitating miniaturization of the sensor assembly.

[0012] In some possible implementations, the flexible insulating material includes at least one of FR-4 and resin. This configuration can improve the flexibility of the flexible insulating material in material selection.

[0013] In some possible implementations, the first pad further includes a first pad body. At least a portion of the first pad body is located between the sensor and the buffer connection layer and is electrically connected to the sensor and the buffer connection layer. This arrangement can improve the convenience of electrical connection between the buffer connection layer and the sensor.

[0014] In some possible implementations, the ratio of the area of ​​the buffer connection layer's orthographic projection on the reference surface to the area of ​​the first pad body's orthographic projection on the reference surface is greater than or equal to 50%. The reference surface is perpendicular to the thickness direction of the buffer connection layer. This configuration prevents the ratio of the area of ​​the buffer connection layer's orthographic projection on the reference surface to the area of ​​the first pad body's orthographic projection on the reference surface from being too small, ensuring the buffer connection layer's ability to buffer motherboard vibration and the stress caused by vibration, thereby reducing the impact of motherboard vibration and the stress caused by vibration on the sensor.

[0015] In some possible implementations, the first pad body includes a first sub-pad and a second sub-pad. The first sub-pad is located between the sensor and the buffer connection layer, and is electrically connected to the sensor and the buffer connection layer. The second sub-pad is located on a side of the buffer connection layer away from the sensor, and is electrically connected to the buffer connection layer. It can be understood that setting the first sub-pad between the sensor and the buffer connection layer, and electrically connected to the sensor and the buffer connection layer, can improve the convenience of electrical connection between the sensor and the buffer connection layer. Setting the second sub-pad on the side of the buffer connection layer away from the sensor, and electrically connected to the buffer connection layer, allows the buffer connection layer to be electrically connected to the mainboard through the second sub-pad, thereby improving the convenience of electrical connection between the buffer connection layer and the mainboard.

[0016] In some possible implementations, at least one of the first sub-pad and the second sub-pad is a rectangular parallelepiped. This configuration can improve the convenience of electrically connecting the first sub-pad to the sensor and the buffer connection layer, and improve the convenience of electrically connecting the second sub-pad to the buffer connection layer and the motherboard.

[0017] In some possible implementations, the sensor assembly further includes a second solder pad electrically connected to the sensor. The ratio of the number of first solder pads to the sum of the number of first and second solder pads is greater than or equal to 30%. This configuration can avoid having too few first solder pads, improve the buffering effect of the buffer connection layer of the first solder pads against vibrations of the motherboard and the stress caused by vibrations, and thus reduce the impact of vibrations of the motherboard and the stress caused by vibrations on the sensor.

[0018] In some possible implementations, the ratio of the number of first pads to the sum of the number of first and second pads is greater than or equal to 50%. This configuration can avoid having too few first pads, improve the buffering effect of the buffer connection layer of the first pads on the vibration of the motherboard and the stress caused by the vibration, and thus reduce the impact of the motherboard vibration on the sensor.

[0019] In some possible implementations, the first pad is closer to the vibration source on the mainboard than the second pad. This arrangement can improve the buffering effect of the buffer connection layer of the first pad on the vibration of the mainboard and the stress caused by the vibration, thereby reducing the impact of the vibration of the mainboard and the stress caused by the vibration on the sensor, improving the accuracy and reliability of the sensor, and reducing the risk of resonance between the mainboard and the sensor, thereby reducing the risk of damage to the sensor. In some possible implementations, the first pad and the second pad are arranged alternately. This arrangement allows the first pads to be evenly distributed, improves the buffering effect of the buffer connection layer of the first pad on the vibration of different positions on the mainboard and the stress caused by the vibration, and reduces the impact of the vibration of the mainboard and the stress caused by the vibration on the sensor.

[0020] In some possible implementations, the first surface of the sensor has a centerline that passes through the center of the first surface and divides the first surface of the sensor into a first area and a second area. There are multiple first pads, and the multiple first pads are located in the first area and the second area. This arrangement allows the multiple first pads to be distributed at different positions on the first surface, thereby improving the buffering effect of the buffer connection layer of the first pads on vibrations at different positions of the motherboard and the stress caused by vibrations, reducing the impact of the motherboard vibrations and the stress caused by vibrations on the sensor, improving the accuracy and reliability of the sensor, and reducing the risk of resonance between the motherboard and the sensor, thereby reducing the risk of damage to the sensor.

[0021] In some possible implementations, multiple first solder pads are spaced apart along the edge of the sensor. This arrangement allows the multiple first solder pads 120 to prevent vibration from being transmitted from the edge of the sensor to the center of the sensor, reducing vibration and stress caused by vibration in the central area of ​​the sensor, reducing the impact of vibration and stress caused by vibration on the sensor caused by the mainboard 201, and improving the accuracy and reliability of the sensor.

[0022] In some possible implementations, the thickness of the buffer connection layer ranges from 0.1 mm to 1 mm. This configuration prevents the buffer connection layer from being too thin (e.g., greater than 0.1 mm), ensuring that the buffer connection layer effectively buffers the vibration of the motherboard and the stress caused by vibration. Furthermore, it prevents the buffer connection layer from being too thick (e.g., greater than 1 mm), thereby reducing the size of the sensor assembly and facilitating miniaturization of the sensor assembly.

[0023] In another aspect, embodiments of the present application provide a sensor assembly. The sensor assembly includes a sensor and a first pad. The sensor is at least one of a vibration-sensitive sensor and a stress-sensitive sensor. The first pad is disposed on a first surface of the sensor and is electrically connected to the sensor. The first pad includes a buffer connection layer, which includes a flexible material.

[0024] In an embodiment of the present application, a buffer connection layer is provided comprising a flexible material, so that when the sensor and the mainboard are electrically connected, the flexible material can be located between the sensor and the mainboard. In this way, when a vibration source on the mainboard drives the mainboard to vibrate, the flexible material disposed between the mainboard and the sensor can buffer the vibration of the mainboard, hindering the transmission of vibration and the stress caused by vibration to the sensor, reducing the vibration energy and stress energy received by the sensor, thereby reducing the impact of the vibration of the mainboard and the stress caused by vibration on the sensor, and improving the accuracy and reliability of the sensor. This also reduces the risk of resonance between the mainboard and the sensor, thereby reducing the risk of damage to the sensor. Furthermore, by using the flexible material to buffer the vibration of the mainboard, there is no need to change the location of the sensor on the mainboard, thereby increasing the flexibility of the placement of the sensor and other components on the mainboard.

[0025] In some possible implementations, the first pad further includes a first pad body. At least a portion of the first pad body is located between the sensor and the buffer connection layer and is electrically connected to the sensor and the buffer connection layer. This arrangement can improve the convenience of electrical connection between the buffer connection layer and the sensor.

[0026] In some possible implementations, the sensor assembly further includes a second solder pad electrically connected to the sensor. The ratio of the number of first solder pads to the sum of the number of first and second solder pads is greater than or equal to 30%. This configuration can avoid having too few first solder pads, improve the buffering effect of the buffer connection layer of the first solder pads against vibrations of the motherboard and the stress caused by vibrations, and thus reduce the impact of vibrations of the motherboard and the stress caused by vibrations on the sensor.

[0027] In some possible implementations, the first pad is closer to the vibration source on the motherboard than the second pad. This arrangement can enhance the buffering effect of the first pad's buffer connection layer on motherboard vibration and the stress caused by vibration, thereby reducing the impact of motherboard vibration and the stress caused by vibration on the sensor, improving the accuracy and reliability of the sensor, and reducing the risk of resonance between the motherboard and the sensor, thereby reducing the risk of sensor damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of the structure of a sensor assembly and a mainboard provided in an embodiment of the present application;

[0030] Figure 3 A schematic diagram of the structure of another sensor assembly and mainboard provided in an embodiment of the present application;

[0031] Figure 4for Figure 3 A schematic cross-sectional view of the sensor assembly along the A1-A1 direction in some embodiments;

[0032] Figure 5 for Figure 3 A schematic cross-sectional view of the sensor assembly along the A1-A1 direction in some other embodiments;

[0033] Figure 6 for Figure 3 A schematic cross-sectional view of the sensor assembly along the A1-A1 direction in some further embodiments;

[0034] Figure 7 for Figure 3 A schematic cross-sectional view of the sensor assembly along the A1-A1 direction in some further embodiments;

[0035] Figure 8 for Figure 3 A schematic cross-sectional view of the sensor assembly along the A1-A1 direction in some further embodiments;

[0036] Figure 9 A top view of a flexible insulating material and a conductive portion provided in an embodiment of the present application;

[0037] Figure 10 A top view of another flexible insulating material and a conductive portion provided in an embodiment of the present application;

[0038] Figure 11 A top view of another flexible insulating material and a conductive portion provided in an embodiment of the present application;

[0039] Figure 12 A top view of a flexible insulating material provided in an embodiment of the present application;

[0040] Figure 13 A top view of another flexible insulating material provided in an embodiment of the present application;

[0041] Figure 14 A top view of another flexible insulating material and a conductive portion provided in an embodiment of the present application;

[0042] Figure 15 A top view of another flexible insulating material and a conductive portion provided in an embodiment of the present application;

[0043] Figure 16 A schematic diagram of the positional relationship between a buffer connection layer and a first pad body provided in an embodiment of the present application;

[0044] Figure 17 A schematic diagram of the positional relationship between a first solder pad and a second solder pad provided in an embodiment of the present application;

[0045] Figure 18 A schematic diagram of the positional relationship between another first solder pad and a second solder pad provided in an embodiment of the present application;

[0046] Figure 19 A schematic diagram of the position of a first solder pad provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0048] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0049] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0050] As used herein, "perpendicular" and "parallel" include the stated conditions and conditions similar to the stated conditions, within an acceptable range of deviations, as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "perpendicular" includes both absolutely perpendicular and approximately perpendicular, where the acceptable range of deviation for approximately perpendicular may be 5%.

[0051] Figure 1 A schematic structural diagram of an electronic device 200 provided in an embodiment of the present application. Figure 2 A schematic structural diagram of a sensor assembly 100 and a mainboard 201 provided in an embodiment of the present application.

[0052] like Figure 1 As shown, an embodiment of the present application provides an electronic device 200. For example, the electronic device 200 can be a terminal device such as a mobile phone, a tablet computer, or a laptop computer. Alternatively, the electronic device 200 can be a terminal device such as an earphone, a smart bracelet, or a smart watch. The embodiment of the present application does not further limit the type of the electronic device 200.

[0053] In some examples, such as Figure 2 As shown, the electronic device 200 may include a sensor component 100 and a mainboard 201, and the sensor component 100 is electrically connected to the mainboard 201. For example, Figure 1 As shown, the electronic device 200 may further include a housing 202 , and the sensor assembly 100 and the mainboard 201 are both disposed in a receiving space enclosed by the housing 202 , so that the housing 202 can protect the sensor assembly 100 and the mainboard 201 .

[0054] The mainboard 201 may be a printed circuit board (PCB). The number of sensor assemblies 100 may be one or more. When there are multiple sensor assemblies 100, the multiple sensor assemblies 100 may be spaced apart on the mainboard 201. The multiple sensor assemblies 100 may be of the same or different types.

[0055] For example, the electronic device 200 may further include a processor, such as a central processing unit (CPU) or a graphics processing unit (GPU). The processor is electrically connected to the motherboard 201. In this way, the information detected by the sensor assembly 100 can be transmitted to the processor via the motherboard 201. It is understood that other components (not shown in the figure) are also electrically connected to the motherboard 201, such as capacitors, radio frequency chips, etc.

[0056] Figure 3 This is a schematic diagram of the structure of another sensor assembly 100 and mainboard 201 provided in an embodiment of the present application. In some examples, such as Figure 3 As shown, the sensor assembly 100 includes a sensor 110 and a first pad 120. The sensor 110 may be at least one of a vibration sensitive sensor and a stress sensitive sensor.

[0057] It is understood that a vibration-sensitive sensor refers to a sensor that is sensitive to vibration. In one embodiment, the vibration-sensitive sensor is capable of converting vibrations experienced by the sensor into electrical signals. In one embodiment, the vibrations experienced by the sensor affect the electrical signals it converts. For example, the vibration-sensitive sensor may be a vibration sensor, an accelerometer, a gyroscope, or the like.

[0058] A stress-sensitive sensor is a sensor that is sensitive to stress or pressure. In one embodiment, the stress-sensitive sensor can convert the stress or pressure it experiences into an electrical signal. In one embodiment, the stress or pressure experienced by the stress-sensitive sensor affects the electrical signal it converts. For example, the stress-sensitive sensor can be a stress sensor, an accelerometer, a gyroscope, or the like.

[0059] For example, the sensor 110 may include at least one of an accelerometer and a gyroscope. For example, the sensor 110 may be an accelerometer, or the sensor 110 may be a gyroscope, or the sensor 110 may be an a+g (accelerometer+gyroscope, accelerometer and gyroscope two-in-one) sensor.

[0060] Taking sensor 110 as an A+G sensor, for example, the A+G sensor can include multiple movable grid plates made using micro-electromechanical system (MEMS) technology. During use of electronic device 200, the A+G sensor can calculate at least one of acceleration and angular velocity based on the position changes of the grid plates. By performing an algorithmic calculation on at least one of acceleration and angular velocity, electronic device 200 can implement common functions such as step counting, behavioral state recognition (e.g., identifying motion states), and automatic screen rotation. However, because the grid plates are movable, the A+G sensor is very sensitive to vibration and stress.

[0061] Figure 4 for Figure 3 FIG. 1 is a schematic cross-sectional view of the sensor assembly 100 along direction A1-A1 in some embodiments.

[0062] In some examples, such as Figure 4As described above, the first solder pad 120 is disposed on the first surface P1 of the sensor 110 and is electrically connected to the sensor 110. For example, the first surface P1 of the sensor 110 is the surface of the sensor 110 that is closest to the mainboard 201 when the sensor 110 is electrically connected to the mainboard 201. The sensor 110 is electrically connected to the mainboard 201 via the first solder pad 120. It is understood that the first solder pad 120 is located between the first surface P1 of the sensor 110 and the mainboard 201, and electrically connects the sensor 110 and the mainboard 201.

[0063] In some embodiments, some components on the mainboard 201 (such as capacitors or radio frequency chips) may exert a force on the mainboard 201 under the action of electromagnetic induction during operation, causing the mainboard 201 to vibrate. For example, these components may be referred to as vibration sources of the mainboard 201. One or more vibration sources may be provided on the mainboard 201. The vibration of the mainboard 201 may be transmitted to the sensor 110, affecting the operation of the sensor 110 and thereby affecting the accuracy and reliability of the sensor 110. Furthermore, when resonance occurs between the mainboard 201 and the sensor 110, the sensor 110 may be easily damaged.

[0064] In the related art, the sensor 110 can be placed away from the vibration source of the mainboard 201 (such as a capacitor or radio frequency chip) to reduce the impact of the vibration source of the mainboard 201 on the sensor 110. However, there are many vibration sources on the mainboard 201, and the space on the mainboard 201 is limited. As a result, the distance between the sensor 110 and the vibration source of the mainboard 201 is limited, affecting the accuracy and reliability of the sensor 110.

[0065] Alternatively, the sensor 110 can be placed near a screw hole on the mainboard 201, with bolts passing through the screw holes to connect the mainboard 201 to the housing 202 of the electronic device 200 (e.g., the middle frame of the housing 202). This reduces vibration near the screw hole on the mainboard 201, thereby reducing the impact of the vibration source of the mainboard 201 on the sensor 110. However, the sensor 110 is generally tall, while the space near the screw hole on the mainboard 201 is small. Placing the sensor 110 near the screw hole on the mainboard 201 will affect the placement of other components.

[0066] Figure 5 for Figure 3 Schematic cross-sectional view of the sensor assembly 100 along the A1-A1 direction in some other embodiments. Figure 6 for Figure 3 Schematic cross-sectional view of the sensor assembly 100 along the A1-A1 direction in some further embodiments. Figure 7 for Figure 3 Schematic cross-sectional view of the sensor assembly 100 along the A1-A1 direction in some further embodiments. Figure 8 for Figure 3 Schematic cross-sectional view of the sensor assembly 100 along the A1-A1 direction in some further embodiments.

[0067] Based on this, Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, in the sensor component 100 provided by the embodiment of the present application, the first pad 120 includes a cushion pad 121 , and the cushion pad 121 includes a flexible material.

[0068] For example, the flexible material can be a soft material capable of buffering or absorbing vibrations. The buffer connection layer 121 includes a flexible material so that when the sensor 110 and the mainboard 201 are connected, the flexible material can be positioned between the sensor 110 and the mainboard 201. This allows the flexible material to buffer the vibrations of the mainboard 201 when a vibration source on the mainboard 201 causes the mainboard 201 to vibrate. This prevents the vibrations and the resulting stress from being transmitted to the sensor 110, reducing the vibration energy and stress energy received by the sensor 110. This reduces the impact of the vibrations and the resulting stress from the mainboard 201 on the sensor 110, thereby improving the accuracy and reliability of the sensor 110. This also reduces the risk of resonance between the mainboard 201 and the sensor 110, thereby reducing the risk of damage to the sensor 110. Furthermore, by using the flexible material to buffer the vibrations of the mainboard 201, the sensor 110's placement on the mainboard 201 does not need to be changed, thereby increasing the flexibility of positioning the sensor 110 and other components on the mainboard 201.

[0069] It can be understood that the sensor 110 may include at least one of an accelerometer or a gyroscope, thereby reducing the impact of the vibration of the mainboard 201 and the stress caused by the vibration on at least one of the accelerometer or the gyroscope, improving the accuracy and reliability of at least one of the accelerometer or the gyroscope, and reducing the risk of resonance between at least one of the accelerometer or the gyroscope and the mainboard, thereby reducing the risk of damage to at least one of the accelerometer or the gyroscope.

[0070] For example, Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, the flexible material may be in contact with and fit the first surface P1 of the sensor 110 , and the flexible material may be in contact with and fit the surface of the mainboard 201 close to the sensor 110 , so as to improve the vibration buffering effect of the flexible material.

[0071] In some examples, such as Figure 6As shown, the flexible material may be a flexible conductive material 1211, which is electrically connected to the sensor 110. For example, the flexible conductive material 1211 and the sensor 110 may be directly electrically connected, or indirectly electrically connected via other components (e.g., the first pad body 122). It is understood that the sensor 110 can be electrically connected to the mainboard 201 via the flexible conductive material 1211.

[0072] It can be understood that when the flexible material is a flexible conductive material 1211 , the buffer connection layer 121 can play the role of conduction and buffering, which simplifies the structure of the buffer connection layer 121 and facilitates the miniaturization of the sensor assembly 100 .

[0073] For example, the flexible conductive material 1211 may include at least one of conductive rubber and conductive polymer, which increases the flexibility in material selection of the flexible conductive material 1211. It is understandable that the flexible conductive material 1211 may also include other conductive materials.

[0074] In other examples, such as Figure 8 As shown, the flexible material may be a flexible insulating material 1212. It is understood that the flexible insulating material 1212 is insulating, and the sensor 110 cannot be electrically connected to the mainboard 201 through the flexible insulating material 1212. In this case, the buffer connection layer 121 may further include a conductive portion 1213, which is electrically connected to the sensor 110.

[0075] For example, the conductive portion 1213 and the sensor 110 may be directly electrically connected, or indirectly electrically connected via other components (eg, the first pad body 122 ). It is understood that the sensor 110 can be electrically connected to the mainboard 201 via the conductive portion 1213 .

[0076] It can be understood that by providing the conductive portion 1213, electrical signals can be transmitted between the sensor 110 and the mainboard 201 through the conductive portion 1213, thereby reducing the impact of the flexible insulating material 1212 on the electrical connection between the sensor 110 and the mainboard 201. For example, the conductive portion 1213 can be a wire, or the conductive portion 1213 can also be a conductive metal such as solder.

[0077] Figure 9 A top view of a flexible insulating material 1212 and a conductive portion 1213 provided in an embodiment of the present application. Figure 10 A top view of another flexible insulating material 1212 and a conductive portion 1213 provided in an embodiment of the present application. Figure 11 A top view of another flexible insulating material 1212 and a conductive portion 1213 provided in an embodiment of the present application.

[0078] In some examples, such as Figure 9 and Figure 10 As shown, the conductive portion 1213 may be located on the outer periphery of the flexible insulating material 1212 and surround at least a portion of the flexible insulating material 1212. For example, Figure 11 As shown, there may be a plurality of conductive portions 1213 , which are arranged at intervals and surround at least a portion of the flexible insulating material 1212 .

[0079] Providing the conductive portion 1213 to surround at least a portion of the flexible insulating material 1212 can reduce the impact of the conductive portion 1213 on the flexible insulating material 1212, compared to arranging the conductive portion 1213 to be embedded in the flexible insulating material 1212, thereby ensuring that the flexible insulating material 1212 has a buffering effect on the vibration of the mainboard 201 and the stress caused by the vibration, thereby reducing the impact of the vibration of the mainboard 201 on the sensor.

[0080] Figure 12 A top view of a flexible insulating material 1212 provided in an embodiment of the present application. Figure 13 A top view of another flexible insulating material 1212 provided in an embodiment of the present application. Figure 14 A top view of another flexible insulating material 1212 and a conductive portion 1213 provided in an embodiment of the present application. Figure 15 A top view of another flexible insulating material 1212 and a conductive portion 1213 provided in an embodiment of the present application.

[0081] In some embodiments, as Figure 12 and Figure 13 As shown, the flexible insulating material 1212 may be provided with a connecting groove 1214 , and the connecting groove 1214 may penetrate the flexible insulating material 1212 along the thickness direction Z of the flexible insulating material 1212 .

[0082] For example, Figure 12 As shown, the connection groove 1214 can be opened on the outer peripheral side of the flexible insulating material 1212, or, as shown in FIG. Figure 13 As shown, the connection groove 1214 can also be opened in the middle area away from the edge of the flexible insulating material 1212. It can be understood that there can be multiple connection grooves 1214, and the multiple connection grooves 1214 can be arranged at intervals.

[0083] like Figure 14 and Figure 15 As shown, at least a portion of the conductive portion 1213 is embedded in the connecting groove 1214 . Exemplarily, the number of the connecting grooves 1214 is the same as the number of the conductive portions 1213 , and one conductive portion 1213 is embedded in one connecting groove 1214 .

[0084] It can be understood that at least a portion of the conductive portion 1213 is embedded in the connecting groove 1214 so that the conductive portion 1213 does not need to occupy additional space, which is conducive to the miniaturization of the sensor assembly 100.

[0085] For example, the flexible insulating material 1212 includes at least one of FR-4 and resin. This configuration can improve the flexibility of material selection for the flexible insulating material 1212. For example, FR-4 can include fiberglass cloth and epoxy resin.

[0086] In some examples, such as Figure 6 、 Figure 7 and Figure 8 As shown, the first pad 120 further includes a first pad body 122. At least a portion of the first pad body 122 is located between the sensor 110 and the buffer connection layer 121, and is electrically connected to the sensor 110 and the buffer connection layer 121.

[0087] For example, Figure 6 As described above, the first pad body 122 may be located only between the sensor 110 and the buffer connection layer 121, or Figure 7 and Figure 8 As shown, the first pad body 122 may also be located between the sensor 110 and the buffer connection layer 121 , and between the buffer connection layer 121 and the mainboard 201 .

[0088] The first pad body 122 may be electrically connected to a pin of the sensor 110. For example, the first pad body 122 may be made of metal, such as gold, silver, copper, or tin, so that the first pad body 122 is conductive.

[0089] At least a portion of the first pad body 122 is located between the sensor 110 and the buffer connection layer 121 and is electrically connected to the sensor 110 and the buffer connection layer 121 , which can improve convenience in electrical connection between the buffer connection layer 121 and the sensor 110 .

[0090] In some embodiments, the orthographic projections of the buffer connection layer 121 and the first pad body 122 in the thickness direction of the mainboard 201 at least partially overlap.

[0091] In some examples, such as Figure 7 and Figure 8 As shown, the first pad body 122 includes a first sub-pad 1221 and a second sub-pad 1222. The first sub-pad 1221 is located between the sensor 110 and the buffer connection layer 121 and is electrically connected to the sensor 110 and the buffer connection layer 121. The second sub-pad 1222 is located on a side of the buffer connection layer 121 away from the sensor 110 and is electrically connected to the buffer connection layer 121.

[0092] It is understood that the material and shape of the first sub-pad 1221 can be the same as or different from the material and shape of the second sub-pad 1222. The first sub-pad 1221 is positioned between the sensor 110 and the buffer connection layer 121 and is electrically connected to the sensor 110 and the buffer connection layer 121, thereby improving the convenience of the electrical connection between the sensor 110 and the buffer connection layer 121. For example, when the flexible material is a flexible conductive material 1211, the first sub-pad 1221 can be electrically connected to the flexible conductive material 1211. When the flexible material is a flexible insulating material 1212 and a conductive portion 1213, the first sub-pad 1221 can be electrically connected to the conductive portion 1213.

[0093] The second sub-pad 1222 is located on a side of the buffer connection layer 121 away from the sensor 110 and is electrically connected to the buffer connection layer 121. This allows the buffer connection layer 121 to be electrically connected to the mainboard 201 via the second sub-pad 1222, thereby improving the convenience of the electrical connection between the buffer connection layer 121 and the mainboard 201. For example, when the flexible material is a flexible conductive material 1211, the second sub-pad 1222 can be electrically connected to the flexible conductive material 1211. When the flexible material is a flexible insulating material 1212 and a conductive portion 1213, the second sub-pad 1222 can be electrically connected to the conductive portion 1213.

[0094] In some examples, at least one of the first sub-pad 1221 and the second sub-pad 1222 is a rectangular parallelepiped. This configuration can improve the convenience of electrically connecting the first sub-pad 1221 to the sensor 110 and the buffer connection layer 121, and improve the convenience of electrically connecting the second sub-pad 1222 to the buffer connection layer 121 and the mainboard 201.

[0095] For example, the first sub-pad 1221 and the second sub-pad 1222 may also be in other shapes, such as cylindrical, polygonal, or other irregular shapes. The shapes of the first sub-pad 1221 and the second sub-pad 1222 may be the same or different.

[0096] Figure 16 A schematic diagram of the positional relationship between a buffer connection layer 121 and a first pad body 122 provided in an embodiment of the present application.

[0097] In some examples, such as Figure 16 As shown, the ratio of the orthographic projection area of ​​the buffer connection layer 121 on the reference plane to the orthographic projection area of ​​the first pad body 122 on the reference plane is greater than or equal to 50%. The reference plane is perpendicular to the thickness direction Z of the buffer connection layer 121.

[0098] It can be understood that the reference plane is a virtual plane perpendicular to the thickness direction Z of the buffer connection layer 121. When the pad body 122 includes a first sub-pad 1221 and a second sub-pad 1222, the area of ​​the orthographic projection of the first sub-pad 1221 on the reference plane and the area of ​​the orthographic projection of the second sub-pad 1222 on the reference plane can coincide with or partially overlap. For example, the area of ​​the orthographic projection of the first pad body 122 on the reference plane is the closed shape enclosed by the orthographic projections of the first sub-pad 1221 and the second sub-pad 1222 on the reference plane.

[0099] Setting the ratio of the area of ​​the orthographic projection of the buffer connection layer 121 on the reference surface to the area of ​​the orthographic projection of the first pad body 122 on the reference surface to be greater than or equal to 50% can prevent the ratio from being too small, thereby ensuring that the buffer connection layer 121 buffers the vibration of the mainboard 201 and the stress caused by the vibration, thereby reducing the impact of the vibration of the mainboard 201 and the stress caused by the vibration on the sensor 1110. For example, the ratio of the area of ​​the orthographic projection of the buffer connection layer 121 on the reference surface to the area of ​​the orthographic projection of the first pad body 122 on the reference surface can be 70%, 80%, or 100%.

[0100] In some examples, the ratio of the area of ​​the orthographic projection of the flexible material in the buffer connection layer 121 on the reference surface to the area of ​​the orthographic projection of the first pad body 122 on the reference surface is greater than or equal to 50%. For example, the ratio of the area of ​​the orthographic projection of the flexible material in the buffer connection layer 121 on the reference surface to the area of ​​the orthographic projection of the first pad body 122 on the reference surface can be 70%, 80% or 100%, etc.

[0101] Figure 17 A schematic diagram of the positional relationship between a first solder pad 120 and a second solder pad 130 provided in an embodiment of the present application. Figure 18 A schematic diagram of the positional relationship between another first solder pad 120 and a second solder pad 130 provided in an embodiment of the present application. Figure 19 A schematic diagram of the position of a first solder pad 120 provided in an embodiment of the present application.

[0102] In some examples, such as Figure 17 and Figure 18 As shown, the sensor assembly 100 further includes a second pad 130 electrically connected to the sensor 110. The ratio of the number of first pads 120 to the sum of the number of first pads 120 and second pads 130 is greater than or equal to 30%.

[0103] For example, the second pad 130 may include only a conductive metal and not include the buffer connection layer 121 .

[0104] It is understandable that there are multiple first pads 120 and multiple second pads 130. Setting the ratio of the number of first pads 120 to the sum of the number of first pads 120 and second pads 130 to be greater than or equal to 30% can prevent the number of first pads 120 from being too small, improve the buffering effect of the buffer connection layer 121 of the first pads 120 on the vibration of the mainboard 201 and the stress caused by the vibration, and thus reduce the impact of the vibration of the mainboard 201 and the stress caused by the vibration on the sensor 110.

[0105] For example, the ratio of the number of the first pads 120 to the sum of the number of the first pads 120 and the number of the second pads 130 may be 35%, 40%, or 45%.

[0106] In some examples, the ratio of the number of first pads 120 to the sum of the number of first pads 120 and second pads 130 is greater than or equal to 50%. This can prevent the number of first pads 120 from being too small, improve the buffering effect of the buffer connection layer 121 of the first pads 120 on the vibration of the mainboard 201 and the stress caused by the vibration, and thus reduce the impact of the vibration of the mainboard 201 and the stress caused by the vibration on the sensor 110.

[0107] For example, the ratio of the number of the first pads 120 to the sum of the number of the first pads 120 and the number of the second pads 130 may be 65%, 80%, or 100%.

[0108] It can be understood that when the ratio of the number of the first pads 120 to the sum of the number of the first pads 120 and the second pads 130 is 100%, as shown in FIG. Figure 19 As shown, the sensor assembly 100 includes only the first pad 120 and does not include the second pad 130 .

[0109] In some examples, the first solder pad 120 is closer to the vibration source on the mainboard 201 than the second solder pad 130 .

[0110] For example, the vibration source on the mainboard 201 may be located on one side of the sensor 110 along the first sub-direction X1. Figure 17 As shown, the first solder pad 120 is located on one side of the second solder pad 130 along the first sub-direction X1. Alternatively, the vibration source on the mainboard 201 can be located on one side of the sensor 110 along the second sub-direction X2. In this case, the first solder pad 120 is located on one side of the second solder pad 130 along the second sub-direction X2. The second sub-direction X2 is opposite to the first sub-direction X1.

[0111] Arranging the first solder pad 120 closer to the vibration source on the mainboard 201 relative to the second solder pad 130 can improve the buffering effect of the buffer connection layer 121 of the first solder pad 120 on the vibration of the mainboard 201 and the stress caused by the vibration, reduce the impact of the vibration of the mainboard 201 and the stress caused by the vibration on the sensor 110, improve the accuracy and reliability of the sensor 110, and reduce the risk of resonance between the mainboard 201 and the sensor 110, thereby reducing the risk of damage to the sensor 110.

[0112] In other examples, such as Figure 18 As shown, the first pads 120 and the second pads 130 are alternately arranged. This allows the first pads 120 to be evenly distributed, improving the buffering effect of the buffer connection layer 121 of the first pads 120 on the vibration and stress caused by the vibration at different positions of the mainboard 201, reducing the impact of the vibration and stress caused by the vibration of the mainboard 201 on the sensor 110, improving the accuracy and reliability of the sensor 110, and reducing the risk of resonance between the mainboard 201 and the sensor 110, thereby reducing the risk of damage to the sensor 110.

[0113] In some examples, such as Figure 18 As shown, the first surface P1 of the sensor 110 has a center line Q, which passes through the center of the first surface P1 and divides the first surface P1 of the sensor 110 into a first area and a second area.

[0114] It can be understood that the center line Q1 is a virtual straight line passing through the center of the first surface P1 and extending in any direction. Figure 18 As shown, the centerline Q can extend along the first direction X (including the first sub-direction X1 and the second sub-direction X2). In this case, the first surface P1 of the sensor 110 can be divided by the centerline Q into a first area and a second area arranged along the second direction Y. Alternatively, the centerline Q can also extend along the second direction Y. In this case, the first surface P1 of the sensor 110 can be divided by the centerline Q into a first area and a second area arranged along the first direction X. Alternatively, the centerline Q can also extend in a direction other than the first direction X and the second direction Y. The embodiments of the present application do not further limit the extending direction of the centerline Q.

[0115] The second direction Y intersects the first direction X. For example, the second direction Y is perpendicular to the first direction X. The thickness direction Z of the buffer connection layer 121 intersects the plane where the first direction X and the second direction Y are located. For example, the buffer connection layer 121 is perpendicular to the plane where the first direction X and the second direction Y are located.

[0116] There are multiple first solder pads 120, and the multiple first solder pads 120 are located in the first area and the second area. This allows the multiple first solder pads 120 to be distributed at different locations on the first surface P1, thereby improving the buffering effect of the buffer connection layer 121 of the first solder pads 120 on vibrations and stress caused by vibrations at different locations on the mainboard 201. This reduces the impact of vibrations and stress caused by vibrations on the sensor 110 from the mainboard 201, improves the accuracy and reliability of the sensor 110, and reduces the risk of resonance between the mainboard 201 and the sensor 110, thereby reducing the risk of damage to the sensor 110.

[0117] In some examples, the first pad 120 located in the first region and the first pad 120 located in the second region may be symmetrical about the center line Q.

[0118] In some examples, such as Figure 19 As shown, multiple first solder pads 120 are spaced apart along the edge of the sensor 110. This arrangement allows the multiple first solder pads 120 to prevent vibration from being transmitted from the edge of the sensor 110 to the center of the sensor 110, reducing the vibration and stress caused by the vibration in the central area of ​​the sensor 110, reducing the impact of the vibration of the mainboard 201 and the stress caused by the vibration on the sensor 110, and improving the accuracy and reliability of the sensor 110.

[0119] In some examples, the thickness of the buffer connection layer 121 ranges from 0.1 mm to 1 mm.

[0120] This configuration prevents the buffer connection layer 121 from being too thin (e.g., greater than 0.1 mm), ensuring that the buffer connection layer 121 effectively buffers the vibration of the mainboard 201 and the stress caused by vibration. Furthermore, it prevents the buffer connection layer 121 from being too thick (e.g., greater than 1 mm), thereby reducing the size of the sensor assembly 100 and facilitating miniaturization of the sensor assembly 100.

[0121] For example, the thickness of the buffer connection layer 121 may be 0.3 mm, 0.5 mm, or 0.8 mm, etc. The embodiment of the present application does not further limit the value of the thickness of the buffer connection layer 121 .

[0122] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An electronic device (200), characterized in that The invention comprises a sensor assembly (100) and a main board (201); the sensor assembly (100) comprises: A sensor (110), wherein the sensor (110) is at least one of a vibration-sensitive sensor and a stress-sensitive sensor; A first pad (120) is provided on a first surface (P1) of the sensor (110) and is electrically connected to the sensor (110); the first pad (120) includes a buffer connection layer (121), and the buffer connection layer (121) includes a flexible material; The sensor (110) is electrically connected to the mainboard (201) via the first solder pad (120).

2. The electronic device (200) according to claim 1, characterized in that The sensor (110) includes at least one of an accelerometer or a gyroscope.

3. The electronic device (200) according to claim 2, characterized in that The flexible material is a flexible conductive material (1211); the flexible conductive material (1211) is electrically connected to the sensor (110).

4. The electronic device (200) according to claim 3, characterized in that The flexible conductive material (1211) includes at least one of conductive rubber and conductive polymer.

5. The electronic device (200) according to claim 2, characterized in that The flexible material is a flexible insulating material (1212); the buffer connection layer (121) further includes a conductive portion (1213), and the conductive portion (1213) is electrically connected to the sensor (110).

6. The electronic device (200) according to claim 5, characterized in that The conductive portion (1213) is located on the outer periphery of the flexible insulating material (1212) and surrounds at least a portion of the flexible insulating material (1212).

7. The electronic device (200) according to claim 5, characterized in that The flexible insulating material (1212) is provided with a connecting groove (1214), and the connecting groove (1214) penetrates the flexible insulating material (1212) along the thickness direction (Z) of the flexible insulating material (1212); at least a portion of the conductive portion (1213) is embedded in the connecting groove (1214).

8. The electronic device (200) according to claim 5, characterized in that The flexible insulating material (1212) includes at least one of FR-4 or resin.

9. The electronic device (200) according to any one of claims 1 to 8, characterized in that: The first pad (120) further includes a first pad body (122); At least a portion of the first pad body (122) is located between the sensor (110) and the buffer connection layer (121), and is electrically connected to the sensor (110) and the buffer connection layer (121).

10. The electronic device (200) according to claim 9, characterized in that The ratio of the area of ​​the orthographic projection of the buffer connection layer (121) on the reference surface to the area of ​​the orthographic projection of the first pad body (122) on the reference surface is greater than or equal to 50%; The reference plane is perpendicular to the thickness direction (Z) of the buffer connection layer (121).

11. The electronic device (200) according to claim 10, characterized in that The first pad body (122) comprises a first sub-pad (1221) and a second sub-pad (1222); The first sub-pad (1221) is located between the sensor (110) and the buffer connection layer (121), and is electrically connected to the sensor (110) and the buffer connection layer (121); The second sub-pad (1222) is located on a side of the buffer connection layer (121) away from the sensor (110), and is electrically connected to the buffer connection layer (121).

12. The electronic device (200) according to claim 11, characterized in that At least one of the first sub-pad (1221) and the second sub-pad (1222) is a rectangular parallelepiped.

13. The electronic device (200) according to any one of claims 1 to 8, characterized in that: The sensor assembly (100) further includes a second pad (130), wherein the second pad (130) is electrically connected to the sensor (110); The ratio of the number of the first pads (120) to the sum of the number of the first pads (120) and the second pads (130) is greater than or equal to 30%.

14. The electronic device (200) according to claim 13, characterized in that The ratio of the number of the first pads (120) to the sum of the number of the first pads (120) and the second pads (130) is greater than or equal to 50%.

15. The electronic device (200) according to claim 14, characterized in that The first soldering pad (120) is closer to the vibration source on the mainboard (201) than the second soldering pad (130).

16. The electronic device (200) according to claim 14, characterized in that The first pads (120) and the second pads (130) are alternately arranged.

17. The electronic device (200) according to any one of claims 1 to 8, characterized in that: The first surface (P1) of the sensor (110) has a center line (Q), the center line (Q) passes through the center of the first surface (P1) and divides the first surface (P1) of the sensor (110) into a first area and a second area; There are multiple first pads (120), and the multiple first pads (120) are located in the first area and the second area.

18. The electronic device (200) according to claim 17, characterized in that A plurality of first pads (120) are arranged at intervals along the edge of the sensor (110).

19. The electronic device (200) according to any one of claims 1 to 8, characterized in that: The thickness of the buffer connection layer (121) ranges from 0.1 mm to 1 mm.

20. A sensor assembly (100), characterized in that include: A sensor (110), wherein the sensor (110) is at least one of a vibration-sensitive sensor and a stress-sensitive sensor; A first pad (120) is provided on a first surface (P1) of the sensor (110) and is electrically connected to the sensor (110); the first pad (120) includes a buffer connection layer (121), and the buffer connection layer (121) includes a flexible material.

21. The sensor assembly (100) according to claim 20, characterized in that The first pad (120) further includes a first pad body (122); At least a portion of the first pad body (122) is located between the sensor (110) and the buffer connection layer (121), and is electrically connected to the sensor (110) and the buffer connection layer (121).

22. The sensor assembly (100) according to claim 21, characterized in that Also included is a second pad (130), wherein the second pad (130) is electrically connected to the sensor (110); The ratio of the number of the first pads (120) to the sum of the number of the first pads (120) and the second pads (130) is greater than or equal to 30%.

23. The sensor assembly (100) according to claim 22, characterized in that The first soldering pad (120) is closer to the vibration source on the mainboard (201) than the second soldering pad (130).

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