Diamond tool bit capable of keeping cutting face sharp

Abstract

The utility model belongs to the technical field of diamond tool bits, and particularly relates to a diamond tool bit capable of keeping a cutting surface sharp, which comprises arrayed diamond particle layers, adjacent diamond particle layers are fixedly connected through connecting layers formed by matrix binding agents, the top ends of the diamond particle layers are M-shaped, and the lower ends of the diamond particle layers are rectangular. A V-shaped groove is formed in the middle of the top end of the diamond particle layer, two grooves are formed in the lower end of the diamond particle layer corresponding to two sharp corners of the M shape at the top end, and the top ends of the grooves are higher than the bottom end of the V-shaped groove; the connecting layers are fixedly connected with the diamond particle layers in a sintering mode, the top faces of the connecting layers are upwards-protruding arcs or planes, the top faces of the connecting layers are lower than the bottom ends of the V-shaped grooves, and every two adjacent diamond particle layers and the lower connecting layer form a chip removal groove; the diamond particle layer can be divided into three sections through the grooves after the tip end of the diamond particle layer is abraded, the contact area between the diamond particle layer and a cut material is small, resistance borne by the diamond particle layer is small, and therefore the effect of keeping the sharpness of a cutting face is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of diamond tool bits, and in particular relates to a diamond tool bit capable of keeping a sharp cutting surface. Background Art

[0002] The diamond segment is the working body of the diamond saw blade. The segment of the diamond saw blade is composed of diamond and matrix binder. Diamond is a superhard material that acts as a cutting edge. The matrix binder plays the role of fixing diamond. It is composed of metal element powder or metal alloy powder. Diamond particles are fixed on the metal powder to form a thin sheet as a working layer to perform grinding. The metal powder and the like serve as the matrix binder as the non-working layer. The diamond sheet itself is also worn during the grinding process, and its height is constantly decreasing. The matrix binder is slowly reduced during the process of grinding debris and liquid flushing, so that the diamond sheet is continuously higher than the non-working layer formed by the matrix binder, so that the diamond sheet can continue to grind, and the debris in the process can also fall out from the gap between the diamond sheet and the non-working layer. However, during the continuous working process of the diamond sheet, the originally sharp tip will be flattened, making the diamond sheet gradually flat and the sharpness reduced. Utility Model Content

[0003] In response to the problems of the existing technology, the utility model provides a diamond cutter head that keeps the cutting surface sharp. After the tip of the diamond particle layer is worn, the diamond particle layer can be separated into three sections by grooves. The diamond particle layer has a small contact area with the cut material and withstands little resistance, thereby achieving the effect of maintaining the sharpness of the cutting surface.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A diamond bit for maintaining a sharp cutting surface comprises an array of diamond particle layers, wherein adjacent diamond particle layers are fixedly connected by a connecting layer formed by a matrix binder, and is characterized in that:

[0006] The diamond particle layer has an "M"-shaped top and a rectangular bottom. The middle of the top of the diamond particle layer is a V-shaped groove. The bottom of the diamond particle layer has two grooves corresponding to the two sharp corners of the top M shape. The top of the groove is higher than the bottom of the V-shaped groove.

[0007] The connecting layer is sintered and fixedly connected to the diamond particle layer, and its top surface is an upwardly convex arc or plane, and the top surface is lower than the bottom end of the V-shaped groove. The two adjacent diamond particle layers and the lower connecting layer form a chip groove.

[0008] The diamond segment is welded and mounted on the saw blade. As the saw blade rotates, the M-shaped structure of the diamond particle layer first contacts the material being cut. After long-term use, the diamond particle layer wears out and the M-shaped sharp-angle structure is gradually smoothed. At this time, the diamond particle layer is divided into three sections by grooves, which reduces the contact area between the diamond particle layer and the material being cut, and reduces the resistance during cutting, keeping the cutting surface of the diamond segment sharp. The top surface of the connecting layer is arc-shaped or flat. The arc-shaped structure makes it easier for the cut material debris and other debris in the middle section of the chip groove to fall out from both ends along the connecting layer.

[0009] Preferably, when the connecting layer is a plane, the edges thereof are chamfered.

[0010] Preferably, the cross section of the connecting layer is a downwardly concave arc surface.

[0011] The cross section of the connecting layer is a downwardly concave arc surface, which makes the chip groove form a concave bottom structure, increasing the chip groove capacity. At the same time, the higher sides of the arc surface can connect the diamond particle layers on both sides, avoiding the blade being too high to affect the strength.

[0012] Preferably, the top of the diamond particle layer is 3-5 mm higher than the top of the connecting layer.

[0013] Preferably, the connecting layer has a thickness of 1.3 mm to 1.5 mm.

[0014] Preferably, the angle of the tip of the diamond particle layer is α, 105°<α<135°.

[0015] Preferably, the angle α is 120°.

[0016] The beneficial effects of the present invention are as follows: the diamond cutter head of the present invention is fixedly welded on the saw blade. When in use, the M-shaped structure at the top of the diamond particle layer contacts the material to be cut, and the diamond cutter head is sharper due to its own pointed structure. After the saw blade is used for a long time, the top of the diamond particle layer wears away and becomes flat. When the diamond particle layer wears to the top of the groove, the groove separates the diamond particle layer into three sections, reducing the contact area between the diamond particle layer and the material to be cut, reducing the resistance to extraction, and keeping the cutting surface of the diamond cutter head sharp. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the front structure of a diamond bit for maintaining a sharp cutting surface in an embodiment;

[0018] Figure 2 Schematic diagram of the axial structure of the diamond bit for maintaining a sharp cutting surface in an embodiment;

[0019] Figure 3Schematic diagram of the side structure of a diamond bit with an arc-shaped top surface of the connecting layer to maintain a sharp cutting surface in an embodiment;

[0020] Figure 4 Schematic diagram of the cross-sectional structure of a diamond bit with an arc-shaped top surface of the connecting layer to maintain a sharp cutting surface in an embodiment;

[0021] Figure 5 Schematic diagram of the axial structure of a diamond bit with an arc-shaped top surface of the connecting layer to maintain a sharp cutting surface in an embodiment;

[0022] Figure 6 This is a schematic structural diagram of the sharp corner of the diamond bit for maintaining a sharp cutting surface in an embodiment when not in use;

[0023] Figure 7 Schematic diagram of the structure of the diamond bit after the sharp corners that keep the cutting surface sharp are worn in the embodiment.

[0024] In the figure: 1, diamond particle layer; 101, V-shaped groove; 102, sharp corner; 103, groove; 2, connecting layer; 201, arc surface; 3, chip groove. DETAILED DESCRIPTION

[0025] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0026] Specific implementation examples Figure 1 、 2 As shown in Figures 3, 4, 5, 6 and 7, a diamond blade head for maintaining a sharp cutting surface comprises an array of diamond particle layers 1, adjacent diamond particle layers 1 are fixedly connected by a connecting layer 2 formed by a matrix binder, and is characterized in that:

[0027] The diamond particle layer 1 has an M-shaped top and a rectangular bottom. A V-shaped groove 101 is formed in the middle of the top of the diamond particle layer 1. Two grooves 103 are formed at the bottom of the diamond particle layer 1 corresponding to the two sharp corners 102 of the M-shaped top. The top of the groove 103 is higher than the bottom of the V-shaped groove 101.

[0028] The connecting layer 2 is sintered and fixedly connected to the diamond particle layer 1 , and its top surface is an upwardly convex arc or plane, and the top surface is lower than the bottom end of the V-shaped groove 101 . Two adjacent diamond particle layers 1 and the lower connecting layer 2 form a chip groove 3 .

[0029] In order to speed up the discharge of debris from the chip removal groove 3, when the connecting layer 2 is a plane, the edge thereof is a chamfered structure.

[0030] like Figure 2 、 3 As shown in Figures 5 and 5 , the cross section of the connecting layer 2 is a downwardly concave arc surface 201 .

[0031] The top of the diamond particle layer 1 is 3-5 mm higher than the top of the connecting layer 2 .

[0032] The connecting layer 2 has a thickness of 1.3 mm to 1.5 mm.

[0033] The angle of the top corner 102 of the diamond particle layer 1 is α, 105°<α<135°.

[0034] The angle of the tip of the diamond particle layer is α, and α is 120°.

[0035] Working principle: The diamond cutter head of this scheme adopts sintering to fix the diamond particle layer 1 and the connecting layer 2, and the diamond cutter head is welded to the saw blade. When the saw blade rotates, the material is cut. The top of the diamond particle layer 1 is an "M"-shaped structure. The "M"-shaped sharp angle bevel of the diamond particle layer 1 serves as the main cutting surface to contact the cut material for grinding and cutting. The debris generated during the grinding and cutting process falls out through the chip groove 3 formed by the top surface of the diamond particle layer 1 and the connecting layer 2; after continuous use of the diamond saw blade, the "M"-shaped structure of the top of the diamond particle layer 1 will wear out, and the sharp corner 102 of the M-shaped structure will gradually be smoothed. After the sharp corner 102 of the diamond particle layer 1 is smoothed, the groove 103 is exposed. The groove 103 separates the diamond particle layer 1. The top surface of the separated diamond particle layer 1 serves as the main cutting surface, which reduces the contact area between the diamond particle layer 1 and the cut material, reduces the resistance, and keeps the diamond cutter head sharp.

[0036] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. A diamond bit for maintaining a sharp cutting surface, comprising an array of diamond particle layers (1), adjacent diamond particle layers (1) being fixedly connected by a connecting layer (2) formed by a matrix binder, characterized in that: The diamond particle layer (1) has an "M"-shaped top and a rectangular bottom. The middle of the top of the diamond particle layer (1) is a V-shaped groove (101). Two grooves (103) are formed at the bottom of the diamond particle layer (1) corresponding to the two sharp corners (102) of the top M. The top of the groove (103) is higher than the bottom of the V-shaped groove (101). The connecting layer (2) is sintered and fixedly connected to the diamond particle layer (1), and its top surface is an upwardly convex arc or plane, and the top surface is lower than the bottom end of the V-shaped groove (101). Two adjacent diamond particle layers (1) and the lower connecting layer (2) form a chip groove (3).

2. A diamond bit for maintaining a sharp cutting surface according to claim 1, characterized in that: When the connecting layer (2) is a plane, the edges thereof are chamfered.

3. The diamond segment for maintaining a sharp cutting surface according to claim 1, characterized in that: The cross section of the connecting layer (2) is a downwardly concave arc-shaped surface (201).

4. The diamond bit for maintaining a sharp cutting surface according to claim 1, characterized in that: The top of the diamond particle layer (1) is 3-5 mm higher than the top of the connecting layer (2).

5. The diamond segment for maintaining a sharp cutting surface according to claim 1, characterized in that: The connecting layer (2) has a thickness of 1.3 mm to 1.5 mm.

6. The diamond bit for maintaining a sharp cutting surface according to claim 1, characterized in that: The angle of the top tip (102) of the diamond particle layer (1) is α, 105°<α<135°.

7. A diamond segment for maintaining a sharp cutting surface according to claim 6, characterized in that: The angle α is 120°.

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