Outer cover for exhaust pipe of radio frequency matcher and semiconductor process equipment

Abstract

The utility model provides an outer cover for an exhaust pipe of a radio frequency matcher and semiconductor process equipment, the outer cover is used for the exhaust pipe of the radio frequency matcher and is provided with a cover body with an accommodating cavity, and the accommodating cavity is used for accommodating a pipe opening end of the exhaust pipe; and a first exhaust fan assembly is installed on the first side wall, corresponding to the pipe opening position of the exhaust pipe, of the cover body, and the first exhaust fan assembly is used for feeding cold air into the containing cavity so that hot air in the containing cavity can be exhausted out of the containing cavity. The cover body is installed at the pipe opening end of an exhaust pipe of the radio frequency matcher, the pipe opening end of the exhaust pipe is located in the containing cavity, and the exhaust pipe exhausts hot air into the containing cavity. And meanwhile, the first exhaust fan assembly is used for blowing hot air in the containing cavity, so that the hot air is exhausted through the opening of the containing cavity. Therefore, according to the embodiment of the invention, the first exhaust fan assembly is arranged on the outer cover, so that the exhaust heat dissipation effect of the radio frequency matcher is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an outer cover of an exhaust pipe for a radio frequency matcher and semiconductor process equipment. Background Art

[0002] In the semiconductor industry, physical vapor deposition (PVD) is the most widely used thin-film manufacturing technology. It broadly refers to thin-film fabrication processes that utilize physical methods to produce thin films. Specifically, it involves using radio frequency plasma to activate reactive gases, promoting chemical reactions on or near the substrate surface to form solid films. RF matching devices are key components for ensuring the efficient and reliable operation of PVD equipment.

[0003] To better match RF impedance, ceramic capacitors are installed in RF matching units. By adjusting the capacitor's capacitance, the impedance at the RF matching unit's input end is ultimately conjugately matched with the constant output impedance of the RF power supply. This process generates heat in the capacitor, and how to effectively dissipate this heat is a common concern in the industry.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Utility Model Content

[0005] In response to the problems in the prior art, the purpose of the present invention is to provide an outer cover for an exhaust duct of a radio frequency matcher and semiconductor process equipment, which overcomes the difficulties of the prior art and solves the exhaust and heat dissipation problems of the radio frequency matcher.

[0006] A first aspect of the present disclosure provides a cover for an exhaust duct of a radio frequency matching device, comprising:

[0007] A cover body having a receiving cavity, wherein the receiving cavity is used to receive the nozzle end of the exhaust pipe;

[0008] A first exhaust fan assembly is installed on the first side wall of the cover body corresponding to the pipe opening of the exhaust duct. The first exhaust fan assembly is used to supply cold air into the accommodating cavity to discharge the hot air in the accommodating cavity to the outside of the accommodating cavity.

[0009] Optionally, the first exhaust fan assembly includes:

[0010] shell;

[0011] A first exhaust fan is encapsulated in the housing, the air intake side of the first exhaust fan is aligned with the accommodating cavity through a through hole provided on the first side wall, and the air exhaust side of the first exhaust fan leads to the outside of the housing.

[0012] Optionally, an air suction pipe is installed on the above-mentioned shell, one end of the air suction pipe leads to the exhaust side of the above-mentioned first exhaust fan, and the other end of the air suction pipe leads to the outside of the above-mentioned shell.

[0013] Optionally, the cover body is provided with a first air guide groove, and the first air guide groove is located on the inner side of the second side wall of the cover body, and the second side wall is opposite to the first side wall.

[0014] Optionally, the first air guide groove is a strip-shaped groove.

[0015] Optionally, the length direction of the strip groove is perpendicular to the depth direction of the accommodating cavity.

[0016] Optionally, there are at least two groups of the first air guide grooves, and each group of the first air guide grooves is arranged along the depth direction of the accommodating cavity.

[0017] Optionally, a second exhaust fan assembly is also installed on the third side wall of the above-mentioned cover body. The above-mentioned third side wall is connected to the above-mentioned first side wall and faces the capacitor position in the above-mentioned RF matcher. The above-mentioned second exhaust fan assembly is used to supply air into the above-mentioned accommodating cavity toward the above-mentioned capacitor position.

[0018] Optionally, an exhaust hole and a second air guide groove are provided on the inner side of the fourth side wall of the cover body, and the fourth side wall is opposite to the third side wall.

[0019] An embodiment of the present disclosure also provides a semiconductor process equipment, which includes a radio frequency matcher and an outer cover for the exhaust duct of the radio frequency matcher according to any of the above embodiments, wherein the radio frequency matcher has an exhaust duct, the outer cover is installed at the pipe mouth end of the exhaust duct, and the pipe mouth end is located in the above-mentioned accommodating cavity.

[0020] In the disclosed outer cover, the cover is mounted on the nozzle end of the exhaust duct of the RF matcher. The nozzle end of the exhaust duct is located within the storage chamber, and the exhaust duct exhausts hot air into the storage chamber. Simultaneously, a first exhaust fan assembly is used to blow the hot air within the storage chamber, thereby discharging the hot air through the opening of the storage chamber. Therefore, by installing the first exhaust fan assembly on the outer cover, the disclosed embodiment improves the exhaust and heat dissipation effect of the RF matcher.

[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings.

[0023] Figure 1A perspective view showing an outer cover of an exhaust duct for a radio frequency matching device in the related art.

[0024] Figure 2 It is a three-dimensional view of an outer cover of an exhaust duct for a radio frequency matcher provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0025] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0026] In addition, the concepts of "first" and "second" mentioned in this disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0027] In related technologies, such as Figure 1 The outer cover of the exhaust pipe of the radio frequency matching device shown in the figure has a ventilation pipe 1 installed on one side wall. The ventilation pipe 1 is connected to the accommodating cavity 1a in the outer cover and is used to discharge the hot air discharged from the exhaust pipe.

[0028] However, the ventilation effect of the outer cover in the related art is not good.

[0029] Figure 2 A perspective view showing an outer cover of an exhaust duct for a radio frequency matching device provided by an embodiment of the present disclosure, such as Figure 2 As shown, the outer cover of the exhaust duct for the radio frequency matching device includes:

[0030] The housing 2 has a receiving cavity 2a, wherein the receiving cavity 2a is used to receive the nozzle end of the exhaust pipe (not shown in the figure);

[0031] A first exhaust fan assembly 3 is installed on the first side wall 21 of the cover body 2 corresponding to the pipe opening of the exhaust duct. The first exhaust fan assembly 3 is used to supply cold air into the accommodating cavity 2a to discharge the hot air in the accommodating cavity 2a to the outside of the accommodating cavity 2a.

[0032] Here, cold air and hot air are relative concepts. Hot air refers to the air sent into the accommodating chamber 2a by the RF matching device through the exhaust pipe, which has a higher temperature than cold air. Cold air refers to the air used to blow away the hot air, which has a lower temperature than hot air and can be natural wind from the outside.

[0033] With the disclosed outer cover, the cover body 2 is mounted on the outlet end of the exhaust duct of the RF matching device. The outlet end of the exhaust duct is located within the accommodating chamber 2a, and the exhaust duct exhausts hot air into the accommodating chamber 2a. Simultaneously, the first exhaust fan assembly 3 is used to blow the hot air within the accommodating chamber 2a, thereby discharging the hot air through the opening of the accommodating chamber 2a. Therefore, by mounting the first exhaust fan assembly 3 on the outer cover, the disclosed embodiment improves the exhaust and heat dissipation effect of the RF matching device.

[0034] like Figure 2 As shown, in the embodiment of the present disclosure, the first exhaust fan assembly 3 includes:

[0035] Housing 31;

[0036] The first exhaust fan encapsulated in the shell 31 (shielded by the shell 31 and invisible) has its suction side aligned with the accommodating cavity 2a through a through hole provided on the first side wall 21 , and its exhaust side leads to the outside of the shell 31 .

[0037] In this embodiment, the first exhaust fan assembly 3 is encapsulated by the housing 31, thereby enhancing the product integration of the outer cover.

[0038] In one embodiment, an air suction pipe 32 is installed on the housing 31 , one end of the air suction pipe 32 leads to the exhaust side of the first exhaust fan, and the other end of the air suction pipe 32 leads to the outside of the housing 31 .

[0039] When the first exhaust fan is working, cold air is sucked in from the outside through the suction pipe 32. For example, the suction pipe 32 leads to a natural wind environment to absorb the natural wind from the outside. Then the first exhaust fan sends the sucked cold air into the accommodating chamber 2a.

[0040] In this embodiment, the housing 2 is provided with a first air guide groove 2b, which is located on the inner side of the second side wall 22 of the housing 2, which is opposite the first side wall 21. The first air guide groove 2b faces the opposite side of the first exhaust fan assembly 3. When the first exhaust fan blows cold air into the accommodating chamber 2a, the cold air flows toward the second side wall 22 and is guided by the first air guide groove 2b to form a large area of ​​cold air flow within the accommodating chamber 2a. This large area of ​​cold air flow facilitates the discharge of hot air out of the accommodating chamber 2a, thereby enhancing the exhaust and heat dissipation effect.

[0041] In one embodiment, the first air guide groove 2b is a strip groove or other shapes, which is not limited here.

[0042] In an optional embodiment, the length direction LL of the strip groove is perpendicular to the depth direction HH of the above-mentioned accommodating cavity 2a. In this way, the cold air blown in is guided by the upper and lower groove walls of the strip groove to the bottom and top openings of the accommodating cavity 2a, thereby covering a larger airflow range in the depth direction HH, thereby achieving an enhanced effect of discharging hot air.

[0043] In one embodiment, the first air guide grooves 2b have one or at least two groups, and each group of first air guide grooves 2b is arranged along the depth direction HH of the above-mentioned accommodating cavity 2a, which can form a guide surface with a larger range, thereby achieving better discharge of hot air.

[0044] In one embodiment, a second exhaust fan assembly 4 is also installed on the third side wall 23 of the above-mentioned cover body 2. The above-mentioned third side wall 23 is connected to the above-mentioned first side wall 21 and faces the capacitor position in the above-mentioned RF matcher (not shown in the figure). The above-mentioned second exhaust fan assembly 4 is used to supply air into the above-mentioned accommodating cavity 2a toward the above-mentioned capacitor position.

[0045] In this embodiment, the second exhaust fan assembly 4 supplies air toward the capacitor position, and the output cold air flow directly blows and cools the capacitor in the RF matching device, thereby increasing the life of the capacitor.

[0046] In one embodiment, an exhaust hole 2c and a second air guide slot 2d are provided on the inner side of the fourth side wall 24 of the housing 2, which is opposite the third side wall 23. Thus, the cold air blown in by the second exhaust fan assembly 4 can discharge the hot air from the exhaust hole 2c, while the second air guide slot 2d can guide the cold air, thereby improving the exhaust efficiency of the hot air in the accommodating chamber 2a.

[0047] In this embodiment, the exhaust holes 2c are multiple circular holes distributed on the fourth side wall 24. The diameter and number of the exhaust holes 2c are set as needed and are not limited here. However, it should be noted that since the RF matching device may generate RF radiation during operation, the diameter and number of the exhaust holes 2c should not be too large.

[0048] In the embodiment of the present disclosure, the shape and arrangement of the second air guide groove 2d can refer to the first air guide groove 2b. The second air guide groove 2d is also a strip-shaped groove, and its length direction is also perpendicular to the depth direction HH of the accommodating cavity 2a.

[0049] An embodiment of the present disclosure also provides a semiconductor process equipment, which includes a radio frequency matcher and a cover for an exhaust duct of the radio frequency matcher according to any of the above embodiments, wherein the radio frequency matcher has an exhaust duct, and the cover is installed at the pipe mouth end of the above exhaust duct, and the above pipe mouth end is located in the above accommodating cavity 2a.

[0050] In one embodiment, the semiconductor processing equipment may be a PVD equipment.

[0051] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the utility model disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A cover for an exhaust duct of a radio frequency matching device, characterized in that: include: A cover body having a receiving cavity, wherein the receiving cavity is used to receive the nozzle end of the exhaust pipe; A first exhaust fan assembly is installed on the first side wall of the cover body corresponding to the pipe opening position of the exhaust duct. The first exhaust fan assembly is used to supply cold air into the accommodating cavity to discharge the hot air in the accommodating cavity to the outside of the accommodating cavity.

2. The outer cover for the exhaust duct of the radio frequency matching device according to claim 1, characterized in that: The first exhaust fan assembly comprises: shell; A first exhaust fan is encapsulated in the housing, wherein the air intake side of the first exhaust fan is aligned with the accommodating cavity through a through hole provided on the first side wall, and the air exhaust side of the first exhaust fan leads to the outside of the housing.

3. The outer cover for the exhaust duct of the radio frequency matching device according to claim 2, characterized in that: An air suction pipe is installed on the shell, one end of the air suction pipe leads to the exhaust side of the first exhaust fan, and the other end of the air suction pipe leads to the outside of the shell.

4. The outer cover for the exhaust duct of a radio frequency matching device according to claim 1, characterized in that: The cover body is provided with a first air guide groove, and the first air guide groove is located on the inner side of the second side wall of the cover body, and the second side wall is opposite to the first side wall.

5. The outer cover for the exhaust duct of the radio frequency matching device according to claim 4, characterized in that: The first air guide groove is a strip-shaped groove.

6. The outer cover for the exhaust duct of the radio frequency matching device according to claim 5, characterized in that: The length direction of the strip groove is perpendicular to the depth direction of the accommodating cavity.

7. The outer cover for the exhaust duct of a radio frequency matching device according to claim 6, characterized in that: The first air guiding grooves have at least two groups, and each group of the first air guiding grooves is arranged along the depth direction of the accommodating cavity.

8. The outer cover for the exhaust duct of a radio frequency matching device according to claim 1, characterized in that: A second exhaust fan assembly is also installed on the third side wall of the cover body. The third side wall is connected to the first side wall and faces the capacitor position in the RF matcher. The second exhaust fan assembly is used to supply air into the accommodating cavity toward the capacitor position.

9. The outer cover for the exhaust duct of a radio frequency matching device according to claim 8, characterized in that: An exhaust hole and a second air guide groove are provided on the inner side of the fourth side wall of the cover body, and the fourth side wall is opposite to the third side wall.

10. A semiconductor process equipment, characterized in that: A radio frequency matching device and a cover for an exhaust pipe of the radio frequency matching device according to any one of claims 1 to 8, wherein the radio frequency matching device has an exhaust pipe, the cover is installed at the pipe end of the exhaust pipe, and the pipe end is located in the accommodating cavity.

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