Decoding equipment base and decoding equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and particularly discloses a decoding equipment base and decoding equipment. The decoding equipment base comprises a material table; a plurality of first sample grooves with different diameters are formed in the material table; a decoding area is arranged on the material table; and the decoding area is partially or completely overlapped with each first sample groove. According to the scheme, the wafers can be placed in different first sample grooves according to sizes. As the code is generally located at the edge position of the wafer and each first sample groove intersects with the decoding area, the code can correspond to the lens group only by correspondingly placing the code in the decoding area when the wafer is placed. According to the decoding equipment base provided by the scheme, wafers of different sizes can be placed, and the limitation of a placing area is provided for workers through the first sample groove, so that the requirements on the number of equipment and the number of lens groups can be reduced, the equipment cost is reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a decoding device base and a decoding device. Background Art

[0002] During the semiconductor manufacturing process, wafers, chips, and other samples are initially etched with unique codes (such as QR codes, barcodes, or special patterns) through laser etching and ion implantation. Decoding equipment can read these micron-level markings at close range, obtaining essential information such as the wafer's batch number, material parameters, and production date. This ensures accurate tracking of each wafer throughout the entire process and helps the equipment perform high-precision operations on the samples. For example, before electron beam lithography (EBL) equipment is used, decoding equipment reads alignment marks on the sample, enabling the EBL equipment to more precisely adjust the exposure position, ensuring nanometer-level overlay accuracy for multi-layer circuit patterns.

[0003] During the actual decoding process, different samples have different sizes. To ensure stable placement of samples of varying sizes, two current methods are generally used. The first involves deploying multiple devices, each suitable for samples of different sizes. During decoding, the operator locates the corresponding decoding device and performs the decoding operation. The second method involves equipping the decoding device with multiple variable-pitch lens assemblies. Samples of varying sizes are placed directly on the decoding device, and the multiple variable-pitch lens assemblies then automatically lock onto the code at the different locations for decoding.

[0004] In the first method, the cost of multiple devices is high, and when multiple samples of different sizes need to be decoded at the same time, the staff needs to switch between different devices, which reduces work efficiency. In the second method, multiple variable-length lens groups also increase equipment costs, and there are also problems of heavy processor workload and low work efficiency. Utility Model Content

[0005] In view of this, the purpose of this application is to provide a decoding device base and a decoding device, which are used to solve some or all of the above problems.

[0006] In order to achieve the above technical objectives, the first aspect of the present application provides a decoding device base, comprising: a material table;

[0007] The material table is provided with a plurality of first sample slots of different diameters;

[0008] A decoding area is provided on the material table;

[0009] The decoding area partially or completely overlaps with each of the first sample slots.

[0010] Furthermore, the area of ​​the overlapping portion between the decoding region and each of the first sample slots is greater than or equal to half the area of ​​the decoding region.

[0011] Furthermore, a second sample tank is provided on the material table;

[0012] The second sample slot is located in the decoding area.

[0013] Furthermore, the second sample tank is in the shape of a rectangular column.

[0014] Furthermore, the second sample tank is a stepped tank body.

[0015] Furthermore, the length of the second sample groove is 62±1 mm;

[0016] The width of the second sample groove is 54±1 mm.

[0017] Furthermore, the number of the first sample slots is three.

[0018] Furthermore, the three first sample slots are sample slot No. 1, sample slot No. 2 and sample slot No. 3 respectively;

[0019] The diameter of the No. 1 sample tank is 8 inches;

[0020] The diameter of the No. 2 sample tank is 6 inches;

[0021] The radius of the No. 3 sample tank is 4 inches.

[0022] A second aspect of the present application provides a decoding device, comprising any one of the decoding device bases described above.

[0023] Furthermore, it also includes: a vertical pole, a light source mounting block, a camera clamp block and a laser positioning piece;

[0024] The vertical pole is arranged beside the material table in the base of the decoding device;

[0025] The light source mounting block, the camera clamping block and the laser positioning member are all arranged on the vertical pole.

[0026] Furthermore, it also includes: a chassis;

[0027] The material platform is arranged on the chassis;

[0028] The vertical rod is slidably arranged on the chassis along a horizontal direction.

[0029] It can be seen from the above technical solution that the present application provides a decoding device base and a decoding device; wherein, the decoding device base includes: a material table; a plurality of first sample slots of different diameters are arranged on the material table; a decoding area is arranged on the material table; the decoding area partially or completely overlaps with each of the first sample slots.

[0030] In this solution, wafers can be placed in different first sample slots depending on their size. Since the code is generally located at the edge of the wafer, and each first sample slot intersects with the decoding area, when placing the wafer, simply place the code within the decoding area to match the code with the lens group. The decoding device base provided in this solution can accommodate wafers of different sizes, and the first sample slot provides staff with a placement area restriction, thereby reducing the requirements for the number of equipment and lens groups, reducing equipment costs and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the overall structure of a decoding device base provided in an embodiment of the present application;

[0033] Figure 2 A side view of a base of a decoding device provided in an embodiment of the present application;

[0034] Figure 3 For the Figure 2 Top view of the AA section;

[0035] Figure 4 A side view of a second sample slot of a decoding device base provided in an embodiment of the present application;

[0036] In the picture:

[0037] 10. Material table; 11. First sample slot; 12. Decoding area; 13. Second sample slot; 20. Vertical pole; 30. Light source mounting block; 40. Camera clamping block; 50. Laser positioning component; 60. Chassis; 111. Sample slot No. 1; 112. Sample slot No. 2; 113. Sample slot No. 3. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions of the embodiments of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection requested by this application.

[0039] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0040] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0041] See also Figures 1 to 3 In a first aspect, embodiments of the present application provide a decoding device base, comprising a material table 10. In this embodiment, the material table 10 can be used to place samples such as wafers, providing support and stable placement for the samples. The material table 10 utilizes high-precision machining technology to ensure surface flatness.

[0042] In this embodiment, a plurality of first sample slots 11 with different diameters are provided on the material platform 10 ; a decoding area 12 is provided on the material platform 10 ; and the decoding area 12 partially or completely overlaps with each of the first sample slots 11 .

[0043] The decoding area 12 may correspond to the lens range of the lens group in the decoding device, that is, the lens group in the decoding device may cover the decoding area 12 to implement decoding operations on the codes in the decoding area 12 .

[0044] Because the multiple first sample slots 11 have different diameters, they can be used to accommodate samples of different sizes, such as wafers. After the decoding device is equipped with the material table 10 provided in this embodiment, when the staff needs to decode multiple samples of different sizes, the samples of different sizes can be processed on the same decoding device, avoiding the need to use multiple decoding devices for samples of different sizes, which can effectively reduce experimental and R&D costs.

[0045] Meanwhile, if the material platform 10 is not provided with the decoding area 12 and the first sample slot 11, for example, if the top surface of the material platform 10 is flat, workers can still directly place samples of different sizes on the material platform 10. However, different operators and different batches of operations may lead to large deviations in the placement of samples. Moreover, workers can only manually adjust the sample position based on the position of the lens group and its coverage range, which reduces decoding efficiency and places high demands on the lens group calculation. As a result, existing decoding equipment requires more lens groups.

[0046] In this embodiment, the material table 10 can be directly applied to existing decoding equipment with a single lens assembly. For example, the material table in an existing encoding device can be directly replaced with the material table 10 in this embodiment. During operation, the first sample slot 11 can be used to place and position the sample, reducing sample placement deviation. The decoding area 12 provides a positional guide for the code on the sample, ensuring that the code is recognized by the lens assembly after the operator adjusts it to the decoding area 12. This improves decoding efficiency and accuracy while retaining the other components of the existing decoding equipment and reduces the computational burden on the lens assembly.

[0047] In one embodiment, the overlapping area between the decoding region 12 and each first sample slot 11 is greater than or equal to half of the area of ​​the decoding region 12 .

[0048] Specifically, the decoding range of the lens assembly is generally configured to be at least six times the area of ​​the decoding region 12. In this embodiment, the overlapping area between the decoding region 12 and any first sample slot 11 is at least half the area of ​​the decoding region 12. This ensures that after a sample is placed in the first sample slot 11, the code at the edge of the sample can be completely positioned within the decoding region 12 through position adjustment, ensuring that the lens assembly can effectively cover and recognize the code.

[0049] In one embodiment, a second sample slot 13 is provided on the material table 10 ; the second sample slot 13 is located in the decoding area 12 .

[0050] As an embodiment, the second sample tank 13 may be in the shape of a rectangular column.

[0051] As an embodiment, the second sample slot 13 can completely overlap with the decoding area 12 , that is, the second sample slot 13 covers the entire decoding area 12 . In this embodiment, the groove edge of the second sample slot 13 can serve as an identification structure of the decoding area 12 .

[0052] Specifically, in actual applications, in addition to round wafers, some small-sized chips are also present as samples, and the size of these chips is smaller than that of the decoding area 12. In this embodiment, these small-sized chips can be placed directly in the second sample slot 13, or they can be placed in a sample box, which is then placed in the second sample slot 13.

[0053] In this embodiment, the sample placed in the second sample slot 13 can be directly recognized by the lens group. Therefore, by setting the second sample slot 13, the adaptability of the decoding device to samples of different sizes can be further increased. At the same time, for samples suitable for placing in the second sample slot 13, the error of sample placement can be reduced, thereby improving decoding efficiency.

[0054] In one embodiment, Figure 3 and Figure 4 As shown, the second sample tank 13 can be a stepped tank body.

[0055] Specifically, the stepped trough body refers to the stepped bottom of the second sample trough 13. The second sample trough 13 may be provided with one or more steps.

[0056] The stepped second sample slot 13 can accommodate samples of different heights and widths, thereby improving the applicability and accommodating capacity of the second sample slot 13 and enabling samples or sample boxes of different sizes to be stably placed.

[0057] As an implementation manner, in this embodiment, the length of the second sample slot 13 is 62±1 mm; the width of the second sample slot 13 is 54±1 mm, which is applicable to the current sample box that can accommodate multiple wafers.

[0058] In one embodiment provided in the present application, the number of the first sample slots 11 is three.

[0059] The inventors have discovered that the intersection of the three first sample slots 11 can meet the placement requirements of samples of different sizes while ensuring that each sample can be accurately aligned with the decoding area.

[0060] For more specific examples, see Figure 3The three first sample slots 11 are sample slot No. 111, sample slot No. 2 112 and sample slot No. 3 113; the diameter of sample slot No. 111 is 8 inches, which can be used to place 8-inch wafers; the diameter of sample slot No. 2 112 is 6 inches, which can be used to place 6-inch and 5-inch wafers; the radius of sample slot No. 3 113 is 4 inches, which can be used to place 4-inch and 3-inch wafers.

[0061] In practical applications, commonly used wafer sizes are generally 3 inches, 4 inches, 6 inches, and 8 inches. In this embodiment, the first sample slot 111, the second sample slot 112, and the third sample slot 113 can cover the commonly used wafer size range, while ensuring that after the wafer is placed, the code on the wafer can be adjusted to the decoding area 12 and recognized by the lens group.

[0062] A second aspect of the present application provides a decoding device, comprising any one of the above-mentioned decoding device bases.

[0063] For more specific examples, see Figure 1 The decoding device also includes: a vertical pole 20, a light source mounting block 30, a camera clamp block 40 and a laser positioning component 50; the vertical pole 20 is arranged next to the material table 10 in the base of the decoding device; the light source mounting block 30, the camera clamp block 40 and the laser positioning component 50 are all arranged on the vertical pole 20.

[0064] In this embodiment, the vertical pole 20 can be arranged in the vertical direction; after the light source mounting block 30 , the camera clamping block 40 and the laser positioning member 50 are installed, they are all located above the material table 10 .

[0065] The light source mounting block 30 can be used to mount a lighting element to provide light to the material platform 10. The camera clamp 40 can be used to mount a camera. The laser positioning element 50 is used to precisely calibrate the sample position to ensure the accuracy of the decoding process.

[0066] In one embodiment, the decoding device further includes a chassis 60; a material platform 10 disposed on the chassis 60; and a vertical rod 20 slidably disposed horizontally on the chassis 60, such that the horizontal position of the vertical rod 20 and components on the vertical rod 20 can be adjusted. Accordingly, the chassis 60 may be provided with a slide rail for the vertical rod 20 to slide.

[0067] The above are only preferred embodiments of the present application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the aforementioned examples or make equivalent replacements for some of the technical features therein. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A decoding device base, characterized in that: include: Material table (10); The material table (10) is provided with a plurality of first sample slots (11) of different diameters; A decoding area (12) is provided on the material table (10); The decoding area (12) partially or completely overlaps with each of the first sample slots (11).

2. The decoding device base according to claim 1, characterized in that A second sample slot (13) is provided on the material table (10); The second sample slot (13) is located in the decoding area (12).

3. The decoding device base according to claim 2, characterized in that: The second sample tank (13) is in the shape of a rectangular column.

4. The decoding device base according to claim 2 or 3, characterized in that: The second sample tank (13) is a stepped tank body.

5. The decoding device base according to claim 1, characterized in that: The area of ​​the overlapping portion between the decoding region (12) and each of the first sample slots (11) is greater than or equal to half the area of ​​the decoding region (12).

6. The decoding device base according to claim 1, characterized in that: The number of the first sample slots (11) is three.

7. The decoding device base according to claim 6, characterized in that: The three first sample slots (11) are respectively a No. 1 sample slot (111), a No. 2 sample slot (112) and a No. 3 sample slot (113); The diameter of the No. 1 sample tank (111) is 8 inches; The diameter of the second sample tank (112) is 6 inches; The diameter of the No. 3 sample tank (113) is 4 inches.

8. A decoding device, characterized in that: The decoding device base comprises the decoding device base according to any one of claims 1 to 7.

9. The decoding device according to claim 8, characterized in that Also includes: A vertical pole (20), a light source mounting block (30), a camera clamping block (40) and a laser positioning member (50); The vertical pole (20) is arranged beside the material table (10) in the base of the decoding device; The light source mounting block (30), the camera clamping block (40) and the laser positioning member (50) are all arranged on the vertical pole (20).

10. The decoding device according to claim 9, characterized in that Also includes: chassis (60); The material platform (10) is arranged on the chassis (60); The vertical rod (20) is slidably arranged on the chassis (60) along a horizontal direction.

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