Piezoelectric ceramic stacking and bonding device

Abstract

The utility model provides a piezoelectric ceramic stacking and bonding device. The piezoelectric ceramic stacking and bonding device comprises a support, a fixing frame, a pressing block assembly and a jacking piece. The support comprises a first support part and a second support part which are integrated and oppositely arranged. The first fixing frame is provided with a first groove, and the two ends of the first fixing frame are installed on the inner sides of the first support part and the second support part respectively. The pressing block assembly comprises a first pressing block and a second pressing block which are arranged in the first groove in a sliding mode. The second fixing frame is provided with a second groove; the two ends of the second fixing frame are installed on the inner sides of the first support part and the second support part respectively, the second fixing frame is matched with the first fixing frame in shape, and the second groove and the first groove are spliced to form a channel groove wrapping the pressing block. And the first jacking piece and the second jacking piece are respectively mounted on the first bracket part and the second bracket part, respectively extend from the two ends of the channel groove and are respectively jacked on the first pressing block and the second pressing block. According to the stacking and bonding device, stacking can be limited, deviation and falling can be prevented, glue distribution is optimized in a vertical curing mode, and the appearance and performance of the stacking are improved.

Description

Technical Field

[0001] The present application relates to the technical field of piezoelectric ceramic device preparation, and in particular to a piezoelectric ceramic stack bonding device. Background Art

[0002] As a new type of special functional ceramic, piezoelectric ceramics play an increasingly important role in modern industry and technology due to their unique piezoelectric, dielectric, and elastic properties. The piezoelectric effect enables the conversion of electrical and mechanical energy, leading to their widespread application in a variety of fields, including electroacoustic devices, medical equipment, aerospace, and military defense. As a key form of piezoelectric ceramics, the quality and performance of the piezoelectric ceramic stack are directly affected by the quality of its preparation process.

[0003] The preparation process for piezoelectric ceramic stacks typically includes steps such as chip placement, dispensing, bonding, curing, welding, and packaging. Among these steps, the bonding and curing processes are particularly critical, as they directly affect the accuracy and performance of the ceramic stack. However, during the actual bonding process, due to the complexity of process control, the ceramic stack often shifts. In particular, during the downward pressure of the stacking tooling, the ceramic single piece is prone to cracking and shifting, causing the product's external dimensions to exceed specifications and even affecting electrical performance parameters, such as poor frequency offset and displacement consistency.

[0004] To address this issue, existing technical solutions employ adhesive fixtures to secure the position of the ceramic wafers and reduce the occurrence of misalignment. For example, some solutions propose an adhesive fixture that applies pressure to a pressing block by raising and lowering a limit rod to secure the position of the ceramic wafers. This fixture is designed to displace excess glue between the wafers through the stress generated during the lifting process, thereby ensuring stacking performance.

[0005] Although the existing bonding tooling can fix the position of ceramic monoliths to a certain extent, there are still some problems in practical applications. First, the pressure block is easily offset during the lifting and lowering of the limit rod, which in turn affects the positioning accuracy of the ceramic monolith. Secondly, the uneven distribution of downward force may damage the ceramic stack and affect the bonding quality. In addition, the distribution of glue between ceramic monoliths is directly related to the yield of the product. If the glue is not completely removed, it will not only affect the appearance of the stack, but may also cause the ceramic piece to break due to stress concentration during driving. The increase in the thickness of the glue between the ceramic monoliths after curing will also weaken the displacement of the ceramic piece due to the low stiffness characteristics of the glue, resulting in a decrease in product performance.

[0006] During the glue curing process, due to the lubrication of the glue between the ceramic sheets, thermal stress can cause the ceramic stack to shift or fall off, further reducing product yield. Therefore, existing bonding tooling and curing processes need to be improved to enhance the fabrication quality and performance of piezoelectric ceramic stacks. Summary of the Invention

[0007] The purpose of this application is to provide a piezoelectric ceramic stack bonding device that, through a channel groove formed by two fixed frames, guides the displacement direction of the pressing block and limits the stack, improving the stack's curing positioning accuracy and preventing drift and fallout. Furthermore, the vertical curing method optimizes glue distribution and, combined with the pressing block extrusion, evenly removes excess glue, improving the stack's appearance and performance.

[0008] The present application provides a piezoelectric ceramic stack bonding device, comprising a bracket, a first fixing bracket, a second fixing bracket, a pressure block assembly, a first supporting member, and a second supporting member. The bracket comprises a first bracket portion and a second bracket portion connected as one body, and the first and second bracket portions are disposed at opposite ends of the bracket. The first fixing bracket is provided with a first groove, one side open and extending through both ends, and the ends of the first fixing bracket are respectively mounted on the inside of the first and second bracket portions. The pressure block assembly comprises a first pressure block and a second pressure block slidably positioned within the first groove. The second fixing bracket is provided with a second groove, one side open and extending through both ends; the ends of the second fixing bracket are respectively mounted on the inside of the first and second bracket portions, and the second fixing bracket matches the shape of the first fixing bracket. The second groove and the first groove combine to form a channel groove that encloses the pressure block assembly, with the ends of the channel groove opening toward the first and second bracket portions, respectively. The first supporting member is mounted on the first bracket portion, extending from one end of the channel groove into the first pressure block and supporting it. The second supporting member is mounted on the second bracket portion, extending from the other end of the channel groove into the second pressure block and supporting it.

[0009] In an implementable solution, the contact form between the first supporting member and the first pressing block is point contact; and / or the contact form between the second supporting member and the second pressing block is point contact.

[0010] In an implementable solution, the contact portion of the first supporting member with the first pressing block is hemispherical; and / or the contact portion of the second supporting member with the second pressing block is hemispherical.

[0011] In one feasible solution, the first supporting member is threadedly mounted on the first bracket portion, and one end thereof extends into the channel groove and abuts against the first pressure block; and / or the second supporting member is threadedly mounted on the second bracket portion, and one end thereof extends into the channel groove and abuts against the second pressure block.

[0012] In one feasible solution, a first through-hole is provided on the first bracket portion at a position corresponding to the channel slot, a first feed mechanism is mounted on the side of the first bracket portion facing away from the second bracket portion, and a first supporting member is mounted at the output end of the first feed mechanism; the first feed mechanism drives the first supporting member through the first through-hole and into the channel slot. Alternatively, a second through-hole is provided on the second bracket portion at a position corresponding to the channel slot, a second feed mechanism is mounted on the side of the second bracket portion facing away from the first bracket portion, and a second supporting member is mounted at the output end of the second feed mechanism; the second feed mechanism drives the second supporting member through the second through-hole and into the channel slot.

[0013] In an implementable solution, the cross-sectional shape of the channel groove formed by combining the second groove and the first groove is rectangular or circular.

[0014] In one feasible solution, a plurality of first fixing bolts and second fixing bolts are provided. The first fixing bolts are threadedly connected to the ends of the first fixing frame through the end surfaces of the first bracket portion and the second bracket portion, respectively; and the second fixing bolts are threadedly connected to the ends of the second fixing frame through the end surfaces of the first bracket portion and the second bracket portion, respectively.

[0015] In one feasible solution, a retractable first spring pin and a retractable second spring pin are provided. First latch holes are provided on both end surfaces of the first fixing frame, and first spring pins are mounted on both the first bracket and the second bracket. When the first fixing frame is installed, the first spring pins at both ends are inserted into the first latch holes at both ends of the first fixing frame. Second latch holes are provided on both end surfaces of the second fixing frame, and second spring pins are mounted on both the first bracket and the second bracket. After the second fixing frame is assembled with the first fixing frame, the second spring pins at both ends are inserted into the second latch holes at both ends of the second fixing frame.

[0016] In one feasible solution, drainage grooves are provided in both the first groove of the first fixing frame and the second groove of the second fixing frame. In the first groove, the drainage grooves are provided on the surface of the first groove and extend to both ends of the first groove; in the second groove, the drainage grooves are provided on the surface of the second groove and extend to both ends of the second groove.

[0017] In one feasible embodiment, the piezoelectric ceramic stack bonding apparatus further includes a rotation mechanism, the bracket being mounted on the rotation mechanism, and the rotation mechanism having at least a first rotation angle and a second rotation angle. When the rotation mechanism is at the first rotation angle, the channel groove formed by the first bracket portion and the second bracket portion is aligned horizontally; when the rotation mechanism is at the second rotation angle, the channel groove formed by the first bracket portion and the second bracket portion is aligned vertically.

[0018] Compared with the prior art, the beneficial effects of this application include at least the following:

[0019] First, in the piezoelectric ceramic stack bonding device of the present application, the channel groove formed by the combination of the first and second fixing frames, on the one hand, forms a limit on the displacement direction of the pressing block, preventing the risk of offset during the compression of the piezoelectric ceramic stack by the first and second pressing blocks, thereby ensuring that the pressing blocks exert a relatively uniform extrusion force on the piezoelectric ceramic stack. On the other hand, the inner wall of the channel groove forms a limit on the piezoelectric ceramic stack, improving the positioning accuracy of the ceramic monolith and preventing the risk of offset or falling off of the piezoelectric ceramic stack during the curing process.

[0020] At the same time, when the piezoelectric ceramic stack is solidified, the first fixing frame and the second fixing frame are maintained in a vertical state, so that the contact planes between the layers of the piezoelectric ceramic stack are in a horizontal state, and the stack is solidified vertically, avoiding the risk of glue concentrating on one side of the ceramic stack during the thermal curing process, thereby optimizing the glue distribution between the single pieces of the piezoelectric ceramic stack, and combined with the extrusion effect of the first and second pressing blocks, the excess glue between the ceramic single pieces is evenly removed from the four sides of the ceramic single pieces, thereby ensuring the appearance quality and stack performance of the stack.

[0021] Furthermore, glue expelled by the pressing block can be removed by removing either the first or second fixing frame to perform glue wiping on different surfaces of the piezoelectric ceramic stack. During this wiping process, the first and second supporting members do not need to be removed; they maintain their grip on the pressing block, ensuring uninterrupted glue extrusion and removal, improving efficiency and preserving the stack's appearance and performance.

[0022] In addition, in a further solution, the contact form between the top holding member and the pressing block is point contact, so that the pressure during the bonding of the stack passes through the end of the top holding member and is transmitted through the pressing block. The pressure will be evenly applied to the end face of the stack, avoiding damage to the piezoelectric ceramic stack caused by uneven pressure and reducing the uneven glue layer in the piezoelectric ceramic stack caused by the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 This is a structural diagram of a piezoelectric ceramic stack bonding device shown in an embodiment of the present application;

[0025] Figure 2 for Figure 1 Schematic diagram of the explosion structure of the medium-voltage electric ceramic stack bonding device;

[0026] Figure 3 This is a schematic diagram of an exploded structure of a first fixing frame and a second fixing frame shown in an embodiment of the present application;

[0027] Figure 4 This is a schematic structural diagram of a first fixing frame and a second fixing frame when assembled, as shown in an embodiment of the present application;

[0028] Figure 5 for Figure 1 Side structural view of the medium-pressure ceramic stack bonding device;

[0029] Figure 6 For the Figure 5 A cutaway perspective view of the middle BB;

[0030] Figure 7 for Figure 6 A top view of

[0031] Figure 8 For the Figure 5 Cross-sectional view of AA;

[0032] Figure 9 A schematic diagram of the three-dimensional structure of a first fixing frame shown in an embodiment of the present application;

[0033] Figure 10 This is a structural diagram of a piezoelectric ceramic stack bonding device with a feeding mechanism shown in an embodiment of the present application;

[0034] Figure 11 for Figure 10 Schematic diagram of a partial explosion structure of a medium-voltage ceramic stack bonding device;

[0035] Figure 12 This is a cross-sectional view of a matching structure of a fixing frame locked by a spring pin according to an embodiment of the present application;

[0036] Figure 13 and Figure 14 This is a three-dimensional structural diagram of a piezoelectric ceramic stack bonding device with a rotating mechanism shown in an embodiment of the present application.

[0037] In the figure: 1. bracket; 11. first bracket part; 12. second bracket part; 21. first fixing frame; 211. first groove; 22. second fixing frame; 221. second groove; 200. channel groove; 201. drainage groove; 31. first pressure block; 32. second pressure block; 41. first supporting member; 42. second supporting member; 51. first feeding mechanism; 52. second feeding mechanism; 61. first fixing bolt; 62. second fixing bolt; 71. first spring pin; 72. second spring pin; 81. first pin hole; 82. second pin hole; 10. assembly gap; 90. rotating mechanism; 100. piezoelectric ceramic stack. DETAILED DESCRIPTION

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0039] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0040] like Figures 1 to 4 As shown, an embodiment of the present application provides a piezoelectric ceramic stack bonding device, including a bracket 1, a fixing frame, a pressing block assembly and a top holding member.

[0041] The bracket 1 includes a first bracket portion 11 and a second bracket portion 12 connected as one body, and the first bracket portion 11 and the second bracket portion 12 are respectively arranged at opposite ends of the bracket 1. The fixing frame includes a first fixing frame 21 and a second fixing frame 22, and the supporting member includes a first supporting member 41 and a second supporting member 42.

[0042] The first fixing frame 21 is provided with a first groove 211 that is open on one side and extends through both ends. The two ends of the first fixing frame 21 are respectively mounted on the inside of the first bracket portion 11 and the second bracket portion 12. The pressure block assembly includes a first pressure block 31 and a second pressure block 32 that are slidably placed in the first groove 211. The second fixing frame 22 is provided with a second groove 221 that is open on one side and extends through both ends. The two ends of the second fixing frame 22 are respectively mounted on the inside of the first bracket portion 11 and the second bracket portion 12, and the second fixing frame 22 matches the shape of the first fixing frame 21. The second groove 221 and the first groove 211 are combined to form a channel groove 200 that encloses the pressure block assembly. The two ends of the channel groove 200 are opened toward the first bracket portion 11 and the second bracket portion 12, respectively. The first supporting member 41 is mounted on the first bracket portion 11. The first supporting member 41 extends from one end of the channel groove 200 into and supports the first pressure block 31. The second supporting member 42 is mounted on the second bracket portion 12 . The second supporting member 42 extends from the other end of the channel groove 200 and supports the second pressing block 32 .

[0043] When the piezoelectric ceramic stack bonding device of this embodiment is used, Figure 5 、 Figure 6 and Figure 7As shown, first, the two ends of the first fixing frame 21 are respectively mounted on the inner sides of the first bracket portion 11 and the second bracket portion 12, the piezoelectric ceramic stack 100 is placed in the first groove 211 of the first fixing frame 21, and the first pressing block 31 and the second pressing block 32 are respectively set at the two ends of the piezoelectric ceramic stack 100 in the first groove 211. Figure 1 and Figure 8 As shown, the two ends of the second fixing frame 22 are then mounted to the inner sides of the first bracket portion 11 and the second bracket portion 12, respectively, so that the second groove 221 of the second fixing frame 22 is combined with the first groove 211 of the first fixing frame 21 to form a channel groove 200 that wraps the pressure block assembly and the piezoelectric ceramic stack 100. Afterwards, the first supporting member 41 extends from one end of the channel groove 200 and supports the first pressure block 31, and the second supporting member 42 extends from the other end of the channel groove 200 and supports the second pressure block 32. The first supporting member 41 and / or the second supporting member 42 are operated to apply pressure to the first pressure block 31 and the second pressure block 32, so that the first pressure block 31 and / or the second pressure block 32 can apply a compressive force to the piezoelectric ceramic stack 100 in the middle along the channel groove 200. Finally, the piezoelectric ceramic stack bonding device is placed vertically, that is, the first fixing frame 21 and the second fixing frame 22 are kept vertical, so that the contact planes between the layers of the piezoelectric ceramic stack 200 are horizontal. Similarly, the second bracket part can be installed first according to the above operation, and there is no limitation here.

[0044] First, in the piezoelectric ceramic stack bonding device of this embodiment, the channel groove 200 formed by the combination of the first fixing frame 21 and the second fixing frame 22, on the one hand, limits the displacement direction of the pressing block, preventing the risk of deviation during the compression of the piezoelectric ceramic stack 100 by the first pressing block 31 and the second pressing block 32, thereby ensuring that the pressing blocks exert a relatively uniform compressive force on the piezoelectric ceramic stack 100. On the other hand, the inner wall of the channel groove 200 limits the piezoelectric ceramic stack 100, improving the positioning accuracy of the ceramic single piece and preventing the risk of deviation or falling off of the piezoelectric ceramic stack 100 during the curing process.

[0045] At the same time, when the piezoelectric ceramic stack 100 is cured, the first fixing frame 21 and the second fixing frame 22 are maintained in a vertical state, so that the contact planes between the layers of the piezoelectric ceramic stack 100 are in a horizontal state, thereby realizing vertical curing of the stack and avoiding the risk of glue concentrating on one side of the ceramic stack during the thermal curing process, thereby optimizing the glue distribution between the single pieces of the piezoelectric ceramic stack 100. Combined with the extrusion effect of the first and second pressing blocks, the excess glue between the ceramic single pieces is evenly removed from the four sides of the ceramic single pieces, thereby ensuring the appearance quality and stack performance of the stack.

[0046] Furthermore, glue expelled by the pressing block can be removed by removing the first or second fixing frame 21 or 22 to perform glue wiping on different surfaces of the piezoelectric ceramic stack 100. During the wiping process, the first and second supporting members 41 and 42 do not need to be removed; they remain in place to press the pressing block, ensuring uninterrupted glue extrusion and removal, improving efficiency and preserving the stack's appearance and performance.

[0047] In one embodiment, the end of the supporting member is generally arranged to contact the center of the pressing block to ensure the uniformity of the applied pressure as much as possible.

[0048] In one embodiment, the contact form between the first supporting member 41 and the first pressing block 31 may be point contact, and / or the contact form between the second supporting member 42 and the second pressing block 32 may be point contact. Figure 7 and Figure 8 As shown, the contact portion of the first supporting member 41 with the first pressing block 31 may be hemispherical, and / or the contact portion of the second supporting member 42 with the second pressing block 32 may be hemispherical. For another example, the contact portion of the first supporting member 41 with the first pressing block 31 may be conical (not shown in the figure), and / or the contact portion of the second supporting member 42 with the second pressing block 32 may be conical (not shown in the figure).

[0049] If the support member and the pressing block were in planar contact, it would be difficult to ensure absolute parallelism between their contact surfaces, resulting in uneven pressure and, in turn, uneven distribution of glue across the stack. In this embodiment, however, the support member and the pressing block are in point contact, so that the pressure applied during stack bonding is transmitted through the end of the support member and the pressing block, resulting in a uniform application of pressure across the end faces of the stack. This prevents uneven pressure from damaging the piezoelectric ceramic stack 100 and reduces process-induced unevenness in the adhesive layer within the piezoelectric ceramic stack 100.

[0050] In one embodiment, the ends of the first and second supporting members 41 and 42 that contact the pressure block are preferably made of a metal or ceramic with high rigidity. For example, a material with a Young's modulus of 200 GPa to 400 GPa can be used as the end material of the supporting members. For example, the ends of the first and second supporting members 41 and 42 that contact the pressure block can be made of tungsten steel. Similarly, the material of the first and second pressure blocks 31 and 32 is also preferably a material with high rigidity. This allows pressure to be transmitted to the stack without excessive attenuation through the ends of the supporting members and the pressure blocks. This also reduces deformation of the first and second supporting members 41 and 42, and the first and second pressure blocks 31 and 32 during long-term use, thereby increasing the life of the overall tooling.

[0051] In one embodiment, if Figure 6 、 Figure 7 and Figure 8 As shown, the first supporting member 41 can be threadedly mounted on the first bracket portion 11, with one end extending into the channel groove 200 and abutting against the first pressing block 31; and / or the second supporting member 42 can be threadedly mounted on the second bracket portion 12, with one end extending into the channel groove 200 and abutting against the second pressing block 32. Therefore, by rotating the first supporting member 41 and / or the second supporting member 42, the pressing force exerted by the first and second pressing blocks 31, 32 on the piezoelectric ceramic stack 100 can be adjusted.

[0052] In one embodiment, if Figure 10 and Figure 11 As shown, a first through-hole (not shown) can be provided at a position of the first bracket portion 11 corresponding to the channel groove 200, a first feeding mechanism 51 can be mounted on the side of the first bracket portion 11 facing away from the second bracket portion 12, and a first supporting member 41 is mounted at the output end of the first feeding mechanism 51; the first feeding mechanism 51 drives the first supporting member 41 through the first through-hole and into the channel groove 200. Alternatively, a second through-hole (not shown) can be provided at a position of the second bracket portion 12 corresponding to the channel groove 200, a second feeding mechanism 52 can be mounted on the side of the second bracket portion 12 facing away from the first bracket portion 11, and a second supporting member 42 is mounted at the output end of the second feeding mechanism 52; the second feeding mechanism 52 drives the second supporting member 42 through the second through-hole and into the channel groove 200.

[0053] By adjusting the feed stroke of the first feeding mechanism 51 and / or the second feeding mechanism 52, the first supporting member 41 and the second supporting member 42 are respectively brought into contact with the first pressing block 31 and the second pressing block 32. Furthermore, by adjusting the specific values ​​of the feed stroke of the first feeding mechanism 51 and / or the second feeding mechanism 52, the magnitude of the force applied by the first supporting member 41 and the second supporting member 42 to the first pressing block 31 and the second pressing block 32 can be controlled, thereby achieving the magnitude of the extrusion force exerted by the first pressing block 31 and the second pressing block 32 on the stack.

[0054] In one embodiment, the first feeding mechanism 51 and the second feeding mechanism 52 can be formed by an electric push rod, a pneumatic cylinder, a hydraulic cylinder, or the like, and the stack extrusion pressure can be adjusted through electric control. In addition, a pressure sensor can be provided on the first supporting member 41 and / or the second supporting member 42, or at the connection between the feeding mechanism and the supporting member, to sense the magnitude of the extrusion pressure exerted by the pressing block on the stack, thereby facilitating adjustment of the extrusion pressure exerted by the supporting member on the pressing block, thereby achieving more refined stack curing pressure regulation.

[0055] In one embodiment, if Figure 3 and Figure 4As shown, the cross-sectional shape of the channel groove 200 formed by the second groove 221 and the first groove 211 can be rectangular or circular. For example, the cross-sectional shape of the channel groove 200 can be rectangular, and correspondingly, the cross-sectional shapes of the second groove 221 and the first groove 211 are respectively "V"-shaped. This can basically ensure that the contact points between the grooves and the piezoelectric ceramic stack 100 are evenly distributed, thereby ensuring force balance during bonding. When the cross-sectional shape of the channel groove 200 is rectangular, it can be used with cylindrical or polygonal piezoelectric ceramic stacks 100, but is preferably suitable for piezoelectric ceramic stacks 100 with a cross-sectional shape consistent with the channel groove 200.

[0056] For another example, the cross-sectional shape of the channel groove 200 may be circular (not shown in the figure), and correspondingly, the cross-sectional shapes of the second groove 221 and the first groove 211 are semicircular, respectively. In this case, the cylindrical piezoelectric ceramic stack 100 is preferably adapted.

[0057] In one embodiment, if Figure 2 、 Figure 5 、 Figure 7 and Figure 8 As shown, the piezoelectric ceramic stack bonding device further includes a first fixing bolt 61 and a second fixing bolt 62. The first fixing bolts 61 pass through the end surfaces of the first bracket portion 11 and the second bracket portion 12, respectively, and are threadedly connected to both ends of the first fixing frame 21. The second fixing bolts 62 pass through the end surfaces of the first bracket portion 11 and the second bracket portion 12, respectively, and are threadedly connected to both ends of the second fixing frame 22.

[0058] Specifically, the end surfaces of both ends of the first fixing frame 21 are respectively provided with a first threaded hole (not marked in the figure), and the first bracket portion 11 and the second bracket portion 12 are both provided with a first through hole (not marked in the figure). When the first fixing frame 21 is installed, the first fixing bolt 61 passes through the first through hole and is threadedly engaged with the first threaded hole. The end surfaces of the second fixing frame 22 are respectively provided with a second threaded hole (not marked in the figure), and the first bracket portion 11 and the second bracket portion 12 are both provided with a second through hole (not marked in the figure). When the second fixing frame 22 is assembled with the first fixing frame 21, the second fixing bolt 62 passes through the second through hole and is threadedly engaged with the second threaded hole. The provision of the first fixing bolt 61 and the second fixing bolt 62 can better increase the structural stability of the first fixing frame 21 and the second fixing frame 22, so that the piezoelectric ceramic stack can be placed more stably during bonding, and the threaded connection method can facilitate the disassembly of the first fixing frame 21 and the second fixing frame 22, and facilitate the cleaning of the glue overflow generated during the bonding process of the piezoelectric ceramic stack.

[0059] In one embodiment, if Figure 11 and Figure 12As shown, the piezoelectric ceramic stack bonding device also includes a retractable first spring pin 71 and a retractable second spring pin 72. The end surfaces of the first fixing frame 21 can be respectively provided with first latch holes 81, and the first bracket portion 11 and the second bracket portion 12 are both mounted with first spring pins 71. When the first fixing frame 21 is installed, the first spring pins 71 at both ends are respectively inserted into the first latch holes 81 at both ends of the first fixing frame 21. When the first fixing frame 21 is disassembled, the first spring pins 71 are pulled outward from the outside of the first bracket portion 11 and the second bracket portion 12 so that the front end of the first spring pin 71 is disengaged from the first latch hole 81, and the first fixing frame 21 can then be removed from between the first bracket portion 11 and the second bracket portion 12.

[0060] Second latch holes 82 can be provided on each end surface of the second fixing frame 22. Second spring pins 72 are installed on both the first bracket portion 11 and the second bracket portion 12. After the second fixing frame 22 is assembled with the first fixing frame 21, the second spring pins 72 at both ends are inserted into the second latch holes 82 at both ends of the second fixing frame 22. To remove the second fixing frame 22, pull the second spring pins 72 outward from the outside of the first bracket portion 11 and the second bracket portion 12 until the front ends of the second spring pins 72 are released from the second latch holes 82. This allows the second fixing frame 22 to be removed from between the first bracket portion 11 and the second bracket portion 12.

[0061] Among them, the piezoelectric ceramic stack bonding device uses the first spring pin 71 to fix the first fixing frame 21 and the second spring pin 72 to fix the second fixing frame 22, which makes disassembly and assembly more convenient and operation more convenient, further improving the efficiency of the piezoelectric ceramic stack bonding process.

[0062] In one embodiment, if Figure 9 As shown, drainage grooves 201 can be provided in both the first groove 211 of the first fixing frame 21 and the second groove 221 of the second fixing frame 22. In the first groove 211, the drainage grooves 201 are provided on the surface of the first groove 211 and extend to both ends of the first groove 211. In the second groove 221, the drainage grooves 201 are provided on the surface of the second groove 221 and extend to both ends of the second groove 221. The provision of drainage grooves 201 facilitates the timely discharge of glue squeezed out between stacks, avoiding quality issues caused by excessive concentration of discharged glue.

[0063] In one embodiment, if Figure 1 As shown, an assembly gap 10 can be provided at the end surface after the second fixing frame 22 and the first fixing frame 21 are assembled. The provision of the assembly gap 10 can also facilitate the timely discharge of glue squeezed out between the stacks, avoiding quality problems caused by excessive concentration of discharged glue.

[0064] It should be noted that to achieve vertical placement of the piezoelectric ceramic stack bonding device, a support bracket can be provided, and the piezoelectric ceramic stack bonding device can be mounted or displayed on the support bracket in a vertical position. The support bracket can be provided with a slot to facilitate the stable placement of the piezoelectric ceramic stack bonding device. In addition, the end surface of the first bracket portion 11 and / or the second bracket portion 12 can be a flat surface. By placing the end surface of the first bracket portion 11 and / or the second bracket portion 12 on a horizontal surface, the vertical placement of the piezoelectric ceramic stack bonding device can be achieved.

[0065] Furthermore, in one embodiment, Figure 13 and Figure 14 As shown, the piezoelectric ceramic stack bonding device further includes a rotating mechanism 90, the bracket 1 is mounted on the rotating mechanism 90, and the rotating mechanism 90 includes at least a first rotation angle and a second rotation angle. Figure 13 As shown, when the rotating mechanism 90 is at the first rotation angle, the channel groove 200 formed by the first bracket portion 11 and the second bracket portion 12 is in the horizontal direction, which makes it easy to place the piezoelectric ceramic stack 100 between the first fixing frame 21 and the second fixing frame 22, and also facilitates the installation of the first fixing frame 21 and the second fixing frame 22. Figure 14 As shown, when the rotating mechanism 90 is at the second rotation angle, the channel groove 200 formed by the first bracket portion 11 and the second bracket portion 12 is vertically aligned to perform the solidification process of the piezoelectric ceramic stack 100 .

[0066] The provision of the rotating mechanism 90 facilitates the posture conversion of the piezoelectric ceramic stack bonding device, further improving the operating efficiency of the bonding and curing process of the piezoelectric ceramic stack 100 .

[0067] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A piezoelectric ceramic stack bonding device, characterized in that: include: A bracket (1) comprises a first bracket portion (11) and a second bracket portion (12) connected as one body, wherein the first bracket portion (11) and the second bracket portion (12) are respectively arranged at opposite ends of the bracket (1); A first fixing frame (21) is provided with a first groove (211) with an opening on one side and extending through both ends, and both ends of the first fixing frame (21) are respectively mounted on the inner sides of the first bracket portion (11) and the second bracket portion (12); A pressing block assembly, comprising a first pressing block (31) and a second pressing block (32) slidably disposed in the first groove (211); The second fixing frame (22) is provided with a second groove (221) with an opening on one side and extending through both ends; both ends of the second fixing frame (22) are respectively mounted on the inner sides of the first bracket portion (11) and the second bracket portion (12), and the second fixing frame (22) matches the shape of the first fixing frame (21); the second groove (221) and the first groove (211) are combined to form a channel groove (200) that wraps the pressing block assembly, and the openings at both ends of the channel groove (200) are respectively facing the first bracket portion (11) and the second bracket portion (12); A first supporting member (41) is installed on the first bracket portion (11), and the first supporting member (41) extends from one end of the channel groove (200) and supports the first pressing block (31); A second supporting member (42) is installed on the second bracket portion (12). The second supporting member (42) extends from the other end of the channel groove (200) and supports the second pressing block (32).

2. The piezoelectric ceramic stack bonding device according to claim 1, wherein: The contact form between the first supporting member (41) and the first pressing block (31) is point contact; And / or the contact form between the second supporting member (42) and the second pressing block (32) is point contact.

3. The piezoelectric ceramic stack bonding device according to claim 2, wherein: The first supporting member (41) is in a hemispherical shape at a contact point with the first pressing block (31); And / or the contact portion of the second supporting member (42) with the second pressing block (32) is hemispherical.

4. The piezoelectric ceramic stack bonding device according to claim 1, wherein: The first supporting member (41) is threadedly mounted on the first bracket portion (11), and one end thereof extends into the channel groove (200) and abuts against the first pressing block (31); And / or the second supporting member is threadedly mounted on the second bracket portion (12), and one end thereof extends into the channel groove (200) to abut against the second pressing block (32).

5. The piezoelectric ceramic stack bonding device according to claim 1, wherein: A first through hole is provided at a position corresponding to the first bracket portion (11) and the channel groove (200); a first feeding mechanism (51) is installed on the side of the first bracket portion (11) facing away from the second bracket portion (12); the first supporting member (41) is installed at the output end of the first feeding mechanism (51); the first feeding mechanism (51) drives the first supporting member (41) to pass through the first through hole and extend into the channel groove (200); and / or A second through hole is provided at a position corresponding to the second bracket portion (12) and the channel groove (200); a second feeding mechanism (52) is installed on the side of the second bracket portion (12) facing away from the first bracket portion (11); and the second supporting member (42) is installed at the output end of the second feeding mechanism (52); the second feeding mechanism (52) drives the second supporting member (42) to pass through the second through hole and extend into the channel groove (200).

6. The piezoelectric ceramic stack bonding device according to claim 1, wherein: The cross-sectional shape of the channel groove (200) formed by combining the second groove (221) and the first groove (211) is rectangular or circular.

7. The piezoelectric ceramic stack bonding device according to claim 1, wherein: It includes a first fixing bolt (61) and a second fixing bolt (62); A plurality of first fixing bolts (61) respectively pass through the end surfaces of the first bracket portion (11) and the second bracket portion (12) and are threadedly connected to both ends of the first fixing frame (21); A plurality of second fixing bolts (62) respectively pass through the end surfaces of the first bracket portion (11) and the second bracket portion (12) and are threadedly connected to both ends of the second fixing frame (22).

8. The piezoelectric ceramic stack bonding device according to claim 1, wherein: It comprises a retractable first spring pin (71) and a retractable second spring pin (72); The end surfaces of both ends of the first fixing frame (21) are respectively provided with first pin holes (81), and the first bracket portion (11) and the second bracket portion (12) are both installed with the first spring pins (71); when the first fixing frame (21) is installed, the first spring pins (71) at both ends are respectively inserted into the first pin holes (81) at both ends of the first fixing frame (21); The end surfaces of both ends of the second fixing frame (22) are respectively provided with second pin holes (82), and the first bracket portion (11) and the second bracket portion (12) are both installed with the second spring pins (72); after the second fixing frame (22) and the first fixing frame (21) are assembled, the second spring pins (72) at both ends are respectively inserted into the second pin holes (82) at both ends of the second fixing frame (22).

9. The piezoelectric ceramic stack bonding device according to claim 1, wherein: A drainage groove (201) is provided in both the first groove (211) of the first fixing frame (21) and the second groove (221) of the second fixing frame (22); In the first groove (211), the drainage groove (201) is provided on the surface of the first groove (211) and extends to both ends of the first groove (211); In the second groove (221), the drainage groove (201) is arranged on the surface of the second groove (221) and extends to both ends of the second groove (221).

10. The piezoelectric ceramic stack bonding device according to any one of claims 1 to 9, characterized in that: It also includes a rotating mechanism (90), the bracket (1) is mounted on the rotating mechanism (90), and the rotating mechanism (90) includes at least a first rotation angle and a second rotation angle; When the rotating mechanism (90) is at a first rotation angle, the channel groove (200) formed by the first bracket portion (11) and the second bracket portion (12) is aligned in a horizontal direction; When the rotating mechanism (90) is at a second rotation angle, the channel groove (200) formed by the first bracket portion (11) and the second bracket portion (12) is aligned in a vertical direction.

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