Air-cooled heat dissipation structure

Abstract

The utility model discloses an air cooling heat dissipation structure, which comprises a heat dissipation plate, a heat dissipation device and a fan are sequentially arranged above the heat dissipation plate, the top of the heat dissipation plate is in contact with the bottom of the heat dissipation device for heat conduction, the heat dissipation device comprises a plurality of heat dissipation sheets which are sequentially distributed, and a ventilation interval is arranged between every two adjacent heat dissipation sheets; a first heat conduction boss is arranged at the bottom of the heat dissipation plate and can be matched with a chip in a heat conduction mode, the top of the heat dissipation plate makes contact with one end of a heat pipe for heat conduction, one end of the heat pipe is located above the first heat conduction boss, and the other end of the heat pipe penetrates through a plurality of cooling fins of the radiator. The radiator is reasonable in structural design, the utilization rate of the radiating fins of the radiator is improved, heat generated by a chip can be transmitted to the radiating fins of the radiator more directly and efficiently, and then the heat is taken away by the fan, so that the radiating efficiency is remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air cooling and heat dissipation, in particular to an air cooling and heat dissipation structure. Background Art

[0002] Currently, gasoline vehicles generally lack liquid cooling systems. To add high-computing power assisted driving functions, high-computing power chips are necessary. However, when faced with high-power chip operation, conventional air cooling methods are no longer able to meet the heat dissipation requirements.

[0003] While using heat pipes for heat transfer can improve cooling to a certain extent, relying solely on the flat heat pipes for heat conduction still results in a significant portion of the heat sink (fin) area being unused, resulting in low heat dissipation efficiency. This situation severely limits the chip's heat dissipation capacity, potentially causing it to overheat and affect product operation. Utility Model Content

[0004] The purpose of the present utility model is to provide an air-cooled heat dissipation structure to solve the technical problem in the prior art that although the structure using heat pipes for heat transfer can improve the heat dissipation effect to a certain extent, relying solely on the flat heat conduction method of the heat pipes will still result in a large part of the area of ​​the heat sink (FIN) being unable to be effectively utilized, resulting in low heat dissipation efficiency.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the present utility model provides an air-cooled heat dissipation structure, including a heat sink, a radiator and a fan are sequentially arranged above the heat sink, the top of the heat sink is in contact with the bottom of the heat sink for heat conduction, the heat sink includes a plurality of heat sinks distributed in sequence, and a ventilation gap is provided between two adjacent heat sinks; a first heat conduction boss is provided at the bottom of the heat sink, the first heat conduction boss can cooperate with the chip for heat conduction, the top of the heat sink is in contact with one end of the heat pipe for heat conduction, one end of the heat pipe is located above the first heat conduction boss, and the other end of the heat pipe passes through a plurality of heat sinks of the radiator.

[0006] Furthermore, a groove is provided on the top of the heat dissipation plate, and the groove is located above the first heat-conducting boss. One end of the heat pipe is provided with a first heat-conducting end portion in a plate shape, and the first heat-conducting end portion is assembled in the groove.

[0007] Furthermore, a avoidance groove is provided at the bottom edge of the radiator, the middle part of the heat pipe is curved and extends to the outside of the radiator through the avoidance groove, and the other end of the heat pipe is provided with a second heat-conducting end extending in a straight line, and the second heat-conducting end passes through several heat sinks of the radiator.

[0008] Furthermore, the number of the heat pipes includes two, the two heat pipes are distributed along the left and right sides, the avoidance groove is located at the rear end of the middle of the bottom of the radiator, and the second heat-conducting ends of the two heat pipes pass forward through the left and right ends of the radiator respectively.

[0009] Furthermore, the bottom of the radiator presses down the first heat-conducting ends of the two heat pipes, and the left and right ends of the radiator are respectively provided with straight pipes extending forward and backward, and the second heat-conducting ends of the two heat pipes respectively pass forward through the inside of the straight pipes at the left and right ends.

[0010] Furthermore, the plurality of fins of the radiator are sequentially distributed along the front-to-back direction, the front and rear and upper and lower end surfaces of the radiator are closed, and the left and right end surfaces of the radiator are grille-opening.

[0011] Furthermore, a heat dissipation groove is provided on the top of the radiator, and the fan is assembled in the heat dissipation groove so that the fan can communicate with the ventilation space of the radiator.

[0012] Furthermore, the first heat-conducting boss can be heat-conductingly matched with the chip through thermal grease.

[0013] Furthermore, a PCBA may be placed on the bottom of the heat dissipation plate, and the first heat-conducting boss may be thermally matched with the chip on the PCBA via thermal grease.

[0014] Furthermore, a plurality of second heat-conducting bosses are provided at the bottom of the heat dissipation plate, and the plurality of second heat-conducting bosses are distributed around the first heat-conducting bosses. The second heat-conducting bosses are smaller than the first heat-conducting bosses. The frame around the heat dissipation plate extends downward and can surround the PCBA.

[0015] In summary, the technical solution of the present invention has the following beneficial effects: The structural design of the present invention is reasonable. (1) The heat sink is provided with a heat sink and a fan in sequence above the heat sink. The top of the heat sink contacts the bottom of the heat sink for heat conduction. The heat sink includes a plurality of heat sinks distributed in sequence. A ventilation gap is provided between two adjacent heat sinks. Thus, the heat on the heat sink can be transferred upward to the heat sink by contact heat conduction. (2) The bottom of the heat sink is provided with a first heat conduction boss. The first heat conduction boss can cooperate with the chip for heat conduction. The top of the heat sink contacts one end of the heat pipe for heat conduction. One end of the heat pipe is located above the first heat conduction boss, and the other end of the heat pipe passes through the plurality of heat sinks of the heat sink. Thus, when the chip generates heat, the heat pipe can efficiently conduct the heat away from the chip through the first heat conduction boss, and then quickly transfer the heat to the plurality of heat sinks of the heat sink, so that the heat sink has a larger heat dissipation surface area and dissipates the heat to the surrounding environment through the heat sink. Finally, the air flow generated by the fan effectively takes away the heat from the heat sink, thereby reducing the temperature of the entire heat dissipation structure. From this analysis, it can be seen that the utility model improves the utilization rate of the heat sink of the radiator. The heat generated by the chip can be transferred to the heat sink of the radiator more directly and efficiently, and then the heat is taken away by the fan, thereby significantly improving the heat dissipation efficiency. This structural scheme not only optimizes the heat dissipation path, but also enhances the use effect of the heat sink, ensuring the stable operation of the chip under high load, enabling the chip to operate stably at a lower temperature, achieving efficient and stable heat dissipation effect, and ensuring the performance and life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the first perspective three-dimensional structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the second perspective three-dimensional structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the utility model when the fan is removed;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the radiator of the utility model from a first viewing angle;

[0020] Figure 5 This is a schematic diagram of the three-dimensional structure of the radiator of the present invention from a second viewing angle;

[0021] Figure 6 This is a schematic diagram of the three-dimensional structure of the utility model when the radiator is removed;

[0022] Figure 7 This is a schematic diagram of the three-dimensional structure of the utility model when the heat pipe is removed;

[0023] Figure 8 This is a schematic diagram of the three-dimensional structure of the heat dissipation plate of the present invention;

[0024] Figure 9 This is a schematic diagram of the three-dimensional structure of the PCBA of the present invention;

[0025] Figure 10 It is a schematic diagram of the cross-sectional structure of the utility model;

[0026] Explanation of the reference numerals: 1-heat sink, 2-heat pipe, 3-radiator, 4-fan, 5-chip, 6-thermal grease, 7-PCBA.

[0027] 101 - first heat-conducting boss, 102 - second heat-conducting boss, 103 - groove, 104 - frame; 201 - first heat-conducting end, 202 - second heat-conducting end; 301 - heat sink, 302 - ventilation space, 303 - avoidance groove, 304 - heat dissipation groove, 305 - straight pipe. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention, but this does not constitute a limitation on the protection scope of the present invention.

[0029] In this utility model, for a clearer description, the following explanation is made: the observer faces the Figure 1 For observation, the left side of the observer is set as left, the right side of the observer is set as right, the front of the observer is set as front, the rear of the observer is set as rear, the top of the observer is set as top, and the bottom of the observer is set as bottom. It should be noted that the terms "front end", "rear end", "left side", "right side", "middle", "top", "bottom" and so on in the text indicate the direction or position relationship based on the direction or position relationship set in the accompanying drawings. They are only for the convenience of clearly describing the present invention, and do not indicate or imply that the structure or component referred to must have a specific direction or be constructed in a specific direction. Therefore, they cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", and "fourth" are only used for the purpose of clarifying or simplifying the description, and cannot be understood as indicating or implying relative importance or quantity.

[0030] See also Figures 1 to 10This embodiment provides an air-cooled heat dissipation structure, comprising a heat sink 1, a heat sink 3 and a fan 4 are sequentially arranged above the heat sink 1, the top of the heat sink 1 is in contact with the bottom of the heat sink 3 for heat conduction, the heat sink 3 comprises a plurality of heat sinks 301 distributed in sequence, and a ventilation gap 302 is provided between two adjacent heat sinks 301; a first heat conduction boss 101 is provided at the bottom of the heat sink 1, the first heat conduction boss 101 can cooperate with the chip 5 for heat conduction, the top of the heat sink 1 is in contact with one end of the heat pipe 2 for heat conduction, one end of the heat pipe 2 is located above the first heat conduction boss 101, and the other end of the heat pipe 2 passes through the plurality of heat sinks 301 of the heat sink 3. Function: (1) By comprising a heat sink, a heat sink and a fan are sequentially arranged above the heat sink, the top of the heat sink is in contact with the bottom of the heat sink for heat conduction, the heat sink comprises a plurality of heat sinks distributed in sequence, and a ventilation gap is provided between two adjacent heat sinks; so that the heat on the heat sink can be transferred upward to the heat sink by contact heat conduction. (2) A first heat-conducting boss is provided at the bottom of the heat sink, and the first heat-conducting boss can cooperate with the chip for heat conduction. The top of the heat sink contacts one end of the heat pipe for heat conduction. One end of the heat pipe is located above the first heat-conducting boss, and the other end of the heat pipe passes through several heat sinks of the radiator. Thus, when the chip generates heat, the heat pipe can efficiently conduct the heat away from the chip through the first heat-conducting boss, and then quickly transfer the heat to several heat sinks of the radiator, so that the radiator has a larger heat dissipation surface area and dissipates the heat to the surrounding environment through the heat sink. Finally, the wind flow generated by the fan effectively takes away the heat on the radiator, reducing the temperature of the entire heat dissipation structure. From this analysis, it can be seen that the utility model improves the utilization rate of the heat sink of the radiator, and the heat generated by the chip can be transferred to the heat sink of the radiator more directly and efficiently, and then taken away by the fan, thereby significantly improving the heat dissipation efficiency. This structural solution not only optimizes the heat dissipation path, but also enhances the use effect of the heat sink, ensuring the stable operation of the chip under high load, and enabling the chip to operate stably at a lower temperature, achieving efficient and stable heat dissipation effect, and ensuring the performance and life of the product.

[0031] Specifically, a groove 103 is provided on the top of the heat sink 1, and the groove 103 is located above the first heat-conducting boss 101. One end of the heat pipe 2 is provided with a first heat-conducting end portion 201 in the shape of a plate, and the first heat-conducting end portion 201 is assembled in the groove 103. Function: The design of this groove is to ensure that the heat pipe can be accurately aligned with and covered above the chip that needs heat dissipation, that is, through the setting of the groove 103, the bottom end of the heat pipe is accurately placed in the groove at the upper end of the heat sink. The setting of the first heat-conducting end portion 201 can make the bottom end of the heat pipe flat against the upper surface of the heat sink, so that it can be accurately installed directly above the chip, so that the heat generated by the chip can be better transferred to the heat sink, and then the heat is taken away by the fan, thereby improving the heat dissipation efficiency.

[0032] Specifically, the bottom edge of the heat sink 3 is provided with a relief groove 303. The middle portion of the heat pipe 2 is curved and extends out of the heat sink 3 through the relief groove 303. The other end of the heat pipe 2 is provided with a second heat-conducting end portion 202 extending in a straight line. The second heat-conducting end portion 202 passes through several heat sink fins 301 of the heat sink 3. Function: Through the heat conduction mechanism within the heat pipe (i.e., the first heat-conducting end portion 201, the curved end portion, and the second heat-conducting end portion 202, heat is quickly transferred to the larger surface area of ​​the heat sink fins).

[0033] Specifically, there are two heat pipes 2, distributed along the left and right sides. The avoidance groove 303 is located at the rear end of the middle bottom of the radiator 3. The second heat-conducting ends 202 of the two heat pipes 2 extend forward through the left and right ends of the radiator 3, respectively. Function: The two heat pipes conduct heat simultaneously, further increasing the heat dissipation surface area of ​​the heat sink and improving heat dissipation efficiency.

[0034] Specifically, the bottom of the radiator 3 presses down on the first heat-conducting ends 201 of the two heat pipes 2. Straight pipes 305 extending forward and backward are respectively provided on the left and right ends of the radiator 3. The second heat-conducting ends 202 of the two heat pipes 2 pass forward through the interiors of the straight pipes 305 on the left and right ends, respectively. Function: The provision of the straight pipes 305 facilitates the passage of the second heat-conducting ends 202 of the heat pipes 2 through the plurality of fins 301 of the radiator 3. It also allows the heat pipes and fins 301 to achieve a zero-clearance fit, ensuring a tight fit between the heat pipes and fins 301, forming a complete heat dissipation unit.

[0035] Specifically, the radiator 3 has several fins 301 distributed in a front-to-back direction. The front and rear, upper and lower end surfaces of the radiator 3 are closed, while the left and right end surfaces of the radiator 3 are grille-shaped. This arrangement facilitates ventilation and heat dissipation within the radiator 3 while also protecting the radiator's internal structure and ensuring thermal conductivity with the underlying heat sink.

[0036] Specifically, a heat dissipation slot 304 is provided on the top of the radiator 3, and the fan 4 is assembled in the heat dissipation slot 304 so that the fan 4 can communicate with the ventilation space 302 of the radiator 3. Function: The provision of the heat dissipation slot 304 facilitates the installation of the fan 4 and accelerates heat dissipation.

[0037] Specifically, the first heat-conducting boss 101 can be heat-conductingly matched with the chip 5 via the thermal grease 6. Function: The thermal grease 6 can improve the heat conduction efficiency.

[0038] Specifically, the PCBA 7 can be placed at the bottom of the heat sink 1, and the first heat-conducting boss 101 can be heat-conductingly matched with the chip 5 on the PCBA 7 through the thermal grease 6. Function: The PCBA can carry the chip upward and match with the first heat-conducting boss 101.

[0039] Specifically, the bottom of heat sink 1 is equipped with several second thermally conductive bosses 102, which are distributed around first thermally conductive boss 101 and are smaller than first thermally conductive boss 101. A frame 104 extends downward around heat sink 1 and surrounds PCBA 7. The second thermally conductive bosses 102 facilitate heat transfer with other heat sources, while the frame 104 positions and protects PCBA 7.

[0040] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. An air-cooled heat dissipation structure, comprising a heat dissipation plate (1), characterized in that: A radiator (3) and a fan (4) are sequentially provided above the heat dissipation plate (1); the top of the heat dissipation plate (1) contacts the bottom of the heat dissipation plate (3) for heat conduction; the heat dissipation plate (3) comprises a plurality of heat dissipation fins (301) distributed in sequence, and a ventilation gap (302) is provided between two adjacent heat dissipation fins (301); a first heat conduction boss (101) is provided at the bottom of the heat dissipation plate (1); the first heat conduction boss (101) can cooperate with the chip (5) for heat conduction; the top of the heat dissipation plate (1) contacts one end of the heat pipe (2) for heat conduction; one end of the heat pipe (2) is located above the first heat conduction boss (101), and the other end of the heat pipe (2) passes through the plurality of heat dissipation fins (301) of the heat dissipation plate (3).

2. The air-cooling heat dissipation structure according to claim 1, characterized in that: A groove (103) is provided on the top of the heat dissipation plate (1), and the groove (103) is located above the first heat-conducting boss (101). One end of the heat pipe (2) is provided with a plate-shaped first heat-conducting end portion (201), and the first heat-conducting end portion (201) is assembled in the groove (103).

3. The air-cooling heat dissipation structure according to claim 2, characterized in that: The bottom edge of the radiator (3) is provided with a relief groove (303); the middle portion of the heat pipe (2) is curved and extends to the outside of the radiator (3) through the relief groove (303); the other end of the heat pipe (2) is provided with a second heat-conducting end portion (202) extending in a straight line; the second heat-conducting end portion (202) passes through a plurality of heat-dissipating fins (301) of the radiator (3).

4. The air-cooling heat dissipation structure according to claim 3, characterized in that: The number of the heat pipes (2) includes two, the two heat pipes (2) are distributed along the left and right sides, the avoidance groove (303) is located at the rear end in the middle of the bottom of the radiator (3), and the second heat-conducting end portions (202) of the two heat pipes (2) respectively pass forward through the left and right ends of the radiator (3).

5. The air-cooling heat dissipation structure according to claim 4, characterized in that: The bottom of the radiator (3) presses down the first heat-conducting end portions (201) of the two heat pipes (2); the left and right ends of the radiator (3) are respectively provided with straight pipes (305) extending forward and backward; the second heat-conducting end portions (202) of the two heat pipes (2) respectively pass forward through the interiors of the straight pipes (305) at the left and right ends.

6. The air-cooling heat dissipation structure according to any one of claims 1 to 5, characterized in that: The plurality of fins (301) of the radiator (3) are sequentially distributed along the front-to-back direction; the front and rear, upper and lower end surfaces of the radiator (3) are closed; and the left and right end surfaces of the radiator (3) are grille-opening.

7. The air-cooling heat dissipation structure according to any one of claims 1 to 5, characterized in that: A heat dissipation groove (304) is provided on the top of the radiator (3), and the fan (4) is assembled in the heat dissipation groove (304) so ​​that the fan (4) can communicate with the ventilation space (302) of the radiator (3).

8. The air-cooling heat dissipation structure according to any one of claims 1 to 5, characterized in that: The first heat-conducting boss (101) can be heat-conductingly matched with the chip (5) via heat-conducting grease (6).

9. The air-cooling heat dissipation structure according to claim 8, characterized in that: A PCBA (7) can be placed on the bottom of the heat dissipation plate (1), and the first heat-conducting boss (101) can be heat-conductingly matched with the chip (5) on the PCBA (7) via thermal grease (6).

10. The air-cooling heat dissipation structure according to claim 9, characterized in that: The bottom of the heat dissipation plate (1) is further provided with a plurality of second heat-conducting bosses (102), which are distributed around the first heat-conducting boss (101), and the second heat-conducting bosses (102) are smaller than the first heat-conducting bosses (101). The frame (104) around the heat dissipation plate (1) extends downward and can surround the PCBA (7).

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