Micro-channel flow-equalizing water-cooling structure
By setting up a current collecting chamber and a multi-stage baffle in the water-cooled plate, the problem of uneven flow in the microflower water-cooled plate is solved, uniform flow distribution and temperature uniformity are achieved, and the heat dissipation efficiency of the water-cooled plate is improved.
Patent Information
- Application Number
- CN202422363436.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-09-26
AI Technical Summary
Uneven flow distribution in the microflow water-cooled plate leads to low heat exchange efficiency and uneven temperature distribution, which may damage the equipment in severe cases.
A micro-flower flow-spread water-cooling structure is adopted, including a water-cooling plate and a flow-spread structure. By setting up a current collecting chamber and a flow-spreading structure inside the water-cooling plate, the flow rate is evenly distributed to each micro-flowering channel by using a multi-stage baffle to ensure the uniformity of the flow rate.
It improves the uniformity of flow distribution, prevents the local temperature of the water-cooled plate from being too high, improves the temperature uniformity, and improves the heat dissipation performance of the water-cooled plate.
Smart Images
Figure CN223307393U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of refrigerant diversion, in particular to a micro-channel uniform flow water cooling structure. Background Art
[0002] With the emergence of technologies such as electronic chips, micro-electromechanical systems, and very large-scale integrated circuits, important engineering fields such as electronics and power, energy and chemical engineering, aerospace, biomedicine, and nuclear energy and military industries are paying more and more attention to the efficiency and integration of equipment.
[0003] As equipment integration and efficiency continue to improve, the heat load intensity of its heat exchange system gradually increases, and the temperature rise problem caused by power consumption is becoming more and more serious. In particular, the uneven flow distribution within the microchannel water-cooled plate causes low heat exchange efficiency and uneven temperature distribution of the water-cooled plate, which not only wastes resources but can also seriously damage the water-cooled plate. Utility Model Content
[0004] The purpose of the utility model is to provide a micro-channel uniform flow water cooling structure to improve the uniformity of flow distribution and the heat exchange efficiency.
[0005] To achieve this purpose, the present invention adopts the following technical solutions:
[0006] A microchannel uniform flow water cooling structure, comprising:
[0007] A water-cooled plate, wherein an inlet is provided at one end in the length direction of the water-cooled plate, a manifold is provided inside the water-cooled plate, the cross-section of the manifold is an isosceles trapezoid, and the inlet is connected to the narrow end of the manifold, 2n microchannels are evenly spaced along the length direction of the water-cooled plate, where n is an integer greater than 3, the microchannels are arranged along the width direction of the water-cooled plate, one end of the microchannel is connected to the wide end of the manifold, and the other end extends to the side wall of the water-cooled plate, and the inlet, the manifold and the 2n microchannels are symmetrical along the symmetry axis of the water-cooled plate;
[0008] A flow balancing structure, wherein the top and bottom of the flow balancing structure are connected to the manifold and are arranged along the thickness direction of the manifold, the flow balancing structure is in an inverted herringbone shape, the flow balancing structure is symmetrical along the symmetry axis of the water-cooled plate, the flow balancing structure includes a primary baffle and a first flow balancing unit and a second flow balancing unit located on both sides of the primary baffle, the primary baffle is configured to divide the primary flow entering the manifold into two secondary flows, one of which flows into the first microchannel to the nth microchannel, and the other flows into the nth microchannel. into the n+1th microchannel to the 2nth microchannel, the first flow balancing unit includes a secondary baffle, a tertiary baffle and a quaternary baffle, the secondary baffle is configured to divide the secondary flow into a tertiary flow and a single-channel flow flowing into the nth microchannel, the tertiary baffle is configured to divide the secondary flow into a fourth-level flow and a single-channel flow flowing into the n-1th microchannel, the fourth-level baffle is configured to divide the fourth-level flow into a fifth-level flow and a single-channel flow flowing into the n-2th microchannel, and the fifth-level flow flows into the 1st microchannel to the n-3th microchannel.
[0009] Preferably, the first-level baffle has two side walls, both of which are arc-shaped, the length of the first-level baffle is half the width of the manifold, and one of the top corners of the first-level baffle is flush with the narrow end of the manifold, a point of one of the top corners of the first-level baffle is set as point b, a point of the other top corner of the first-level baffle is set as point a, the right end point of the nth microchannel section close to the inlet side is point c, the point a, the point b and the point c are in the same plane, and one of the side walls of the first-level baffle is tangent to the line segment bc.
[0010] Preferably, the secondary baffle has three side walls, the side wall of the secondary baffle away from the primary baffle is a second arc surface, a point of the secondary baffle close to the top corner of the primary baffle is set as point e, the left end point of the nth microchannel section close to the inlet side is point d, and the right end point of the n-1th microchannel section close to the inlet side is point g, the points d, e and g are located in the same plane, the point e is located at the intersection of the perpendicular bisector of line segment ab and line segment bd, the second arc surface is tangent to line segment eg, and one of the side walls of the secondary baffle is set along the line segment ed.
[0011] Preferably, the other side wall of the secondary baffle is arranged along the perpendicular midline of the line segment ed.
[0012] Preferably, the three-stage baffle has three side walls, the side wall of the three-stage baffle away from the first-stage baffle is a third arc surface, a point of the three-stage baffle close to the top corner of the first-stage baffle is set as point h, the left end point of the n-1th microchannel cross section close to the inlet side is point f, and the right end point of the n-2th microchannel cross section close to the inlet side is point j, the points h, f and j are located in the same plane, the point h is located at the intersection of the perpendicular bisector of the line segment ed and the line segment ef, the third arc surface is tangent to the line segment hj, and one of the side walls of the three-stage baffle is set along the line segment hf.
[0013] Preferably, the other side wall of the third-stage baffle is arranged along the perpendicular midline of the line segment hf.
[0014] Preferably, the four-stage baffle has three side walls, the side wall of the four-stage baffle away from the one-stage baffle is a fourth arc surface, a point of the four-stage baffle close to the top corner of the one-stage baffle is set as point k, the left end point of the n-2 microchannel cross section close to the inlet side is point i, and the right end point of the n-3 microchannel cross section close to the inlet side is point L, points k, i and L are located in the same plane, point k is located at the intersection of the perpendicular bisector of line segment hf and line segment hi, the fourth arc surface is tangent to line segment kL, and one of the side walls of the four-stage baffle is set along the line segment ki.
[0015] Preferably, the other side wall of the fourth-stage baffle is arranged along the perpendicular midline of the line segment ki.
[0016] Preferably, when n is an integer greater than 4, the first flow balancing unit further includes a five-level baffle, and the five-level baffle is configured to divide the five-level flow into six-level flow and seven-level flow.
[0017] Preferably, the five-stage baffle has three side walls, the side wall of the five-stage baffle away from the first-stage baffle is a fifth arc surface, a point of the five-stage baffle close to the top corner of the first-stage baffle is set as point p, the left end point of one of the two adjacent microchannels located on the left side of the n-3th microchannel close to the inlet side of the microchannel cross section is point m, the right end point of the other microchannel cross section close to the inlet side is point o, and the point o is located on the left side of the point m, point p, point m and point 0 are located in the same plane, the point p is located at the intersection of the perpendicular bisector of the line segment ki and km, the fifth arc surface is tangent to the line segment no, and one of the side walls of the five-stage baffle is set along the line segment nm.
[0018] Beneficial effects of the utility model:
[0019] The utility model provides a micro-channel flow-sharing water-cooling structure, comprising a water-cooling plate and a flow-sharing structure, wherein an inlet is arranged at one end in the length direction of the water-cooling plate, a manifold is arranged inside the water-cooling plate, the cross-section of the manifold is an isosceles trapezoid, and the inlet is connected to the narrow end of the manifold, 2n micro-channels are evenly spaced inside the water-cooling plate along its length direction, and n is an integer greater than 3, the micro-channels are arranged along the width direction of the water-cooling plate, one end of the micro-channel is connected to the wide end of the manifold, and the other end extends to the side wall of the water-cooling plate, and the inlet, the manifold and the 2n micro-channels are symmetrical along the symmetry axis of the water-cooling plate, the top and bottom of the flow-sharing structure are connected to the manifold, and are arranged along the thickness direction of the manifold, the flow-sharing structure is an inverted herringbone shape, and the flow-sharing structure is symmetrical along the symmetry axis of the water-cooling plate, and the flow-sharing structure comprises a primary baffle and a first flow-sharing unit and a second flow-sharing unit located on both sides of the primary baffle. The first flow balancing unit includes a secondary baffle, a tertiary baffle and a quaternary baffle; the first baffle is configured to divide the primary flow entering the manifold into two equal secondary flows, wherein one secondary flow flows into the 1st microchannel to the nth microchannel, and the other secondary flow flows into the n+1th microchannel to the 2nth microchannel; the secondary flow is divided into a tertiary flow and a single-channel flow flowing into the nth microchannel through the secondary baffle; the secondary flow is divided into a fourth-level flow and a single-channel flow flowing into the n-1th microchannel through the third baffle; the fourth-level flow is divided into a fifth-level flow and a single-channel flow flowing into the n-2th microchannel through the fourth baffle; the fifth-level flow flows into the 1st microchannel to the n-3th microchannel, so that the flow entering each microchannel tends to be uniform, thereby preventing the water-cooled plate from having a locally high temperature, thereby improving the temperature uniformity of the water-cooled plate and improving the heat dissipation performance of the water-cooled plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a schematic diagram of a microchannel uniform flow water cooling structure provided by an embodiment of the utility model. Figure 1 ;
[0021] Figure 2 This is a schematic diagram of a microchannel uniform flow water cooling structure provided by an embodiment of the utility model. Figure 2 ;
[0022] Figure 3 This is a cross-sectional view of a microchannel uniform flow water cooling structure provided by an embodiment of the present utility model;
[0023] Figure 4 It is a partial cross-sectional view of a microchannel uniform flow water cooling structure provided by an embodiment of the present utility model.
[0024] In the picture:
[0025] 1. Water-cooled plate; 11. Inlet; 12. Manifold; 13. Microchannel; 21. Primary baffle; 22. Secondary baffle; 23. Third-stage baffle; 24. Fourth-stage baffle; 25. Fifth-stage baffle. DETAILED DESCRIPTION
[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0027] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0029] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0030] This embodiment provides a microchannel uniform flow water cooling structure with a simple structure, which can improve the uniformity of the flow in each microchannel, thereby improving the temperature uniformity of the water cooling plate and improving the heat dissipation performance of the water cooling plate.
[0031] See also Figures 1-4A microchannel flow-equalizing water cooling structure includes a water-cooling plate 1 and a flow-equalizing structure arranged inside the water-cooling plate 1. After the flow enters the interior of the water-cooling plate 1, the flow-equalizing structure distributes the flow evenly, so that the flow entering each microchannel 13 tends to be uniform, preventing the water-cooling plate 1 from having a local temperature that is too high, thereby improving the temperature uniformity of the water-cooling plate 1 and improving the heat dissipation performance of the water-cooling plate 1.
[0032] Specifically, see Figure 1-Figure 3 The water-cooled plate 1 has an inlet 11 at one end along its length. A manifold 12 is provided within the water-cooled plate 1. The manifold 12 has an isosceles trapezoidal cross-section, and the inlet 11 is connected to the narrow end of the manifold 12. Furthermore, 2n microchannels 13 are evenly spaced along the length of the water-cooled plate 1. From left to right, they are the first microchannel 13, the second microchannel 13, ..., the n-3 microchannel 13, the n-2 microchannel 13, the n-1 microchannel 13, and the n microchannel 13. Each microchannel 13 is arranged along the width of the water-cooled plate 1. One end of the microchannel 13 is connected to the wide end of the manifold 12, and the other end extends to the sidewall of the water-cooled plate 1. In this embodiment, the inlet 11, manifold 12, and 2n microchannels 13 are symmetrical along the axis of symmetry of the water-cooled plate 1 to improve the uniformity of flow distribution. Through the above arrangement, the flow enters the manifold 12 through the inlet 11 and further enters each microchannel 13 .
[0033] Preferably, in this embodiment, n is an integer greater than 3.
[0034] More preferably, the cross-sectional shape of the microchannel 13 is any one of circular, semicircular, triangular, rectangular, elliptical, and trapezoidal.
[0035] The flow balancing structure is arranged in the manifold 12. For example, the flow balancing structure is in an inverted herringbone shape, and the axis of symmetry of the flow balancing structure coincides with the axis of symmetry of the manifold 12. The flow balancing structure includes a primary baffle 21 and a first flow balancing unit and a second flow balancing unit located on both sides of the primary baffle 21. The first flow balancing unit is located on the left side of the primary baffle 21, and the second flow balancing unit is located on the right side of the primary baffle 21. The structure of the first flow balancing unit is the same as that of the second flow balancing unit. The primary baffle 21 is configured to divide the primary flow (refrigerant) entering the manifold 12 into two equal secondary flows, wherein one secondary flow flows evenly into the 1st microchannel 13 to the nth microchannel 13 through the first flow balancing unit, and the other secondary flow flows evenly into the n+1th microchannel 13 to the 2nth microchannel 13 through the second flow balancing unit.
[0036] In this embodiment, the primary baffle 21 has two sidewalls. Furthermore, the primary baffle 21 is positioned along the width of the manifold 12, and its length is half the width of the manifold 12. Furthermore, one of the top corners of the primary baffle 21 is flush with the narrow end of the manifold 12. In other words, the primary flow is divided equally into two secondary flows by the primary baffle 21 the moment it enters the manifold 12 through the inlet 11. For example, both sidewalls are curved to minimize pressure drop and losses.
[0037] For example, see Figure 3 and Figure 4 , set a point at one of the vertex angles of the first-level baffle 21 as point b, that is, a point at the vertex angle flush with the narrow end of the manifold 12 as point b, a point at the other vertex angle of the first-level baffle 21 as point a, and the right end point of the cross section of the nth microchannel 13 close to the inlet 11 as point c. Points a, b and c are located in the same plane, and one of the side walls of the first-level baffle 21 is tangent to the line segment bc, that is, the side wall of the first-level baffle 21 close to the first flow balancing unit is tangent to the line segment bc.
[0038] Preferably, the top and bottom of the primary baffle 21 are respectively connected to the top cavity wall and the bottom cavity wall of the manifold 12 , and the primary baffle 21 is extended along the thickness direction of the manifold 12 .
[0039] Furthermore, the first flow balancing unit includes a secondary baffle 22, a tertiary baffle 23, and a quaternary baffle 24. The secondary baffle 22 is configured to divide one portion of the secondary flow into a single-channel flow flowing into the nth microchannel 13 and a tertiary flow. The tertiary baffle 23 is configured to divide the secondary flow into a single-channel flow flowing into the n-1th microchannel 13 and a quaternary flow. The quaternary baffle 24 is configured to divide the quaternary flow into a single-channel flow flowing into the n-2th microchannel 13 and a quinary flow. The quinary flow flows into the 1st microchannel 13 to the n-3rd microchannel 13. Through the above arrangement, the refrigerant can be introduced into each microchannel 13 after step-by-step diversion, so that the flow in each microchannel 13 tends to be uniform.
[0040] Specifically, the secondary baffle 22 has three sidewalls, of which the sidewall of the secondary baffle 22 facing away from the primary baffle 21 is a second curved surface. This curved surface is designed to reduce pressure drop. A point at the vertex of the secondary baffle 22 near the primary baffle 21 is designated as point e, the left end of the cross section of the nth microchannel 13 near the inlet 11 is designated as point d, and the right end of the cross section of the (n-1)th microchannel 13 near the inlet 11 is designated as point g. Points d, e, and g lie in the same plane, with point e located at the intersection of the perpendicular bisector of line segment ab and line segment bd. The second curved surface is tangent to line segment eg, and one of the sidewalls of the secondary baffle 22 is positioned along line segment ed. Through this configuration, a portion of the secondary flow can be divided into three-stage flow and single-channel flow by the vertex of the secondary baffle 22 near the primary baffle 21, and this single-channel flow can flow into the nth microchannel 13.
[0041] Furthermore, the other side wall of the secondary baffle 22 is arranged along the perpendicular midline of the line segment ed, that is, the length of one side wall of the secondary baffle 22 is half of the line segment ed, and the side walls of the secondary baffle 22 are perpendicular.
[0042] Similarly, the tertiary baffle 23 has three sidewalls, of which the sidewall of the tertiary baffle 23 facing away from the primary baffle 21 is a third curved surface. This curved surface is designed to reduce pressure drop. A point at the vertex of the tertiary baffle 23 near the primary baffle 21 is designated as point h, the left end of the cross section of the n-1th microchannel 13 near the inlet 11 is designated as point f, and the right end of the cross section of the n-2th microchannel 13 near the inlet 11 is designated as point j. Points h, f, and j lie on the same plane, with point h located at the intersection of the perpendicular bisector of line segment ed and line segment ef. The third curved surface is tangent to line segment hj, and one of the sidewalls of the tertiary baffle 23 is positioned along line segment hf. Through this configuration, the tertiary flow can be divided into four-stage flow and single-channel flow by the vertex of the tertiary baffle 23 near the primary baffle 21, and this single-channel flow can flow into the n-1th microchannel 13.
[0043] Furthermore, another side wall of the tertiary baffle 23 is arranged along the perpendicular midline of the line segment hf, that is, the length of one side wall of the tertiary baffle 23 is half of the line segment hf, and the side walls of the tertiary baffle 23 are perpendicular.
[0044] Similarly, the fourth-stage baffle 24 has three sidewalls, of which the sidewall of the fourth-stage baffle 24 facing away from the first-stage baffle 21 is a fourth curved surface. This curved surface is designed to reduce pressure drop. A point at the vertex of the fourth-stage baffle 24 near the first-stage baffle 21 is designated as point k, the left end of the cross section of the n-2 microchannel 13 near the inlet 11 is designated as point i, and the right end of the cross section of the n-3 microchannel 13 near the inlet 11 is designated as point L. Points k, i, and L lie in the same plane, with point k located at the intersection of the perpendicular bisector of line segment hf and line segment hi. The fourth curved surface is tangent to line segment kL, and one of the sidewalls of the fourth-stage baffle 24 is positioned along line segment ki. Through this configuration, the fourth-stage flow can be divided into five-stage flow and single-channel flow by the vertex of the fourth-stage baffle 24 near the first-stage baffle 21, and this single-channel flow can flow into the n-2 microchannel 13.
[0045] Furthermore, another side wall of the fourth-stage baffle 24 is arranged along the perpendicular midline of the line segment ki, that is, the length of one side wall of the third-stage baffle 23 is half of the line segment ki, and the side walls of the fourth-stage baffle 24 are perpendicular.
[0046] When n is an integer greater than 4, there are at least 10 microchannels 13, and the first-level flow is distributed by the first-level baffle 21, the second-level baffle 22, the third-level baffle 23 and the fourth-level baffle 24 into a single-channel flow entering the fifth microchannel 13, a single-channel flow entering the fourth microchannel 13, a single-channel flow entering the third microchannel 13 and a five-level flow entering the 1st microchannel 13 and the n-3rd microchannel 13. That is, the five-level flow needs to enter at least two microchannels 13. In order to further improve the uniformity of flow distribution, this embodiment is also provided with a fifth baffle, and the five-level baffle 25 is configured to divide the five-level flow into a sixth-level flow and a seventh-level flow.
[0047] For example, the fifth-stage baffle 25 has three sidewalls, of which the sidewall of the fifth-stage baffle 25 away from the first-stage baffle 21 is a fifth curved surface. The curved surface is provided to reduce pressure drop. A point at the vertex of the fifth-stage baffle 25 near the first-stage baffle 21 is designated as point p. The left end of the cross section of one of the two adjacent microchannels 13 located to the left of the (n-3)th microchannel 13 is designated as point m. The right end of the cross section of the other microchannel 13 near the inlet 11 is designated as point o, and point o is located to the left of point m. Points p, m, and 0 are located in the same plane. Point p is located at the intersection of the perpendicular bisector of line segment ki and km. The fifth curved surface is tangent to line segment no. One sidewall of the fifth-stage baffle 25 is arranged along line segment nm. Through the above setting, the fifth-level flow can be divided into sixth-level flow and seventh-level flow by the top corner of the fifth-level baffle 25 close to the first-level baffle 21, and the sixth-level flow can flow into at least two microchannels 13 located on the left side of the n-2 microchannel 13 and close to the n-2 microchannel 13, and the seventh-level flow can flow into the remaining microchannels 13 located on the left side of the n-2 microchannel 13.
[0048] Furthermore, another side wall of the five-stage baffle 25 is arranged along the perpendicular bisector of the line segment nm, that is, the length of one side wall of the five-stage baffle 25 is half of the line segment nm, and the side walls of the five-stage baffle 25 are perpendicular.
[0049] The present embodiment provides a microchannel flow-averaging water-cooling structure, which divides the primary flow entering the manifold 12 into two secondary flows by a primary baffle 21, wherein one secondary flow flows into the 1st microchannel 13 to the nth microchannel 13, and the other secondary flow flows into the n+1th microchannel 13 to the 2nth microchannel 13; the secondary flow is divided into a tertiary flow and a single-channel flow flowing into the nth microchannel 13 by a secondary baffle 22; the secondary flow is divided into a fourth flow and a single-channel flow flowing into the n-1th microchannel 13 by a third baffle 23; and the fourth baffle 24 is used to divide the secondary flow into a fourth flow and a single-channel flow flowing into the n-1th microchannel 13. The fourth-level flow is divided into a fifth-level flow and a single-channel flow flowing into the n-2 microchannel 13. The fifth-level flow is divided into a sixth-level flow and a seventh-level flow through the fifth-level baffle 25. The sixth-level flow flows into at least two microchannels 13 located on the left side of the n-2 microchannel 13 and close to the n-2 microchannel 13. The seventh-level flow flows into the remaining microchannels 13 located on the left side of the n-2 microchannel 13, so that the flow entering each microchannel 13 tends to be uniform, preventing the water-cooled plate 1 from having a local temperature that is too high, thereby improving the temperature uniformity of the water-cooled plate 1 and improving the heat dissipation performance of the water-cooled plate 1.
[0050] In other feasible embodiments, the sixth baffle, the seventh baffle, etc. may be specifically designed according to the actual number of microchannels 13 .
[0051] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A microchannel uniform flow water cooling structure, characterized in that: include: A water-cooling plate (1), wherein an inlet (11) is provided at one end in the longitudinal direction of the water-cooling plate (1), a manifold (12) is provided inside the water-cooling plate (1), the cross-sectional shape of the manifold (12) is an isosceles trapezoid, and the inlet (11) is connected to the narrow end of the manifold (12), 2n microchannels (13) are evenly spaced along the longitudinal direction of the water-cooling plate (1), and n is an integer greater than 3, the microchannels (13) are provided along the width direction of the water-cooling plate (1), one end of the microchannel (13) is connected to the wide end of the manifold (12), and the other end extends to the side wall of the water-cooling plate (1), and the inlet (11), the manifold (12) and the 2n microchannels (13) are all symmetrical along the symmetry axis of the water-cooling plate (1); A flow balancing structure, wherein the top and bottom of the flow balancing structure are both connected to the manifold (12) and are arranged along the thickness direction of the manifold (12), the flow balancing structure is in an inverted herringbone shape, the flow balancing structure is symmetrical along the symmetry axis of the water-cooling plate (1), the flow balancing structure includes a primary baffle (21) and a first flow balancing unit and a second flow balancing unit located on both sides of the primary baffle (21), the primary baffle (21) is configured to divide the primary flow entering the manifold (12) into two secondary flows, wherein one secondary flow flows into the first microchannel (13) to the nth microchannel (13), and the other secondary flow flows into the n+1th microchannel (13) to the 2nth microchannel (13), the first flow balancing unit includes a secondary baffle (22), a tertiary baffle (23) and a quaternary baffle (24), the secondary baffle (22) is configured to divide the secondary flow into a tertiary flow and a single-channel flow flowing into the nth microchannel (13), the tertiary baffle (23) is configured to divide the secondary flow into a quaternary flow and a single-channel flow flowing into the n-1th microchannel (13), the quaternary baffle (24) is configured to divide the quaternary flow into a five-level flow and a single-channel flow flowing into the n-2th microchannel (13), and the five-level flow flows into the 1st microchannel (13) to the n-3th microchannel (13).
2. The microchannel uniform flow water cooling structure according to claim 1, characterized in that: The first-level baffle (21) has two side walls, both of which are arc-shaped. The length of the first-level baffle (21) is half the width of the manifold (12), and one of the top corners of the first-level baffle (21) is flush with the narrow end of the manifold (12). A point at one of the top corners of the first-level baffle (21) is set as point b, a point at the other top corner of the first-level baffle (21) is set as point a, and the right end point of the cross section of the nth microchannel (13) close to the inlet (11) is point c. Point a, point b and point c are located in the same plane, and one of the side walls of the first-level baffle (21) is tangent to the line segment bc.
3. The microchannel uniform flow water cooling structure according to claim 2, characterized in that: The secondary baffle (22) has three side walls, the side wall of the secondary baffle (22) away from the primary baffle (21) is a second arc surface, a point of the secondary baffle (22) close to the vertex of the primary baffle (21) is set as point e, the left end point of the cross section of the nth microchannel (13) close to the inlet (11) is point d, and the right end point of the cross section of the n-1th microchannel (13) close to the inlet (11) is point g, the points d, e and g are located in the same plane, the point e is located at the intersection of the perpendicular bisector of line segment ab and line segment bd, the second arc surface is tangent to line segment eg, and one of the side walls of the secondary baffle (22) is set along the line segment ed.
4. The microchannel uniform flow water cooling structure according to claim 3, characterized in that: The other side wall of the secondary baffle (22) is arranged along the perpendicular midline of the line segment ed.
5. The microchannel uniform flow water cooling structure according to claim 3, characterized in that: The three-stage baffle (23) has three side walls, the side wall of the three-stage baffle (23) away from the first-stage baffle (21) is a third arc surface, a point of the three-stage baffle (23) close to the top corner of the first-stage baffle (21) is set as point h, the left end point of the cross section of the n-1 microchannel (13) close to the inlet (11) is point f, and the right end point of the cross section of the n-2 microchannel (13) close to the inlet (11) is point j, the points h, f and j are located in the same plane, the point h is located at the intersection of the perpendicular bisector of the line segment ed and the line segment ef, the third arc surface is tangent to the line segment hj, and one of the side walls of the three-stage baffle (23) is set along the line segment hf.
6. The microchannel uniform flow water cooling structure according to claim 5, characterized in that: The other side wall of the third-stage baffle (23) is arranged along the perpendicular midline of the line segment hf.
7. The microchannel uniform flow water cooling structure according to claim 5, characterized in that: The four-stage baffle (24) has three side walls, and the side wall of the four-stage baffle (24) away from the one-stage baffle (21) is a fourth arc surface. A certain point of the four-stage baffle (24) close to the top corner of the one-stage baffle (21) is set as point k, the left end point of the cross section of the n-2 microchannel (13) close to the inlet (11) is point i, and the right end point of the cross section of the n-3 microchannel (13) close to the inlet (11) is point L. Point k, point i and point L are located in the same plane, and point k is located at the intersection of the perpendicular bisector of line segment hf and line segment hi. The fourth arc surface is tangent to line segment kL, and one of the side walls of the four-stage baffle (24) is set along the line segment ki.
8. The microchannel uniform flow water cooling structure according to claim 7, characterized in that: The other side wall of the fourth-stage baffle (24) is arranged along the perpendicular midline of the line segment ki.
9. The microchannel uniform flow water cooling structure according to claim 7, characterized in that: When n is an integer greater than 4, the first flow balancing unit further includes a five-level baffle (25), and the five-level baffle (25) is configured to divide the five-level flow into six-level flow and seven-level flow.
10. The microchannel uniform flow water cooling structure according to claim 9, characterized in that: The five-stage baffle (25) has three side walls, the side wall of the five-stage baffle (25) away from the first baffle (21) is a fifth arc surface, a point of the five-stage baffle (25) close to the top corner of the first baffle (21) is set as point p, the left end point of the cross section of one of the two adjacent microchannels (13) located on the left side of the n-3 microchannel (13) close to the inlet (11) is point m, the right end point of the cross section of the other microchannel (13) close to the inlet (11) is point o, and the point o is located on the left side of the point m, point p, point m and point 0 are located in the same plane, the point p is located at the intersection of the perpendicular bisector of the line segment ki and km, the fifth arc surface is tangent to the line segment no, and one of the side walls of the five-stage baffle (25) is set along the line segment nm.