Laser projection equipment

Abstract

The utility model relates to the field of laser, and discloses laser projection equipment. The laser projection equipment comprises a laser light source, an illumination light path and a lens, the laser source comprises a laser and a radiator; the radiator comprises a heat conducting piece, a phase change heat pipe, a first radiating fin and an annular radiating fin, and the heat conducting piece is in surface contact with the laser; the phase change heat pipe comprises a first linear heat pipe section, a second linear heat pipe section and a transition heat pipe section connected with the first linear heat pipe section and the second linear heat pipe section. The first linear heat pipe section is fixedly arranged on the heat conduction piece; the first radiating fin is fixedly arranged on the second linear heat pipe section; the transition heat pipe section is sleeved with the annular cooling fins. The annular cooling fins are additionally arranged on the transition heat pipe sections, on one hand, the annular cooling fins do not influence other structures in space and do not increase the size of the whole radiator, on the other hand, the annular cooling fins can increase the heat dissipation area of the phase change heat pipe, the heat dissipation efficiency of the phase change heat pipe is improved, and the heat dissipation efficiency of the whole radiator is further improved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser projection device. Background Art

[0002] As the brightness of laser TV products increases, the demand and requirements for heat dissipation in laser projection equipment are getting higher and higher. At present, the mainstream heat dissipation method in projection equipment is air cooling. The existing air-cooled radiators are of various forms. Heat pipe heat dissipation modules are widely used in projection equipment due to their high cooling efficiency. In traditional projection equipment, the components and structural forms of the heat pipe heat dissipation module are relatively fixed. The number and volume of the heat dissipation fins are greatly affected by the heat power of the heat source and the structure of the whole machine, and the volume compression of the heat dissipation part is relatively difficult. Therefore, when the volume of the heat pipe heat dissipation module is fixed, how to increase the heat dissipation area to better improve the heat dissipation efficiency of the heat pipe heat dissipation module is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0003] The present application discloses a laser projection device, which is used to improve heat dissipation efficiency without increasing the volume of the radiator.

[0004] To achieve the above objectives, this application provides the following technical solutions:

[0005] A laser projection device, comprising:

[0006] Laser light source; the laser light source comprises:

[0007] lasers; and

[0008] Radiator; the radiator comprises:

[0009] a heat conducting member in contact with the laser surface;

[0010] Phase-change heat pipe; the phase-change heat pipe comprises:

[0011] A first linear heat pipe section is fixed to the heat conducting member;

[0012] a second linear heat pipe segment; and

[0013] a transition heat pipe section, connecting the first linear heat pipe section and the second linear heat pipe section;

[0014] A first heat sink is fixed to the second linear heat pipe segment; and

[0015] an annular heat sink, sleeved on the transition heat pipe section;

[0016] an illumination optical path, located on the light-emitting side of the laser light source, for modulating the light beam emitted by the laser light source; and

[0017] The lens is located on the light-emitting side of the illumination light path and is used to image the modulated light beam of the illumination light path.

[0018] The above technical solution has the following beneficial effects:

[0019] The laser projection device provided in the embodiment of the present application includes a laser light source, an illumination optical path and a lens. The laser light source is used to provide a laser beam to the illumination optical path. The illumination optical path is used to modulate the received laser beam and project the modulated laser beam to the lens so that the modulated laser beam is imaged through the lens. The laser in the laser light source is the main heat source, and the heat sink transfers the heat generated during the laser light emission process to the external environment. The heat sink includes a heat conductor, a phase change heat pipe and a first heat sink. The heat conductor is in contact with the laser surface. The phase change heat pipe includes a first linear heat pipe section, a transition heat pipe section and a second linear heat pipe section. The first linear heat pipe section is connected to the heat conductor, and the second linear heat pipe section is connected to the first heat sink. The heat conductor conducts most of the heat generated by the laser to the phase change heat pipe. The phase change heat pipe transfers the heat to the first heat sink through the phase change of the internal medium. The first heat sink has a large heat dissipation area and can quickly transfer heat to the external environment. In the phase-change heat pipe, compared with the first linear heat pipe section and the second linear heat pipe section, the transition heat pipe section is located between the heat conductor and the first heat sink and is exposed to the external environment. An annular heat sink is added to the transition heat pipe section. On the one hand, the annular heat sink does not affect other structures in space and does not increase the volume of the entire radiator. On the other hand, the annular heat sink can increase the heat dissipation area of ​​the phase-change heat pipe, improve the heat dissipation efficiency of the phase-change heat pipe, and further improve the heat dissipation efficiency of the entire radiator.

[0020] In some embodiments, the transition heat pipe section comprises:

[0021] a first connecting section;

[0022] a second connecting section; and

[0023] a linear transition section, one end of the linear transition section being connected to the first linear heat pipe section via the first connecting section, and the other end of the linear transition section being connected to the second linear heat pipe section via the second connecting section;

[0024] The outer portion of the linear transition section is covered with a plurality of annular heat sinks, and the plurality of annular heat sinks are arranged at intervals along the extending direction of the linear transition section.

[0025] The above technical solution has the following beneficial effects:

[0026] The transition heat pipe segment includes a linear transition segment. To facilitate connection between the linear transition segment and the first and second linear heat pipe segments, one end of the linear transition segment is connected to the first connecting segment and the other end to the second connecting segment. To facilitate connection, both the first and second connecting segments can be arc-shaped segments. Due to its linear nature, the linear transition segment facilitates the installation of multiple annular heat sinks at intervals, further increasing the heat dissipation area of ​​the phase change heat pipe.

[0027] In some embodiments, the heat sink further comprises:

[0028] A temperature homogenizing plate, the temperature homogenizing plate comprising a first contact surface;

[0029] The temperature homogenizing plate is fixed to the plurality of annular heat sinks via the first contact surface.

[0030] The above technical solution has the following beneficial effects:

[0031] By connecting multiple annular heat sinks into one through a temperature equalizing plate, the heat in different areas of the transition heat pipe section can be evenly heated through the temperature equalizing plate, thereby improving the uniformity of heat dissipation and thus improving the heat dissipation efficiency of the entire radiator.

[0032] In some embodiments, each of the plurality of annular heat sinks includes a first side surface facing the vapor chamber;

[0033] All first side surfaces of the plurality of annular heat sinks have the same area and are located on the same plane, so that each of the annular heat sinks contacts the temperature homogenizing plate through the first side surface.

[0034] The above technical solution has the following beneficial effects:

[0035] The annular heat sink's first side surface contacts the first contact surface of the vapor chamber, significantly improving heat transfer. The first side surfaces of all annular heat sinks are equal in area and coplanar, resulting in a flat first contact surface. This facilitates the design and fabrication of the vapor chamber, reduces costs, and ensures uniform heat transfer between the annular heat sink and the vapor chamber.

[0036] In some embodiments, the radiator includes a plurality of the phase-change heat pipes, and the first contact surface of the temperature homogenizer connects the annular heat sinks on the linear transition sections of all the phase-change heat pipes into a whole.

[0037] The above technical solution has the following beneficial effects:

[0038] The laser projection device provided in the embodiments of this application utilizes multiple phase-change heat pipes to dissipate heat from the laser. Different phase-change heat pipes are fixed to different locations on the heat conductor. Due to the structural limitations of the laser, temperatures in different areas of the heat conductor may vary, resulting in different heat transfer rates from different phase-change heat pipes. This embodiment utilizes a temperature homogenizer to connect all annular heat sinks into a single unit. This distributes the heat transferred by the phase-change heat pipes at different temperatures evenly across the temperature homogenizer, further ensuring uniform heat dissipation and improving the heat dissipation efficiency of the radiator.

[0039] In some embodiments, the radiator further includes a temperature balancing tube;

[0040] The temperature balancing tube is fixed on the second contact surface; the second contact surface is the surface of the temperature balancing plate opposite to the first contact surface;

[0041] The temperature-averaging tube comprises:

[0042] evaporation end; and

[0043] Condensation end;

[0044] Along the direction of gravity, the condensation end is located above the evaporation end.

[0045] The above technical solution has the following beneficial effects:

[0046] To further improve heat dissipation uniformity, a heat averaging tube is installed on the heat averaging plate. Since heat dissipation in the heat averaging tube is achieved through the phase change of the internal medium, the condensation end of the heat averaging tube is above the evaporation end to ensure its heat dissipation efficiency. The condensed medium can flow back to the evaporation end under the action of gravity to absorb heat.

[0047] In some embodiments, the linear transition sections of all the phase-change heat pipes are arranged at intervals along the extension direction of the temperature-averaging pipe.

[0048] The above technical solution has the following beneficial effects:

[0049] All linear transition sections are arranged at intervals along the extension direction of the temperature-averaging tube, which facilitates the heat transfer of the temperature-averaging tube while further balancing the temperature of each phase change heat pipe and improving the uniformity of heat dissipation.

[0050] In some embodiments, the thermally conductive member comprises:

[0051] A bottom plate, the bottom plate being in surface contact with the laser;

[0052] a cover plate, the cover plate being fastened to the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and

[0053] a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink;

[0054] The linear transition section is located in the heat dissipation gap;

[0055] The annular heat sink does not contact either the first heat sink or the second heat sink.

[0056] The above technical solution has the following beneficial effects:

[0057] In the laser projection device provided in the embodiments of the present application, the bottom plate of the heat conductor contacts the laser surface, and a second heat sink is connected to the other side of the heat conductor. Due to structural limitations, a heat dissipation gap is formed between the first and second heat sinks. To save space, the transition heat pipe section of the phase change heat pipe is located within the heat dissipation gap, that is, the linear transition section is located within the heat dissipation gap. To ensure the heat dissipation efficiency of each heat sink, the annular heat sink does not contact the first and second heat sinks, ensuring that air can flow through the gap between the heat sinks.

[0058] In some embodiments, the thermally conductive member comprises:

[0059] A bottom plate, the bottom plate being in surface contact with the laser;

[0060] a cover plate, the cover plate being fastened to the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and

[0061] a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink;

[0062] The linear transition section is located in the heat dissipation gap;

[0063] The annular heat sink and the temperature homogenizing plate are not in contact with the first heat sink and the second heat sink.

[0064] The above technical solution has the following beneficial effects:

[0065] The linear transition section is located within the heat dissipation gap formed between the first heat sink and the second heat sink. A plurality of annular heat sinks are provided on the outside of the linear transition section, and a temperature equalizer is connected to the plurality of annular heat sinks. To ensure that the heat dissipation efficiency of the first and second heat sinks is not affected, the annular heat sinks and the temperature equalizer do not contact the first and second heat sinks. For example, the temperature equalizer is located on the side of the annular heat sink facing away from the first heat sink. A gap is formed between the side of the annular heat sink closest to the first heat sink and the first heat sink to ensure air flow through the gap. A gap is formed between the side of the temperature equalizer closest to the second heat sink and the second heat sink to ensure air flow through the gap.

[0066] In some embodiments, the thermally conductive member comprises:

[0067] A bottom plate, the bottom plate being in surface contact with the laser;

[0068] a cover plate, the cover plate being fastened to the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and

[0069] a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink;

[0070] The linear transition section is located in the heat dissipation gap;

[0071] The annular heat sink and the temperature balancing tube are not in contact with the first heat sink and the second heat sink.

[0072] The above technical solution has the following beneficial effects:

[0073] The linear transition section is located in the heat dissipation gap formed between the first heat sink and the second heat sink. The linear transition section is externally sleeved with a plurality of annular heat sinks, the plurality of annular heat sinks are connected to a temperature equalizing plate, and the temperature equalizing plate is connected to a temperature equalizing tube. In order to ensure that the heat dissipation efficiency of the first heat sink and the second heat sink is not affected, the annular heat sink, the temperature equalizing plate, and the temperature equalizing tube are not in contact with the first heat sink and the second heat sink. For example, the temperature equalizing plate is located on the side of the annular heat sink facing away from the first heat sink, and the temperature equalizing tube is located on the side of the temperature equalizing plate facing away from the annular heat sink; a gap is provided between the side of the annular heat sink close to the first heat sink and the first heat sink to ensure that air can flow through the gap; a gap is provided between the side of the temperature equalizing tube close to the second heat sink and the second heat sink to ensure that air can flow through the gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 A schematic structural diagram of a laser projection device provided in an embodiment of the present application;

[0075] Figure 2 This is a schematic diagram of the structure of a radiator in a laser projection device;

[0076] Figure 3 Schematic diagram of the principle of phase change heat pipe in radiator;

[0077] Figure 4 This is one of the structural schematic diagrams of a radiator in a laser projection device provided in an embodiment of the present application;

[0078] Figure 5 This is a second structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0079] Figure 6 for Figure 5 Schematic diagram of the structure of the phase change heat pipe;

[0080] Figure 7 This is a third structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0081] Figure 8 This is a fourth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0082] Figure 9 This is a fifth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0083] Figure 10 for Figure 9 Schematic diagram of the structure of the phase change heat pipe;

[0084] Figure 11 This is a sixth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0085] Figure 12 This is a seventh structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0086] Figure 13 This is an eighth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0087] Figure 14 This is a ninth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0088] Figure 15 This is a tenth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0089] Figure 16 for Figure 15 Schematic diagram of the structure of the phase change heat pipe;

[0090] Figure 17 This is an eleventh structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0091] Figure 18 This is a twelfth structural diagram of a radiator in a laser projection device provided in an embodiment of the present application;

[0092] Icons: 100-laser light source; 200-illumination optical path; 300-lens; 110-laser; 120-heat sink; 121-heat conductor; 122-phase change heat pipe; 123-first heat sink; 124-annular heat sink; 125-temperature equalizer; 126-temperature equalizer; 1211-base plate; 1212-cover plate; 1213-second heat sink; 1221-first linear heat pipe section; 1222-second linear heat pipe section; 1223-transition heat pipe section; 1223a-first connecting section; 1223b-linear transition section; 1223c-second connecting section. DETAILED DESCRIPTION

[0093] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0094] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0095] Projection display technology is a visual presentation method that converts images or video signals into visible light and shadows and projects them onto a flat screen or other surface. This technology is widely used in education, business presentations, home entertainment, and cinemas to create an immersive viewing experience for audiences.

[0096] The fundamental principle of projection display involves the transmission or reflection of light. Simply put, light from a light source within the device undergoes a series of processing steps before passing through or being reflected from a lens system, carrying image information. The lens then focuses and magnifies the beam, ultimately forming a clear image that is projected onto the screen.

[0097] Based on this, the embodiment of the present application provides a laser projection device, such as Figure 1As shown, the laser projection device includes a laser light source 100, an illumination optical path 200 and a lens 300; the laser light source 100 is used to provide a laser light beam toward the illumination optical path 200; the illumination optical path 200 is located on the light-emitting side of the laser light source 100, and is used to modulate the light beam emitted by the laser light source 100; the lens 300 is located on the light-emitting side of the illumination optical path 200, and is used to image the light beam modulated by the illumination optical path 200.

[0098] As the brightness of projection equipment, such as laser TVs, increases, the need and requirements for heat dissipation are also increasing. Currently, there are numerous heat dissipation solutions for projection equipment, such as air-cooled heat pipe modules and liquid-cooled heat pipe modules. However, regardless of the heat dissipation solution, the heat dissipation module structure is affected by other internal components of the projection equipment, and the space is limited, and in most cases, the space is irregular.

[0099] Taking the air-cooled heat pipe cooling module as an example, within a certain volume space range, the number and volume of the cooling fins and heat pipes of the air-cooled heat pipe cooling module are relatively simple, and its heat dissipation capacity and heat dissipation efficiency are also relatively limited; if the thermal power of the projection equipment is high and the load of the fan system is too large, it will further cause the problem of excessive noise, shorten the service life of the projection equipment, and also affect the user experience.

[0100] like Figure 1 As shown, the embodiment of the present application provides a laser projection device, wherein the laser light source 100 includes a laser 110 and a heat sink 120; Figure 2 As shown, the heat sink 120 includes a heat conductor 121, a phase-change heat pipe 122, and a first heat sink 123. The heat conductor 121 is in surface contact with the laser 110. The phase-change heat pipe 122 includes a first linear heat pipe segment 1221, a second linear heat pipe segment 1222, and a transition heat pipe segment 1223 connecting the first and second linear heat pipe segments 1221 and 1222. The first linear heat pipe segment 1221 is fixed to the heat conductor 121, and the first heat sink 123 is fixed to the second linear heat pipe segment 1222. Due to internal structural limitations, it is difficult to arrange the phase-change heat pipes 122 in a consistent parallel state. Therefore, the phase-change heat pipes 122 of the same heat sink 120 are parallel only at the heat conductor 121 end and the first heat sink 123 end. The curvature and inclination of the transition heat pipe segment 1223 in the middle of each phase-change heat pipe 122 vary.

[0101] The working principle of the phase change heat pipe 122 is as follows Figure 3 As shown, the phase change heat pipe 122 includes an evaporation section Z and a condensation section L. The refrigerant liquid inside the phase change heat pipe 122 absorbs heat and evaporates in the evaporation section Z to become saturated steam. Figure 3 The dotted arrows indicate the flow direction of the steam; the gaseous refrigerant flows to the condensation section L through the channel inside the phase change heat pipe 122 under the pressure difference; the gaseous refrigerant releases heat in the condensation section L and condenses into liquid. Figure 3 The solid arrows in the figure indicate the direction of liquid flow; due to capillary forces, the liquid refrigerant flows back to the evaporation section Z through the capillary structure, thus circulating. The evaporation section is typically in contact with the heat source, and the condensation section is typically connected to a heat sink. In this embodiment, the evaporation section is the first linear heat pipe section 1221, and the condensation section is the second linear heat pipe section 1222. The first linear heat pipe section 1221 is fixedly mounted in the heat conducting member 121 in surface contact with the laser 110, and the second linear heat pipe section 1222 is fixedly mounted on the first heat sink 123, thereby transferring the heat generated by the laser 110 to the external environment.

[0102] like Figure 4 As shown, in the projection device provided by the embodiment of the present application, the radiator 120 includes a heat conductor 121, a phase-change heat pipe 122, a first heat sink 123 and an annular heat sink 124. The heat conductor 121 is in surface contact with the laser 110; the phase-change heat pipe 122 includes a first linear heat pipe segment 1221, a second linear heat pipe segment 1222 and a transition heat pipe segment 1223 connecting the first linear heat pipe segment 1221 and the second linear heat pipe segment 1222; the first linear heat pipe segment 1221 is fixed to the heat conductor 121; the first heat sink 123 is fixed to the second linear heat pipe segment 1222; and the annular heat sink 124 is sleeved on the transition heat pipe segment 1223.

[0103] The laser projection device provided in the embodiments of the present application includes a laser light source 100, an illumination optical path 200, and a lens 300. The laser light source 100 is configured to provide a laser beam to the illumination optical path 200. The illumination optical path 200 is configured to modulate the received laser beam and project the modulated laser beam onto the lens 300, so that the modulated laser beam is imaged through the lens 300. In the laser light source 100, the laser 110 is the primary heat source, and the heat sink 120 transfers the heat generated during the laser 110's light emission process to the external environment. The heat sink 120 includes a heat conductor 121, a phase-change heat pipe 122, and a first heat sink 123. The heat conductor 121 is in surface contact with the laser 110. The phase-change heat pipe 122 includes a first linear heat pipe segment 1221, a transition heat pipe segment 1223, and a second linear heat pipe segment 1222. The first linear heat pipe segment 1221 is connected to the heat conductor 121, and the second linear heat pipe segment 1222 is connected to the first heat sink 123. The heat conductor 121 conducts most of the heat generated by the laser 110 to the phase-change heat pipe 122. The phase-change heat pipe 122 transfers the heat to the first heat sink 123 through the phase change of the internal medium. The first heat sink 123 has a large heat dissipation area and can quickly transfer heat to the external environment. In the phase-change heat pipe 122, compared with the first linear heat pipe segment 1221 and the second linear heat pipe segment 1222, the transition heat pipe segment 1223 is located between the heat conductor 121 and the first heat sink 123 and is exposed to the external environment. The annular heat sink 124 is added to the transition heat pipe segment 1223. On the one hand, the annular heat sink 124 does not affect the space of other structures and does not increase the volume of the entire radiator 120. On the other hand, the annular heat sink 124 can increase the heat dissipation area of ​​the phase-change heat pipe 122, improve the heat dissipation efficiency of the phase-change heat pipe 122, and further improve the heat dissipation efficiency of the entire radiator 120.

[0104] In some embodiments, as Figure 5 As shown, the first linear heat pipe section 1221 extends along the first direction and passes through the heat conducting member 121 along the first direction, and the second linear heat pipe section 1222 extends along the second direction and passes through the first heat sink 123 along the second direction, wherein the first direction and the second direction are perpendicular. Since the first linear heat pipe section 1221 and the second linear heat pipe section 1222 are perpendicular, the transition heat pipe section 1223 needs to have a bend section transition, combined with Figure 6 The transition heat pipe section 1223 includes a first connecting section 1223a, a linear transition section 1223b and a second connecting section 1223c. One end of the linear transition section 1223b is connected to the first linear heat pipe section 1221 through the first connecting section 1223a, and the other end is connected to the second linear heat pipe section 1222 through the second connecting section 1223c. The linear transition section 1223b is covered with a plurality of annular heat sinks 124 on the outside, and the plurality of annular heat sinks 124 are arranged at intervals along the extension direction of the linear transition section 1223b.

[0105] like Figure 5 and Figure 6 As shown, to facilitate the arrangement of annular heat sinks 124, the transition heat pipe section 1223 includes a linear transition section 1223b. To facilitate the connection of the linear transition section 1223b with the first linear heat pipe section 1221 and the second linear heat pipe section 1222, one end of the linear transition section 1223b is connected to the first connecting section 1223a and the other end is connected to the second connecting section 1223c. To facilitate connection, the first connecting section 1223a and the second connecting section 1223c can both be arc-shaped sections. Due to its linear nature, the linear transition section 1223b facilitates the arrangement of multiple annular heat sinks 124 at intervals, further increasing the heat dissipation area of ​​the phase change heat pipe 122.

[0106] In some embodiments, as Figure 7 and Figure 8 As shown, the heat conducting member 121 includes a bottom plate 1211, a cover plate 1212, and a second heat sink 1213. The bottom plate 1211 is in surface contact with the laser 110. The cover plate 1212 is fastened to the bottom plate 1211 to form an accommodating cavity for accommodating the first linear heat pipe segment 1221. The second heat sink 1213 is fixed to the side of the cover plate 1212 away from the bottom plate 1211 and forms a heat dissipation gap with the first heat sink 123.

[0107] The linear transition section 1223b is located in the heat dissipation gap;

[0108] The annular heat sink 124 is not in contact with the first heat sink 123 and the second heat sink 1213 .

[0109] In the laser projection device provided in the embodiments of the present application, the base plate 1211 of the heat conductor 121 is in surface contact with the laser 110. A second heat sink 1213 is connected to the other side of the heat conductor 121. Due to structural limitations, a heat dissipation gap is formed between the first heat sink 123 and the second heat sink 1213. To save space, the transition heat pipe section 1223 of the phase change heat pipe 122 is partially located within the heat dissipation gap, namely, the linear transition section 1223b is located within the heat dissipation gap. To ensure the heat dissipation efficiency of each heat sink, the annular heat sink 124 does not contact the first heat sink 123 or the second heat sink 1213, ensuring that air can flow through the gap between the heat sinks.

[0110] In some embodiments, as Figure 9 and Figure 10As shown, the first linear heat pipe section 1221 and the second linear heat pipe section 1222 are perpendicular, an obtuse angle is formed between the linear transition section 1223b and the first linear heat pipe section 1221, and an acute angle is formed between the linear transition section 1223b and the second linear heat pipe section 1222. A plurality of annular heat sinks 124 are spaced apart on the linear transition section 1223b. In order to ensure the temperature uniformity of the plurality of annular heat sinks 124, the radiator 120 further includes a temperature averaging plate 125. Since the angle between the linear transition section 1223b and the first heat sink 123 is relatively large, the temperature averaging plate 125 is disposed on the side of the annular heat sink 124 facing away from the first heat sink 123, as shown in FIG. Figure 9 As shown, it does not affect the layout of the first heat sink 123. The temperature plate 125 includes a first contact surface; the first contact surface is the surface of the temperature plate 125 facing the first heat sink 123. Figure 9 This is only one implementation and should not be construed as limiting the present embodiment. The temperature averaging plate 125 is fixed to the plurality of annular heat sinks 124 via a first contact surface. For example, the temperature averaging plate 125 is made of copper or aluminum.

[0111] By connecting multiple annular heat sinks 124 into one through a temperature equalizing plate 125, the heat in different areas of the transition heat pipe section 1223 can be evenly heated through the temperature equalizing plate 125, thereby improving the uniformity of heat dissipation and further improving the heat dissipation efficiency of the entire radiator 120.

[0112] In some embodiments, as Figure 10 As shown, each of the multiple annular heat sinks 124 includes a first side surface facing the temperature equalizing plate 125, and the areas of all the first side surfaces of the multiple annular heat sinks 124 are equal and are located in the same plane, so that each annular heat sink 124 is in surface contact with the temperature equalizing plate 125 through the first side surface.

[0113] The annular heat sink 124 makes surface contact with the first contact surface of the vapor chamber 125 via its first side surface, significantly improving the heat transfer rate. The first side surfaces of all annular heat sinks 124 are equal in area and lie on the same plane, resulting in a flat first contact surface. This facilitates the design and fabrication of the vapor chamber 125, reduces costs, and ensures uniform heat transfer between the annular heat sink 124 and the vapor chamber 125.

[0114] In some embodiments, as Figure 11 As shown, the radiator 120 includes a plurality of phase change heat pipes 122, and the first contact surface of the temperature plate 125 connects the annular heat sinks 124 on the linear transition sections 1223b of all phase change heat pipes 122 into a whole. Figure 11 and Figure 12As shown, the spacing between two adjacent first linear heat pipe segments 1221 is smaller than the spacing between two adjacent second linear heat pipe segments 1222. The end of the transition heat pipe segment 1223 closest to the first linear heat pipe segment 1221 is defined as the first end, and the end of the transition heat pipe segment 1223 closest to the second linear heat pipe segment 1222 is defined as the second end. The spacing between two adjacent phase change heat pipes 122 is smaller at the first end than at the second end, resulting in two adjacent linear transition segments 1223b being non-parallel. The first side surfaces of the annular fins 124 on the linear transition segments 1223b of all phase change heat pipes 122 are located in the same plane, so that the first contact surface of the temperature vapor chamber 125 is in surface contact with all annular fins 124.

[0115] The laser projection device provided in the embodiment of the present application employs multiple phase-change heat pipes 122 to dissipate heat from the laser 110. Different phase-change heat pipes 122 are fixed to different positions relative to the heat conductor 121. Due to the structural limitations of the laser 110, the temperatures of different regions of the heat conductor 121 may vary, resulting in different heat transfer from different phase-change heat pipes 122. This embodiment utilizes a temperature homogenizer 125 to connect all annular heat sinks 124 into a single unit. This allows the heat transferred from the phase-change heat pipes 122 at different temperatures to be evenly distributed across the temperature homogenizer 125, further ensuring heat dissipation uniformity from the radiator 120 and thereby improving the heat dissipation efficiency of the radiator 120.

[0116] In some embodiments, as Figure 12 and Figure 13 As shown, the heat conducting member 121 includes a bottom plate 1211, a cover plate 1212, and a second heat sink 1213. The bottom plate 1211 is in surface contact with the laser 110. The cover plate 1212 is fastened to the bottom plate 1211 to form an accommodating cavity for accommodating the first linear heat pipe segment 1221. The second heat sink 1213 is fixed to the side of the cover plate 1212 away from the bottom plate 1211 and forms a heat dissipation gap with the first heat sink 123.

[0117] The linear transition section 1223b is located in the heat dissipation gap;

[0118] The annular heat sink 124 and the temperature equalizing plate 125 are not in contact with the first heat sink 123 and the second heat sink 1213 .

[0119] The linear transition section 1223b is located within the heat dissipation gap formed between the first heat sink 123 and the second heat sink 1213. A plurality of annular heat sinks 124 are disposed on the exterior of the linear transition section 1223b, and these annular heat sinks 124 are connected to a temperature equalizer 125. To ensure that the heat dissipation efficiency of the first heat sink 123 and the second heat sink 1213 is not affected, the annular heat sinks 124 and the temperature equalizer 125 do not contact either the first heat sink 123 or the second heat sink 1213. For example, the temperature equalizer 125 is located on the side of the annular heat sink 124 facing away from the first heat sink 123. A gap is defined between the side of the annular heat sink 124 closest to the first heat sink 123 and the first heat sink 123, ensuring air flow through the gap. A gap is defined between the side of the temperature equalizer 125 closest to the second heat sink 1213 and the second heat sink 1213, ensuring air flow through the gap.

[0120] In some embodiments, as Figure 14 As shown, the radiator 120 further includes a temperature averaging tube 126, which is fixed to the second contact surface; the second contact surface is the surface of the temperature averaging plate 125 opposite to the first contact surface;

[0121] The temperature-equalizing tube 126 includes an evaporating end and a condensing end. Along the direction of gravity, the condensing end is located above the evaporating end.

[0122] To further improve heat dissipation uniformity, a temperature averaging tube 126 is fixed to the temperature averaging plate 125. Since heat dissipation in the temperature averaging tube 126 is achieved through the phase change of the internal medium to absorb and release heat, to ensure the heat dissipation efficiency of the temperature averaging tube 126, the condensation end of the temperature averaging tube 126 is above the evaporation end, so that the condensed medium can flow back to the evaporation end under the action of gravity to absorb heat.

[0123] In some embodiments, as Figure 15 and Figure 16 As shown, the linear transition sections 1223 b of all phase-change heat pipes 122 are arranged at intervals along the extension direction of the temperature-averaging pipe 126 .

[0124] All the linear transition sections 1223b are arranged at intervals along the extension direction of the temperature averaging tube 126, which facilitates the temperature averaging tube 126 to transfer heat while further balancing the temperature of each phase change heat pipe 122, thereby improving the heat dissipation uniformity. Figure 17 and Figure 18 As shown, the heat conducting member 121 includes a bottom plate 1211, a cover plate 1212, and a second heat sink 1213. The bottom plate 1211 is in surface contact with the laser 110. The cover plate 1212 is fastened to the bottom plate 1211 to form an accommodating cavity for accommodating the first linear heat pipe segment 1221. The second heat sink 1213 is fixed to the side of the cover plate 1212 away from the bottom plate 1211 and forms a heat dissipation gap with the first heat sink 123.

[0125] The linear transition section 1223b is located in the heat dissipation gap;

[0126] The annular heat sink 124 and the temperature balancing tube 126 are not in contact with the first heat sink 123 and the second heat sink 1213 .

[0127] The linear transition section 1223b is located within the heat dissipation gap formed between the first heat sink 123 and the second heat sink 1213. A plurality of annular heat sinks 124 are sheathed on the outside of the linear transition section 1223b. These annular heat sinks 124 are connected to a temperature averaging plate 125, which in turn is connected to a temperature averaging tube 126. To ensure that the heat dissipation efficiency of the first and second heat sinks 123 and 1213 is not affected, the annular heat sinks 124, temperature averaging plate 125, and temperature averaging tube 126 do not contact the first and second heat sinks 123 and 1213. Exemplarily, the temperature equalizing plate 125 is located on the side of the annular heat sink 124 away from the first heat sink 123, and the temperature equalizing tube 126 is located on the side of the temperature equalizing plate 125 away from the annular heat sink 124; a gap is provided between the side of the annular heat sink 124 close to the first heat sink 123 and the first heat sink 123 to ensure that air can flow in the gap; a gap is provided between the side of the temperature equalizing tube 126 close to the second heat sink 1213 and the second heat sink 1213 to ensure that air can flow in the gap.

[0128] In the laser projection device provided in the embodiments of this application, the laser chip in the laser light source 100 is the primary heat source. Heat generated by this chip is transferred to the external environment through the cooperation of the heat sink 120 and the fan cooling module. A temperature sensor is located at the heat source to read the real-time temperature of the heat source. A control circuit board, located within the main body housing of the laser projection device, houses the chip and a corresponding number of terminal sockets. This circuit board is responsible for providing driving power and operating control signals to the fan cooling module.

[0129] In some embodiments, the heat sink 120 with annular fins 124 is secured to the mainframe housing via screws. The base plate 1211 of the heat conductor 121 is in close contact with the heat source via a thermally conductive medium, such as thermal grease. The base plate 1211 of the heat conductor 121 can be made of copper, which has high thermal conductivity; the cover plate 1212 of the heat conductor 121 is made of aluminum. The base plate 1211 and the cover plate 1212 are buckled together to wrap one end of the phase change heat pipe 122, and the three are welded together by solder paste. The heat of the laser chip is transferred to the evaporation end of the phase change heat pipe 122, namely the first linear heat pipe section 1221, through the contact base plate 1211; the other end of the phase change heat pipe 122, namely the second linear heat pipe section 1222, and the heat sink fin, namely the first heat sink 123, are welded together by solder paste. The exposed part of the middle section of the phase change heat pipe 122, namely the transition heat pipe section 1223, the annular heat sink 124 and the outer wall of the transition heat pipe section 1223 are welded together by solder paste. The cover plate 1212 in direct contact with the laser chip absorbs heat and transfers it to the evaporation end of the deformation heat pipe. The liquid refrigerant in the phase change heat pipe 122 absorbs heat and changes into gas, and transfers the heat to the cold end of the heat pipe, that is, the second linear heat pipe section 1222. When passing through the position of the annular heat sink 124, the annular heat sink 124, the temperature plate 125 and the temperature pipe 126 release part of the heat through convection heat exchange with the external environment. At this time, the temperature uniformity between the multiple phase change heat pipes 122 is also better, and The remaining heat is then released to the outside environment through the action of the heat sink fins and the fan; the gaseous refrigerant releases heat and condenses into liquid, which flows back to the evaporation end through the capillary structure inside the phase-change heat pipe 122. The residual heat carried by the returning liquid refrigerant, when it flows through the position of the annular heat sink 124, is released to the outside environment through convection heat exchange with the outside environment through the annular heat sink 124, the temperature plate 125 and the temperature tube 126, and then the cold liquid flows back to the evaporation end of the phase-change heat pipe 122 and re-enters the next cycle. At this time, compared with the ordinary heat pipe heat dissipation module, the temperature of the returning cold liquid in the phase-change heat pipe 122 with the annular heat sink 124 will be lower, and the temperature difference between the condensation end and the evaporation end of the phase-change heat pipe 122 will be greater. As the temperature difference increases, the pressure difference inside the phase-change heat pipe 122 will also increase, the heat transfer power of the phase-change heat pipe 122 will be enhanced, and the heat dissipation capacity and heat dissipation efficiency of the heat pipe heat dissipation module will also be improved.

[0130] Compared with the traditional heat pipe cooling module, the radiator 120 provided in the embodiment of the present application has some annular heat sinks 124 added to the phase change heat pipes 122. Under the condition of the same cooling fin area, the radiator 120 with the annular heat sink 124 can help the heat source transfer heat faster, and then the heat of different phase change heat pipes 122 in the radiator 120 is evenly extracted through the temperature equalizing plate 125 and the temperature equalizing pipe 126 on the annular heat sink 124, thereby increasing the heat dissipation area of ​​the radiator 120, and at the same time effectively solving the problem of uneven heat transfer at the heat source, thereby effectively improving the heat transfer efficiency of the radiator 120.

[0131] When the laser projection device is started, the fan of the whole machine and the radiator 120 with the annular heat sink 124 start to work, and the control system starts real-time monitoring of the temperature of the high-power heat source, records the temperature data of the heat source once every preset time, such as 10S, and provides feedback. After receiving the temperature information fed back by the temperature measuring element such as the temperature sensor, the control system controls and adjusts the speed of the fans at different positions of the whole machine according to the established fan logic, and controls the temperature of the high-power heat source within the specified range through the cooperation of the air-cooled heat pipe heat dissipation module and the fan system to ensure the normal operation of the laser projection device.

[0132] It is understandable that the heat dissipation fin portion of the radiator 120 in the embodiment of the present application can also be completely replaced by the annular heat sink 124, or the annular heat sink 124 and the heat dissipation fins can be flexibly combined according to the heat dissipation space and the overall structure requirements. The position and number of the temperature equalizer 125 and the temperature equalizer tube 126 can also be combined differently according to actual needs. Not limited to the form in the accompanying drawings, different combinations of heat sinks and fins can be designed according to structural requirements to ensure the heat dissipation requirements of the heat source. For other heat dissipation components inside the laser projection device with smaller heat dissipation requirements, a heat pipe heat dissipation module with a smaller volume and a larger heat dissipation area can also be designed.

[0133] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations.

Claims

1. A laser projection device, characterized in that: include: Laser light source; The laser light source comprises: lasers; and Radiator; the radiator comprises: a heat conducting member in contact with the laser surface; Phase change heat pipe; the phase change heat pipe comprises: A first linear heat pipe section is fixed to the heat conducting member; a second linear heat pipe segment; and a transition heat pipe section, connecting the first linear heat pipe section and the second linear heat pipe section; A first heat sink is fixed to the second linear heat pipe segment; and an annular heat sink, sleeved on the transition heat pipe section; an illumination optical path, located on the light-emitting side of the laser light source, for modulating the light beam emitted by the laser light source; and The lens is located on the light-emitting side of the illumination light path and is used to image the modulated light beam of the illumination light path.

2. The laser projection device according to claim 1, characterized in that: The transition heat pipe section comprises: a first connecting section; a second connecting section; and a linear transition section, one end of the linear transition section being connected to the first linear heat pipe section via the first connecting section, and the other end of the linear transition section being connected to the second linear heat pipe section via the second connecting section; The outer portion of the linear transition section is covered with a plurality of annular heat sinks, and the plurality of annular heat sinks are arranged at intervals along the extending direction of the linear transition section.

3. The laser projection device according to claim 2, characterized in that: The radiator further comprises: A temperature homogenizing plate, the temperature homogenizing plate comprising a first contact surface; The temperature homogenizing plate is fixed to the plurality of annular heat sinks via the first contact surface.

4. The laser projection device according to claim 3, characterized in that: Each of the plurality of annular heat sinks includes a first side surface facing the vapor chamber; All first side surfaces of the plurality of annular heat sinks have equal areas and are located on the same plane, so that each of the annular heat sinks contacts the temperature homogenizing plate surface through the first side surface.

5. The laser projection device according to claim 4, characterized in that: The radiator includes a plurality of phase-change heat pipes, and the first contact surface of the temperature homogenizer connects the annular fins on the linear transition sections of all the phase-change heat pipes into a whole.

6. The laser projection device according to claim 5, characterized in that: The radiator further includes a temperature-averaging tube; The temperature balancing tube is fixed on the second contact surface; the second contact surface is the surface of the temperature balancing plate opposite to the first contact surface; The temperature balancing tube comprises: evaporation end; and Condensation end; Along the direction of gravity, the condensation end is located above the evaporation end.

7. The laser projection device according to claim 6, characterized in that: The linear transition sections of all the phase-change heat pipes are arranged at intervals along the extension direction of the temperature-averaging pipe.

8. The laser projection device according to claim 2, characterized in that: The heat conducting member comprises: A bottom plate, the bottom plate being in surface contact with the laser; a cover plate, the cover plate being buckled onto the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink; The linear transition section is located in the heat dissipation gap; The annular heat sink does not contact either the first heat sink or the second heat sink.

9. The laser projection device according to claim 3, characterized in that: The heat conducting member comprises: A bottom plate, the bottom plate being in surface contact with the laser; a cover plate, the cover plate being buckled onto the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink; The linear transition section is located in the heat dissipation gap; The annular heat sink and the temperature homogenizer are not in contact with the first heat sink and the second heat sink.

10. The laser projection device according to claim 6, characterized in that: The heat conducting member comprises: A bottom plate, the bottom plate being in surface contact with the laser; a cover plate, the cover plate being buckled onto the bottom plate to form an accommodating cavity for accommodating the first linear heat pipe segment; and a second heat sink, the second heat sink being fixedly arranged on a side of the cover plate facing away from the bottom plate and forming a heat dissipation gap with the first heat sink; The linear transition section is located in the heat dissipation gap; The annular heat sink and the temperature balancing tube are not in contact with the first heat sink and the second heat sink.

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