Silicon wafer feeding rotating wheel and silicon wafer production line

Abstract

The utility model discloses a silicon wafer feeding rotating wheel and a silicon wafer production line, the feeding rotating wheel comprises two flanges, each flange is provided with a first rotating part and an arc-shaped groove, two ends of the arc-shaped groove are spaced along the circumferential direction of the flanges, a plurality of supporting parts are rotatably arranged between the two flanges, and the plurality of supporting parts are distributed along the circumferential direction of the flanges at intervals. The multiple supporting parts are arranged to be sleeved with a belt, second rotating parts and guiding parts are arranged on the supporting parts, the first rotating parts are rotationally connected with the second rotating parts, and the guiding parts move along the arc-shaped grooves so as to adjust the peripheral diameter of the structure formed by the multiple supporting parts. The rotating disc is connected with one of the two flanges, a first guide groove is formed in the rotating disc, the rotating disc is configured to drive the guide part to move along the first guide groove so as to drive the guide part to move along the arc-shaped groove, the rotating shaft passes through the two flanges, and the driving part is configured to drive the flanges to rotate. The feeding rotating wheel is of an outer diameter adjustable structure, a belt is convenient to replace, and the service life is long.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer feeding wheel and a silicon wafer production line. Background Art

[0002] In the silicon wafer production process, the silicon rod is first cut into silicon wafers by a wire cutting machine. At this time, the silicon wafer is glued to the crystal tray by a resin plate. Then the crystal tray and the cut silicon wafer are placed together in the material frame. The material frame transports the crystal tray and silicon wafer together to the degumming station. The degumming machine is used to degummed and separate the crystal tray and silicon wafer. Then the silicon wafer is transported to the subsequent insertion, cleaning, drying and other stations in sequence.

[0003] In the silicon wafer production line disclosed in Chinese patent CN117484702A, during the vertical wafer loading and insertion process, the flip conveyor module receives vertical silicon wafers from the vertical conveyor and flips them from a vertical position to a horizontal position. The horizontal conveyor module receives horizontal silicon wafers from the flip conveyor module. The flip conveyor module includes a rubber-coated roller that rotates, attaching the silicon wafer vertically and tangentially to the roller. The roller rotates with the roller to a horizontal position, where it is then connected to the horizontal conveyor belt to continue forward, completing the transition from a vertical position to a horizontal position, preparing for wafer insertion.

[0004] The rubber-coated rolling wheel is an integral structure. The rubber layer can only be used once, has a short service life and cannot be reused. After the rubber layer is worn, it needs to be replaced as a whole. The replacement operation is complicated and time-consuming.

[0005] The above information disclosed in this background technology is only used to increase the understanding of the background technology of this application. Therefore, it may contain information that does not constitute the prior art known to ordinary technicians in this field. Summary of the Invention

[0006] In response to the problems pointed out in the background technology, the utility model proposes a silicon wafer feeding wheel and a silicon wafer production line. The wheel has an adjustable outer diameter structure, which is convenient for belt replacement and has a long service life.

[0007] In order to achieve the above-mentioned purpose of the utility model, the utility model adopts the following technical solutions:

[0008] In some embodiments, a silicon wafer loading wheel is provided, comprising:

[0009] Two flanges, each flange being provided with a first rotating portion and an arc-shaped groove, wherein two ends of the arc-shaped groove are spaced apart along the circumference of the flange;

[0010] a plurality of support portions, the support portions being rotatably disposed between the two flanges, the plurality of support portions being spaced apart along the circumference of the flanges, the plurality of support portions being configured to be sleeved with a belt, a second rotating portion and a guide portion being provided on the support portion, the first rotating portion being rotatably connected to the second rotating portion, and the guide portion moving along the arc-shaped groove to adjust the outer diameter of the structure formed by the plurality of support portions;

[0011] a turntable connected to one of the two flanges, the turntable being provided with a first guide groove, the turntable being configured to drive the guide portion to move along the first guide groove to drive the guide portion to move along the arc-shaped groove;

[0012] a rotating shaft, passing through the two flanges;

[0013] The driving part is configured to drive the flange to rotate.

[0014] In some embodiments, the first guide groove extends in a radial direction of the turntable.

[0015] In some embodiments, the two ends of the arcuate groove are end A and end B, respectively, the end A and the end B are on the same circumference, and the arcuate groove extends in an arc shape between the end A and the end B toward the center of the flange;

[0016] The first guide groove has an outer end and an inner end, and the outer end is closer to the outer circumference of the turntable than the inner end;

[0017] When the turntable drives the guide portion to move unidirectionally between the outer end and the inner end of the first guide groove, the guide portion moves unidirectionally between the A end and the B end of the arc groove.

[0018] In some embodiments, the two ends of the arc-shaped groove are end A and end C, and end A is closer to the outer periphery of the flange than end C.

[0019] The first guide groove has an outer end and an inner end, and the outer end is closer to the outer circumference of the turntable than the inner end;

[0020] When the turntable drives the guide portion to move unidirectionally between the outer end and the inner end of the first guide groove, the guide portion moves unidirectionally between the C ends and the C ends of the arc groove.

[0021] In some embodiments, a second guide groove is provided on the turntable, and the second guide groove extends along the circumference of the turntable;

[0022] The feeding wheel further includes a locking member, which is used to fix the turntable to the flange via the second guide groove and the flange.

[0023] In some embodiments, a notch is provided on the support portion, the notch separates the support portion into a first sub-support portion and a second sub-support portion, and the first sub-support portion and the second sub-support portion are spaced apart along the length direction of the support portion;

[0024] Belts are respectively sleeved on the first sub-support portion and the second sub-support portion.

[0025] In some embodiments, a plurality of connecting rods are provided between the two flanges.

[0026] In some embodiments, the flange includes a first sub-flange and a second sub-flange, the first sub-flange is arranged in the middle of the second sub-flange and protrudes toward the outside of the second sub-flange, and the outer peripheral contour of the first sub-flange is circular;

[0027] An opening is provided in the middle of the turntable, and the first sub-flange is located in the opening.

[0028] In some embodiments, the driving unit includes a motor, a first pulley is provided at the power output end of the motor, a second pulley is fixedly provided on the other of the two flanges, and a synchronous belt is provided between the first pulley and the second pulley.

[0029] In some embodiments, a silicon wafer production line is provided, comprising the above-described rotating wheel, wherein the rotating wheel is configured to flip a silicon wafer in a vertical position to a horizontal position.

[0030] Compared with the prior art, the advantages and positive effects of the present invention are:

[0031] The outer contour of the structure formed by the multiple support parts of the feeding wheel disclosed herein is equivalent to the outer diameter of the feeding wheel. The outer diameter of the feeding wheel is adjusted by the swinging of the support parts, facilitating belt replacement. The swinging of the support parts is achieved by the rotation of the turntable. When the swinging side of the support parts swings inward from the flange, the diameter of the outer contour of the structure formed by the multiple support parts decreases, making it easy to remove the belt from the support parts. When the swinging side of the support parts swings outward from the flange, the diameter of the outer contour of the structure formed by the multiple support parts increases, tightening the belt on the support parts and enabling quick installation of the belt. The feeding wheel has an adjustable outer diameter structure, which facilitates belt replacement and has a long service life.

[0032] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0034] Figure 1 is a schematic diagram of a silicon wafer production line according to some embodiments;

[0035] Figure 2 is a structural diagram of a loading wheel according to some embodiments;

[0036] Figure 3 is a side view of a loading wheel according to some embodiments;

[0037] Figure 4 is another structural diagram of a loading wheel according to some embodiments;

[0038] Figure 5 is another side view of a loading wheel according to some embodiments;

[0039] Figure 6 for Figure 4 The structure shown is the structure diagram after the belt is omitted;

[0040] Figure 7 for Figure 6 The structure shown omits the structure behind the turntable;

[0041] Figure 8 is an exploded view of a loading wheel according to some embodiments;

[0042] Figure 9 is a cross-sectional view of a loading wheel according to some embodiments;

[0043] Figure 10 is a structural diagram of a turntable according to some embodiments;

[0044] Figure 11 is a structural diagram of a flange according to some embodiments;

[0045] Figure 12 is another structural diagram of a flange according to some embodiments;

[0046] Figure 13 is another structural diagram of a flange according to some embodiments;

[0047] Figure 14 is a structural diagram of a support portion according to some embodiments;

[0048] Figure 15 is a structural diagram of two flanges, a rotating shaft, and a connecting rod according to some embodiments;

[0049] Reference numerals:

[0050] 11. Cutting station; 12. Material frame horizontal conveying station; 13. Slice flipping station; 14. Silicon wafer horizontal conveying station; 15. Wafer insertion station; 16. Cleaning and drying station;

[0051] 20. Material frame conveying module;

[0052] 30. Sharding module;

[0053] 40. Turning conveying module;

[0054] 50. Horizontal conveying module;

[0055] 60. Material frame;

[0056] 100, support portion; 110, first sub-support portion; 120, second sub-support portion; 130, notch portion; 140, second rotating portion; 150, guide portion; 160, swing side;

[0057] 200, turntable; 210, first guide groove; 211, outer end; 212, inner end; 220, second guide groove; 230, opening;

[0058] 300, flange; 310, arc-shaped groove; 320, mounting hole; 330, first sub-flange; 340, second sub-flange; 350, first rotating part;

[0059] 400, rotating shaft; 410, rotating shaft seat; 420, bearing;

[0060] 500, driving unit; 510, motor; 520, first pulley; 530, second pulley; 540, synchronous belt; 550, motor base;

[0061] 600, connecting rod;

[0062] 700, belt;

[0063] 810, end cover; 820, screw; 830, locking piece; 840, gap. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0065] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0066] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0067] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0068] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0069] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0070] In some embodiments, a silicon wafer production line is disclosed, including operations such as silicon wafer cutting, degumming, slicing, loading, cleaning, and drying.

[0071] Reference Figure 1 The silicon wafer production line includes a cutting station 11, a debonding station 17, a material frame horizontal conveying station 12, a slice flipping station 13, a silicon wafer horizontal conveying station 14, a wafer inserting station 15, and a cleaning and drying station 16.

[0072] The cutting station 11 completes the cutting of silicon rods, the degumming station 17 completes the degumming and separation of the crystal tray and the silicon wafer, the material frame horizontal conveying station 12 realizes the horizontal conveyance of the material frame 60, the slicing and flipping station 13 completes the slicing and vertical loading and conveying, the silicon wafer horizontal conveying station 14 completes the horizontal conveyance of the silicon wafer, the inserting station 15 completes the silicon wafer inserting, and the cleaning and drying station 16 completes the cleaning and drying of the silicon wafer.

[0073] Among them, the material frame horizontal conveying station 12, the slice flipping station 13, the silicon wafer horizontal conveying station 14, and the wafer inserting station 15 are arranged in sequence along the same straight line and integrated into an all-in-one structure to realize the automatic conveyance of silicon wafers.

[0074] Cutting station 11 is equipped with slicing equipment, such as a wire saw, to cut the silicon ingots into wafers. After the ingots are cut, the wafers are bonded to a wafer tray with a resin sheet. The wafer tray and wafers are then loaded into a material frame 60, which is then transported by a transfer cart to the debonding station 17.

[0075] The degumming station 17 is provided with a degumming device for degumming and separating the wafer tray and the silicon wafer. The silicon wafer continues to remain in the material frame 60, which transfers the silicon wafer to the next process.

[0076] The material frame horizontal conveying station 12 is provided with a material frame conveying module 20 for conveying the material frame 60 horizontally to the slice flipping station 13 , that is, conveying the debonded silicon wafers to the next station.

[0077] The wafer flipping station 13 is equipped with a wafer splitting module 30 and a flipping and conveying module 40. The wafer splitting module 30 is used to split the silicon wafers in the material frame 60 and convey the split wafers upward one by one in a vertical position. The flipping and conveying module 40 is used to receive the vertical silicon wafers conveyed by the wafer splitting module 30 and flip the silicon wafers from the vertical position to the horizontal position.

[0078] The horizontal wafer conveying station 14 is provided with a horizontal conveying module 50 for receiving the horizontal silicon wafers conveyed by the flip conveying module 40 and conveying the silicon wafers in a horizontal posture to the wafer insertion station 15 .

[0079] A flower basket is provided on the wafer inserting station 15 for inserting the silicon wafers conveyed by the horizontal conveying module 50 .

[0080] The cleaning and drying station 16 is provided with cleaning and drying equipment for cleaning and drying the silicon wafers after insertion.

[0081] The silicon wafer production line realizes the full process automation of silicon wafers, improving the reliability and efficiency of operations such as silicon wafer transmission, slicing, loading, and insertion.

[0082] In some embodiments, the flipping conveyor module 40 includes a loading wheel configured to flip a vertical silicon wafer to a horizontal position.

[0083] In some embodiments, reference Figures 2 to 9 ,in, Figure 2 This is a structural diagram of the feeding wheel viewed from the side where the driving unit 500 is located. Figure 3 This is a side view of the loading wheel as viewed from the side where the driving unit 500 is located. Figure 3 The motor 510 and other components are omitted. Figure 4 This is a structural diagram of the loading wheel viewed from the side where the turntable 200 is located. Figure 5 This is a side view of the loading wheel as viewed from the side where the turntable 200 is located. Figure 6 for Figure 4 The structure shown is a structural diagram after the belt 700 is omitted. Figure 7 for Figure 6 The structure shown is a structural diagram after omitting the turntable 200. Figure 8 This is an exploded view of the feeding wheel. Figure 9 A cross-sectional view of the feeding wheel.

[0084] The loading wheel comprises a flange 300 . Figures 11 to 13 1 is a structural diagram of different structural forms of the flange 300. Two flanges 300 are provided, and the two flanges 300 are arranged at an interval.

[0085] The flange 300 is provided with a first rotating portion 350 and an arc-shaped groove 310. The two ends of the arc-shaped groove 310 are spaced apart along the circumference of the flange 300. In other words, the arc-shaped groove 310 extends in an arc shape along the circumference of the flange 300.

[0086] The loading wheel includes a supporting portion 100 . Figure 14 The figure shows a structure of the support portion 100. The support portion 100 is a long plate-like structure. The support portion 100 is rotatably disposed between two flanges 300. The two ends of the support portion 100 are rotatably connected to the flanges 300 on the corresponding sides.

[0087] A plurality of support parts 100 are provided. The plurality of support parts 100 are spaced apart along the circumference of the flange 300. The plurality of support parts 100 are configured to be sleeved with a belt 700. The belt 700 is sleeved on the outer periphery of the structure formed by the plurality of support parts 100.

[0088] The support portion 100 is provided with a second rotating portion 140. For example, the second rotating portion 140 is provided at the end of the support portion 100. The first rotating portion 350 is rotatably connected to the second rotating portion 140 to achieve a rotatable connection between the support portion 100 and the flange 300.

[0089] For example, the first rotating portion 350 is a mounting hole, and the second rotating portion 140 is a mounting post. The mounting post is inserted into the mounting hole and rotates in the mounting hole.

[0090] The support portion 100 is provided with a guide portion 150. For example, the guide portion 150 is provided at the end of the support portion 100. For example, the guide portion 150 is a cylindrical structure. The guide portion 150 is inserted into the arcuate groove 310 and moves along the arcuate groove 310 to adjust the outer diameter of the structure formed by the multiple support portions 100.

[0091] When the support part 100 rotates with the connection between the first rotating part 350 and the second rotating part 140 as the fulcrum, the guide part 150 moves along the arc groove 310, and the support part 100 swings relative to the flange 300. The side of the support part 100 that contacts the belt 700 is the swinging side 160.

[0092] When the swing side 160 of the support portion 100 swings toward the outer peripheral side of the flange 300 , the diameter of the outer peripheral contour of the structure formed by the multiple support portions 100 increases, and at this time, the belt 700 can be tightened.

[0093] When the swinging side 160 of the support part 100 swings toward the inside of the flange 300, the diameter of the outer peripheral contour of the structure formed by multiple support parts 100 becomes smaller, which makes it easier to put the belt 700 on the support part 100 or remove the belt 700 from the support part 100.

[0094] The loading wheel includes a turntable 200 . Figure 10 2 is a structural diagram of the turntable 200. The turntable 200 is connected to one of the two flanges 300.

[0095] A first guide groove 210 is provided on the turntable 200 . The turntable 200 is configured to drive the guide portion 150 to move along the first guide groove 210 , thereby driving the guide portion 150 to move along the arc groove 310 .

[0096] The feeding wheel includes a rotating shaft 400 . The rotating shaft 400 passes through two flanges 300 .

[0097] The feeding wheel includes a driving portion 500. The driving portion 500 is configured to drive the flange 300 to rotate.

[0098] The surface of the belt 700 is specially processed to make the surface of the belt 700 have a certain water absorption and friction force, which can absorb the silicon wafer and flip it from a vertical posture to a horizontal posture.

[0099] When the loading wheel of the present invention is working, the driving part 500 is started, the driving part 500 drives the flange 300 to rotate, and the flange 300 drives multiple support parts 100 to rotate synchronously. Since the belt 700 is tightened on the support part 100, the support part 100 drives the belt 700 to rotate, and the belt 700 absorbs the silicon wafer and flips it from a vertical posture to a horizontal posture.

[0100] The replacement process of the belt 700 of the feeding wheel of the present disclosure includes:

[0101] Remove the old belt 700 from the loading wheel and rotate the turntable 200. The rotation of the turntable 200 will drive the guide part 150 to move along the first guide groove 210. The guide part 150 will also move along the arc groove 310, thereby driving the swinging side 160 of the support part 100 to swing toward the inside of the flange 300. The diameter of the outer peripheral contour of the structure formed by multiple support parts 100 becomes smaller. At this time, the belt 700 can be removed from the support part 100.

[0102] Install the new belt 700 onto the loading wheel. First, reduce the diameter of the outer contour of the structure formed by the multiple support parts 100 according to the above-mentioned operation process, then put the belt 700 onto the support part 100, and then reversely rotate the turntable 200. The rotation of the turntable 200 will drive the guide part 150 to move in the opposite direction along the first guide groove 210. At the same time, the guide part 150 moves in the opposite direction along the arc groove 310, thereby driving the swinging side 160 of the support part 100 to swing toward the outer peripheral side of the flange 300. The diameter of the outer contour of the structure formed by the multiple support parts 100 becomes larger. At this time, the multiple support parts 100 tighten the belt 700, and the installation of the belt 700 is completed.

[0103] In the feeding wheel disclosed herein, the outer periphery of the structure formed by the multiple support parts 100 is equivalent to the outer diameter of the feeding wheel. The outer diameter of the feeding wheel can be adjusted by swinging the support parts 100, so as to facilitate the replacement of the belt 700. The swinging of the support parts 100 is achieved by rotating the turntable 200. When the swinging side 160 of the support part 100 swings toward the inner side of the flange 300, the diameter of the outer periphery of the structure formed by the multiple support parts 100 becomes smaller, and the belt 700 can be easily removed from the support part 100. When the swinging side 160 of the support part 100 swings toward the outer periphery of the flange 300, the diameter of the outer periphery of the structure formed by the multiple support parts 100 becomes larger, tightening the belt 700 on the support part 100, and realizing the quick installation of the belt 700.

[0104] In some embodiments, a plurality of first guide grooves 210 are provided, and the plurality of first guide grooves 210 are arranged at intervals along the circumference of the turntable 200 .

[0105] A plurality of arcuate grooves 310 are provided, and the plurality of arcuate grooves 310 are spaced apart along the circumference of the flange 300 .

[0106] Multiple first guide grooves 210 are respectively arranged corresponding to multiple arc grooves 310, and multiple guide parts 150 on multiple support parts 100 are respectively arranged corresponding to multiple arc grooves 310. The guide parts 150 are simultaneously passed through the corresponding arc grooves 310 and the first guide grooves 210.

[0107] In some embodiments, reference Figure 10 The first guide groove 210 extends along the radial direction of the turntable 200. The first guide groove 210 is a linear groove.

[0108] In some embodiments, reference Figure 11 The arcuate groove 310 has an A end and a B end, which are located on the same circumference. The arcuate groove 310 extends in an arc shape between the A end and the B end toward the center of the flange 300. The arcuate groove 310 has an arc structure, and the middle position of the arcuate groove 310 is marked as C.

[0109] Reference Figure 10 The first guide groove 210 has an outer end 211 and an inner end 212 , and the outer end 211 is closer to the outer periphery of the turntable 200 than the inner end 212 .

[0110] When the turntable 200 drives the guide portion 150 to move unidirectionally between the outer end 211 and the inner end 212 of the first guide slot 210 , the guide portion 150 moves unidirectionally between the end A and the end B of the arc slot 310 .

[0111] Specifically, when the guide portion 150 is located at the outer end 211 of the first guide groove 210, the guide portion 150 is also located at the A end of the arc groove 310. At this time, the diameter of the outer peripheral contour of the structure formed by the multiple support portions 100 is the smallest, and the belt 700 is loose, making it easy to remove the belt 700.

[0112] Rotate the turntable 200 to move the guide portion 150 toward the inner end 212 of the first guide groove 210. At this time, the guide portion 150 moves from the A end toward the direction close to the C position in the arc groove 310, and the swinging side 160 of the support portion 100 swings toward the outer peripheral side of the flange 300. As the guide portion 150 continues to approach the C position, the diameter of the outer peripheral profile of the structure formed by the multiple support portions 100 continues to increase. When the guide portion 150 moves to the C position of the arc groove 310, the diameter of the outer peripheral profile of the structure formed by the multiple support portions 100 is the largest, so as to tighten the belt 700 installed on the support portion 100.

[0113] Continue to rotate the turntable 200 so that the guide part 150 continues to move toward the inner end 212 of the first guide groove 210. At this time, the guide part 150 moves from position C in the arc groove 310 toward the direction close to the B end, and the swing side 160 of the support part 100 swings toward the inner side of the flange 300. As the guide part 150 continues to approach the B end, the diameter of the outer peripheral contour of the structure formed by the multiple support parts 100 continues to decrease. When the guide part 150 moves to the B end of the arc groove 310, the guide part 150 is located at the inner end 212 of the first guide groove 210. At this time, the diameter of the outer peripheral contour of the structure formed by the multiple support parts 100 becomes the smallest again, and the belt 700 is loose, making it easy to remove the belt 700.

[0114] The movement process of the guide part 150 along the outer end 211 to the inner end 212 of the first guide groove 210 is also the movement process of the guide part 150 along the A end to the B end of the arc groove 310. During this movement process, the diameter of the outer peripheral contour of the structure formed by the multiple support parts 100 first increases and then decreases.

[0115] When the guide portion 150 is located at position C of the arc-shaped slot 310 , the user can rotate the turntable 200 counterclockwise or clockwise to loosen the belt 700 so as to facilitate removal of the belt 700 .

[0116] In some embodiments, reference Figure 12 or Figure 13 The two ends of the arc groove 310 are end A and end C respectively, and end A is closer to the outer periphery of the flange 300 than end C. Figure 12 and Figure 13 The middle arc-shaped groove 310 extends in the opposite direction.

[0117] Reference Figure 10The first guide groove 210 has an outer end 211 and an inner end 212 , and the outer end 211 is closer to the outer periphery of the turntable 200 than the inner end 212 .

[0118] When the turntable 200 drives the guide portion 150 to move unidirectionally between the outer end 211 and the inner end 212 of the first guide groove 210 , the guide portion 150 moves unidirectionally between the end A and the end C of the arc-shaped groove 310 .

[0119] Specifically, when the guide portion 150 is located at the outer end 211 of the first guide groove 210, the guide portion 150 is also located at the A end of the arc groove 310. At this time, the diameter of the outer peripheral contour of the structure formed by the multiple support portions 100 is the smallest, and the belt 700 is loose, making it easy to remove the belt 700.

[0120] Rotate the turntable 200 to move the guide portion 150 toward the inner end 212 of the first guide groove 210. At this time, the guide portion 150 moves from the A end toward the C end in the arc groove 310, and the swinging side 160 of the support portion 100 swings toward the outer peripheral side of the flange 300. As the guide portion 150 continues to approach the C end, the diameter of the outer peripheral profile of the structure formed by the multiple support portions 100 continues to increase. When the guide portion 150 moves to the C end of the arc groove 310, the diameter of the outer peripheral profile of the structure formed by the multiple support portions 100 is the largest, so as to tighten the belt 700 installed on the support portion 100.

[0121] The movement process of the guide part 150 along the outer end 211 to the inner end 212 of the first guide groove 210 is also the movement process of the guide part 150 along the A end to the C end of the arc groove 310. During this movement process, the diameter of the outer peripheral contour of the structure formed by the multiple support parts 100 continues to increase.

[0122] The turntable 200 is rotated in the reverse direction to move the guide portion 150 toward the outer end 211 of the first guide groove 210. At this time, the guide portion 150 moves from the C end toward the A end in the arc groove 310, and the swinging side 160 of the support portion 100 swings toward the inner side of the flange 300. As the guide portion 150 continues to approach the A end, the diameter of the outer peripheral contour of the structure formed by the multiple support portions 100 continues to decrease.

[0123] In some embodiments, reference Figure 10 A second guide groove 220 is provided on the turntable 200 , and the second guide groove 220 extends along the circumference of the turntable 200 .

[0124] Reference Figure 4 The feeding wheel further includes a locking member 830. For example, the locking member 830 is a screw. Figure 11The flange 300 is provided with a mounting hole 320 for the locking member 830 to pass through. The locking member 830 is fixed to the flange 300 via the second guide groove 220 and the mounting hole 320.

[0125] When the turntable 200 needs to be rotated, the locking member 830 is loosened to release the fixed connection between the turntable 200 and the flange 300, and the turntable 200 can be rotated. When the turntable 200 rotates, the locking member 830 moves along the second guide groove 220 and also plays a role in motion guidance.

[0126] After the turntable 200 is rotated into position, the locking member 830 is tightened to fix the turntable 200 to the flange 300 , and the position of the turntable 200 is locked, so that the support portion 100 is locked in the target position.

[0127] In some embodiments, two second guide grooves 220 are provided, and the two second guide grooves 220 are symmetrically arranged relative to the center of the turntable 200 .

[0128] In some embodiments, reference Figure 14 The support portion 100 is provided with a notch portion 130 , which separates the support portion 100 into a first sub-support portion 110 and a second sub-support portion 120 . The first sub-support portion 110 and the second sub-support portion 120 are spaced apart along the length direction of the support portion 100 .

[0129] Reference Figure 9 Belts 700 are respectively mounted on the first sub-support portion 110 and the second sub-support portion 120 .

[0130] The gap 840 between the two belts 700 is opposite to the notch 130 , providing an escape space for the horizontal conveying module 50 , so that the silicon wafers in a horizontal posture can be smoothly conveyed to the horizontal conveying module 50 .

[0131] In some embodiments, reference Figure 8 and Figure 9 A plurality of connecting rods 600 are provided between the two flanges 300 to improve the connection reliability between the two flanges 300. The connecting rods 600 are fixedly connected to the flanges 300 by screws 820.

[0132] In some embodiments, reference Figure 4 and Figure 11 The flange 300 includes a first sub-flange 330 and a second sub-flange 340. The first sub-flange 330 and the second sub-flange 340 are integrally formed. The first sub-flange 330 is positioned in the middle of the second sub-flange 340 and protrudes outward from the second sub-flange 340. The outer periphery of the first sub-flange 330 is circular. The second sub-flange 340 is provided with an arcuate groove 310 and a mounting hole 320.

[0133] Reference Figure 10 An opening 230 is provided in the middle of the turntable 200 , and the first sub-flange 330 is located in the opening 230 , thereby improving the installation reliability of the turntable 200 on the flange 300 .

[0134] When the turntable 200 rotates, the first sub-flange 330 rotates in the opening 230 , and the cooperation between the two helps to improve the rotation reliability of the turntable 200 .

[0135] In some embodiments, the driving unit 500 includes a motor 510, a first pulley 520 is provided at the power output end of the motor 510, a second pulley 530 is fixedly provided on the other of the two flanges 300, and a synchronous belt 540 is provided between the first pulley 520 and the second pulley 530.

[0136] The motor 510 starts, driving the first pulley 520 to rotate, and drives the second pulley 530 to rotate through the synchronous belt 540. The second pulley 530 drives the flange 300 to rotate. Since the support part 100 is connected to the flange 300, the belt 700 can be rotated.

[0137] In some embodiments, reference Figure 2 The driving part 500 is located on one side of the feeding wheel. That is, the driving part 500 is located on the side of one of the flanges 300.

[0138] Reference Figure 9 The second pulley 530 is fixedly connected to one of the flanges 300 by screws 820. The feeding wheel further includes an end cover 810, which is fixedly connected to the other flange 300 by screws 820.

[0139] In some embodiments, reference Figure 9 A bearing 420 is provided between the flange 300 and the rotating shaft 400 .

[0140] In some embodiments, reference Figure 2 、 Figure 4 as well as Figure 8 A rotating shaft seat 410 is respectively provided at both ends of the rotating shaft 400.

[0141] In some embodiments, reference Figure 2 The motor 510 is fixed on the motor base 550 .

[0142] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0143] The above are only specific embodiments of the present invention, but the scope of protection of the present invention is not limited to them. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this utility model should be included in the scope of protection of the present utility model. Therefore, the scope of protection of the present utility model should be based on the scope of protection of the claims.

Claims

1. A silicon wafer feeding wheel, characterized in that: include: Two flanges, each flange being provided with a first rotating portion and an arc-shaped groove, wherein two ends of the arc-shaped groove are spaced apart along the circumference of the flange; a plurality of support portions, the support portions being rotatably disposed between the two flanges, the plurality of support portions being spaced apart along the circumference of the flanges, the plurality of support portions being configured to be sleeved with a belt, a second rotating portion and a guide portion being provided on the support portion, the first rotating portion being rotatably connected to the second rotating portion, and the guide portion moving along the arc-shaped groove to adjust the outer diameter of the structure formed by the plurality of support portions; a turntable connected to one of the two flanges, the turntable being provided with a first guide groove, the turntable being configured to drive the guide portion to move along the first guide groove to drive the guide portion to move along the arc-shaped groove; a rotating shaft, passing through the two flanges; The driving part is configured to drive the flange to rotate.

2. The silicon wafer feeding wheel according to claim 1, characterized in that: The first guide groove extends along the radial direction of the turntable.

3. The silicon wafer feeding wheel according to claim 1, characterized in that: The two ends of the arcuate groove are end A and end B respectively, the end A and the end B are on the same circumference, and the arcuate groove extends in an arc shape between the end A and the end B toward the center position of the flange; The first guide groove has an outer end and an inner end, and the outer end is closer to the outer circumference of the turntable than the inner end; When the turntable drives the guide portion to move unidirectionally between the outer end and the inner end of the first guide groove, the guide portion moves unidirectionally between the A end and the B end of the arc groove.

4. The silicon wafer feeding wheel according to claim 1, characterized in that: The two ends of the arc-shaped groove are end A and end C respectively, and end A is closer to the outer periphery of the flange than end C; The first guide groove has an outer end and an inner end, and the outer end is closer to the outer circumference of the turntable than the inner end; When the turntable drives the guide portion to move unidirectionally between the outer end and the inner end of the first guide groove, the guide portion moves unidirectionally between the C ends and the C ends of the arc groove.

5. The silicon wafer feeding wheel according to any one of claims 1 to 4, characterized in that: The turntable is provided with a second guide groove, and the second guide groove extends along the circumference of the turntable; The feeding wheel further includes a locking member, which is used to fix the turntable to the flange via the second guide groove and the flange.

6. The silicon wafer feeding wheel according to any one of claims 1 to 4, characterized in that: The support portion is provided with a notch portion, the notch portion divides the support portion into a first sub-support portion and a second sub-support portion, the first sub-support portion and the second sub-support portion are spaced apart along the length direction of the support portion; Belts are respectively sleeved on the first sub-support portion and the second sub-support portion.

7. The silicon wafer feeding wheel according to any one of claims 1 to 4, characterized in that: A plurality of connecting rods are arranged between the two flanges.

8. The silicon wafer feeding wheel according to any one of claims 1 to 4, characterized in that: The flange includes a first sub-flange and a second sub-flange, the first sub-flange is arranged in the middle of the second sub-flange and protrudes toward the outside of the second sub-flange, and the outer peripheral contour of the first sub-flange is circular; An opening is provided in the middle of the turntable, and the first sub-flange is located in the opening.

9. The silicon wafer feeding wheel according to any one of claims 1 to 4, characterized in that: The driving part includes a motor, a first pulley is provided at the power output end of the motor, a second pulley is fixedly provided on the other of the two flanges, and a synchronous belt is provided between the first pulley and the second pulley.

10. A silicon wafer production line, characterized in that: The rotating wheel comprises the rotating wheel according to any one of claims 1 to 9, wherein the rotating wheel is configured to flip a silicon wafer in a vertical position to a horizontal position.

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