Silicon wafer breaking mechanism

Abstract

The utility model relates to a silicon wafer breaking-off mechanism, and belongs to the technical field of photovoltaic silicon wafer processing, and the silicon wafer breaking-off mechanism comprises a storage rack which is internally provided with a containing cavity, at least one side of the storage rack is provided with an opening, and the storage rack is used for fixing a wafer support and enabling a wafer to be located in the containing cavity; the pushing assembly is arranged close to the storage rack and comprises a pushing plate parallel to the wafers and a driving part for driving the pushing plate to enter the containing cavity from the opening and sequentially pushing the wafers in the arrangement direction of the wafers, a guide structure is formed between the driving part and the pushing plate, and the pushing plate is arranged in the containing cavity. According to the wafer breaking device, the wafer holder is fixedly placed through the arrangement of the storage rack, and the wafers are sequentially pushed in the arrangement direction of the wafers through the pushing assembly, so that the wafers are broken off from the wafer holder, the work of automatically breaking off the wafers is achieved, the work intensity is reduced, and the work efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a silicon wafer breaking mechanism, belonging to the technical field of photovoltaic silicon wafer processing. Background Art

[0002] After the silicon wafers are processed and debonded in the debonding machine, the wafer tray and the wafer are pulled out together with the discharge cart. The wafers are usually broken off manually. Since multiple wafers are arranged on a single wafer tray, breaking the wafers manually is not only labor-intensive but also has low production efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a silicon wafer breaking mechanism to solve the above problems.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a silicon wafer breaking mechanism, the silicon wafer breaking mechanism comprising:

[0005] A storage rack having a storage cavity formed therein and an opening formed on at least one side, the storage rack being used to fix the wafer holder and to position the wafer in the storage cavity;

[0006] A pushing assembly is arranged near the storage rack, including a pushing plate arranged parallel to the wafer and a driving member that drives the pushing plate to enter the accommodating cavity from the opening and push the wafers in sequence along the arrangement direction of the wafers. A guide structure is formed between the driving member and the pushing plate, and the guide structure is used to guide the pushing direction of the pushing plate.

[0007] Furthermore, a pushing surface is formed on the pushing plate and is adapted to the shape of the side surface of the wafer being pushed.

[0008] Furthermore, the driving member is a pushing cylinder, the output shaft of the pushing cylinder is fixedly connected to the center position of the pushing plate and the axis of the output shaft is perpendicular to the pushing surface.

[0009] Furthermore, the guide structure includes a guide rod connected to the push plate and a graphite copper sleeve fixed to the end of the cylinder, and the graphite copper sleeve is sleeved on the guide rod.

[0010] Furthermore, two groups of graphite copper sleeves are provided and are fixed to the front end and the middle position of the cylinder housing respectively through fixing plates.

[0011] Furthermore, the push plate is a square plate, and the guide structures are provided in four groups and are evenly distributed on the four corners of the square plate.

[0012] Furthermore, the storage rack includes a rack body and position-limiting members arranged at two ends of the top of the rack body, and the position-limiting members abut against two ends of the wafer support along the arrangement direction of the wafers.

[0013] Furthermore, the limiting member includes a connecting portion connected to the frame and a limiting portion abutting against the crystal support, the limiting portion extends from the connecting portion toward a direction away from the crystal support, and an angle between the limiting portion and the connecting portion is an obtuse angle.

[0014] The beneficial effect of the present invention is that: the present invention sets up a storage rack to fix the crystal tray, and pushes the wafers in sequence along the arrangement direction of the wafers through the pushing assembly, thereby breaking the wafers off the crystal tray, realizing the work of automatically breaking the wafers, reducing work intensity and improving work efficiency.

[0015] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a silicon wafer breaking mechanism according to an embodiment of the present application;

[0017] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of part A in the middle. DETAILED DESCRIPTION

[0018] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "axial", "radial", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, in the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium.

[0022] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. Throughout this specification, the schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0023] Please refer to Figures 1 to 2 The silicon wafer breaking mechanism shown in one embodiment of the present application includes a rack 10 and a pushing assembly. The rack 10 is used to place and fix the crystal tray 31, and the pushing assembly is used to push the wafers 32 on the crystal tray 31 off one by one.

[0024] A receiving cavity is formed in the rack 10 and has an opening on at least one side. The rack 10 is used to fix the crystal tray 31 and place the wafer 32 in the receiving cavity. That is, the crystal tray 31 and the wafer 32 are inverted on the rack 10, the crystal tray 31 is partially overlapped on the top of the rack 10, and the wafer 32 extends into the receiving cavity.

[0025] The pushing assembly is arranged close to the storage rack 10. The pushing assembly includes a pushing plate 21 arranged parallel to the chip 32 and a driving member that drives the pushing plate 21 to enter the accommodating cavity from the opening and push the chips 32 in sequence along the arrangement direction of the chips 32. A guide structure is formed between the driving member and the pushing plate 21, and the guide structure is used to guide the pushing direction of the pushing plate 21.

[0026] In one embodiment, the silicon wafer breaking mechanism also includes a collecting assembly for receiving the wafers 32. The collecting assembly includes a transmission belt arranged along the arrangement direction of the wafers 32 and a soft pad provided on the transmission belt. The pushing assembly pushes the fallen wafers 32 to fall onto the soft pad, and the wafers 32 are arranged at intervals on the soft pad under the drive of the conveyor belt, thereby avoiding damage to the wafers 32 and realizing fully automatic wafer breaking.

[0027] In one embodiment, the push plate 21 is formed with a push surface that matches the shape of the side surface of the wafer 32 being pushed. The push plate 21 is arranged parallel to the wafer 32 and has a push surface that matches its shape. This ensures a high degree of fit between the contact surfaces of the push plate 21 and the wafer 32 during the pushing process, resulting in more uniform force distribution and preventing damage to the wafer 32 due to uneven force.

[0028] In one embodiment, the driving member is a push cylinder 25. The output shaft of the push cylinder 25 is fixedly connected to the center of the push plate 21, with the axis of the output shaft perpendicular to the push surface. This ensures that the thrust force applied by the push cylinder 25 is uniformly applied to the push plate 21, improving the uniformity of the force applied to the wafer 32 during the push of the push plate 21 and preventing damage to the wafer 32.

[0029] In one embodiment, the guide structure includes a guide rod 24 connected to the push plate 21 and a graphite copper sleeve 23 fixed to the end of the cylinder. The graphite copper sleeve 23 is mounted on the guide rod 24. The graphite copper sleeve 23 cooperates with the guide rod 24 to guide the movement of the push plate 21, ensuring precise docking between the push plate 21 and the wafer 32.

[0030] In one embodiment, two sets of graphite copper sleeves 23 are provided and fixed to the front and middle positions of the cylinder housing via fixing plates 22. The two sets of graphite copper sleeves 23 are fixed to the front and middle positions of the cylinder housing at intervals, and the two graphite sleeves are used to coordinately guide the guide rod 24, thereby improving the guiding accuracy of the guide rod 24.

[0031] In one embodiment, the push plate 21 is a square plate with four sets of guide structures evenly distributed at the four corners of the square plate. By evenly distributing the four sets of guide structures at the four corners of the push plate 21 and utilizing the four sets of guide structures to coordinate guidance, the accuracy of the push plate 21's movement is further improved, ensuring that the pushing surface of the push plate 21 is always parallel to the pushed side of the wafer 32.

[0032] In one embodiment, the rack 10 includes a frame body and stoppers 11 disposed at both ends of the frame body. The stoppers 11 abut against both ends of the wafer tray 31 along the arrangement direction of the wafers 32. The stoppers 11 restrict movement of the wafer tray 31 in the arrangement direction of the wafers 32 to prevent movement of the wafer tray 31 when the push assembly pushes the wafers 32, resulting in poor pushing effect and the wafers 32 not being released from the wafer tray 31.

[0033] In one embodiment, the limiting member 11 includes a connecting portion 111 connected to the frame and a limiting portion 112 that abuts against the wafer support 31. The limiting portion 112 extends from the connecting portion 111 in a direction away from the wafer support 31, and the angle between the limiting portion 112 and the connecting portion 111 is an obtuse angle. By slanting the limiting portion 112, while providing a limiting effect, the wafer support 31 can automatically slide from the limiting portion 112 to the connecting portion 111 when the wafer support 31 is placed, without the need for additional adjustment of the position of the wafer support 31. Preferably, limiting posts 12 are provided on the connecting portion 111. The limiting posts 12 are engaged on both sides of the wafer support 31 perpendicular to the arrangement direction of the wafers 32 to further limit the position of the wafer support 31 and prevent it from moving.

[0034] The beneficial effect of the present invention is that: the present invention sets up a storage rack to fix the crystal tray, and pushes the wafers in sequence along the arrangement direction of the wafers through the pushing assembly, thereby breaking the wafers off the crystal tray, realizing the work of automatically breaking the wafers, reducing work intensity and improving work efficiency.

[0035] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0036] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A silicon wafer breaking mechanism, characterized in that: The silicon wafer breaking mechanism comprises: A storage rack having a storage cavity formed therein and an opening formed on at least one side, the storage rack being used to fix the wafer holder and to position the wafer in the storage cavity; A pushing assembly is arranged near the storage rack, including a pushing plate arranged parallel to the wafer and a driving member that drives the pushing plate to enter the accommodating cavity from the opening and push the wafers in sequence along the arrangement direction of the wafers. A guide structure is formed between the driving member and the pushing plate, and the guide structure is used to guide the pushing direction of the pushing plate.

2. The silicon wafer breaking mechanism according to claim 1, wherein: The pushing plate is formed with a pushing surface that matches the shape of the side surface of the wafer being pushed.

3. The silicon wafer breaking mechanism according to claim 2, wherein: The driving member is a pushing cylinder, the output shaft of the pushing cylinder is fixedly connected to the center position of the pushing plate, and the axis of the output shaft is perpendicular to the pushing surface.

4. The silicon wafer breaking mechanism according to claim 3, wherein: The guide structure includes a guide rod connected to the push plate and a graphite copper sleeve fixed to the end of the cylinder, and the graphite copper sleeve is sleeved on the guide rod.

5. The silicon wafer breaking mechanism according to claim 4, wherein: The graphite copper sleeves are provided in two groups and are fixed at the front end and the middle position of the cylinder housing respectively through fixing plates.

6. The silicon wafer breaking mechanism according to claim 5, wherein: The pushing plate is a square plate, and the guide structures are provided in four groups and are evenly distributed on the four corners of the square plate.

7. The silicon wafer breaking mechanism according to claim 1, wherein: The storage rack includes a rack body and position-limiting members arranged at two ends of the top of the rack body, and the position-limiting members abut against two ends of the wafer support along the arrangement direction of the wafers.

8. The silicon wafer breaking mechanism according to claim 7, wherein: The limiting member includes a connecting portion connected to the frame and a limiting portion abutting against the crystal support. The limiting portion extends from the connecting portion toward a direction away from the crystal support, and an angle between the limiting portion and the connecting portion is an obtuse angle.

Images