Special transformer terminal

Abstract

The utility model provides a special transformer terminal, which belongs to the technical field of special transformer terminal heat dissipation structures and comprises a processor, a heat conduction assembly, a shell and a heat conduction plate. The heat-conducting assembly contacts the processor; a containing cavity is defined by the shell, the processor and the heat conduction assembly are both contained in the containing cavity, the shell comprises a substrate, and heat dissipation holes communicating with the containing cavity are formed in the substrate; the heat conduction plate is attached to the side, away from the containing cavity, of the substrate and covers the heat dissipation holes. The heat conduction assembly penetrates through the heat dissipation holes and makes contact with the heat conduction plate. According to the special transformer terminal provided by the embodiment of the utility model, the heat conduction plate is attached to one side, deviating from the accommodating cavity, of the substrate and covers the heat dissipation holes, so that the heat of the heat conduction assembly penetrating through the heat dissipation holes can be further diffused to the surface of the shell in the direction perpendicular to the arrangement direction of the substrate and the heat conduction plate; the heat dissipation area of the special transformer terminal is further increased, and the heat dissipation capability of the special transformer terminal is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures of special transformer terminals, in particular to special transformer terminals. Background Art

[0002] In the related art, dedicated transformer terminals process collected data using a processor housed within the housing. This process generates a significant amount of heat. Existing dedicated transformer terminals typically only have a heat sink attached to the processor. This heat sink absorbs the processor's heat and then transfers it to the outside of the housing, allowing the heat to be conducted to the outside. As dedicated transformer processor specifications increase, the heat dissipation efficiency of heat sinks is limited by the size of the heat sink, making it difficult to meet the increasing heat dissipation requirements. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a dedicated terminal that can further improve the heat dissipation efficiency of the processor.

[0004] According to the first embodiment of the present invention, a dedicated terminal includes:

[0005] processor;

[0006] a heat conducting component contacting the processor;

[0007] A housing defining a housing cavity, wherein the processor and the heat conducting assembly are both housed in the housing cavity, the housing comprising a substrate, wherein the substrate is provided with a heat dissipation hole communicating with the housing cavity;

[0008] a heat conducting plate, attached to a side of the substrate facing away from the accommodating cavity and covering the heat dissipation holes;

[0009] Wherein, the heat conducting component is arranged through the heat dissipation hole and contacts the heat conducting plate.

[0010] The dedicated transformer terminal according to the embodiment of the present invention has at least the following beneficial effects: the heat-conducting component conducts the heat of the processor contained in the accommodating cavity to the heat-conducting plate attached to the side of the substrate facing away from the accommodating cavity through the heat-dissipating holes, so that the heat generated by the processor can be heat-exchanged with the external gas through the heat-conducting plate. In terms of heat dissipation structure design, the heat-conducting plate of the present invention is attached to the side of the substrate facing away from the accommodating cavity and covers the heat-dissipating holes, so that the heat of the heat-conducting component passing through the heat-dissipating holes can be further diffused to the surface of the housing in a direction perpendicular to the arrangement direction of the substrate and the heat-conducting plate. Under the premise that the size of the heat-dissipating holes can remain unchanged, the heat dissipation area of ​​the dedicated transformer terminal is further increased, thereby improving the heat dissipation capacity of the dedicated transformer terminal.

[0011] According to some embodiments of the present invention, the heat-conducting assembly includes a heat sink, which is located between the processor and the heat-conducting plate. The heat sink passes through the heat-dissipating hole and contacts the heat-conducting plate. The heat sink has a heat-dissipating surface, which contacts the surface of the processor.

[0012] According to some embodiments of the present invention, the heat conduction assembly further includes a ceramic piece, wherein the ceramic piece is located between the heat conduction plate and the heat sink, and the heat sink contacts the ceramic piece to indirectly contact the heat conduction plate.

[0013] According to some embodiments of the present invention, the heat sink is connected to a side of the substrate facing away from the heat conducting plate, and clamps the ceramic component together with the heat conducting plate.

[0014] According to some embodiments of the present invention, the heat conducting plate is detachably connected to the substrate, and the substrate has a limiting groove on a side close to the heat conducting plate, the limiting groove is connected to the heat dissipation hole, and the ceramic part is accommodated in the limiting groove and covers the heat dissipation hole; the heat conducting plate can expose the limiting groove when separated from the substrate, and the heat conducting plate can jointly limit the movement of the ceramic part together with the wall of the limiting groove when connected to the substrate.

[0015] According to some embodiments of the present invention, the heat-conducting component further includes thermal grease, and the thermal grease is arranged between the processor and the heat sink; and / or, the thermal grease is arranged between the heat sink and the ceramic component; and / or, the thermal grease is arranged between the ceramic component and the heat-conducting plate.

[0016] According to some embodiments of the present invention, the dedicated transformer terminal also includes a circuit board and a shielding cover, the processor is arranged on the circuit board, the shielding cover is connected to the circuit board and together with the circuit board, encloses the processor; the heat-conducting component also includes thermal grease, the thermal grease is arranged between the processor and the shielding cover, and the heat sink contacts the shielding cover to indirectly contact the processor.

[0017] According to some embodiments of the present invention, the dedicated transformer terminal further includes a connecting portion, one end of which is connected to the edge of the heat conducting plate, and the other end protrudes toward the substrate relative to the heat conducting plate and is connected to the edge of the substrate.

[0018] According to some embodiments of the present invention, a groove is provided on a side of the heat conducting plate facing away from the base plate.

[0019] According to some embodiments of the present invention, the heat conducting plate has a plurality of grooves, and each groove extends in the same direction.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 This is an overall schematic diagram of a dedicated terminal according to some embodiments of the present invention;

[0023] Figure 2 for Figure 1 Explosion diagram of the technical secondary school transformer terminal;

[0024] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0025] Figure 4 for Figure 2 A partial enlarged view of point B in the middle;

[0026] Figure 5 for Figure 1 Schematic cross-sectional view in ;

[0027] Figure 6 for Figure 5 A partial enlarged view of point C in the middle;

[0028] Figure 7 for Figure 5 A partial enlarged view of point D in the middle.

[0029] Reference numerals:

[0030] Special transformer terminal 10;

[0031] Processor 100;

[0032] Thermal conductive component 200, heat sink 210, heat dissipation surface 211, ceramic component 220, thermal conductive silicone grease 230;

[0033] Housing 300, accommodating cavity 310, base plate 320, heat dissipation holes 321, limiting grooves 322, front housing 330;

[0034] Heat conducting plate 400, groove 410;

[0035] Circuit board 500;

[0036] Shielding cover 600;

[0037] Connecting portion 700. DETAILED DESCRIPTION

[0038] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0039] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0040] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0042] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0043] In the related art, the dedicated transformer terminal 10 is capable of collecting the user's electricity consumption information and processing the collected data through the processor 100 arranged inside the shell. After the processing is completed, the processed data can be directly displayed on the control interface of the dedicated transformer terminal 10, or transmitted to other modules in the form of signal transmission. The processor 100 generates a large amount of heat when processing the collected data. The accumulation of heat in the dedicated transformer terminal 10 will affect the operating efficiency of the processor 100 and affect the electrical performance on the collection terminal. When the heat accumulates to a certain extent, it may even cause extreme situations such as desoldering and burning of the processor 100 in the dedicated transformer terminal 10, thereby affecting other modules connected to the dedicated transformer terminal 10.

[0044] In order to reduce heat accumulation, the existing dedicated terminal 10 is usually only provided with a radiator on the processor 100. The radiator absorbs the heat of the processor 100 and then conducts the heat to the outside of the shell, so that the heat on the radiator can be exchanged with the outside air, thereby reducing the heat accumulated in the dedicated terminal 10. In order to enable the radiator to exchange with the outside air, the shell used to protect the processor 100 needs to be provided with a heat dissipation hole 321 for allowing the radiator to extend to the outside of the shell. As the specifications of the processor 100 are improved, if the heat dissipation capacity needs to be further enhanced, the size of the radiator needs to be further increased. The size of the heat dissipation hole 321 will increase with the increase in the size of the radiator, which will cause the shell structural strength of the dedicated terminal 10 to decrease.

[0045] In view of this, please refer to Figure 1 、 Figure 2 、 Figure 5 As shown, the present invention proposes a dedicated terminal 10 , which includes a processor 100 , a heat-conducting component 200 , a housing 300 and a heat-conducting plate 400 .

[0046] The heat conducting component 200 of the present invention is in contact with the processor 100 , so that the heat generated by the processor 100 can be conducted to the heat conducting component 200 , thereby reducing the temperature of the processor 100 and extending the working time of the processor 100 in a low temperature state.

[0047] Please refer to Figure 1 、 Figure 5 As shown, Figure 1 and Figure 5The complete structure of the housing 300 is not shown. The housing 300 of the present invention defines a housing cavity 310, in which the processor 100 and the thermally conductive component 200 are both accommodated. The housing 300 protects the processor 100 and the thermally conductive component 200 accommodated in the housing cavity 310, preventing them from being exposed to the external environment, thereby protecting them from direct external impacts, and reducing the possibility of external static electricity affecting the processor 100.

[0048] Without departing from the inventive concept of the present invention, those skilled in the art can design the structure of the housing 300 to form a receiving cavity 310 for receiving the processor 100 and the heat conducting assembly 200. Figure 1 、 Figure 2 、 Figure 5 As shown, Figure 1 、 Figure 2 、 Figure 5 The rear shell is not shown. In some embodiments, the housing 300 includes a front shell 330 and a rear shell. The front shell 330 and the rear shell are detachably connected and together define a receiving cavity 310 .

[0049] Please refer to Figure 1 、 Figure 2 and Figure 4 As shown, the housing 300 of the present invention includes a base plate 320, which is provided with a heat dissipation hole 321 that communicates with the accommodating cavity 310. A heat conducting plate 400 is attached to the side of the base plate 320 facing away from the accommodating cavity 310 and covers the heat dissipation hole 321. The heat conducting plate 400, covering the heat dissipation hole 321, can seal the accommodating cavity 310, preventing external dust or other impurities from entering the accommodating cavity 310 through the heat dissipation hole 321, thereby ensuring the stable operation of the processor 100.

[0050] The heat conducting assembly 200 of the present invention is disposed through the heat dissipation hole 321 and contacts the heat conducting plate 400. The heat conducting assembly 200, which has absorbed heat from the processor 100, can further transfer heat to the heat conducting plate 400. Since the heat conducting plate 400 is attached to the side of the substrate 320 facing away from the accommodating cavity 310, after receiving the heat conducted by the heat conducting assembly 200, the heat conducting plate 400 can also exchange heat with the outside air, ultimately allowing the heat of the processor 100 to be continuously conducted to the outside world, achieving the discharge of heat from the processor 100 to the outside world and reducing the accumulation of heat in the dedicated terminal 10.

[0051] Without departing from the inventive concept of the present invention, those skilled in the art may determine the material of the heat conducting plate 400 of the present invention according to actual needs. In some embodiments, the heat conducting plate 400 may be made of graphite, ceramic materials, or common metals such as copper, iron, etc. In some embodiments, the heat conducting plate 400 may be made of a heat conducting material having a thermal conductivity coefficient of not less than 96W / (m·K). As a preferred embodiment, the heat conducting plate 400 is made of cast aluminum material. Compared with other materials, cast aluminum has strong thermal conductivity and is easy to process, which is more conducive to reducing the manufacturing cost of the dedicated transformer terminal 10.

[0052] On the other hand, in terms of heat dissipation structure design, the heat conducting plate 400 of the present invention is attached to the side of the substrate 320 away from the accommodating cavity 310 and covers the heat dissipation hole 321, so that the heat of the heat conducting component 200 passing through the heat dissipation hole 321 can be further diffused to the surface of the housing 300 in a direction perpendicular to the arrangement direction of the substrate 320 and the heat conducting plate 400. Under the premise that the size of the heat dissipation hole 321 can remain unchanged, the heat dissipation area of ​​the dedicated transformer terminal 10 is further increased, thereby improving the heat dissipation capacity of the dedicated transformer terminal 10. Based on the inventive concept of the present invention, since the size of the heat dissipation hole 321 can remain unchanged when those skilled in the art adjust the heat dissipation capacity of the dedicated transformer terminal 10, the structural strength of the housing 300 will not decrease due to the increase in heat dissipation capacity, and the structural stability of the dedicated transformer terminal 10 will be stronger.

[0053] Without departing from the inventive concept of the present invention, those skilled in the art may adjust the structure of the heat conducting plate 400 according to actual needs. For example, those skilled in the art may adjust the area of ​​the heat conducting plate 400. In some embodiments, the area of ​​the heat conducting plate 400 is 1 / 2 to 2 / 3 the area of ​​the substrate 320. While ensuring the heat dissipation capacity of the dedicated terminal 10, the above embodiment also facilitates those skilled in the art to install fasteners on the substrate 320 to secure the overall structure of the housing 300.

[0054] Those skilled in the art may also adjust the surface of the heat conducting plate 400. Figure 1 、 Figure 2 、 Figure 3 As shown, in some embodiments, a plurality of grooves 410 are provided on the side of the heat conducting plate 400 facing away from the substrate 320. Through the above solution, without increasing the volume of the heat conducting plate 400, the grooves 410 further increase the contact area between the surface of the heat conducting plate 400 and the outside air, further improving the heat dissipation capacity of the dedicated transformer terminal 10.

[0055] Please refer to Figure 3As shown in FIG. 1 , as a preferred embodiment, the heat conducting plate 400 has a plurality of grooves 410 , each of which extends in the same direction. The above solution improves the heat dissipation capacity of the heat conducting plate 400 while further simplifying the processing of the heat conducting plate 400 , thereby reducing the manufacturing cost of the heat conducting plate 400 .

[0056] Please refer to Figure 1 、 Figure 2 As shown, further, in some embodiments, the dedicated transformer terminal 10 further includes a connecting portion 700, one end of which is connected to the edge of the heat conducting plate 400, and the other end of which protrudes relative to the heat conducting plate 400 toward the substrate 320 and is connected to the edge of the substrate 320. Through the above solution, since the connecting portion 700 is simultaneously connected to the edge of the substrate 320 and the edge of the heat conducting plate 400, the substrate 320 can limit the movement of the heat conducting plate 400 perpendicular to the arrangement direction of the substrate 320 and the heat conducting plate 400 through the connecting portion 700, thereby improving the stability of heat dissipation of the heat conducting plate 400.

[0057] As a preferred embodiment, the dedicated transformer terminal 10 further includes multiple connecting portions 700, each of which has one end connected to the edge of the heat conducting plate 400 and the other end protruding toward the substrate 320 relative to the heat conducting plate 400 and connected to the edge of the substrate 320. By providing multiple connecting portions 700 that simultaneously connect the edges of the substrate 320 and the edges of the heat conducting plate 400, the movement of the heat conducting plate 400 perpendicular to the arrangement direction of the heat conducting plate 400 on the substrate 320 can be further restricted, thereby further improving the stability of heat dissipation of the heat conducting plate 400.

[0058] Please refer to Figure 2 As shown, as a preferred embodiment, the connecting portion 700 is integrally connected to the heat conducting plate 400, thereby further strengthening the connection between the connecting portion 700 and the heat conducting plate 400, thereby further limiting the movement of the heat conducting plate 400 perpendicular to the arrangement direction of the heat conducting plate 400 on the substrate 320, and further improving the stability of the heat dissipation of the heat conducting plate 400. On the other hand, the heat transferred to the heat conducting plate 400 can also be directly transferred to the connecting portion 700, further increasing the heat dissipation area through the connecting portion 700, thereby improving the heat dissipation efficiency of the dedicated transformer terminal 10.

[0059] Without departing from the inventive concept of the present invention, those skilled in the art may select a commonly used heat dissipation structure as the thermal conductive assembly 200 of the present invention. In some embodiments, the thermal conductive assembly 200 comprises a copper tube, one end of which contacts the processor 100 via an insulating heat dissipation sticker, and the other end connects to the thermal conductive plate 400 through the heat dissipation holes 321. In the above embodiment, heat from the processor 100 can be transferred to the thermal conductive plate 400 through the copper tube and ultimately discharged to the outside.

[0060] As a preferred embodiment, please refer to Figure 2As shown, the heat-conducting assembly 200 includes a heat sink 210, which is located between the processor 100 and the heat-conducting plate 400. One end of the heat sink 210 contacts the processor 100, and the other end passes through the heat-dissipating hole 321 and contacts the heat-conducting plate 400. In the above embodiment, the heat of the processor 100 can be conducted to the heat-conducting plate 400 through the heat sink 210, and finally discharged to the outside. The heat sink 210 can make surface contact with the surface of the processor 100 through the heat dissipation surface 211, which can improve the thermal conductivity between the processor 100 and the heat sink 210. Preferably, the heat dissipation surface 211 completely covers the surface of the processor 100, so that every part of the surface of the processor 100 can directly conduct heat to the heat sink 210, further improving the thermal conductivity between the processor 100 and the heat sink 210.

[0061] Based on the above embodiment, the heat sink 210 is preferably an aluminum alloy heat sink, which has high thermal conductivity and low processing cost, which is beneficial to improving the heat dissipation efficiency of the dedicated terminal 10 and reducing the manufacturing cost of the dedicated terminal 10.

[0062] It should be noted that the "contact" mentioned in this utility model includes both direct contact and indirect contact between two objects. For example, as a preferred solution, please refer to Figure 2 As shown, the thermal assembly 200 further includes a ceramic member 220, which is located between the thermally conductive plate 400 and the heat sink 210. The heat sink 210 contacts the ceramic member 220, thereby indirectly contacting the thermally conductive plate 400. Because the ceramic member 220 is made of an insulating thermally conductive material, while transferring heat from the heat sink 210 to the thermally conductive plate 400, the ceramic member 220 disposed between the thermally conductive plate 400 and the heat sink 210 can effectively reduce the possibility of current flowing from the heat sink 210 to the thermally conductive plate 400, thereby improving the overall voltage resistance of the dedicated transformer terminal 10.

[0063] Based on the above solution, please refer to Figure 2 As shown, in some embodiments, the heat conducting assembly 200 further includes thermal grease 230, which is disposed between the heat sink 210 and the ceramic member 220. The thermal grease 230 can further fill the gap between the heat sink 210 and the ceramic member 220, preventing the air between the heat sink 210 and the ceramic member 220 from hindering heat conduction, thereby enhancing the heat conduction efficiency between the heat sink 210 and the ceramic member 220.

[0064] In some embodiments, thermal grease 230 is disposed between the ceramic member 220 and the heat conducting plate 400, or between the processor 100 and the heat sink 210. The above embodiments can further enhance the heat conduction efficiency between the ceramic member 220 and the heat conducting plate 400, or between the processor 100 and the heat sink 210. In some embodiments, thermal grease 230 is disposed between the ceramic member 220 and the heat conducting plate 400, between the processor 100 and the heat sink, and between the heat sink and the ceramic member 220.

[0065] It should be noted that the thermal grease 230 of the present invention can be either a solid thermal grease 230 sheet or a common fluid thermal grease 230 .

[0066] Without departing from the inventive concept of the present invention, those skilled in the art may adjust the fixing method of the heat conducting component 200 .

[0067] As a preferred method, please refer to Figure 4 、 Figure 7 As shown, in some embodiments, the heat conducting plate 400 is detachably connected to the substrate 320, and the substrate 320 has a limiting groove 322 on the side close to the heat conducting plate 400, and the limiting groove 322 is connected to the heat dissipation hole 321, and the ceramic part 220 is accommodated in the limiting groove 322 and covers the heat dissipation hole 321; when the heat conducting plate 400 is separated from the substrate 320, the limiting groove 322 can be exposed, and when the heat conducting plate 400 is connected to the substrate 320, it can jointly limit the movement of the ceramic part 220 with the wall of the limiting groove 322.

[0068] When the heat conducting plate 400 is separated from the base plate 320 , since the limiting groove 322 is connected to the outside, the ceramic part 220 can be placed into the limiting groove 322 from the outside of the base plate 320 without removing the shell 300 , which is convenient for the staff to maintain the ceramic part 220 .

[0069] When the heat conducting plate 400 is connected to the substrate 320, the heat conducting plate 400 and the wall of the limiting groove 322 jointly limit the movement of the ceramic part 220, which is conducive to ensuring that the heat dissipation part 210 is stably in contact with the ceramic part 220 when the heat dissipation part 210 is installed, thereby ensuring that the heat of the heat dissipation part 210 can be transferred to the ceramic part 220.

[0070] On the other hand, since the heat conducting plate 400 can be detachably connected to the base plate 320, it is easier for the staff to maintain the heat conducting plate 400, and the heat conducting plate 400 can also be replaced with a heat conducting plate 400 of different materials or different specifications according to the heat dissipation requirements of the dedicated terminal 10, thereby improving the utilization rate of the dedicated terminal 10.

[0071] As a preferred method, please refer to Figure 7As shown, in some embodiments, the heat sink 210 is connected to the side of the substrate 320 facing away from the heat conducting plate 400, and clamps the ceramic member 220 together with the heat conducting plate 400. The heat sink 210 and the heat conducting plate 400 jointly clamping the ceramic member 220 facilitates more complete contact between the heat sink 210 and the heat conducting plate 400 and improves the heat transfer efficiency among the heat sink 210, the heat conducting plate 400, and the ceramic member 220.

[0072] In some embodiments, the heat sink 210 is fixed to the base plate 320 by bolts. In the process of tightening the bolts, the staff can also adjust the strength of the heat conducting plate 400 and the heat sink 210 to clamp the ceramic part 220 by the tightening degree of the bolts, thereby adjusting the thermal conductivity efficiency of the heat conducting assembly 200, and then adjusting the heat dissipation efficiency of the dedicated transformer terminal 10. For example, when the heat dissipation efficiency of the dedicated transformer terminal 10 is insufficient, the technician can increase the strength of the heat conducting plate 400 and the heat sink 210 to clamp the ceramic part 220 by tightening the bolts, thereby improving the thermal conductivity efficiency of the heat conducting assembly 200. When the heat dissipation efficiency of the dedicated transformer terminal 10 is sufficient, the technician can reduce the strength of the heat conducting plate 400 and the heat sink 210 to clamp the ceramic part 220 by loosening the bolts, thereby extending the service life of the ceramic part 220.

[0073] As previously discussed, thermal grease 230 is provided within the thermal assembly 200 to reduce air gaps. In some embodiments, thermal grease 230 is provided between the heat sink 210 and the ceramic member 220, and between the heat conducting plate 400 and the ceramic member 220. When the heat sink 210 and the heat conducting plate 400 clamp the ceramic member 220, the thermal grease 230 is also subjected to the clamping force of the heat sink 210 and the heat conducting plate 400, which in turn squeezes out air trapped within the thermal grease 230. This further reduces the air gaps between the heat conducting plate 400 and the ceramic member 220, as well as the air gaps between the heat sink 210 and the ceramic member 220, thereby improving the thermal conductivity of the thermal assembly 200.

[0074] For further information, please refer to Figure 5 、 Figure 6 As shown, the processor 100 is provided on the circuit board 500, and the shielding cover 600 is connected to the circuit board 500 and together with the circuit board 500, the processor 100 is enclosed. By providing the shielding cover 600 for enclosing the processor 100, the electromagnetic interference to the processor 100 during the processing and collection work can be further reduced, thereby enhancing the stability of the dedicated terminal 10 during operation.

[0075] Based on the above solution, in some embodiments, the thermal conductive assembly 200 further includes thermal grease 230, which is disposed between the processor 100 and the shielding cover 600. The heat sink 210 contacts the shielding cover 600 to indirectly contact the processor 100. Since the thermal grease 230 is disposed between the processor 100 and the shielding cover 600, the air between the processor 100 and the shielding cover 600 is reduced. As a result, the processor 100 can directly transfer heat to the shielding cover 600 through the thermal grease 230, and the shielding cover 600 then transfers the heat to the heat sink 210.

[0076] As a preferred solution, thermal grease 230 may be provided between the shielding cover 600 and the heat sink 210 to reduce the air gap between the shielding cover 600 and the heat sink 210 and improve the heat conduction efficiency of the heat conducting assembly 200 .

[0077] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. The dedicated terminal is characterized by: include: processor; a heat conducting component contacting the processor; A housing defining a housing cavity, wherein the processor and the heat conducting assembly are both housed in the housing cavity, the housing comprising a substrate, wherein the substrate is provided with a heat dissipation hole communicating with the housing cavity; a heat conducting plate, attached to a side of the substrate facing away from the accommodating cavity and covering the heat dissipation holes; Wherein, the heat conducting component is arranged through the heat dissipation hole and contacts the heat conducting plate.

2. The dedicated terminal according to claim 1, characterized in that: The heat conduction assembly includes a heat sink located between the processor and the heat conduction plate. The heat sink passes through the heat dissipation hole and contacts the heat conduction plate. The heat sink has a heat dissipation surface that contacts the surface of the processor.

3. The dedicated terminal according to claim 2, characterized in that: The heat conduction assembly further includes a ceramic component, which is located between the heat conduction plate and the heat sink. The heat sink contacts the ceramic component to indirectly contact the heat conduction plate.

4. The dedicated terminal according to claim 3, characterized in that: The heat sink is connected to a side of the base plate facing away from the heat conducting plate, and clamps the ceramic component with the heat conducting plate.

5. The dedicated terminal according to claim 3, characterized in that: The heat conducting plate is detachably connected to the substrate, and a limiting groove is provided on a side of the substrate close to the heat conducting plate. The limiting groove is connected to the heat dissipation hole, and the ceramic component is accommodated in the limiting groove and covers the heat dissipation hole. When the heat conducting plate is separated from the substrate, the limiting groove can be exposed, and when the heat conducting plate is connected to the substrate, it can jointly limit the movement of the ceramic component with the wall of the limiting groove.

6. The dedicated terminal according to claim 3, characterized in that: The heat-conducting component also includes thermal grease, which is arranged between the processor and the heat sink; and / or, the thermal grease is arranged between the heat sink and the ceramic component; and / or, the thermal grease is arranged between the ceramic component and the heat-conducting plate.

7. The dedicated terminal according to claim 3, characterized in that: The dedicated transformer terminal also includes a circuit board and a shielding cover. The processor is arranged on the circuit board. The shielding cover is connected to the circuit board and together with the circuit board, encloses the processor. The heat-conducting component also includes thermal grease, which is arranged between the processor and the shielding cover. The heat sink contacts the shielding cover to indirectly contact the processor.

8. The dedicated terminal according to claim 1, characterized in that: The dedicated transformer terminal further includes a connecting portion, one end of which is connected to the edge of the heat conducting plate, and the other end of which protrudes toward the substrate relative to the heat conducting plate and is connected to the edge of the substrate.

9. The dedicated terminal according to claim 1, characterized in that: A groove is provided on a side of the heat conducting plate facing away from the base plate.

10. The dedicated terminal according to claim 9, characterized in that: The heat conducting plate has a plurality of grooves, and each of the grooves extends in the same direction.

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