Dry-cold cleaning device for semiconductor parts

Abstract

The utility model discloses a dry and cold cleaning device for semiconductor parts, which belongs to the technical field of cleaning of semiconductor parts and comprises a box body, a cleaning device, a cleaning device and a control device, and is characterized in that the box body is used for dry and cold cleaning of the semiconductor parts; the placing plate slides in the box body and is used for placing semiconductor parts needing to be cleaned; the dust blowing assembly comprises an air blowing pipe which is rotationally connected into the box body and used for blowing air; the swinging assembly comprises a first bevel gear which is fixedly connected to the air blowing pipe and used for driving the air blowing pipe to swing; the closing assembly comprises a door plate which is slidably connected into the box body and used for closing one side of the box body, a motor is started to drive a semi-bevel gear to continuously rotate, and a blowing pipe can be driven to rotate in a reciprocating mode under the action of a second bevel gear and a first bevel gear, so that dust on semiconductor parts is completely blown downwards from through holes, and the dust removal efficiency is improved. And in addition, the pull block is fixed through the two sets of hooks, operation is easy and fast, and the situation that workers are hurt due to nitrogen leakage can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component cleaning, in particular to a dry cooling cleaning device for semiconductor components. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Semiconductor parts often have high requirements for cleanliness, surface uniformity, and process stability. Tiny impurities and dust, and uneven particle size will affect the performance of semiconductors, so semiconductors need to be cleaned frequently.

[0003] Most existing cleaning devices are inconvenient to clean the dust generated after cleaning in a timely manner, which easily causes the dust to float and cause secondary contamination of semiconductors. In addition, when cleaning multiple workpieces at the same time, it is inconvenient to fix and place the semiconductors, affecting work efficiency.

[0004] In order to solve the above problems, after searching, the existing published patent (application number: CN202221710629.1) is a dry cold cleaning device for semiconductor components. The article proposes "including a cleaning device body, a temporary storage box fixedly connected to the top of the cleaning chamber of the cleaning device body, a liquid nitrogen box and a blower box are provided on the top of the temporary storage box, and the output ends of the liquid nitrogen box and the blower box are connected to connecting pipes, and a solenoid valve is provided in the middle of the connecting pipe. The utility model first injects liquid nitrogen into the interior of the temporary storage box through the liquid nitrogen tank, and sprays it on the surface of the workpiece through the small holes at the bottom of the temporary storage box, so that the workpiece is instantly cooled and the dust on the surface of the workpiece can fall off. By starting the blower, cold air is injected into the interior of the temporary storage box and blown onto the surface of the workpiece to blow off the dust. The blown dust and the used liquid nitrogen are also extracted by the exhaust fan, thereby improving the cleaning effect, improving the use effect, and avoiding dust floating and secondary pollution of the semiconductor."

[0005] During use, cold air is injected into the temporary storage box through the blower box to blow off the dust on the surface of the workpiece. However, the position of the air outlet is fixed, and the dust cannot be blown off completely when there are many workpieces. Therefore, it has certain limitations when used, affecting the cleaning effect. Utility Model Content

[0006] The utility model solves the technical problems in the above-mentioned background technology and provides a dry cooling cleaning device for semiconductor components.

[0007] In order to solve the above technical problems, the technical solutions provided by the present invention are as follows:

[0008] A dry cooling cleaning device for semiconductor components, comprising:

[0009] The box is used for dry and cold cleaning of semiconductor components;

[0010] A placement plate is slid inside the box to place semiconductor components that need to be cleaned;

[0011] A dust blowing assembly includes a blowing pipe rotatably connected to the box body for blowing air;

[0012] The swing assembly includes a first bevel gear fixed to the blowing pipe and used to drive the blowing pipe to swing;

[0013] The closing assembly comprises a door panel which is slidably connected to the box body and is used for closing one side of the box body.

[0014] Preferably, a nitrogen inlet pipe for connecting liquid nitrogen is fixedly connected to the top of the box body, an exhaust pipe for discharging liquid nitrogen and dust is fixedly connected to the bottom of one side of the box body, a slot for inserting a placement plate is provided in the box body, and a through hole for dust and nitrogen to pass through is provided on the placement plate.

[0015] Preferably, the dust blowing assembly further comprises:

[0016] The blower box is fixed to the top of the box body and connected to the blower pipe through a hose;

[0017] The blowing head is fixed to the bottom of the blowing pipe and is used to blow dust off semiconductor components.

[0018] Preferably, the blowing heads are provided in three groups and are evenly distributed on the blowing pipe, and the blowing pipe is located above the placement plate.

[0019] Preferably, the swing assembly further comprises:

[0020] The second bevel gear is fixed to the air blowing pipe and is symmetrically arranged with the first bevel gear;

[0021] The half bevel gear is rotatably connected to the housing and meshes with the first bevel gear and the second bevel gear;

[0022] The motor is fixed to the top of the box body and the semi-bevel gear is fixed to the output end of the motor.

[0023] Preferably, the semi-bevel gear is located above the blowing pipe, and the semi-bevel gear is located between the second bevel gear and the first bevel gear.

[0024] Preferably, the closure assembly further comprises:

[0025] A pull block is fixed to the top of the door panel and is used to pull the door panel upward;

[0026] The hook is rotatably connected to the box body and is used to limit the pulling block.

[0027] Preferably, the door panel is L-shaped, the hooks are provided in two groups and are located on both sides of the pull block, and one end of the hook is attached to the bottom of the pull block.

[0028] With the above structure, the utility model has the following advantages:

[0029] By starting the motor to drive the semi-bevel gear to rotate continuously, and under the action of the second bevel gear and the first bevel gear, the blowing pipe can be driven to rotate back and forth, thereby completely blowing the dust on the semiconductor components downward from the through-hole, thereby improving the cleaning efficiency. The pulling block is fixed by two sets of hooks, and the operation is simple and quick, which can prevent nitrogen leakage from causing harm to workers.

[0030] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 This is a cross-sectional view of a dry cooling cleaning device for semiconductor components according to the present invention;

[0033] Figure 2 This is a schematic diagram of the mechanism of a dry cooling cleaning device for semiconductor components of the present invention;

[0034] Figure 3 This is a schematic diagram of a second state of a dry cooling cleaning device for semiconductor components according to the present invention;

[0035] Figure 4 yes Figure 1 A magnified view of point A in the figure;

[0036] Figure 5 yes Figure 2 Enlarged view of point B in .

[0037] As shown in the figure: 1. Box body; 101. Nitrogen inlet pipe; 102. Exhaust pipe; 103. Slot; 2. Placement plate; 201. Through hole; 301. Blowing box; 302. Blowing pipe; 303. Blowing head; 401. First bevel gear; 402. Second bevel gear; 403. Half bevel gear; 404. Motor; 501. Door panel; 502. Pull block; 503. Hook. DETAILED DESCRIPTION

[0038] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0040] The following is a further detailed description of the present invention in conjunction with the full text:

[0041] Example 1:

[0042] Combined with attachment Figures 1 to 5 The present embodiment provides a dry cold cleaning device for semiconductor components, comprising a box body 1 for performing dry cold cleaning on semiconductor components, and a placement plate 2 that slides in the box body 1 for placing semiconductor components to be cleaned. A nitrogen inlet pipe 101 for connecting to liquid nitrogen is fixedly connected to the top of the box body 1, and an exhaust pipe 102 for discharging liquid nitrogen and dust is fixedly connected to the bottom of one side of the box body 1. A slot 103 for inserting the placement plate 2 is provided in the box body 1, and a through hole 201 for passing dust and nitrogen is provided on the placement plate 2.

[0043] In order to blow away the dust in the box body 1 after the dry-cold cleaning is completed, a dust removal component is arranged. The dust blowing component includes a blowing pipe 302 rotatably connected to the box body 1 for blowing air.

[0044] As a preferred embodiment, the dust blowing assembly also includes: a blower box 301, fixed to the top of the box body 1 and connected to the blowing pipe 302 through a hose; a blowing head 303, fixed to the bottom of the blowing pipe 302 for blowing dust off semiconductor components.

[0045] As a preferred embodiment, the blowing heads 303 are provided in three groups and are evenly distributed on the blowing pipe 302 , and the blowing pipe 302 is located above the placement plate 2 .

[0046] It should be noted that the exhaust pipe 102 is connected to the exhaust fan. When blowing dust, the dust will be blown into the bottom of the placement plate 2 through the through hole 201 and discharged through the exhaust pipe 102. At the same time, the liquid nitrogen in the box 1 will be discharged through the exhaust pipe 102.

[0047] Example 2:

[0048] On the basis of Example 1, in order to evenly blow away the dust from the semiconductor components placed on 2, a swing assembly is arranged, which includes a first bevel gear 401 fixed to the blowing pipe 302 for driving the blowing pipe 302 to swing.

[0049] As a preferred embodiment, the swing assembly also includes: a second bevel gear 402, fixedly connected to the blowing pipe 302 and symmetrically arranged with the first bevel gear 401; a half bevel gear 403, rotatably connected to the box body 1 and meshing with the first bevel gear 401 and the second bevel gear 402; a motor 404, fixedly connected to the top of the box body 1 and the half bevel gear 403 fixedly connected to the output end of the motor 404.

[0050] As a preferred embodiment, the half bevel gear 403 is located above the blowing pipe 302 , and the half bevel gear 403 is located between the second bevel gear 402 and the first bevel gear 401 .

[0051] It should be noted that when the semi-bevel gear 403 rotates and engages with the first bevel gear 401, it will drive the first bevel gear 401 to rotate and then drive the blowing pipe 302 to rotate. Then, when it engages with the second bevel gear 402, it will drive the blowing pipe 302 to rotate in the opposite direction, realizing the reciprocating rotation of the blowing pipe 302, and then making the blowing head 303 evenly blow away the dust on the semiconductor components.

[0052] Example 3:

[0053] On the basis of Example 1 and Example 2, a closing assembly is arranged to ensure the sealing of the box 1 for cleaning semiconductor components. The closing assembly includes a door panel 501 slidably connected to the box 1 for closing one side of the box 1.

[0054] As a preferred embodiment, the closing assembly further includes: a pull block 502 fixed to the top of the door panel 501 for pulling the door panel 501 upward; a hook 503 rotatably connected to the box body 1 for limiting the pull block 502 .

[0055] As a preferred embodiment, the door panel 501 is L-shaped, two groups of hooks 503 are provided and are located on both sides of the pull block 502 , and one end of the hook 503 is attached to the bottom of the pull block 502 .

[0056] It should be noted that the L-shaped door panel 501 prevents it from completely sliding into the mounting groove, making it easier to pull. A sealing strip is provided on the top of the door panel 501 to enhance the seal and prevent liquid nitrogen leakage. When the door panel 501 is pulled to the top, the bottom of the door panel 501 remains in the mounting groove, and the placement plate 2 is attached to the inner side of the door panel 501.

[0057] The operation steps are as follows: insert the placement plate 2 for placing semiconductor components into the slot 103 in the box body 1, then pull the pull block 502 to drive the door panel 501 to move upward until the opening side of the box body 1 is sealed, and then rotate the two sets of hooks 503 to fit the bottom of the pull block 502 to fix the door panel 501, and inject liquid nitrogen into the box body 1 through the motor 404 to cool the semiconductor components so that dust on the surface of the semiconductor components can fall off, and then stop injecting liquid nitrogen, start the blower box 301 to blow air from the blowing head 303 through the hose and the blowing pipe 302, at this time start the motor 404 to drive the semi-bevel gear 403 to rotate, and drive the blowing pipe 302 to rotate back and forth in the box body 1 through the first bevel gear 401 and the second bevel gear 402, evenly blow away the dust on the semiconductor components, and fall below through the through hole 201 on the placement plate 2, and finally the dust and liquid nitrogen are discharged from the exhaust pipe 102.

[0058] The above description of the present invention and its embodiments is non-limiting. What is shown in the full text is only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to the technical solution without creatively designing, they shall fall within the scope of protection of the present invention.

Claims

1. A dry cooling cleaning device for semiconductor components, characterized in that: include: A box (1) is used for performing dry and cold cleaning on semiconductor components; A placement plate (2) is slidably mounted in the box (1) and is used to place semiconductor components that need to be cleaned; A dust blowing assembly includes a blowing pipe (302) rotatably connected to the box (1) for blowing air; The swing assembly comprises a first bevel gear (401) fixedly connected to the blowing pipe (302) and used for driving the blowing pipe (302) to swing; The closing assembly comprises a door panel (501) slidably connected to the box body (1) for closing one side of the box body (1).

2. The dry cooling cleaning device for semiconductor components according to claim 1, characterized in that: A nitrogen inlet pipe (101) for connecting to liquid nitrogen is fixedly connected to the top of the box (1), an exhaust pipe (102) for discharging liquid nitrogen and dust is fixedly connected to the bottom of one side of the box (1), a slot (103) for inserting a placement plate (2) is provided in the box (1), and a through hole (201) for passing dust and nitrogen is provided on the placement plate (2).

3. The dry cooling cleaning device for semiconductor components according to claim 2, characterized in that: The dust blowing assembly also includes: A blower box (301) is fixed to the top of the box body (1) and connected to the blower pipe (302) via a hose; The blowing head (303) is fixedly connected to the bottom of the blowing pipe (302) and is used for blowing dust off semiconductor components.

4. The dry cooling cleaning device for semiconductor components according to claim 3, characterized in that: The blowing heads (303) are provided in three groups and are evenly distributed on the blowing pipe (302), and the blowing pipe (302) is located above the placement plate (2).

5. The dry cooling cleaning device for semiconductor components according to claim 4, characterized in that: The swing assembly further comprises: The second bevel gear (402) is fixed to the blowing pipe (302) and is symmetrically arranged with the first bevel gear (401); A half bevel gear (403) is rotatably connected to the housing (1) and meshes with the first bevel gear (401) and the second bevel gear (402); The motor (404) is fixed to the top of the box (1) and the semi-bevel gear (403) is fixed to the output end of the motor (404) 6. The dry cooling cleaning device for semiconductor components according to claim 5, characterized in that: The semi-bevel gear (403) is located above the blowing pipe (302), and the semi-bevel gear (403) is located between the second bevel gear (402) and the first bevel gear (401).

7. The dry cooling cleaning device for semiconductor components according to claim 6, characterized in that: The closure assembly further comprises: A pulling block (502) is fixed to the top of the door panel (501) and is used to pull the door panel (501) upward; The hook (503) is rotatably connected to the box body (1) and is used to limit the pulling block (502).

8. The dry cooling cleaning device for semiconductor components according to claim 7, characterized in that: The door panel (501) is L-shaped, and two groups of hooks (503) are provided and located on both sides of the pull block (502). One end of the hook (503) is attached to the bottom of the pull block (502).

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