Electric control assembly, air conditioner indoor unit and air conditioner

Abstract

The utility model discloses an electric control assembly, an air conditioner indoor unit and an air conditioner, and relates to the technical field of air conditioners, the electric control assembly comprises a control panel, an intelligent power module and a heat conduction piece, the control panel is provided with a heat dissipation opening, and the control panel is provided with a first side surface and a second side surface which are oppositely arranged; the intelligent power module is arranged at the position, corresponding to the heat dissipation opening, of the first side surface of the control panel, the intelligent power module is provided with a heat dissipation face, and the heat dissipation face is arranged towards the heat dissipation opening; and the heat conduction piece is arranged on the second side surface of the control panel, and the heat conduction piece penetrates through the heat dissipation opening to be in contact with the heat dissipation surface. According to the technical scheme, the problems that temperature rise of an intelligent power module of an existing air conditioner indoor unit exceeds the standard and the intelligent power module is affected by stress of a radiator can be solved, meanwhile, the size of the air conditioner indoor unit is reduced, and production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air conditioning, in particular to an electric control component, an air conditioning indoor unit and an air conditioner. Background Art

[0002] The existing external drive solution for the indoor unit of the air conditioner mainly dissipates heat through the following two methods: First, heat is dissipated through the intelligent power module body, which is suitable for low-power scenarios. With the miniaturization trend of intelligent power modules and the demand for increased motor power, the temperature rise of the intelligent power module has increased sharply, and the heat dissipation of the body can no longer meet the design requirements of the current solution; second, a heat sink is set on the back of the intelligent power module. The torque of the screws that fix the heat sink and the intelligent power module needs to be precisely controlled to avoid excessive force and damage to the intelligent power module. Since the torque of the heat sink is uncontrollable, there is a risk of damaging the intelligent power module. Therefore, it is necessary to invest in heat sink machine equipment, which increases the cost of the indoor unit of the air conditioner. At the same time, as the power increases, the heat sink needs to be increased synchronously to solve the problem of excessive temperature rise of the intelligent power module. Changing the heat sink requires modification or investment in new equipment, which increases the cost of the indoor unit of the air conditioner. Utility Model Content

[0003] The main purpose of the utility model is to propose an electronic control component, an air conditioner indoor unit and an air conditioner, aiming to improve the problems of excessive temperature rise of the intelligent power module of the existing air conditioner indoor unit and the influence of the stress of the intelligent power module on the radiator, while reducing the volume of the air conditioner indoor unit and improving production efficiency.

[0004] To achieve the above objectives, the electric control assembly proposed in the present invention includes:

[0005] A control board, the control board is provided with a heat dissipation vent, and the control board has a first side surface and a second side surface arranged opposite to each other;

[0006] An intelligent power module is provided on the first side surface of the control board at a position corresponding to the heat dissipation port, the intelligent power module having a heat dissipation surface, the heat dissipation surface being arranged toward the heat dissipation port;

[0007] The heat conducting member is arranged on the second side surface of the control board, and the heat conducting member passes through the heat dissipation opening and contacts the heat dissipation surface.

[0008] In one embodiment, the heat conducting member is a heat conducting boss or a heat conducting column.

[0009] In one embodiment, the electronic control assembly further includes a heat-conducting connector, and the heat-conducting connector is sandwiched between the intelligent power module and the heat-conducting component.

[0010] In one embodiment, the thermally conductive connecting member includes at least one of a thermally conductive pad, thermally conductive cotton, and a thermally conductive bracket;

[0011] And / or, the height of the thermally conductive connector is not less than 5 mm.

[0012] In one embodiment, the electronic control assembly further includes a box body, and an end of the heat conducting member facing away from the intelligent power module is in contact with the box body.

[0013] In one embodiment, the distance between the heat conducting member and the second side surface of the control board is not less than 4 mm;

[0014] And / or, the thickness of the heat conducting element is greater than 1 mm.

[0015] In one embodiment, the cross-sectional area of ​​the heat dissipation vent is larger than the cross-sectional area of ​​the intelligent power module, and one of the first side surface and the second side surface of the control board is flush with the heat dissipation surface;

[0016] Alternatively, the cross-sectional area of ​​the heat dissipation opening is smaller than the cross-sectional area of ​​the intelligent power module, and the intelligent power module is fixed to the first side surface of the control board.

[0017] In one embodiment, the electronic control assembly further includes a bracket, and the control board is disposed on the bracket.

[0018] In one embodiment, the control board is provided with a conductive connecting member, and the bracket is provided with a through hole for the conductive connecting member to pass through.

[0019] In one embodiment, the intelligent power module includes an intelligent power module body and a heat sink. The heat sink is provided on the intelligent power module body and has the heat dissipation surface.

[0020] In one embodiment, the intelligent power module body includes:

[0021] A mounting substrate having a third side surface and a fourth side surface arranged opposite to each other;

[0022] a power device mounted on the third side surface of the mounting substrate;

[0023] The power device is packaged in the package, and the fourth side surface of the mounting substrate is at least partially exposed to the package; the portion of the fourth side surface of the mounting substrate exposed to the package is in contact with the heat conducting member.

[0024] In one embodiment, the electronic control assembly further includes a heat sink, which is sandwiched between the intelligent power module and the heat conductive member, and is used to conduct heat generated by the intelligent power module to the heat conductive member.

[0025] The present invention also provides an indoor unit of an air conditioner, comprising the electronic control assembly as described above.

[0026] The utility model also provides an air conditioner, comprising the air conditioner indoor unit as described above.

[0027] The present invention comprises a control board, an intelligent power module, and a heat conductor. The control board is provided with a heat dissipation port, the control board having a first side surface and a second side surface disposed opposite each other, the intelligent power module being disposed on the first side surface of the control board at a position corresponding to the heat dissipation port, the intelligent power module having a heat dissipation surface facing the heat dissipation port, and a heat conductor disposed on the second side surface of the control board, the heat conductor extending through the heat dissipation port and contacting the heat dissipation surface. Heat generated by the intelligent power module during operation is conducted via the heat dissipation surface to the heat conductor, and then to the external environment via the heat conductor, dissipating heat from the intelligent power module, thereby alleviating the problem of excessive temperature rise in the intelligent power module. Since the present invention does not utilize a heat sink to dissipate heat from the intelligent power module, there is no need to use heat sink machine equipment to secure the heat sink to the intelligent power module, thereby reducing damage to the intelligent power module. Furthermore, there is no need to modify the heat sink or invest in modification equipment, thereby alleviating the problem of temperature rise in the intelligent power module. Furthermore, the reduction in the number of heat sinks reduces the number of components in the electronic control assembly, reducing the size of the electronic control assembly, and thus reducing the size of the air conditioner indoor unit, thereby improving the production efficiency of the air conditioner indoor unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 This is a structural diagram of an embodiment of an electric control component provided by the present utility model;

[0031] Figure 2 This is a structural diagram of another embodiment of the electric control assembly provided by the present utility model;

[0032] Figure 3 A structural diagram of another embodiment of the electric control component provided by the present utility model;

[0033] Figure 4 A structural diagram of another embodiment of the electric control assembly provided by the present utility model;

[0034] Figure 5This is a structural schematic diagram of another embodiment of the electric control component provided by the utility model.

[0035] Description of Figure Numbers:

[0036] 100. Electronic control component; 1. Control board; 11. Heat dissipation vent; 12. First side surface; 13. Second side surface; 14. Conductive connector; 2. Intelligent power module; 21. Intelligent power module body; 211. Mounting substrate; 212. Power device; 213. Package; 22. Heat dissipation element; 221. Heat dissipation surface; 3. Thermal conductive element; 4. Thermal conductive connector; 5. Box body; 6. Bracket; 61. Support plate; 62. First support column; 63. Second support column; 7. Radiator.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0039] Understandably, current drive solutions for indoor air conditioners are divided into internal drives (with the intelligent power module installed inside the fan) and external drives (with the intelligent power module installed outside the motor). As demand for air speed, air volume, and noise levels increases, internal drive solutions are no longer able to meet the demands for high speed, high air volume, low noise, and low cost. This is where the advantages of external drive solutions become more prominent.

[0040] The existing external drive solution for the indoor unit of the air conditioner mainly dissipates heat through the following two methods: First, heat is dissipated through the intelligent power module body, which is suitable for low-power scenarios. With the miniaturization trend of intelligent power modules and the demand for increased motor power, the temperature rise of the intelligent power module has increased sharply, and the heat dissipation of the body can no longer meet the design requirements of the current solution; second, a heat sink is set on the back of the intelligent power module. The torque of the screws that fix the heat sink and the intelligent power module needs to be precisely controlled to avoid excessive force and damage to the intelligent power module. Since the torque of the heat sink is uncontrollable, there is a risk of damaging the intelligent power module. Therefore, it is necessary to invest in heat sink machine equipment, which increases the cost of the indoor unit of the air conditioner. At the same time, as the power increases, the heat sink needs to be increased synchronously to solve the problem of excessive temperature rise of the intelligent power module. Changing the heat sink requires modification or investment in new equipment, which increases the cost of the indoor unit of the air conditioner.

[0041] To this end, the present invention proposes an electronic control component 100, which aims to improve the problem of excessive temperature rise of the intelligent power module of the existing air conditioner indoor unit and the intelligent power module being affected by the stress of the radiator, while reducing the volume of the air conditioner indoor unit and improving production efficiency.

[0042] Reference Figure 1 In one embodiment of the present invention, the electronic control assembly 100 includes:

[0043] A control board 1, the control board 1 is provided with a heat dissipation vent 11, and the control board 1 has a first side surface 12 and a second side surface 13 arranged opposite to each other;

[0044] An intelligent power module 2 is provided on the first side surface 12 of the control board 1 at a position corresponding to the heat dissipation opening 11 . The intelligent power module 2 has a heat dissipation surface 221 , and the heat dissipation surface 221 is arranged toward the heat dissipation opening 11 .

[0045] The heat conducting member 3 is disposed on the second side surface 13 of the control board 1 . The heat conducting member 3 passes through the heat dissipation opening 11 and contacts the heat dissipation surface 221 .

[0046] It is understood that the control board 1 can be the mainboard of the air conditioner's indoor unit or a dedicated driver board for driving components such as a fan. The control board 1 integrates various electronic components and may include a controller, memory, and intelligent power module 2. The operation of the intelligent power module 2 is controlled by a control program stored in the memory.

[0047] Optionally, the intelligent power module 2 may integrate, but is not limited to, an MCU, a PFC driver chip, a fan power driver chip, a PFC power device, and a fan power device. The MCU has a first control terminal and multiple second control terminals. The first control terminal is connected to the signal input terminal of the PFC driver chip, and the multiple second control terminals of the MCU are connected to the signal input terminal of the fan power driver chip. The signal output terminal of the PFC driver chip is connected to the controlled terminal of the PFC power device, and the signal output terminal of the fan power driver chip is connected to the controlled terminal of the fan power device. The MCU outputs a PFC control signal to the PFC driver chip to control the PFC driver chip to drive the PFC power device to operate, thereby achieving power factor conversion. The MCU outputs a fan control signal to the fan power driver chip to control the fan power driver chip to drive the multiple fan power devices to operate, thereby driving the fan.

[0048] When the intelligent power module is operating, power devices such as the PFC power device and the fan power device generate a large amount of heat. To dissipate heat from the intelligent power module 2, the control board 1 of this embodiment is provided with a heat dissipation vent 11. The shape and size of the heat dissipation vent 11 are not limited herein. The control board 1 has a first side surface 12 and a second side surface 13 that are arranged opposite each other in the height direction. The intelligent power module 2 is arranged at a position on the first side surface 12 of the control board 1 corresponding to the heat dissipation vent 11. The intelligent power module 2 has a heat dissipation surface 221 that is arranged toward the heat dissipation vent 11. The heat conductor 3 is provided on the second side surface 13 of the control board 1. That is, the intelligent power module 2 and the heat conductor 3 are respectively arranged on opposite sides of the control board 1. The heat conductor 3 passes through the heat dissipation vent 11 provided on the control board 1 and contacts the heat dissipation surface 221 of the intelligent power module 2. In this way, in actual application, the heat generated by the intelligent power module 2 due to operation can be conducted to the heat conductor 3 through the heat dissipation surface 221, and then conducted to the external environment through the heat conductor 3, which can reduce the excessive heat accumulation on the intelligent power module 2 and realize the heat dissipation of the intelligent power module 2; and compared with the heat dissipation method of the intelligent power module 2 in the prior art, the electronic control component 100 of this technical solution does not use the radiator 7 to dissipate heat for the intelligent power module 2. On the one hand, there is no need to use a machine-made device for the radiator 7 to fix the radiator 7 on the intelligent power module 2, thereby reducing the damage to the intelligent power module 2 caused by the machine-made device. On the other hand, when the power of the intelligent power module 2 is increased, it is only necessary to increase the heat conduction area of ​​the heat conductor 3, and there is no need to modify the radiator 7 or invest in modification equipment to increase the size of the radiator 7. This can reduce the number of components of the electronic control component 100, reduce the volume of the electronic control component 100, and thereby reduce the volume of the air conditioner indoor unit, thereby improving production efficiency.

[0049] The technical solution of the present invention is to provide a control board 1, an intelligent power module 2 and a heat conducting member 3. The control board 1 is provided with a heat dissipation port 11. The control board 1 has a first side surface 12 and a second side surface 13 arranged opposite to each other. The intelligent power module 2 is arranged at a position on the first side surface 12 of the control board 1 corresponding to the heat dissipation port 11. The intelligent power module 2 has a heat dissipation surface 221, which is arranged toward the heat dissipation port 11. The heat conducting member 3 is provided on the second side surface 13 of the control board 1. The heat conducting member 3 passes through the heat dissipation port 11 and contacts the heat dissipation surface 221. In this way, the heat generated by the intelligent power module 2 during operation is conducted to the heat conducting member 3 via the heat dissipation surface 221, and then conducted to the external environment via the heat conducting member 3, thereby achieving heat dissipation of the intelligent power module 2, thereby improving the problem of excessive temperature rise of the intelligent power module 2. Because this technical solution does not use heat sink 7 to dissipate heat from the intelligent power module 2, there is no need to use heat sink 7 mounting equipment to secure the heat sink 7 to the intelligent power module 2, reducing damage to the intelligent power module 2. Furthermore, there is no need to modify the heat sink 7 or invest in modification equipment, thereby improving the temperature rise of the intelligent power module 2. Furthermore, the elimination of heat sink 7 reduces the number of components in the electronic control assembly 100, reducing the size of the electronic control assembly 100 and, in turn, the size of the air conditioner indoor unit, thereby improving the production efficiency of the air conditioner indoor unit.

[0050] Reference Figure 1 In one embodiment of the present invention, the heat conducting member 3 is a heat conducting boss or a heat conducting column.

[0051] In this embodiment, the heat conducting member 3 is a trapezoidal, metal-made heat conducting boss. The heat conducting boss has a first heat conducting surface and a second heat conducting surface arranged opposite to each other in the height direction. The first heat conducting surface of the heat conducting boss contacts the heat dissipation surface 221 of the intelligent power module 2 through the heat dissipation port 11, and the cross-sectional area of ​​the first heat conducting surface is smaller than the cross-sectional area of ​​the second heat conducting surface. With this arrangement, when the heat conducting boss is placed in the box body 5 of the electronic control component 100, the second heat conducting surface can increase the contact area between the heat conducting boss and the box body 5, thereby improving the installation stability of the control board 1. In addition, the heat conducting area of ​​the heat conducting boss gradually increases from the end closest to the intelligent power module 2 to the end farther away from the intelligent power module 2. In other words, the heat dissipation efficiency of the intelligent power module 2 gradually increases along the heat dissipation path, thereby enhancing the heat dissipation effect of the intelligent power module 2.

[0052] In another embodiment, the thickness of the heat-conducting boss is greater than 1 mm, which can facilitate heat transfer.

[0053] Reference Figure 2 In one embodiment of the present invention, the electronic control component 100 further includes a heat-conducting connector 4 , which is sandwiched between the intelligent power module 2 and the heat-conducting component 3 .

[0054] It is understandable that the way the heat dissipation surface 221 of the intelligent power module 2 contacts the heat conductor 3 limits the amount of heat that can be transferred from the intelligent power module 2 to the heat conductor 3. To address this situation, in this embodiment, the electronic control component 100 further includes a thermal connector 4, which is sandwiched between the intelligent power module 2 and the heat conductor 3, with the two opposite sides of the thermal connector 4 respectively contacting the intelligent power module 2 and the heat conductor 3. By providing the thermal connector 4, the contact area between the intelligent power module 2 and the heat conductor 3 can be increased, allowing the intelligent power module 2 to transfer more heat to the heat conductor 3, thereby improving the heat dissipation effect of the intelligent power module 2. Optionally, the thermal connector 4 includes at least one of a thermal pad, thermal cotton, and a thermal bracket 6.

[0055] Reference Figure 2 In one embodiment of the present invention, the height of the heat conducting member 3 is not less than 5 mm.

[0056] It is understood that to achieve heat conduction, the thermal conductor 3 is generally made of metal. To prevent the intelligent power module 2 from directly contacting the thermal conductor 3 and causing a short circuit, a certain safety distance is required between the intelligent power module 2 and the thermal conductor 3. The safety distance is generally 4 mm. As can be seen from the above embodiment, the thermal connector 4 is sandwiched between the intelligent power module 2 and the thermal conductor 3. That is, the height of the thermal connector 4 can serve as the installation distance. While ensuring the safety distance, the heat dissipation effect of the intelligent power module 2 is improved. In this embodiment, the thermal connector 4 is a flexible thermal pad with a retractable height range of no less than 7 mm and no more than 10 mm. When the thermal pad is sandwiched between the intelligent power module 2 and the thermal conductor 3, it is in a compressed state, with its two sides respectively contacting the intelligent power module 2 and the thermal conductor 3. In this way, the thermal pad can quickly absorb the heat generated by the intelligent power module 2 and quickly transfer it to the thermal conductor 3, achieving rapid heat dissipation of the intelligent power module 2.

[0057] In another embodiment, to prevent the control board 1 from contacting the heat conducting member 3 and causing a short circuit, the distance between the heat conducting member 3 and the second side surface 23 of the control board 1 is not less than 4 mm.

[0058] Reference Figure 3 In one embodiment of the present invention, the electronic control assembly 100 further includes a box body 5 , and one end of the heat conducting member 3 facing away from the intelligent power module 2 is in contact with the box body 5 .

[0059] In this embodiment, the heat conductor 3 is disposed within the housing 5, with the end of the heat conductor 3 facing away from the intelligent power module 2 in contact with the inner wall of the housing 5. This allows heat generated by the intelligent power module 2 during operation to be conducted to the housing 5 via the heat conductor 3. Because the housing 5 is made of sheet metal and has excellent thermal conductivity, and its volume is larger than that of the heat conductor 3, it can conduct heat to the external environment more quickly, achieving rapid heat dissipation from the intelligent power module 2.

[0060] Of course, in other embodiments, the control board 1 can also be installed in other structures with high heat dissipation efficiency of the air-conditioning indoor unit. When the control board 1 is installed in other structures of the air-conditioning indoor unit, the control board 1 can be fixed to the other structures through sheet metal, and the heat generated by the intelligent power module 2 due to operation can be conducted to the sheet metal through the heat conductor 3, and then conducted to other structures.

[0061] Reference Figure 3 In one embodiment of the present invention, the cross-sectional area of ​​the heat dissipation port 11 is larger than the cross-sectional area of ​​the intelligent power module 2 , and one of the first side surface 12 and the second side surface 13 of the control board 1 is flush with the heat dissipation surface 221 .

[0062] It is understood that the intelligent power module 2 has pins that connect to the pads of the control board 1. To facilitate the connection between the pins and the pads, in this embodiment, the cross-sectional area of ​​the heat dissipation vent 11 is limited to be larger than the cross-sectional area of ​​the intelligent power module 2. In this way, the heat dissipation surface 221 of the intelligent power module 2 can be placed within the heat dissipation vent 11 and flush with one of the first side surface 12 and the second side surface 13 of the control board 1. In this case, the pins of the intelligent power module 2 are arranged correspondingly with the pads of the control board 1 at the heat dissipation vent 11, which greatly facilitates the connection between the pins and the pads.

[0063] Reference Figure 3 In one embodiment of the present invention, the cross-sectional area of ​​the heat dissipation vent 11 is smaller than the cross-sectional area of ​​the intelligent power module 2 , and the intelligent power module 2 is fixed to the first side surface 12 of the control board 1 .

[0064] It is understood that the intelligent power module 2 has pins that connect to the pads on the control board 1. To facilitate the connection between the pins and the pads, in this embodiment, the cross-sectional area of ​​the heat dissipation opening 11 is limited to be smaller than the cross-sectional area of ​​the intelligent power module 2. This allows the heat dissipation surface 221 of the intelligent power module 2 to abut against the first side surface 12 of the control board 1. In this case, the pins of the intelligent power module 2 can be directly connected to the pads on the first side surface 12 of the control board 1, which is also very convenient and can also improve the stability of the intelligent power module 2.

[0065] Reference Figure 4In one embodiment of the present invention, the electronic control component 100 further includes a bracket 6 , and the control board 1 is disposed on the bracket 6 .

[0066] It is understandable that when the control board 1, the intelligent power module 2 and the heat conductor 3 are integrated in the box body 5, since the control board 1 and the devices thereon are directly arranged on the heat conductor 3, if the heat conductor 3 is shaken by external force, the control board 1 and the devices thereon are likely to fall over, or even directly contact the box body 5 and cause a short circuit. The connection between the intelligent power module 2 and the control board 1 will also be affected, thereby affecting the normal operation of the intelligent power module 2.

[0067] To improve the above situation, in this embodiment, the electronic control component 100 also includes a bracket 6, and the control board 1 is set on the bracket 6. When the heat conductor 3 cannot support the control board 1, the bracket 6 can still support and fix the control board 1, reducing the impact of the shaking of the heat conductor 3 on the control board 1 and the components thereon, and at the same time reducing the impact on the connection between the intelligent power module 2 and the control board 1.

[0068] In another embodiment, the bracket 6 includes a support plate 61, a first support column 62, and a second support column 63. The two ends of the support plate 61 are connected to the first support column 62 and the second support column 63, respectively. The support plate 61 is provided with mounting holes for the heat conductor 3 to pass through. The mounting holes are arranged corresponding to the positions of the heat dissipation vents 11. The heat conductor 3 is located between the first support column 62 and the second support column 63, and the control board 1 is mounted on the support plate 61. When assembling the electronic control assembly 100, the heat conductor 3 can be first placed in the box body 5, and then the bracket 6 can be placed in the box body, with the heat conductor 3 passing through the mounting holes of the support plate 61. Finally, the control board 1 is placed on the support plate 61. The intelligent power module 2 thereon passes through the heat dissipation vents 11 and contacts the heat conductor 3. This completes the assembly of the electronic control assembly 100.

[0069] Reference Figure 4 In one embodiment of the present invention, the control board 1 is provided with a conductive connecting member 14 , and the bracket 6 is provided with a through hole for the conductive connecting member 14 to pass through.

[0070] Optionally, the conductive connector 14 may include, but is not limited to, pins, leads, and the like. To prevent electronic components such as pins and leads from directly contacting the bracket 6, the bracket 6 is provided with through-holes for the pins and leads. It should be noted that when the control board 1 is assembled within the housing 5, the pins and leads, and other electronic components, are inserted through their respective through-holes and maintain a safety-compliant distance from the inner wall of the housing 5 to prevent the pins and leads, and other electronic components, from directly contacting the housing 5 and causing a short circuit.

[0071] Reference Figure 5In one embodiment of the present invention, the intelligent power module 2 includes an intelligent power module body 21 and a heat sink 22 . The heat sink 22 is provided on the intelligent power module body 21 , and the heat sink 22 has the heat dissipation surface 221 .

[0072] To improve the heat dissipation of the intelligent power module 2, in this embodiment, the intelligent power module 2 includes an intelligent power module body 21 and a heat sink 22. The intelligent power module body 21 may include, but is not limited to, the aforementioned MCU, PFC driver chip, fan power driver chip, PFC power device, and fan power device. The connection relationships and operating principles among the MCU, PFC driver chip, fan power driver chip, PFC power device, and fan power device have been described in the above embodiments and will not be repeated here. The heat sink 22 can be implemented as a heat sink. The heat sink is attached to the side of the intelligent power module 2 facing the heat conductor 3, and the heat dissipation surface 221 is located on the side of the heat sink facing away from the intelligent power module body 21. With this arrangement, heat generated by the intelligent power module body 21 during operation is sequentially transferred through the heat sink, the thermal connector 4, and the heat conductor 3 to the box body 5, and then transferred to the external environment through the box body 5. In other words, the heat generated by the intelligent power module body 21 is dissipated through the three-layer structure, greatly improving its heat dissipation efficiency and effectiveness.

[0073] Reference Figure 5 In one embodiment of the present invention, the intelligent power module body 21 includes:

[0074] The mounting substrate 211 has a third side surface and a fourth side surface opposite to each other;

[0075] A power device 212 is mounted on a third side surface of the mounting substrate 211;

[0076] The power device 212 is encapsulated in the package body 213 , and the fourth side surface of the mounting substrate 211 is at least partially exposed to the package body 213 ; the portion of the fourth side surface of the mounting substrate 211 exposed to the package body 213 contacts the heat conducting member 3 .

[0077] It is understood that there are many implementations of the intelligent power module body 21. In this embodiment, the intelligent power module body 21 includes a mounting substrate 211, a power device 212, and a package 213. The mounting substrate 211 has a third side surface and a fourth side surface disposed opposite each other in the height direction. The power device 212 may include, but is not limited to, the aforementioned MCU, PFC driver chip, fan power driver chip, PFC power device, and fan power device. The connection relationship and operating principle between the MCU, PFC driver chip, fan power driver chip, PFC power device, and fan power device have been explained in the above embodiments and will not be repeated here. The power device 212 is integrated on the third side surface of the mounting substrate 211 and packaged in the package 213. The fourth side surface of the mounting substrate 211 is at least partially exposed outside the package 213. In this way, heat generated by the power device 212 can be transferred to the mounting substrate 211 and then transferred to the heat conducting member 3 outside the package 213 via the mounting substrate 211, thereby dissipating heat from the power device 212.

[0078] Reference Figure 5 In one embodiment of the present invention, the electronic control component 100 further includes a heat sink 7 , which is sandwiched between the intelligent power module 2 and the heat conductor 3 , and is used to conduct the heat generated by the intelligent power module 2 to the heat conductor 3 .

[0079] Based on the above embodiment, in order to further improve the heat dissipation effect of the intelligent power module 2, in this embodiment, the electronic control component 100 further includes a heat sink 7, which is sandwiched between the intelligent power module 2 and the heat conductor 3, and is mainly used to conduct the heat generated by the intelligent power module 2 to the heat conductor 3 and dissipate it through the heat conductor 3. Preferably, referring to Figure 5 The heat sink 7 is sandwiched between the heat-conducting connector 4 and the heat-conducting member 3. When heat dissipation is achieved, the heat sink 7 is prevented from being assembled with the intelligent power module 2, thereby reducing the impact of the heat sink 7 on the intelligent power module 2.

[0080] The present invention also proposes an air-conditioning indoor unit, which includes an electronic control component 100. The specific structure of the electronic control component 100 refers to the above embodiment. Since the air-conditioning indoor unit adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0081] The present invention also proposes an air conditioner, which includes an air conditioner indoor unit. The specific structure of the air conditioner indoor unit refers to the above-mentioned embodiment. Since this air conditioner adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0082] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An electronic control component, characterized in that: include: A control board, the control board is provided with a heat dissipation vent, and the control board has a first side surface and a second side surface arranged opposite to each other; An intelligent power module is provided on the first side surface of the control board at a position corresponding to the heat dissipation port, the intelligent power module having a heat dissipation surface, the heat dissipation surface being arranged toward the heat dissipation port; The heat conducting member is arranged on the second side surface of the control board, and the heat conducting member passes through the heat dissipation opening and contacts the heat dissipation surface.

2. The electronic control assembly according to claim 1, wherein: The heat conducting member is a heat conducting boss or a heat conducting column.

3. The electronic control assembly according to claim 1, wherein: The electronic control component further includes a heat-conducting connector, which is sandwiched between the intelligent power module and the heat-conducting component.

4. The electronic control assembly according to claim 3, wherein: The heat-conducting connecting member includes at least one of a heat-conducting pad, a heat-conducting cotton, and a heat-conducting bracket; And / or, the height of the thermally conductive connector is not less than 5 mm.

5. The electronic control assembly according to claim 1, wherein: The electronic control assembly further includes a box body, and one end of the heat conducting member facing away from the intelligent power module contacts the box body.

6. The electronic control assembly according to claim 1, wherein: The distance between the heat conducting member and the second side surface of the control board is not less than 4 mm; And / or, the thickness of the heat conducting element is greater than 1 mm.

7. The electronic control assembly according to claim 1, wherein: The cross-sectional area of ​​the heat dissipation opening is larger than the cross-sectional area of ​​the intelligent power module, and one of the first side surface and the second side surface of the control board is flush with the heat dissipation surface; Alternatively, the cross-sectional area of ​​the heat dissipation opening is smaller than the cross-sectional area of ​​the intelligent power module, and the intelligent power module is fixed to the first side surface of the control board.

8. The electronic control assembly according to any one of claims 1 to 7, characterized in that: The electric control component further includes a bracket, and the control board is arranged on the bracket.

9. The electronic control assembly according to claim 8, wherein: The control board is provided with a conductive connecting piece, and the bracket is provided with a through hole for the conductive connecting piece to pass through.

10. The electronic control assembly according to claim 1, wherein: The intelligent power module includes an intelligent power module body and a heat sink. The heat sink is provided on the intelligent power module body and has the heat dissipation surface.

11. The electronic control assembly according to claim 10, wherein: The intelligent power module body includes: A mounting substrate having a third side surface and a fourth side surface arranged opposite to each other; a power device mounted on the third side surface of the mounting substrate; The power device is packaged in the package, and the fourth side surface of the mounting substrate is at least partially exposed to the package; the portion of the fourth side surface of the mounting substrate exposed to the package is in contact with the heat conducting member.

12. The electronic control assembly according to claim 1, wherein: The electronic control assembly further includes a heat sink, which is sandwiched between the intelligent power module and the heat conducting member. The heat sink is used to conduct heat generated by the intelligent power module to the heat conducting member.

13. An air conditioner indoor unit, characterized in that: The device comprises an electronic control component according to any one of claims 1 to 12.

14. An air conditioner, characterized in that: It includes the air conditioner indoor unit as described in claim 13.

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