Constant-voltage integrated circuit (IC) packaging structure for light-emitting diode (LED) light source module
By adopting a constant voltage IC package structure in the LED light source module, the series connection between the lamp beads and the constant voltage IC chip is realized, the circuit design is simplified, the cost is reduced, and the production and promotion and application are facilitated.
Patent Information
- Application Number
- CN202422701105.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-11-06
AI Technical Summary
The existing LED light source module requires multiple power supply devices, which is expensive and inconvenient for production, and is not conducive to widespread promotion and application.
The constant voltage IC packaging structure is adopted, including the IC packaging bracket, the constant voltage IC chip and the lamp bead connection pin. The electrical connection between the lamp bead and the constant voltage IC chip is achieved by welding gold wire, and the light-proof spot glue layer is covered, which is simplified into a constant current device and directly soldered on the aluminum substrate of the LED light source module.
It reduces power supply devices, reduces production costs, simplifies the production process, is easy to use, and is suitable for SMT patch modules.
Smart Images

Figure CN223296813U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED light sources, in particular to a constant voltage IC packaging structure for an LED light source module. Background Art
[0002] With the continuous improvement of people's living standards, quality demands and LED lighting industry technology, the appearance, style and functions of LED lighting fixtures have also been upgraded accordingly, from the most basic energy-saving lighting functions to the intelligent control or automatic sensing functions currently used in the market.
[0003] After searching, a Chinese utility model patent application with patent application number CN202221359214.4 discloses an LED light source module, including an injection-molded housing and a conductive circuit structure. The injection-molded housing and the conductive circuit structure are formed into an integral structure by injection molding. The conductive circuit structure is located within the injection-molded housing, and the injection-molded housing is formed with a number of mounting holes communicating with its inner cavity. Each mounting hole is equipped with an LED flip chip electrically connected to the conductive circuit structure. This utility model forms the LED light-emitting unit of the LED light source module by injection molding the injection-molded housing and the conductive circuit structure. The LED flip chip is then installed in the mounting holes of the injection-molded housing and electrically connected to the conductive circuit structure. Compared with the LED light-emitting unit structure of existing traditional LED light source modules, the PCB board is omitted, reducing production costs. At the same time, there is no need for complex processes such as printing solder paste and reflow soldering, thereby greatly improving production efficiency.
[0004] Another example is Chinese utility model patent application number CN202222125201.7, which discloses a self-driven LED light source board, LED light source module, and lamp. The self-driven LED light source board includes a first loading portion and a second loading portion. The first loading portion is provided with a driving circuit. The second loading portion is a strip plate connected to one side of the first loading portion and extending in a clockwise or counterclockwise spiral around the first loading portion. The strip plate is provided with multiple LED lamp beads along its extension direction. The LED light source module includes at least two of the above-mentioned self-driven LED light source boards. The first loading portion of each LED light source board is rotationally symmetrical about the center, and the distance between the inner and outer edges of the second loading portion of the LED light source board is at least greater than the width of one strip plate. The lamp utilizes the above-mentioned self-driven LED light source board or LED light source module. This utility model does not require an additional connection to a driving power supply. At the same time, it can cleverly utilize the spiral gap to embed and combine multiple LED light source boards, facilitating future upgrades and maintenance.
[0005] Although the existing LED light source modules can meet basic usage requirements, they all achieve constant voltage power supply and constant current output by setting up a driving circuit or linear IC, which requires many power supply components and has a high production cost; and are inconvenient to produce, which is not conducive to widespread promotion and application. Utility Model Content
[0006] The technical problem to be solved by the present invention is to provide a constant voltage IC packaging structure for LED light source modules in response to the above-mentioned defects of the prior art, so as to solve the problems of the existing LED light source modules, such as the large number of power supply components required, high production costs, inconvenience in production, and disadvantages for widespread promotion and application.
[0007] In order to solve the above technical problems, the technical solution of the utility model is:
[0008] A constant voltage IC packaging structure for an LED light source module includes an IC packaging bracket, an IC packaging groove is formed on the IC packaging bracket, a constant voltage IC chip is arranged in the IC packaging groove, a plurality of lamp bead connection pins are provided at the bottom of the IC packaging bracket, the constant voltage IC chip is electrically connected to the lamp bead connection pins by welding gold wires, and a light-proof glue layer is covered on the top of the constant voltage IC chip.
[0009] Preferably, the constant voltage IC chip is provided with a VP pin, a VDD pin and a VN pin in sequence, and the VP pin, the VDD pin and the VN pin are all electrically connected to the lamp bead connection pin by welding gold wires.
[0010] Preferably, the lamp bead connection pins include a plurality of first lamp bead connection pins, second lamp bead connection pins and third lamp bead connection pins, and the first lamp bead connection pins, second lamp bead connection pins and third lamp bead connection pins are electrically connected to the VP pin, VDD pin and VN pin respectively.
[0011] Preferably, the light-proof glue layer is black silica gel.
[0012] Preferably, the first lamp bead connecting pin, the second lamp bead connecting pin and the third lamp bead connecting pin are all welded to the bottom of the IC package bracket.
[0013] Preferably, the welding gold wire includes a first welding gold wire, a second welding gold wire and a third welding gold wire, the first welding gold wire is respectively connected to the first lamp bead connection pin and the VP pin, the second welding gold wire is respectively connected to the second lamp bead connection pin and the VDD pin, and the third welding gold wire is respectively connected to the third lamp bead connection pin and the VN pin.
[0014] By adopting the above technical solution, the utility model provides a constant voltage IC packaging structure for an LED light source module, which has the following beneficial effects: an IC packaging groove is provided on the IC packaging bracket in the constant voltage IC packaging structure, a constant voltage IC chip is arranged in the IC packaging groove, and a plurality of lamp bead connection pins are provided at the bottom of the IC packaging bracket. The constant voltage IC chip is electrically connected to the lamp bead connection pins by welding gold wires, and a light-proof glue layer is covered on the top of the constant voltage IC chip. By packaging the constant voltage IC chip on the IC packaging bracket, it can be welded to the aluminum substrate circuit of the LED light source module when used, so that the lamp bead circuit and the constant voltage IC chip are connected in series to realize constant voltage power supply and constant current output. It can be used as a constant current device attached to the LED light source module without the need to set up a driving circuit separately, which can reduce the power supply devices required for the LED light source module and reduce the production cost. The production cost is low and it is convenient to produce. It can also be used in SMT patch modules, which is conducive to wide promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is an exploded view of the utility model;
[0016] Figure 2 A three-dimensional diagram of the present invention from another angle;
[0017] In the figure, 1-IC package bracket, 2-IC package groove, 3-constant voltage IC chip, 4-light-proof glue layer, 5-VP pin, 6-VDD pin, 7-VN pin, 8-first lamp bead connection pin, 9-second lamp bead connection pin, 10-third lamp bead connection pin, 11-first welding gold wire, 12-second welding gold wire, 13-third welding gold wire. DETAILED DESCRIPTION
[0018] The following further describes specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the descriptions of these embodiments are intended to aid understanding of the present invention and do not constitute limitations on the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined with one another as long as they do not conflict with one another.
[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0021] like Figure 1-2 As shown, the constant voltage IC package structure for the LED light source module includes an IC package bracket 1, which is provided with an IC package groove 2. A constant voltage IC chip 3 is disposed in the IC package groove 2. The bottom of the IC package bracket 1 is provided with a plurality of lamp bead connection pins. The constant voltage IC chip 3 is electrically connected to the lamp bead connection pins by welding gold wires. The constant voltage IC chip 3 is covered with a light-proof adhesive layer 4. It is understood that the constant voltage IC chip 3 is connected to the lamp bead connection pins by gold wire welding. The constant voltage IC chip 3 can be a NU520 series chip, etc., or other constant voltage IC, and the present invention is not limited thereto.
[0022] Specifically, the constant voltage IC chip 3 is provided with a VP pin 5, a VDD pin 6 and a VN pin 7 in sequence, and the VP pin 55, the VDD pin 6 and the VN pin 7 are electrically connected to the lamp bead connection pins by welding gold wires; the lamp bead connection pins include a plurality of first lamp bead connection pins 8, a second lamp bead connection pin 9 and a third lamp bead connection pin 10, and the first lamp bead connection pin 8, the second lamp bead connection pin 9 and the third lamp bead connection pin 10 are electrically connected to the VP pin 5, the VDD pin 6 and the VN pin 7 respectively; the first lamp bead connection pin 8, the second lamp bead connection pin 9 and the third lamp bead connection pin 10 are electrically connected to the VP pin 5, the VDD pin 6 and the VN pin 7 respectively; The second lamp bead connection pin 9 and the third lamp bead connection pin 10 are both soldered to the bottom of the IC package bracket 1. The soldering gold wires include a first soldering gold wire 11, a second soldering gold wire 12, and a third soldering gold wire 13. The first soldering gold wire 11 is respectively connected to the first lamp bead connection pin 8 and the VP pin 5, the second soldering gold wire 12 is respectively connected to the second lamp bead connection pin 9 and the VDD pin 6, and the third soldering gold wire 13 is respectively connected to the third lamp bead connection pin 10 and the VN pin 7. The light-shielding adhesive layer 4 is black silicone and is used to shield the constant voltage IC chip 3 from light. It is understood that the number of the above-mentioned lamp bead pins is not limited.
[0023] It can be understood that the utility model has a reasonable design and a unique structure. By encapsulating the constant voltage IC chip 3 on the IC packaging bracket 1, it can be welded on the aluminum substrate circuit of the LED light source module when in use, so that the lamp bead circuit and the constant voltage IC chip 3 are connected in series to achieve constant voltage power supply and constant current output. It can be used as a constant current device attached to the LED light source module without the need to set up a separate driving circuit. It can reduce the power supply devices required for the LED light source module and reduce the production cost. The production cost is low and it is convenient to produce. It can be used in SMT patch modules, which is conducive to wide promotion and application.
[0024] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.
Claims
1. A constant voltage IC packaging structure for an LED light source module, comprising an IC packaging bracket, characterized in that: An IC packaging groove is provided on the IC packaging bracket, a constant voltage IC chip is arranged in the IC packaging groove, a plurality of lamp bead connection pins are provided at the bottom of the IC packaging bracket, the constant voltage IC chip is electrically connected to the lamp bead connection pins by welding gold wires, and a light-proof glue layer is covered on top of the constant voltage IC chip.
2. The constant voltage IC packaging structure for an LED light source module according to claim 1, wherein: The constant voltage IC chip is provided with a VP pin, a VDD pin and a VN pin in sequence, and the VP pin, the VDD pin and the VN pin are all electrically connected to the lamp bead connection pin by welding gold wires.
3. The constant voltage IC packaging structure for an LED light source module according to claim 2, wherein: The lamp bead connection pins include a plurality of first lamp bead connection pins, a second lamp bead connection pin and a third lamp bead connection pin, and the first lamp bead connection pins, the second lamp bead connection pins and the third lamp bead connection pins are electrically connected to the VP pin, the VDD pin and the VN pin respectively.
4. The constant voltage IC packaging structure for an LED light source module according to claim 1, wherein: The light-proof glue-dotting layer is black silica gel.
5. The constant voltage IC packaging structure for an LED light source module according to claim 1, wherein: The first lamp bead connecting pin, the second lamp bead connecting pin and the third lamp bead connecting pin are all welded to the bottom of the IC package bracket.
6. The constant voltage IC packaging structure for an LED light source module according to claim 3, wherein: The welding gold wire includes a first welding gold wire, a second welding gold wire and a third welding gold wire. The first welding gold wire is respectively connected to the first lamp bead connection pin and the VP pin, the second welding gold wire is respectively connected to the second lamp bead connection pin and the VDD pin, and the third welding gold wire is respectively connected to the third lamp bead connection pin and the VN pin.
Citation Information
Patent Citations
LED light source plate with drive, LED light source module and lamp
CN217899573U
LED light source module
CN218494790U