Ceramic electric cooker heat conduction device and electric cooker

Abstract

The utility model provides a ceramic electric cooker heat conduction device which comprises a cover body and a heat dissipation part, the face, making contact with a ceramic inner container, of the cover body is matched with and attached to the ceramic inner container in shape, a step face is arranged at the upper end of the cover body and abuts against the ceramic inner container, and the heat dissipation part is arranged on the outer side of the cover body. Due to the fact that the shape of the cover body is matched with and attached to the shape of the ceramic inner container, a closed space is formed between the cover body and the ceramic inner container, the cover body can conduct heat to the ceramic inner container evenly, and meanwhile due to the fact that the heat dissipation part is arranged on the outer side of the cover body, heat can be prevented from being directly transmitted to a shell assembly of the electric cooker, and hand scalding is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of kitchenware, and in particular to a ceramic rice cooker heat conduction device and an electric rice cooker. Background Art

[0002] Ceramic rice cookers utilize ceramic as their inner pot. The ceramic pot is naturally non-toxic and non-polluting, making the heating process healthier. Furthermore, ceramic is easy to clean, resists the accumulation of food residue, and preserves the original flavor of food. Therefore, its unique material and cooking properties have made it a popular choice among consumers.

[0003] Today's ceramic rice cookers generally include a ceramic inner pot and a heating device. The heating plate of the heating device is generally installed at the bottom of the ceramic inner pot. Due to the material properties of the ceramic inner pot, it is easy to cause uneven heating from top to bottom of the ceramic inner pot, affecting the taste of the food.

[0004] Therefore, providing a ceramic rice cooker heat conducting device and an electric rice cooker that can heat the ceramic inner container more evenly has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0005] Embodiments of the present application provide a ceramic rice cooker heat conduction device and an electric rice cooker.

[0006] The present invention provides a ceramic rice cooker heat conduction device for the ceramic inner wall of the ceramic rice cooker.

[0007] The ceramic liner is heat-conducting, comprising: a cover body and a heat dissipation part. The side of the cover body that contacts the ceramic liner is adapted to and fits the shape of the ceramic liner. The upper end of the cover body is provided with a step surface, which abuts the ceramic liner. The heat dissipation part is provided on the outside of the cover body.

[0008] In some embodiments, the heat dissipation portion extends along the outer side of the step surface toward the bottom of the cover body, and

[0009] The heat dissipation portion is parallel to the cover body.

[0010] In some embodiments, the heat dissipation portion extends from the outer edge of the cover toward the top of the cover body, and the heat dissipation portion is parallel to the cover body.

[0011] In some embodiments, there is a gap between the heat dissipation portion and the cover body.

[0012] In some embodiments, the heat dissipation portion is disposed around the outer edge of the cover.

[0013] In some embodiments, the cover body and the heat dissipation portion are integrally formed.

[0014] In some embodiments, the heat dissipation portion is mounted in cooperation with a housing assembly of the ceramic rice cooker.

[0015] In some embodiments, the heat conduction device further includes a partition plate, which is disposed at the bottom of the cover body, with a gap remaining between the partition plate and the bottom of the cover body.

[0016] In some embodiments, the heat conducting device further includes a buffer device, which is disposed between the partition plate and the bottom of the cover body.

[0017] An embodiment of the present application also provides an electric rice cooker, which includes a ceramic inner pot, a heat-conducting device, and an outer shell assembly. The ceramic inner pot is installed on the inner side of the heat-conducting device, and the outer shell assembly is installed on the outer side of the heat-conducting device. The heat-conducting device is the ceramic rice cooker heat-conducting device described in the above embodiment.

[0018] The embodiment of the application provides a ceramic rice cooker heat conduction device for the ceramic inner of the ceramic rice cooker.

[0019] The rice cooker heat conduction device comprises a cover and a heat sink. The side of the cover that contacts the ceramic inner pot is adapted and conforms to the shape of the ceramic inner pot. The upper end of the cover is provided with a stepped surface that abuts the ceramic inner pot. The heat sink is disposed on the outside of the cover. Because the cover and the ceramic inner pot are adapted and conform to each other, a sealed space is formed between the cover and the ceramic inner pot. The cover can evenly conduct heat to the ceramic inner pot. Furthermore, because the heat sink is disposed on the outside of the cover, it prevents heat from being directly transferred to the outer shell of the rice cooker, preventing burns. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0021] Figure 1 This is a schematic structural diagram of the heat conduction device for a ceramic rice cooker provided in an embodiment of the present application.

[0022] Figure 2 Another structural schematic diagram of the ceramic rice cooker heat conduction device provided in an embodiment of the present application.

[0023] Figure 3 This is a schematic diagram of the structure of a ceramic rice cooker provided in an embodiment of the present application.

[0024] 100 heat conduction device, 10 cover, 11 step surface, 12 installation step, 20 heat dissipation part, 30, gap, 40 partition plate, 50 buffer device 1000 rice cooker, 200 ceramic liner, 300 shell assembly. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0028] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0030] The embodiments of the present application provide an assembled toy house and a toy assembly.

[0031] See also Figures 1 to 2 The embodiment of the present application provides a ceramic rice cooker heat conduction device 100 for conducting heat to a ceramic inner pot of a ceramic rice cooker, comprising: a cover body 10 and a heat dissipation portion 20. The surface of the cover body 10 that contacts the ceramic inner pot is adapted to and fits the shape of the ceramic inner pot. A stepped surface 11 is provided at the upper end of the cover body 10, and the stepped surface 11 abuts against the ceramic inner pot. The heat dissipation portion 20 is provided on the outer side of the cover body 10.

[0032] The ceramic rice cooker heat conduction device 100 is designed primarily to improve uniform heating and heat dissipation efficiency within the ceramic inner pot. The side of the cover 10 that contacts the ceramic inner pot is adapted and conforms to the shape of the inner pot, ensuring no gaps between the inner pot and the cover 10, thereby improving heat transfer efficiency. The upper end of the cover 10 is provided with a stepped surface 11 that abuts the ceramic inner pot. This design facilitates heat transfer from the cover 10 to the inner pot, achieving uniform heating. The heat dissipation portion 20 is disposed on the outside of the cover 10, helping to direct heat away from the cover 10, preventing heat accumulation and improving heat dissipation efficiency. With this design, when the heating element of the heating device is energized and generating heat, the heat generated by the heating element is transferred to the bottom surface of the cover 10, and then rapidly transferred from the bottom surface to the side surfaces of the cover 10, thereby maintaining a uniform temperature throughout the entire cover 10. This allows the cover 10 to simultaneously heat both the bottom and side surfaces of the ceramic inner pot, ensuring uniform heating of the ceramic inner pot. In summary, the design of the ceramic rice cooker heat conducting device 100 aims to achieve uniform heating and effective heat dissipation of the ceramic inner pot through the cooperation of the cover 10 and the heat dissipation portion 20, thereby improving cooking efficiency and safety.

[0033] Among them, the materials that can be used for the heat-conducting device 100 are aluminum, stainless steel, and composite materials. For example, the heat-conducting device 100 uses aluminum. The advantages of using aluminum as the heat-conducting device 100 are fast heat conduction, uniform heating, easy molding, and beautiful appearance. For example, the heat-conducting device 100 uses stainless steel: the stainless steel inner liner is corrosion-resistant and does not require surface treatment and can be used directly. For example, the heat-conducting device 100 uses a composite multi-layer material: the composite multi-layer material inner liner combines the advantages of multiple materials, such as an outer aluminum and inner steel composite plate inner liner, which not only meets the requirement that the inner surface is stainless steel, but also uses the overall heat-equalizing effect of aluminum to improve the thermal conductivity of stainless steel. Some composite inner liners are treated with glass microspheres or ceramic microspheres in the external coating for heat insulation treatment to reduce heat loss to the outside and save energy.

[0034] In some embodiments, the heat dissipation portion 20 extends along the outer side of the step surface 11 toward the bottom of the cover body 10, and

[0035] The heat dissipation portion 20 is parallel to the cover body 10 .

[0036] The heat dissipation unit 20 is parallel to the housing 10. This parallel structure helps maintain uniform and continuous heat transfer, preventing localized heat accumulation during heat transfer, thereby improving heat dissipation efficiency. The main function of the heat dissipation unit 20 is to effectively conduct and dissipate heat generated by the housing 10 and the ceramic inner pot during heating, thereby maintaining the temperature of the rice cooker's outer shell within a safe range and preventing overheating.

[0037] In some embodiments, the heat dissipation portion 20 extends from the outer edge of the cover body 10 to the top of the cover body 10 , and the heat dissipation portion 20 is parallel to the cover body 10 .

[0038] The heat dissipation unit 20 is parallel to the housing 10. This parallel structure helps maintain uniform and continuous heat transfer, preventing localized heat accumulation during heat transfer, thereby improving heat dissipation efficiency. The main function of the heat dissipation unit 20 is to effectively conduct and dissipate heat generated by the housing 10 and the ceramic inner pot during heating, thereby maintaining the temperature of the rice cooker's outer shell within a safe range and preventing overheating.

[0039] In some embodiments, a gap 30 is defined between the heat dissipation portion 20 and the cover body 10 .

[0040] The gap 30 between the heat dissipation portion 20 and the cover 10 can increase air flow, thereby improving heat dissipation efficiency. This design allows air to circulate between the heat dissipation portion 20 and the cover 10, helping to dissipate the heat generated by the cover 10 and the ceramic inner pot during the heating process. By providing a gap 30 between the heat dissipation portion 20 and the cover 10, the heat dissipation efficiency can be effectively improved. This design allows heat to be quickly dissipated through the heat dissipation portion 20, reducing the temperature of the outer shell components during operation of the rice cooker and improving its safety.

[0041] In some embodiments, the heat dissipation portion 20 is disposed around the outer edge of the cover body 10 .

[0042] The heat dissipation portion 20 is disposed around the outer edge of the cover 10 to increase the heat dissipation area, thereby improving heat dissipation efficiency. The larger the heat dissipation area, the more conducive to heat dissipation, which helps to maintain the temperature of the rice cooker housing assembly within a safe range.

[0043] In some embodiments, the cover body 10 and the heat dissipation portion 20 are integrally formed.

[0044] The heat dissipation portion 20 and the cover 10 are integrally formed, ensuring overall structural stability, avoiding gaps between components, and improving overall durability and reliability. The integrally formed design further reduces the overall thickness, making the rice cooker more compact and space-saving.

[0045] In some embodiments, the heat dissipation portion 20 is mounted in cooperation with a housing assembly of the ceramic rice cooker.

[0046] Among them, the design of the installation step 12 allows the cover body 10 to be easily fixed and installed with the outer shell assembly of the ceramic rice cooker. This step surface 11 provides a clear installation interface to ensure that the connection between the cover body 10 and the outer shell assembly is both firm and reliable. By connecting the installation step 12 to the outer shell assembly, the structural stability of the entire rice cooker can be enhanced. This design helps to disperse and withstand the forces that may be generated during use, reducing damage caused by thermal expansion or mechanical vibration. The design of the installation step 12 may also take into account the efficiency of heat conduction. The step surface 11 can serve as a heat conduction interface to help transfer heat from the cover body 10 to the outer shell assembly, thereby achieving more uniform heat distribution. The design of the installation step 12 can also improve safety in use. By ensuring a tight connection between the cover body 10 and the outer shell assembly, heat loss from the connection can be reduced, reducing the risk of burns.

[0047] In some embodiments, the heat conducting device 100 further includes a partition plate 40 , which is disposed at the bottom of the cover body 10 , with a gap remaining between the partition plate and the bottom of the cover body 10 .

[0048] The spacer 40 is positioned at the bottom of the housing 10, with a gap between it and the bottom. This design helps improve thermal efficiency and uniformity. The spacer 40 reduces heat loss directly from the bottom of the housing 10 while allowing heat to transfer upward through the gap between the spacer 40 and the housing 10, resulting in more uniform heating of the ceramic liner.

[0049] In some embodiments, the heat conducting device 100 further includes a buffer device 50 , which is disposed between the partition plate 40 and the bottom of the cover body 10 .

[0050] The buffer device 50 is arranged between the partition plate 40 and the bottom of the cover body 10. Its main function is to provide buffering when the ceramic inner pot is placed in the heat-conducting pot, thereby reducing the impact and vibration caused by improper placement or sudden release.

[0051] See also Figure 3 The embodiment of the present application further provides an electric rice cooker 1000, which includes a ceramic inner pot 200, a heat-conducting device 100, and a shell assembly 300. The ceramic inner pot 200 is installed on the inner side of the heat-conducting device 100, and the shell assembly 300 is installed on the outer side of the heat-conducting device 100. The heat-conducting device 100 is the ceramic electric rice cooker 1000 described in the above embodiment.

[0052] The housing assembly 300 includes a heating device for generating heat. The heating device conducts heat to the ceramic liner 200 through the heat conducting device 100 .

[0053] The ceramic inner pot 200 is the core component of the rice cooker 1000, used to directly hold and heat food. The ceramic inner pot 200 has excellent heat preservation and even heating properties, helping to preserve the nutritional content and taste of food.

[0054] Heat conducting device 100: According to the aforementioned embodiment, the heat conducting device 100 comprises a cover, a heat dissipating portion, a spacer, and a buffer device. These components work together to achieve efficient and uniform heating of the rice cooker 1000.

[0055] Cover body: It is adapted to and fits the shape of the ceramic liner 200, and has a stepped surface at the upper end to abut against the liner.

[0056] Heat dissipation part: It is located on the outer edge of the cover to help improve heat dissipation efficiency.

[0057] Partition plate: It is set at the bottom of the cover body, leaving a gap between it and the bottom of the cover body to improve thermal efficiency and uniformity.

[0058] Buffer device: set between the partition plate and the bottom of the cover to provide buffering and stability.

[0059] Housing assembly 300: Attached to the exterior of heat conduction device 100, it protects internal components, provides an operational interface, and maintains the overall appearance. Housing assembly 300 typically includes a top cover, base, and side panels. These components not only protect the internal circuitry and heating elements but also provide user interfaces such as a control panel and display.

[0060] The design of this rice cooker 1000 takes into account thermal efficiency, uniform heating, safety, and user convenience. The excellent heat retention and uniform heating characteristics of the ceramic inner pot 200, combined with the efficient heat dissipation and buffering design of the heat conduction device 100, enable this rice cooker 1000 to provide better cooking results and user experience. The outer shell assembly 300 ensures the durability and user-friendliness of the rice cooker 1000. Overall, this design aims to provide users with an efficient, safe, and easy-to-use cooking tool.

[0061] The application embodiment provides a heat conduction device 100 for a ceramic rice cooker 1000, which is used to conduct heat to the ceramic inner pot of the ceramic rice cooker 1000. The device comprises a cover and a heat dissipation portion. The side of the cover that contacts the ceramic inner pot 200 is adapted and fits the shape of the ceramic inner pot 200. The upper end of the cover is provided with a stepped surface that abuts the ceramic inner pot 200. The heat dissipation portion is provided on the outside of the cover. Because the cover and the ceramic inner pot 200 are adapted and fit together, a closed space is formed between the cover and the ceramic inner pot 200. The cover can evenly conduct heat to the ceramic inner pot 200. At the same time, because the heat dissipation portion is provided on the outside of the cover, it can prevent heat from being directly transferred to the outer shell assembly 300 of the rice cooker 1000, thereby preventing burns.

[0062] The above describes in detail the ceramic electric rice cooker heat conduction device and electric rice cooker provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to facilitate understanding of the present application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation methods and scope of application are possible based on the principles of the present application. In summary, this specification should not be construed as limiting the present application.

Claims

1. A ceramic rice cooker heat conduction device for conducting heat to a ceramic inner pot of a ceramic rice cooker, characterized in that: include: The cover body, the side of the cover body contacting the ceramic liner is adapted to the shape of the ceramic liner and is close to the ceramic liner. The upper end of the cover body is provided with a step surface, and the step surface abuts against the ceramic liner; The heat dissipation portion is arranged outside the cover body.

2. A ceramic rice cooker heat conducting device according to claim 1, characterized in that: The heat dissipation portion extends along the outer side of the step surface toward the bottom of the cover body, and the heat dissipation portion is parallel to the cover body.

3. A ceramic rice cooker heat conducting device according to claim 1, characterized in that: The heat dissipation portion extends from the outer edge of the cover toward the top of the cover body, and the heat dissipation portion is parallel to the cover body.

4. A ceramic rice cooker heat conducting device according to claim 2 or 3, characterized in that: A gap is formed between the heat dissipation portion and the cover body.

5. A ceramic rice cooker heat conducting device according to claim 4, characterized in that: The heat dissipation portion is disposed around the outer edge of the cover.

6. The ceramic rice cooker heat conducting device according to claim 4, characterized in that: The cover body and the heat dissipation portion are integrally formed.

7. The ceramic rice cooker heat conducting device according to claim 1, characterized in that: The heat dissipation part is mounted in cooperation with the outer shell component of the ceramic rice cooker.

8. The ceramic rice cooker heat conducting device according to claim 1, characterized in that: It also includes a partition plate, which is arranged at the bottom of the cover body, and a gap is left between the partition plate and the bottom of the cover body.

9. The ceramic rice cooker heat conducting device according to claim 8, characterized in that: It also includes a buffer device, which is arranged between the partition plate and the bottom of the cover body.

10. An electric rice cooker, characterized in that: The invention comprises a ceramic inner pot, a heat conducting device and an outer shell component, wherein the ceramic inner pot is installed inside the heat conducting device, and the outer shell component is installed outside the heat conducting device. The heat conducting device is the ceramic rice cooker heat conducting device according to any one of claims 1 to 9.

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