Package substrate exposure table board jig

Abstract

The utility model provides a package substrate exposure table board jig which is a single-layer base plate, so that the problems that a stacked double-layer structure is uneven in thickness and easy to be mixed with foreign matters are solved, the flatness of the package substrate when the package substrate is placed on the table board jig is ensured, and the exposure yield is remarkably improved. Meanwhile, a circular through hole used for vacuumizing in the jig is optimally designed, the circular through hole is divided into an upper-layer through hole and a lower-layer through hole, and the aperture of the upper-layer through hole is smaller than that of the lower-layer through hole, so that a step-shaped outline with variable aperture is formed in the circular through hole, and pressure difference can be generated on the upper surface and the lower surface; the adsorption of the base plate and the packaging substrate is facilitated; and the circular through holes and the positioning frame lines are distributed in a staggered manner, so that air leakage of the circular through holes in the slotted holes of the packaging substrate is avoided, and meanwhile, certain through hole density is matched, so that the adsorption flatness is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a packaging substrate exposure table fixture. Background Art

[0002] As product requirements continue to improve, packaging substrate products are constantly being updated in panel design and through-hole and slot design, which poses great challenges to the flatness and vacuum performance of the supporting exposure machine table. Currently, there are some problems as follows:

[0003] 1. The original table is a two-layer structure, with the bottom plate and the upper cover plate forming the exposure machine table. There is a problem of uneven thickness between the two layers. Foreign matter between the layers caused during the production process is difficult to detect and clean in time. The uneven thickness and foreign matter cause the table to be uneven and easily lead to local exposure defects in batches.

[0004] 2. The lower pad is provided with a long strip groove on the bottom surface and a lower through hole passing through the lower pad. The upper cover is provided with an upper through hole passing through the upper cover, and the upper through hole is connected to the lower through hole. The lower pad is placed on the support platform of the exposure machine and is connected to the air guide strip of the support platform so as to be fixed by adsorption through vacuum. The package substrate to be exposed is placed on the surface of the upper cover and fixed by adsorption through the vacuum channel formed by the upper through hole and the lower through hole. Due to the problem of insufficient alignment accuracy between the lower pad and the upper cover, the through holes cannot be smoothly connected. In addition, the package substrate is provided with a hollow cavity slot, and a positioning frame line is drawn on the upper cover corresponding to the slot as a positioning reference. When opening the hole, the positioning frame line and the vacuum hole are likely to intersect, causing the vacuum hole to appear in the hollow slot of the package substrate, which in turn causes air leakage and fails to effectively adsorb the package substrate. This results in uneven vacuuming during vacuuming, affecting the flatness and causing defects such as jagged edges of the exposure window and solder mask residue.

[0005] Therefore, there is an urgent need to develop a jig for packaging substrate exposure table to improve and stabilize product quality. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the present invention provides a package substrate exposure table fixture, the exposure table fixture is a single-layer pad, the single-layer pad is provided with an elongated groove located on the bottom surface and a circular through hole penetrating the single-layer pad; the circular through hole includes an upper through hole and a lower through hole that are interconnected, and the aperture of the upper through hole is smaller than that of the lower through hole; the groove and the circular through hole are both connected to the air guide strip of the exposure machine support platform;

[0007] A positioning frame line is drawn on the upper surface of the single-layer pad as a positioning reference for the packaging substrate, and the circular through holes are staggered with the positioning frame line.

[0008] Optionally, the plurality of grooves are arranged in parallel and at equal intervals along the first direction.

[0009] Optionally, a region where the groove is located is provided with circular through holes arranged in a single row along a second direction, and the second direction is perpendicular to the first direction.

[0010] Optionally, the positioning frame line includes a rectangular first positioning frame and an L-shaped second positioning frame, and the area of ​​the first positioning frame is larger than that of the second positioning frame.

[0011] Optionally, a second positioning frame is provided on the outer side of each corner of the first positioning frame, and four second positioning frames form a discontinuous rectangular outline on the outer side of the first positioning frame.

[0012] Optionally, the diameter of the upper through hole is 0.5-10 mm; the diameter of the lower through hole is 0.5-10 mm.

[0013] Optionally, the single-layer pad includes a plurality of blocks arranged in an array, and a single block includes a plurality of first positioning frames arranged in an array.

[0014] As described above, the present invention provides a jig for exposing a packaging substrate. The jig is a single-layer pad, which eliminates the problems of uneven thickness and easy inclusion of foreign matter in a stacked double-layer structure, ensures the flatness of the packaging substrate when placed on the jig, and significantly improves the exposure yield. At the same time, the circular through holes used for vacuuming in the jig are optimized and designed, and the circular through holes are divided into upper through holes and lower through holes. The aperture of the upper through hole is smaller than that of the lower through hole, so that a stepped profile with varying apertures is formed inside the circular through hole, which can generate a pressure difference between the upper and lower surfaces, which is beneficial to the adsorption of the pad and the packaging substrate. The circular through holes are staggered with the positioning frame line to avoid the circular through holes appearing in the slots of the packaging substrate and causing air leakage. At the same time, a certain through hole density is combined to further ensure the adsorption flatness. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shown is a schematic top view of the structure of the exposure table fixture in the first embodiment of the present invention.

[0016] Figure 2 Display as Figure 1 Schematic diagram of the enlarged structure of the middle unit block.

[0017] Figure 3 The figure shows a bottom view of the structure of the exposure table fixture in the first embodiment of the present invention.

[0018] Figure 4 Shown is a schematic cross-sectional structure diagram of a circular through hole in the first embodiment of the present invention.

[0019] Component number description

[0020] 100-unit block

[0021] 11 First positioning frame

[0022] 12 Second positioning frame

[0023] 21 Upper through hole

[0024] 22 lower layer through hole

[0025] 23 Grooves DETAILED DESCRIPTION

[0026] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0027] For ease of explanation, when describing the embodiments of the present invention, cross-sectional views of device structures may be partially enlarged and not to scale. These schematic views are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0028] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass orientations of the device in use or operation in addition to the orientation depicted in the drawings. Additionally, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may be present. As used herein, "between" is inclusive of both endpoints.

[0029] In the context of the present application, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features, such that the first and second features may not be in direct contact.

[0030] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0031] Example 1

[0032] This embodiment provides a packaging substrate exposure table fixture, such as Figures 1 to 4 As shown, the exposure table fixture is a single-layer pad with an elongated groove 23 on its bottom surface and a circular through-hole running through it. The circular through-hole includes an upper through-hole 21 and a lower through-hole 22 that are interconnected. The aperture of the upper through-hole 21 is smaller than that of the lower through-hole 22. The interior of the through-hole is designed as a stepped shape with varying apertures, which can generate a pressure difference between the upper and lower surfaces, further facilitating the adsorption of the pad and the package substrate located on it. The groove 23 does not penetrate the single-layer pad from top to bottom. The groove 23 and the circular through-hole are both connected to the air guide strips of the exposure machine support platform to enable adsorption and fixation through vacuum extraction.

[0033] Because the packaging substrate (such as a PCB or other circuit board) has hollowed-out cavity slots, a positioning frame line is drawn on the upper surface of the single-layer backing plate corresponding to the slots, which serves as a positioning reference for the packaging substrate. The circular through-holes are staggered with the positioning frame line to prevent the circular through-holes from appearing within the positioning frame line. In other words, when the packaging substrate is placed on the surface of the single-layer backing plate, the circular through-holes will not appear within the slots of the packaging substrate, avoiding air leakage that will ultimately affect the adsorption flatness.

[0034] Furthermore, in this embodiment, the positioning frame line includes a rectangular first positioning frame 11 and an L-shaped second positioning frame 12. The first positioning frames 11 are arranged in an array along the first direction (horizontal in the figure) and the second direction (vertical in the figure). A second positioning frame 12 is provided outside each corner of the first positioning frame 11. The four second positioning frames 12 form a discontinuous rectangular outline outside the first positioning frame. At least two circular through holes are provided within each of the rectangular outlines, and at least one row of circular through holes arranged along the second direction within each of the rectangular outlines is provided to ensure a certain density, so that the non-slot area of ​​the package substrate fits the backing plate and ensures flatness.

[0035] Furthermore, in this embodiment, the diameter of the upper through-holes 21 is 0.5-10mm, preferably 1mm; the diameter of the lower through-holes 22 is 0.5-10mm, preferably 2mm. It should be understood that the through-hole dimensions can be flexibly adjusted in practical applications and are not overly restrictive here. The grooves and lower through-holes are produced using a vacuum etching process; the upper through-holes on the front surface are produced using a mechanical drilling and vacuum coating process.

[0036] Furthermore, the plurality of grooves 23 are arranged parallel and equidistantly along the first direction. Within the region where the grooves 23 are located, a single row of circular through holes is arranged along a second direction, the second direction being perpendicular to the first direction. In other words, some of the single row of circular through holes overlaps with the grooves, and the grooves are etched to the same thickness as the underlying through holes.

[0037] Furthermore, the single-layer backing plate includes multiple unit blocks 100 arranged in an array. Each unit block 100 includes a first positioning frame 11 and four second positioning frames 12 surrounding the first positioning frame 11. The entire backing plate is divided into multiple identical unit blocks 100 to facilitate design and processing. In this embodiment, there are 25 blocks in total, arranged in a 5×5 array.

[0038] The exposure table fixture can be converted from the existing double-layer table fixture CAD data into CAM graphics, and then drawn in hole position film mode. After comparing with the actual product, the local hole positions are adjusted and optimized to ensure that the vacuum holes avoid the cavity slots, and then the drawings are updated to match the production. The specific steps include the following:

[0039] Step 1: After receiving the new model layout design, convert it into CAD drawings.

[0040] Step 2: Overlay and compare with the initial hole position drawing of the countertop, adjust the hole position requirements according to the product cavity design, and make a new hole position drawing.

[0041] Step 3: Convert the new hole position drawing into hole position film, compare it with the physical panel design of the new model, and confirm that the hole positions match the physical board.

[0042] Step 4: Provide the new hole location drawing to the supplier for confirmation and production.

[0043] Step 5: After completion, check the newly exposed table fixture and compare the hole position with the film.

[0044] Step 6: Test and verify on the machine, collect and compare product appearance and yield.

[0045] The exposure table fixture of this embodiment improves exposure defects and solder mask residue defects caused by unstable exposure machine table conditions. After using this solution, the exposure defect and solder mask residue defect rate of new models decreased from 4% to below 0.5%. This improved yield rate significantly increased product yield and profits.

[0046] This solution significantly reduces defects caused by unstable countertop installation and untimely cleaning of foreign matter between countertop layers. The optimized design also facilitates production operations and maintenance, improving equipment stability and utilization. Furthermore, this solution shortens the delivery time of new countertops, meeting the countertop matching requirements for product upgrades.

[0047] In summary, the present invention provides a packaging substrate exposure table jig. The exposure table jig is a single-layer pad, which eliminates the problems of uneven thickness and easy inclusion of foreign matter in the stacked double-layer structure, ensures the flatness of the packaging substrate when placed on the table jig, and significantly improves the exposure yield. At the same time, the circular through holes used for vacuuming in the jig are optimized and designed, and the circular through holes are divided into upper through holes and lower through holes. The aperture of the upper through hole is smaller than the aperture of the lower through hole, so that a stepped profile with varying apertures is formed inside the circular through hole, which can generate a pressure difference between the upper and lower surfaces, which is beneficial to the adsorption of the pad and the packaging substrate; the circular through holes are staggered with the positioning frame line to avoid the circular through holes appearing in the slots of the packaging substrate to cause air leakage, and at the same time, with a certain through hole density, the adsorption flatness is further guaranteed.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A packaging substrate exposure table fixture, characterized in that: The exposure table fixture is a single-layer pad, the bottom surface of which is provided with an elongated groove located on the bottom surface and a circular through hole penetrating the single-layer pad; the circular through hole includes an upper through hole and a lower through hole that are interconnected, and the aperture of the upper through hole is smaller than that of the lower through hole; the groove and the circular through hole are both connected to the air guide strip of the exposure machine support platform; A positioning frame line is drawn on the upper surface of the single-layer pad as a positioning reference for the packaging substrate, and the circular through holes are staggered with the positioning frame line.

2. The package substrate exposure table fixture according to claim 1, characterized in that: The plurality of grooves are arranged in parallel and at equal intervals along the first direction.

3. The package substrate exposure table fixture according to claim 2, characterized in that: A single row of circular through holes arranged along a second direction is provided in the region where the groove is located, and the second direction is perpendicular to the first direction.

4. The package substrate exposure table fixture according to claim 1, characterized in that: The positioning frame line includes a rectangular first positioning frame and an L-shaped second positioning frame, and the area of ​​the first positioning frame is larger than that of the second positioning frame.

5. The package substrate exposure table fixture according to claim 4, characterized in that: A second positioning frame is provided outside each corner of the first positioning frame, and four second positioning frames form a discontinuous rectangular outline outside the first positioning frame.

6. The package substrate exposure table fixture according to claim 1, characterized in that: The diameter of the upper through hole is 0.5-10 mm; the diameter of the lower through hole is 0.5-10 mm.

7. The package substrate exposure table fixture according to claim 1, characterized in that: The single-layer pad includes a plurality of blocks arranged in an array, and a single block includes a plurality of first positioning frames arranged in an array.

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