Sapphire wafer taking and transferring device

Abstract

The utility model discloses a sapphire wafer taking and transferring device, relates to the technical field of sapphire wafer taking and transferring, and aims to solve the problems that when an existing sapphire wafer taking and transferring device is used for taking and transferring a sapphire wafer through vacuum adsorption, if the area of a suction cup is small, the acting force of the suction cup on the wafer is concentrated in the middle position, and the suction cup cannot be used for sucking the sapphire wafer. The problems that a wafer is uneven in stress and prone to being damaged, but if the area of a suction cup is too large than that of the wafer, the edge side of the suction cup cannot be completely attached to the wafer, the sealing performance of the suction cup in the adsorption process is affected, and then adsorption is not stable, and the wafer falls off and is damaged are solved. According to the utility model, a plurality of small suckers are used together to form the wafer taking mechanism for adsorbing the wafer, so that the uniformity of the suction force applied to each position of the wafer can be ensured, the wafer can be protected, and the adsorption area can be adjusted according to the area of the wafer by adjusting the opening and closing of the ventilation part of each annular sucker, so that the wafer taking mechanism has excellent adaptability.

Description

Technical Field

[0001] The utility model relates to the technical field of sapphire wafer fetching and transferring, in particular to a sapphire wafer fetching and transferring device. Background Art

[0002] Sapphire wafer is a synthetic crystal material whose main chemical component is aluminum oxide and whose crystal structure is a hexagonal lattice structure. Sapphire wafer has a variety of excellent physical and chemical properties, which makes it widely used in many fields. Sapphire wafer has the characteristics of high temperature resistance, good thermal conductivity, high hardness, infrared transparency and good chemical stability. These characteristics make sapphire an excellent multifunctional material, widely used in many fields, such as high-temperature resistant infrared windows. It is also a widely used single crystal substrate material and is the preferred substrate for the current blue, purple and white light emitting diodes (LEDs) and blue laser industries. Sapphire wafers usually need to be epitaxially grown with gallium nitride thin films for the manufacture of these optoelectronic devices.

[0003] In Chinese patent 202322404092.7, the utility model relates to the field of lens processing technology, specifically to a transfer device for sapphire wafers, wherein a plurality of sapphire wafer conveyor belts are arranged in an array; a sapphire wafer box conveyor belt is arranged below the end of the sapphire wafer conveyor belt; a sapphire wafer box storage box is connected to the side of the sapphire wafer box conveyor belt; a sapphire wafer box is stored in the sapphire wafer box storage box; the sapphire wafer box is moved onto the sapphire wafer box conveyor belt; a plurality of wafer slots are arranged in the sapphire wafer box; the end of the sapphire wafer box conveyor belt is connected to a wafer box cover assembly table; a wafer box cover conveyor belt is arranged at the other end of the wafer box cover assembly table; a wafer box cover is arranged on the upper part of the wafer box cover conveyor belt; and a discharge conveyor belt is arranged on the side of the wafer box cover assembly table, so as to solve the problems of low transportation efficiency of sapphire wafers during transportation and easy wear of sapphire wafers.

[0004] The existing sapphire wafer transfer device has the problem that when using vacuum adsorption to transfer the sapphire wafer, it is usually only equipped with a suction cup to adsorb the wafer. However, when the area of ​​the suction cup is small, the force exerted on the wafer is concentrated in the middle position, and the wafer is unevenly stressed and easily damaged. However, if the area of ​​the suction cup is too large compared to the wafer, the sides of the suction cup cannot be fully fitted with the wafer, which will affect the sealing of the suction cup during adsorption, and then lead to unstable adsorption and wafer falling and damage.

[0005] In order to solve the above problems, a sapphire wafer fetching and transferring device is proposed. Utility Model Content

[0006] The utility model aims to provide a sapphire wafer fetching and transferring device, which solves the problem that the size of the suction cup cannot be adjusted and is difficult to be applied to wafers of different sizes.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a sapphire wafer picking and transferring device, comprising an adjustable negative pressure picking assembly, the adjustable negative pressure picking assembly comprising a micro vacuum pump, the bottom end of the micro vacuum pump is connected to an air suction main pipe, and a micro electric telescopic rod is installed inside the air suction main pipe, and the output end of the micro electric telescopic rod is fixedly connected to an annular sealing plug, the side of the air suction main pipe is connected to a first air suction branch pipe, and the end of the first air suction branch pipe is connected to a first air suction ring, the bottom of the first air suction ring is connected to a first negative pressure suction cup, and the outside of the first negative pressure suction cup is fixedly connected to a circular mounting plate.

[0008] Preferably, a second air suction branch pipe is provided at the bottom of the first air suction branch pipe, and the end of the second air suction branch pipe is connected to the second air suction ring, and the bottom of the second air suction ring is connected to the second negative pressure suction cup, a third air suction branch pipe is provided at the bottom of the second air suction branch pipe, and the end of the third air suction branch pipe is connected to the third air suction ring, and the bottom of the third air suction ring is connected to the third negative pressure suction cup, a fourth air suction branch pipe is provided at the bottom of the third air suction branch pipe, and the end of the fourth air suction branch pipe is connected to the fourth air suction ring, and the bottom of the fourth air suction ring is connected to the fourth negative pressure suction cup.

[0009] Preferably, the inner diameters of the fourth air intake ring, the third air intake ring, the second air intake ring and the first air intake ring increase step by step from inside to outside, and the number of the fourth air intake branch pipe, the third air intake branch pipe, the second air intake branch pipe and the first air intake branch pipe increases step by step from inside to outside.

[0010] Preferably, the annular sealing plug forms a lifting structure with the suction main pipe through a micro electric telescopic rod, and three annular sealing plugs are arranged at equal intervals about the output end of the micro electric telescopic rod.

[0011] Preferably, the second negative pressure suction cup forms a connecting structure with the main suction pipe through the second suction ring and the second suction branch pipe, the third negative pressure suction cup forms a connecting structure with the main suction pipe through the third suction ring and the third suction branch pipe, and the fourth negative pressure suction cup forms a connecting structure with the main suction pipe through the fourth suction ring and the fourth suction branch pipe.

[0012] Preferably, a buffer protection assembly is provided on the outside of the adjustable negative pressure sheet taking assembly, and the buffer protection assembly includes an external mounting tube, the internal sliding connection of the external mounting tube is connected to a limiting guide rod, and the bottom end of the limiting guide rod is fixedly connected to a connecting ring, and a spring is provided on the side of the limiting guide rod.

[0013] Preferably, the connecting ring and the external mounting tube form a lifting structure through springs, and the springs are distributed in a ring shape about the top of the connecting ring.

[0014] Preferably, a hydraulic lifting mechanism is installed on the top of the external mounting cylinder, and a ball screw transmission mechanism is installed on the top of the hydraulic lifting mechanism.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. The utility model provides a sapphire wafer fetching and transferring device, which utilizes a plurality of small suction cups to form an integral vacuum adsorption mechanism. When the wafer is adsorbed and fetched, it is convenient to ensure that the force at each position of the wafer is uniform, and to prevent the suction force at the middle position from being too large and causing damage to the wafer. Moreover, each ring of negative pressure suction cups can be ventilated or sealed separately, so that the suction area of ​​the adsorption mechanism can be adaptively adjusted according to the actual area of ​​the wafer, so as to ensure the sealing between the suction cup and the wafer during adsorption, thereby ensuring the stability of the suction force, preventing the wafer from falling, and having good applicability.

[0017] 2. The utility model provides a sapphire wafer picking and transferring device. When the hydraulic mechanism moves the external mounting cylinder downward to suck the wafer, the downward thrust acts on the external mounting cylinder, but the suction cup installed on the connecting ring and the circular mounting plate at its bottom contacts the wafer first. A spring is provided in the middle, which can absorb and buffer the force by utilizing its own expansion and contraction, thereby preventing the downward impact force from directly acting on the wafer and protecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model as a whole;

[0019] Figure 2 This is a schematic diagram of the internal structure of the film taking part of the utility model;

[0020] Figure 3 This is a schematic cross-sectional view of the adjustable negative pressure film removal assembly of the present invention;

[0021] Figure 4 It is a schematic diagram of the three-dimensional structure of the buffer protection component of the utility model.

[0022] In the figure: 1. Adjustable negative pressure film taking assembly; 101. Micro vacuum pump; 102. Suction main pipe; 103. Micro electric telescopic rod; 104. Annular sealing plug; 105. First suction branch pipe; 106. First suction ring; 107. First negative pressure suction cup; 108. Circular mounting plate; 109. Second suction branch pipe; 110. Second suction ring; 111. Second negative pressure suction cup; 112. Third suction branch pipe; 113. Third suction ring; 114. Third negative pressure suction cup; 115. Fourth suction branch pipe; 116. Fourth suction ring; 117. Fourth negative pressure suction cup; 2. Buffer protection assembly; 201. External mounting tube; 202. Limiting guide rod; 203. Spring; 204. Connecting ring; 3. Hydraulic lifting mechanism; 4. Ball screw transmission mechanism. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] In order to further understand the content of the present invention, the present invention is described in detail with reference to the accompanying drawings.

[0025] Example 1

[0026] See also Figure 3The utility model provides a sapphire wafer fetching and transferring device, comprising an adjustable negative pressure fetching assembly 1, which comprises a micro vacuum pump 101, the bottom end of the micro vacuum pump 101 is connected to an air suction main pipe 102, and a micro electric telescopic rod 103 is installed inside the air suction main pipe 102, and the output end of the micro electric telescopic rod 103 is fixedly connected to an annular sealing plug 104, the side of the air suction main pipe 102 is connected to a first air suction branch pipe 105, and the end of the first air suction branch pipe 105 is connected to a first air suction ring 106, the bottom of the first air suction ring 106 is connected to a first negative pressure suction cup 107, and the outside of the first negative pressure suction cup 107 is fixedly connected to a circular mounting plate 108. A second air suction branch pipe 109 is provided at the bottom of the first air suction branch pipe 105, and the end of the second air suction branch pipe 109 is connected to the second air suction ring 110, and the bottom of the second air suction ring 110 is connected to the second negative pressure suction cup 111. A third air suction branch pipe 112 is provided at the bottom of the second air suction branch pipe 109, and the end of the third air suction branch pipe 112 is connected to the third air suction ring 113, and the bottom of the third air suction ring 113 is connected to the third negative pressure suction cup 114. A fourth air suction branch pipe 115 is provided at the bottom of the third air suction branch pipe 112, and the end of the fourth air suction branch pipe 115 is connected to the fourth air suction ring 116, and the bottom of the fourth air suction ring 116 is connected to the fourth negative pressure suction cup 117.

[0027] See also Figure 3 The utility model is a sapphire wafer transfer device. The inner diameters of the fourth suction ring 116, the third suction ring 113, the second suction ring 110, and the first suction ring 106 increase step by step from the inside to the outside. The number of the fourth suction branch pipe 115, the third suction branch pipe 112, the second suction branch pipe 109, and the first suction branch pipe 105 increases step by step from the inside to the outside. The annular sealing plug 104 forms a lifting structure with the suction main pipe 102 through the micro electric telescopic rod 103, and the annular sealing plug 104 There are three equally spaced output ends of the micro electric telescopic rod 103. The second negative pressure suction cup 111 is connected to the main suction pipe 102 through the second suction ring 110 and the second suction branch pipe 109. The third negative pressure suction cup 114 is connected to the main suction pipe 102 through the third suction ring 113 and the third suction branch pipe 112. The fourth negative pressure suction cup 117 is connected to the main suction pipe 102 through the fourth suction ring 116 and the fourth suction branch pipe 115.

[0028] The output end of the micro electric telescopic rod 103 can move up and down with the annular sealing plug 104 to selectively block the connection between the suction branch pipes at all levels and the suction main pipe 102. If the wafer area is large, the annular sealing plug 104 can be pulled upward to make the suction branch pipes at all levels and the suction main pipe 102 connected. When taking the wafer, the micro vacuum pump 101 is started, and the micro vacuum pump 101 can extract the air in each negative pressure suction cup through the suction branch pipes at all levels and the suction rings at all levels, so that the space between the negative pressure suction cup and the wafer is in a vacuum state. The negative pressure sucks up the wafer, and then the sucked wafer can be transferred by cooperating with the hydraulic lifting mechanism 3 and the ball screw transmission mechanism 4; if the area of ​​the wafer is small, the output end of the micro electric telescopic rod 103 can be used with an annular sealing plug 104 to seal the connection between the first suction branch pipe 105 and the suction main pipe 102. When suctioning, the first negative pressure suction cup 107 of the outermost ring will not be able to have air enter, and the negative pressure suction cup of the inner ring can be used to suck up the wafer. According to the specific size of the wafer, the outer suction cup of the corresponding number of circles can be closed.

[0029] A plurality of small suction cups are used to form an integral vacuum adsorption mechanism. When the wafer is adsorbed and taken out, it is convenient to ensure that the force at each position of the wafer is uniform, and to prevent the suction force in the middle position from being too strong and causing damage to the wafer. In addition, each ring of negative pressure suction cups can be ventilated or sealed separately, so that the suction area of ​​the adsorption mechanism can be adaptively adjusted according to the actual area of ​​the wafer, so as to ensure the sealing between the suction cup and the wafer during adsorption, thereby ensuring the stability of the suction force, preventing the wafer from falling, and having good applicability.

[0030] Example 2

[0031] See also Figure 2 and Figure 4 The utility model relates to a sapphire wafer picking and transferring device, and a buffer protection component 2 is provided on the outside of the adjustable negative pressure picking component 1, and the buffer protection component 2 includes an external mounting tube 201, and the internal sliding connection of the external mounting tube 201 is connected to a limiting guide rod 202, and the bottom end of the limiting guide rod 202 is fixedly connected to a connecting ring 204, and a spring 203 is provided on the side of the limiting guide rod 202, and the connecting ring 204 forms a lifting structure with the external mounting tube 201 through the spring 203, and the spring 203 is distributed in a ring shape about the top of the connecting ring 204.

[0032] When the hydraulic mechanism moves the external mounting cylinder 201 downward to suck the wafer, the downward thrust acts on the external mounting cylinder 201, but the connecting ring 204 and the suction cup installed on the circular mounting plate 108 at its bottom contact the wafer first. A spring 203 is arranged in the middle, which can absorb and buffer the force by utilizing its own expansion and contraction, thereby preventing the downward impact force from directly acting on the wafer and protecting the wafer.

[0033] See also Figure 1 In the utility model, a sapphire wafer fetching and transferring device is provided, wherein a hydraulic lifting mechanism 3 is installed on the top of the external mounting cylinder 201, and a ball screw transmission mechanism 4 is installed on the top of the hydraulic lifting mechanism 3.

[0034] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A sapphire wafer transfer device, characterized by: The invention comprises an adjustable negative pressure sheet taking assembly (1), wherein the adjustable negative pressure sheet taking assembly (1) comprises a micro air pump (101), the bottom end of the micro air pump (101) is connected to an air suction main pipe (102), a micro electric telescopic rod (103) is installed inside the air suction main pipe (102), and the output end of the micro electric telescopic rod (103) is fixedly connected to an annular sealing plug (104), the side of the air suction main pipe (102) is connected to a first air suction branch pipe (105), and the end of the first air suction branch pipe (105) is connected to a first air suction ring (106), the bottom of the first air suction ring (106) is connected to a first negative pressure suction cup (107), and the outside of the first negative pressure suction cup (107) is fixedly connected to a circular mounting plate (108); A second air suction branch pipe (109) is provided at the bottom of the first air suction branch pipe (105), and the end of the second air suction branch pipe (109) is connected to the second air suction ring (110), and the bottom of the second air suction ring (110) is connected to the second negative pressure suction cup (111); a third air suction branch pipe (112) is provided at the bottom of the second air suction branch pipe (109), and the end of the third air suction branch pipe (112) is connected to the third air suction ring (113), and the bottom of the third air suction ring (113) is connected to the third negative pressure suction cup (114); a fourth air suction branch pipe (115) is provided at the bottom of the third air suction branch pipe (112), and the end of the fourth air suction branch pipe (115) is connected to the fourth air suction ring (116), and the bottom of the fourth air suction ring (116) is connected to the fourth negative pressure suction cup (117).

2. The sapphire wafer transfer device according to claim 1, characterized in that: The inner diameters of the fourth air intake ring (116), the third air intake ring (113), the second air intake ring (110), and the first air intake ring (106) increase step by step from the inside to the outside, and the number of the fourth air intake branch pipe (115), the third air intake branch pipe (112), the second air intake branch pipe (109), and the first air intake branch pipe (105) increases step by step from the inside to the outside.

3. The sapphire wafer transfer device according to claim 1, characterized in that: The annular sealing plug (104) forms a lifting structure with the main air intake pipe (102) through the micro electric telescopic rod (103), and three annular sealing plugs (104) are arranged at equal intervals about the output end of the micro electric telescopic rod (103).

4. The sapphire wafer transfer device according to claim 1, characterized in that: The second negative pressure suction cup (111) is connected to the main suction pipe (102) via the second suction ring (110) and the second suction branch pipe (109), the third negative pressure suction cup (114) is connected to the main suction pipe (102) via the third suction ring (113) and the third suction branch pipe (112), and the fourth negative pressure suction cup (117) is connected to the main suction pipe (102) via the fourth suction ring (116) and the fourth suction branch pipe (115).

5. The sapphire wafer transfer device according to claim 1, characterized in that: The adjustable negative pressure sheet taking assembly (1) is provided with a buffer protection assembly (2) on the outside, and the buffer protection assembly (2) includes an external mounting tube (201), the internal sliding connection of the external mounting tube (201) is connected to a limiting guide rod (202), and the bottom end of the limiting guide rod (202) is fixedly connected to a connecting ring (204), and a spring (203) is provided on the side of the limiting guide rod (202).

6. The sapphire wafer transfer device according to claim 5, characterized in that: The connecting ring (204) forms a lifting structure with the external mounting cylinder (201) through the spring (203), and the spring (203) is arranged in a ring-shaped distribution with respect to the top of the connecting ring (204).

7. The sapphire wafer transfer device according to claim 5, characterized in that: A hydraulic lifting mechanism (3) is installed on the top of the external mounting cylinder (201), and a ball screw transmission mechanism (4) is installed on the top of the hydraulic lifting mechanism (3).

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