High-precision micro-nano electronic component laser etching processing equipment

Abstract

The utility model relates to the technical field of electronic component processing, and discloses high-precision micro-nano electronic component laser etching processing equipment, which comprises a main body mechanism and an adjusting mechanism, and the adjusting mechanism is positioned at the upper end of the main body mechanism. According to the high-precision micro-nano electronic component laser etching processing equipment, through installation of the main body mechanism, a clamping plate is pushed through an electric push rod during processing, circuit boards of different sizes can be fixed conveniently, and through arrangement of a buffer pad, the force during fixing can be buffered conveniently, and the circuit boards are prevented from being damaged; the circuit board is etched through the laser etcher, and finally the negative pressure fan is started, so that the negative pressure fan sucks away harmful gas generated during etching through the air pipe and discharges the harmful gas into the filter box for filtering, the problem that the harmful gas is sucked by workers to affect health can be effectively avoided, and the use effect is improved; and the practicability of the laser etching processing equipment for the high-precision micro-nano electronic component is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component processing, in particular to high-precision laser etching processing equipment for micro-nano electronic components. Background Art

[0002] Over the past 50 years, the advancement of micro-nano processing technology has greatly promoted the development of microelectronics and optoelectronics. The development of microelectronics is represented by ultra-large-scale integrated circuits, and the integration level has doubled every 18 months, making it possible for integrated circuit chips with a minimum circuit size of 90nm to begin mass production. Planar processing technology based on lithography and etching has become the technical core of ultra-large-scale integrated circuits.

[0003] Some existing patented technologies are not convenient for fixing circuit boards of different sizes when used, and harmful gases are generated during laser etching. These gases will affect the health of workers after being inhaled, reducing the effectiveness of use. Utility Model Content

[0004] The purpose of the utility model is to provide a high-precision laser etching processing equipment for micro-nano electronic components to solve the problems raised in the above-mentioned background technology that it is inconvenient to fix circuit boards of different sizes during use, and that harmful gases are generated during laser etching, which can affect the health of workers after being inhaled, thereby reducing the use effect.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-precision laser etching processing device for micro-nano electronic components, comprising a main body mechanism and an adjustment mechanism, wherein the adjustment mechanism is located at the upper end of the main body mechanism, the main body mechanism comprising a support frame, a processing table and a control panel, wherein the processing table is fixedly mounted at the upper end of the support frame, and the control panel is fixedly mounted at the outer end of the processing table;

[0006] Preferably, the main body mechanism also includes a slide rail, a movable slide, a laser etcher, a fixed component, a negative pressure fan, an air duct and a filter box, the slide rail is fixedly mounted on the upper end of the processing table, the movable slide is movably connected to the outer end of the slide rail, the laser etcher is fixedly mounted in front of the movable slide, the fixed component is fixedly mounted on the upper end of the processing table, the negative pressure fan is fixedly mounted on the left end of the processing table, the air duct is fixedly mounted on the upper end of the negative pressure fan, and the filter box is fixedly mounted on the front end of the negative pressure fan. During processing, the clamping plate is pushed by an electric push rod to facilitate fixing circuit boards of different sizes. The setting of the buffer pad is convenient for buffering the force during fixing to avoid damage to the circuit board. The circuit board is then etched by the laser etcher, and finally the negative pressure fan is started to allow the negative pressure fan to absorb the harmful gas generated during etching through the air duct and discharge it into the filter box for filtration, which can effectively prevent the harmful gas from being inhaled by the staff and affecting their health, thereby improving the use effect.

[0007] Preferably, the fixing assembly includes an electric push rod, a clamping plate and a buffer pad, and the electric push rod is fixedly installed on the upper end of the processing table.

[0008] Preferably, the clamping plate is fixedly mounted on the driving end of the electric push rod, and the buffer pad is fixedly mounted on the right end of the clamping plate. The position of the clamping plate can be adjusted by the electric push rod, so that the electronic components can be clamped and fixed with two clamping plates. The buffer pad is convenient for buffering the force during fixing to avoid damage to the electronic components.

[0009] Preferably, the adjustment mechanism includes an adjustment block, a mounting slot, an electric motor, a threaded rod and a screw block, and the adjustment block is fixedly mounted on the front end of the movable slide.

[0010] Preferably, the mounting groove is fixedly arranged at the front end of the adjustment block, and the electric motor is fixedly installed inside the mounting groove.

[0011] Preferably, the threaded rod is fixedly mounted on the output end of the upper end of the electric motor, and the screw block is movably mounted on the outer end of the threaded rod. The screw block is located at the rear end of the laser etcher. Before etching, the staff can start the electric motor to drive the threaded rod to rotate, thereby driving the laser etcher to move through the screw block, making it easy to adjust the laser etcher to a height suitable for use.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. This high-precision micro-nano electronic component laser etching processing equipment, through the installation of the main mechanism, realizes that the clamping plate is pushed by the electric push rod during processing, which is convenient for fixing circuit boards of different sizes. The setting of the buffer pad is convenient for buffering the force during fixing to prevent damage to the circuit board. The circuit board is then etched by the laser etcher. Finally, the negative pressure fan is started to absorb the harmful gases generated during etching through the air duct and discharge them into the filter box for filtration. This can effectively prevent the harmful gases from being inhaled by the workers and affect their health, improve the use effect, and enhance the practicality of the high-precision micro-nano electronic component laser etching processing equipment;

[0014] 2. This high-precision micro-nano electronic component laser etching processing equipment, through the installation of an adjustment mechanism, allows the staff to start the electric motor before etching, so that the electric motor drives the threaded rod to rotate, thereby driving the laser etcher to move through the screw block, making it easy to adjust the laser etcher to a height suitable for use, thereby improving the convenience of the high-precision micro-nano electronic component laser etching processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is an enlarged structural diagram of the main mechanism of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the fixing assembly of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the adjustment mechanism of the utility model.

[0019] In the figure: 1. Main body; 101. Support frame; 102. Processing table; 103. Control panel; 104. Slide rail; 105. Moving slide; 106. Laser etcher; 107. Fixing assembly; 1071. Electric push rod; 1072. Clamping plate; 1073. Buffer pad; 108. Negative pressure fan; 109. Air duct; 110. Filter box; 2. Adjustment mechanism; 201. Adjustment block; 202. Mounting slot; 203. Electric motor; 204. Threaded rod; 205. Screw block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figures 1-4 The utility model provides a technical solution: a high-precision micro-nano electronic component laser etching processing equipment, including a main body mechanism 1 and an adjustment mechanism 2, the adjustment mechanism 2 is located at the upper end of the main body mechanism 1, the main body mechanism 1 includes a support frame 101, a processing table 102 and a control panel 103, the processing table 102 is fixedly installed at the upper end of the support frame 101, and the control panel 103 is fixedly installed at the outer end of the processing table 102.

[0022] The main mechanism 1 also includes a slide rail 104, a movable slide 105, a laser etcher 106, a fixed assembly 107, a negative pressure fan 108, an air duct 109 and a filter box 110. The slide rail 104 is fixedly mounted on the upper end of the processing table 102, the movable slide 105 is movably connected to the outer end of the slide rail 104, the laser etcher 106 is fixedly mounted in front of the movable slide 105, the fixed assembly 107 is fixedly mounted on the upper end of the processing table 102, the negative pressure fan 108 is fixedly mounted on the left end of the processing table 102, the air duct 109 is fixedly mounted on the upper end of the negative pressure fan 108, the filter box 110 is fixedly mounted on the front end of the negative pressure fan 108, and the fixed assembly 107 includes an electric push rod 1071, a clamping plate 1072 and a buffer pad 107. 3. The electric push rod 1071 is fixedly installed on the upper end of the processing table 102, the clamping plate 1072 is fixedly installed on the driving end of the electric push rod 1071, and the buffer pad 1073 is fixedly installed on the right end of the clamping plate 1072. During processing, the clamping plate 1072 is pushed by the electric push rod 1071, which is convenient for fixing circuit boards of different sizes. The setting of the buffer pad 1073 is convenient for buffering the force during fixation to avoid damage to the circuit board. Then the circuit board is etched by the laser etcher 106, and finally the negative pressure fan 108 is started to make the negative pressure fan 108 absorb the harmful gas generated during etching through the air duct 109 and discharge it into the filter box 110 for filtration, which can effectively prevent the harmful gas from being inhaled by the staff and affecting their health.

[0023] The adjusting mechanism 2 includes an adjusting block 201, a mounting groove 202, an electric motor 203, a threaded rod 204 and a screw block 205. The adjusting block 201 is fixedly installed at the front end of the movable slide 105, the mounting groove 202 is fixedly set at the front end of the adjusting block 201, the electric motor 203 is fixedly installed inside the mounting groove 202, the threaded rod 204 is fixedly installed at the output end of the upper end of the electric motor 203, and the screw block 205 is movably installed at the outer end of the threaded rod 204. The screw block 205 is located at the rear end of the laser etcher 106. Before etching, the staff can start the electric motor 203 so that the electric motor 203 drives the threaded rod 204 to rotate, thereby driving the laser etcher 106 to move through the screw block 205, so as to facilitate adjusting the laser etcher 106 to a height suitable for use.

[0024] Working principle: Before etching, the staff can start the electric motor 203, so that the electric motor 203 drives the threaded rod 204 to rotate, thereby driving the laser etcher 106 to move through the screw block 205, so as to facilitate the adjustment of the laser etcher 106 to a height suitable for use. During processing, the clamping plate 1072 is pushed by the electric push rod 1071 to facilitate the fixation of circuit boards of different sizes. The setting of the buffer pad 1073 is convenient for buffering the force during fixation to avoid damage to the circuit board. The circuit board is then etched by the laser etcher 106, and finally the negative pressure fan 108 is started so that the negative pressure fan 108 absorbs the harmful gases generated during etching through the air duct 109 and discharges them into the filter box 110 for filtration, which can effectively prevent the harmful gases from being inhaled by the staff and affecting their health.

[0025] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Simple modifications or equivalent replacements of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A high-precision laser etching processing device for micro-nano electronic components, comprising a main body mechanism (1) and an adjustment mechanism (2), characterized in that: The adjustment mechanism (2) is located at the upper end of the main mechanism (1), and the main mechanism (1) comprises a support frame (101), a processing table (102), and a control panel (103), wherein the processing table (102) is fixedly mounted on the upper end of the support frame (101), and the control panel (103) is fixedly mounted on the outer end of the processing table (102); The main body mechanism (1) further includes a slide rail (104), a movable slide (105), a laser etcher (106), a fixed assembly (107), a negative pressure fan (108), an air duct (109) and a filter box (110), wherein the slide rail (104) is fixedly mounted on the upper end of the processing table (102), the movable slide (105) is movably connected to the outer end of the slide rail (104), the laser etcher (106) is fixedly mounted in front of the movable slide (105), the fixed assembly (107) is fixedly mounted on the upper end of the processing table (102), the negative pressure fan (108) is fixedly mounted on the left end of the processing table (102), the air duct (109) is fixedly mounted on the upper end of the negative pressure fan (108), and the filter box (110) is fixedly mounted on the front end of the negative pressure fan (108).

2. The high-precision laser etching processing equipment for micro-nano electronic components according to claim 1, characterized in that: The fixing assembly (107) comprises an electric push rod (1071), a clamping plate (1072) and a buffer pad (1073), and the electric push rod (1071) is fixedly mounted on the upper end of the processing table (102).

3. The high-precision laser etching processing equipment for micro-nano electronic components according to claim 2, characterized in that: The clamping plate (1072) is fixedly mounted on the driving end of the electric push rod (1071), and the buffer pad (1073) is fixedly mounted on the right end of the clamping plate (1072).

4. The high-precision laser etching processing equipment for micro-nano electronic components according to claim 3, characterized in that: The adjusting mechanism (2) comprises an adjusting block (201), a mounting slot (202), an electric motor (203), a threaded rod (204) and a screw block (205); the adjusting block (201) is fixedly mounted on the front end of the movable slide (105).

5. The high-precision laser etching processing equipment for micro-nano electronic components according to claim 4, characterized in that: The mounting groove (202) is fixedly arranged at the front end of the adjustment block (201), and the electric motor (203) is fixedly installed inside the mounting groove (202).

6. The high-precision laser etching processing equipment for micro-nano electronic components according to claim 5, characterized in that: The threaded rod (204) is fixedly mounted on the output end of the upper end of the electric motor (203), and the screw block (205) is movably mounted on the outer end of the threaded rod (204). The screw block (205) is located at the rear end of the laser etcher (106).

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