Heat insulation cushion block

Abstract

The utility model relates to the technical field of cushion blocks, and provides a heat insulation cushion block which comprises a block body, a plurality of heat insulation blocks are arranged on the two sides of the block body at intervals, a plurality of first heat dissipation grooves are formed in the two sides of the block body, and each first heat dissipation groove is formed between every two adjacent heat insulation blocks. The cross section of each first heat dissipation groove is of a semicircular structure. According to the technical scheme, heat conduction is reduced, and the heat insulation performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pads, and in particular to a heat-insulating pad. Background Art

[0002] Thermal insulation pads are a highly effective thermal insulation material designed specifically for the building materials industry. They are typically made of polystyrene, polyurethane, or other lightweight insulating materials. Their primary function is to reduce heat conduction and improve a building's energy efficiency. Commonly used in walls, roofs, floors, and pipe supports, thermal insulation pads create thermal isolation within the building structure, reducing thermal bridging, thereby effectively controlling indoor temperatures and enhancing living comfort.

[0003] Currently, thermal insulation pads are typically installed by applying a specialized adhesive to both sides and then adhering them directly to the wallboard surface. However, the large surface area of ​​traditional thermal insulation pads increases their contact area with the wallboard, which accelerates heat transfer and reduces the thermal insulation performance of the thermal insulation pads. Utility Model Content

[0004] The utility model provides a heat-insulating pad, which reduces heat conduction and improves heat-insulating performance.

[0005] The technical solution of the present utility model is as follows: a thermal insulation pad, comprising a block body, a plurality of thermal insulation blocks arranged at intervals on both sides of the block body, a plurality of first heat dissipation grooves on both sides of the block body, each of the first heat dissipation grooves being arranged between two adjacent thermal insulation blocks, and a cross-section of each of the first heat dissipation grooves being a semicircular structure.

[0006] Furthermore, the block includes two thermal insulation layers, a low thermal conductivity layer and a buffer layer made of high-density polyethylene foam material. The low thermal conductivity layer is bonded to the buffer layer by an adhesive. One side of the two thermal insulation layers is respectively connected to one side of the low thermal conductivity layer and the buffer layer. Each of the thermal insulation blocks is arranged on the side of the two thermal insulation layers away from the low thermal conductivity layer and the buffer layer.

[0007] Furthermore, a plurality of heat dissipation blocks are provided at intervals on a side of the low thermal conductivity layer away from the buffer layer, a second heat dissipation slot is formed between the heat dissipation blocks, and the heat dissipation blocks are bonded to the thermal insulation layer.

[0008] Furthermore, each heat dissipation block is arranged on the top of the low thermal conductivity layer close to the first heat dissipation slot, and each heat dissipation block is integrally formed with the low thermal conductivity layer.

[0009] Furthermore, each heat dissipation block is provided with a plurality of protrusions on the top, and a plurality of grooves corresponding to the positions of the protrusions are provided on the side of the heat insulation layer close to the heat dissipation block, and each heat dissipation block is bonded to the heat insulation layer by an adhesive.

[0010] Furthermore, the top of each protrusion is in an arc-shaped structure, and the surface of each heat dissipation block is coated with a heat insulation coating.

[0011] The working principle and beneficial effects of the utility model are as follows:

[0012] By placing several spaced-apart insulation blocks on the outside of the blocks, the contact area between the insulation blocks and the wallboard can be significantly reduced, thereby reducing heat conduction and improving the insulation effect. Furthermore, the spaces between the insulation blocks form multiple heat dissipation slots, which increase the contact area between the insulation blocks and the air, allowing heat transferred to the insulation blocks to dissipate more quickly, further reducing the amount of heat transferred by the insulation blocks and improving their insulation effect.

[0013] The heat sink's cross-section is designed as a semicircular structure, effectively dispersing the pressure applied to the insulation block, improving its structural stability during long-term use and preventing bottom cracking caused by external pressure. The semicircular design also has an aesthetic effect. Compared to conventional flat or right-angled designs, the semicircular spacing is more streamlined, reducing protruding edges and corners, and is more visually appealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the partial structure of the utility model Figure 1 ;

[0017] Figure 3 This is a schematic diagram of the partial structure of the utility model Figure 2 .

[0018] In the figure: 1, block; 101, thermal insulation block; 1011, first heat dissipation groove; 102, thermal insulation layer; 103, low thermal conductivity layer; 1031, heat dissipation block; 1032, second heat dissipation groove; 1033, protrusion; 1034, groove; 104, buffer layer. DETAILED DESCRIPTION

[0019] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] refer to Figure 1-3A thermal insulation pad includes a block body 1, and a plurality of thermal insulation blocks 101 are provided on both sides of the block body 1 and are arranged at intervals. A plurality of first heat dissipation grooves 1011 are provided on both sides of the block body 1, and each first heat dissipation groove 1011 is arranged between two adjacent thermal insulation blocks 101, and each first heat dissipation groove 1011 is connected to each other, and the cross-section of each first heat dissipation groove 1011 is a semicircular structure.

[0021] By placing several spaced-apart insulation blocks 101 on the outside of the block 1, the contact area between the insulation pads and the wallboard can be significantly reduced, thereby reducing heat conduction and improving the insulation effect. Furthermore, the spaces between the insulation blocks 101 form multiple heat dissipation slots, which increase the contact area between the insulation blocks 101 and the air, allowing heat transferred to the insulation blocks 101 to dissipate more quickly, further reducing the amount of heat transferred by the insulation blocks 101 and improving their insulation effect.

[0022] The semicircular cross-section of the heat sink effectively disperses the pressure applied to the insulation block 101, improving its structural stability during long-term use and preventing bottom cracking caused by external pressure. Furthermore, the semicircular design offers an aesthetically pleasing aesthetic. Compared to conventional flat or right-angled designs, the semicircular spacing creates a smoother shape, reduces prominent corners, and is visually more aesthetically pleasing.

[0023] Specifically, the block 1 includes two thermal insulation layers 102, a low thermal conductivity layer 103, and a buffer layer 104 made of high-density polyethylene foam material. The thermal insulation layer 102 can be made of ceramic fiber material, which has excellent thermal insulation performance and high temperature resistance. The low thermal conductivity layer 103 can be made of aerogel insulation material. The thermal conductivity coefficient of aerogel material is less than 0.03W / m·K, which is used to further reduce heat conduction. The low thermal conductivity layer 103 is bonded to the buffer layer 104 by an adhesive. One side of the two thermal insulation layers 102 is connected to one side of the low thermal conductivity layer 103 and the buffer layer 104 respectively. Each thermal insulation block 101 is arranged on the side of the two thermal insulation layers 102 away from the low thermal conductivity layer 103 and the buffer layer 104. Each thermal insulation block 101 can be integrally formed with the thermal insulation layer 102 to enhance the structural strength. The buffer layer 104 made of high-density polyethylene foam material has a density of 40-80kg / m 3 , which can provide sufficient thermal insulation and good vibration isolation function.

[0024] It is worth noting that the side with the buffer layer 104 is the inner side of the thermal insulation pad, while the low thermal conductivity layer 103 is the outer side of the thermal insulation pad. By providing the buffer layer 104, the vibration and impact to the thermal insulation pad can be effectively reduced, thereby enhancing the stability of the overall structure.

[0025] Furthermore, a plurality of heat dissipation blocks 1031 are provided on the side of the low thermal conductivity layer 103 away from the buffer layer 104, and a second heat dissipation groove 1032 is formed between each heat dissipation block 1031, and each heat dissipation block 1031 is bonded to the thermal insulation layer 102. By providing the heat dissipation blocks 1031, the contact area between the low thermal conductivity layer 103 and the thermal insulation layer 102 can be reduced, thereby reducing heat conduction. At the same time, each heat dissipation groove can optimize air flow and further reduce the heat transferred by the thermal insulation layer 102. In addition, the heat dissipation blocks 1031 are provided on the surface of the low thermal conductivity layer 103 to help staff identify the inside and outside of the thermal insulation pads, facilitate work and use, and improve practicality.

[0026] In this embodiment, to improve the stability of the overall structure of the thermal insulation block, each heat sink block 1031 is positioned on top of the low thermal conductivity layer 103 near the first heat dissipation slot 1011, and each heat sink block 1031 is integrally formed with the low thermal conductivity layer 103. This integrated molding enhances the structural stability and durability, avoiding structural damage and functional failure caused by separation or weak adhesion between the heat sink block 1031 and the low thermal conductivity layer 103, thereby improving the stability of the thermal insulation block.

[0027] To improve the bonding strength between each heat sink block 1031 and the thermal insulation layer 102, several protrusions 1033 are provided on the top of each heat sink block 1031. Several grooves 1034 corresponding to the positions of the protrusions 1033 are provided on the side of the thermal insulation layer 102 near the heat sink block 1031. Each heat sink block 1031 is bonded to the thermal insulation layer 102 via an adhesive. The provision of protrusions 1033 and grooves 1034 increases the contact area between the heat sink block 1031 and the thermal insulation layer 102, thereby improving the bonding strength and further enhancing the stability of the overall thermal insulation block structure. Furthermore, the protrusions 1033 and grooves 1034 also serve as a positioning mechanism, making it easier for staff to bond the heat sink block 1031 to the thermal insulation layer 102.

[0028] Furthermore, the top of each protrusion 1033 is designed to have an arc-shaped structure, and the surface of each heat sink 1031 is coated with a thermal insulation coating. Arc-shaped protrusions 1033 are generally more aesthetically pleasing. The thermal insulation coating can be a polyurethane thermal insulation coating, which has low thermal conductivity and effectively blocks heat conduction. Furthermore, the adhesive can be a polyurethane-based adhesive, which is compatible with the polyurethane thermal insulation coating and provides excellent adhesion.

[0029] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A thermal insulation pad, comprising a block (1), characterized in that: Both sides of the block (1) are provided with a plurality of heat-insulating blocks (101) arranged at intervals, and both sides of the block (1) are provided with a plurality of first heat-dissipating grooves (1011), each of the first heat-dissipating grooves (1011) is arranged between two adjacent heat-insulating blocks (101), and the cross section of each of the first heat-dissipating grooves (1011) is a semicircular structure.

2. The thermal insulation pad according to claim 1, characterized in that: The block (1) comprises two thermal insulation layers (102), a low thermal conductivity layer (103) and a buffer layer (104) made of high-density polyethylene foam material, wherein the low thermal conductivity layer (103) is bonded to the buffer layer (104) by an adhesive, one side of the two thermal insulation layers (102) is connected to one side of the low thermal conductivity layer (103) and the buffer layer (104), respectively, and each of the thermal insulation blocks (101) is arranged on a side of the two thermal insulation layers (102) away from the low thermal conductivity layer (103) and the buffer layer (104).

3. The thermal insulation pad according to claim 2, characterized in that: A plurality of heat dissipation blocks (1031) are provided at intervals on a side of the low thermal conductivity layer (103) away from the buffer layer (104), a second heat dissipation slot (1032) is formed between each of the heat dissipation blocks (1031), and each of the heat dissipation blocks (1031) is bonded to the thermal insulation layer (102).

4. The thermal insulation pad according to claim 3, characterized in that: Each heat dissipation block (1031) is arranged on the top of the low thermal conductivity layer (103) close to the first heat dissipation slot (1011), and each heat dissipation block (1031) and the low thermal conductivity layer (103) are integrally formed.

5. The thermal insulation pad according to claim 4, characterized in that: A plurality of protrusions (1033) are provided on the top of each heat dissipation block (1031); a plurality of grooves (1034) corresponding to the positions of the protrusions (1033) are provided on a side of the heat insulation layer (102) close to the heat dissipation block (1031); and each heat dissipation block (1031) and the heat insulation layer (102) are bonded together by an adhesive.

6. The thermal insulation pad according to claim 5, characterized in that: The top of each protrusion (1033) is in an arc-shaped structure, and the surface of each heat dissipation block (1031) is coated with a heat insulation coating.

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