Blind hole deviation detection board of high-density interconnection printed circuit board

Abstract

A blind hole deviation detection board of a high-density interconnection printed circuit board comprises a bottom detection base, a bearing frame, a plurality of connecting columns, a plurality of detection needles and a detection analysis system, the bearing frame is located above the detection base, and the two ends of the connecting columns abut against the detection base and the bearing frame respectively for supporting. The plurality of detection needles are arranged on the detection base and located below the bearing frame, and the detection analysis system is in signal connection with the plurality of detection needles; the detection needle comprises a needle cylinder, a needle head, a first telescopic spring and a detection sensor. According to the utility model, by designing the press-fit type detection plate with the detection probe, high accuracy can be achieved when the blind hole deviation of the circuit board is detected, the detection operation is very simple and convenient, and the detection efficiency is greatly optimized; the detection base is designed to be of an adjustable structure, so that the detection plate can be suitable for blind hole deviation detection at different positions; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board detection device, in particular to a blind hole deviation detection board of a high-density interconnected printed circuit board. Background Art

[0002] Circuit boards, also commonly known as printed circuit boards (PCBs), are crucial electronic components that support and connect electronic components. Before the advent of circuit boards, electronic components were interconnected directly via wires. Today, wires are used only in labs for testing, while circuit boards have established a dominant position in the electronics industry. High-density interconnected circuit boards (HDIs) interconnect multiple boards to meet the needs of various devices. Existing HDIs are often constructed by stacking multiple boards.

[0003] Due to the influence of alignment accuracy and cumulative tolerances, blind vias in high-density interconnect circuit boards (HDICs) are prone to misalignment. Large misalignment can affect the electrical connection between circuit board layers, making blind via misalignment monitoring increasingly important. Conventional blind via misalignment detection is mostly performed using automated optical inspection (AOI) equipment or manual visual inspection. While AOI scanning is highly reliable, the loading and unloading and scanning processes are relatively complex, resulting in low efficiency. Furthermore, the high equipment cost hinders production and widespread adoption. Manual visual inspection is not only inefficient but also offers unsatisfactory accuracy. Utility Model Content

[0004] Based on this, it is necessary to provide a blind hole deviation detection board for a high-density interconnected printed circuit board to address the deficiencies in the existing technology.

[0005] A blind hole misalignment detection board for a high-density interconnected printed circuit board comprises a bottom detection base, a supporting frame, a plurality of connecting posts, a plurality of detection needles, and a detection and analysis system. The supporting frame is located above the detection base, and the ends of the plurality of connecting posts respectively abut against the detection base and the supporting frame for support. The plurality of detection needles are mounted on the detection base and located below the supporting frame, and the detection and analysis system is respectively connected to the detection needle signals. The detection needle comprises a syringe, a needle head, a first telescopic spring, and a detection sensor. The syringe is mounted on the detection base and has a hollow structure with an open top. The needle head, the first telescopic spring, and the detection sensor are all snap-fitted and mounted in the syringe head, wherein the needle head is movable and retractable. The bright spot of the first telescopic spring abuts against the syringe head and the needle head respectively. The detection sensor can detect the telescopic displacement of the needle head, and the detection sensor is connected to the detection and analysis system signals.

[0006] Furthermore, the detection base includes a first frame, a plurality of adjustment rods, and support legs. The first frame is designed as a square frame structure, and its two long sides are also provided with adjustment slots. The ends of the plurality of adjustment rods are respectively engaged in the two adjustment slots and can slide and adjust along the adjustment slots. The plurality of support legs are respectively mounted on the bottom of the first frame. The plurality of detection needles are respectively installed on the plurality of adjustment rods and can slide and adjust along the adjustment rods.

[0007] Furthermore, the carrier frame includes a second frame, two sets of fixed carrier blocks, two sets of adjustable carrier blocks, and a press-fit cover. The second frame is designed in a square frame shape, with the two sets of fixed carrier blocks fixedly mounted on two adjacent inner sides of the second frame, and the two sets of adjustable carrier blocks mounted on the other two adjacent inner sides of the second frame and corresponding to the two sets of fixed carrier blocks. The two sets of adjustable carrier blocks can also be screwed to adjust the spacing with the corresponding fixed carrier blocks. The press-fit cover is axially connected to one side of the second frame and can be rotatably covered on the upper end of the second frame.

[0008] Furthermore, the connecting column includes a supporting sleeve, a second telescopic spring and a supporting rod. The supporting sleeve is fixedly mounted on the upper end of the detection base. The supporting sleeve also has a hollow structure design with an open upper end. The second telescopic spring and the supporting rod are both mounted in the supporting sleeve, and the supporting rod can be movably extended and retracted along the supporting sleeve. The upper end of the supporting rod is also fixed to the bottom of the supporting frame.

[0009] Furthermore, the detection and analysis system includes a detection and analysis module, a display module and an alarm module. The detection and analysis module is respectively connected to the detection sensors by signal, and the display module and the alarm module are respectively connected to the detection and analysis module by signal.

[0010] To sum up, the beneficial effects of the blind hole deviation detection board for high-density interconnected printed circuit boards of the present invention are: by designing a press-fit detection board with detection probes, the circuit board can not only achieve high accuracy when detecting blind hole deviation, but also the detection operation is very simple, which greatly optimizes the detection efficiency; the detection base is designed with an adjustable structure, so that the detection board can be suitable for blind hole deviation detection in different positions; the supporting frame is designed with an adjustable structure, so that the detection board can be suitable for circuit board detection of different sizes and models; the utility model is highly practical and has strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of a blind hole deviation detection board for a high-density interconnected printed circuit board according to the present invention;

[0012] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0013] Figure 3 for Figure 2 Schematic diagram of the decomposition structure of the detection base;

[0014] Figure 4 for Figure 2 Schematic diagram of the exploded structure of the middle load-bearing frame;

[0015] Figure 5 for Figure 2 Schematic diagram of the exploded structure of the middle connecting column;

[0016] Figure 6 for Figure 2 Schematic diagram of the decomposed structure of the detection needle. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not intended to limit the utility model.

[0018] like Figures 1 to 6 As shown, the present invention provides a blind hole offset detection board 100 for a high-density interconnected printed circuit board, which includes a bottom detection base 10, a carrier frame 20, a plurality of connecting posts 30, a plurality of detection needles 40 and a detection and analysis system (not shown). The carrier frame 20 is located above the detection base 10, and the two ends of the plurality of connecting posts 30 are respectively supported against the detection base 10 and the carrier frame 20. The plurality of detection needles 40 are all installed on the detection base 10 and located below the carrier frame 20. The detection and analysis system is respectively connected to the plurality of detection needles 40 for signal connection. It can be understood that the present invention also has a plurality of structures for installation and fixation, adjustment and fixation, power supply, signal transmission, etc. Since they are all conventional technical contents in this technical field, they will not be described in detail.

[0019] The detection base 10 includes a first frame 11, a plurality of adjustment rods 12, and support legs 13. The first frame 11 is designed as a square frame structure, and adjustment slots 111 are provided on its two long sides. The ends of the plurality of adjustment rods 12 are respectively engaged in the two adjustment slots 111 and can be slid and adjusted along the adjustment slots 111. The plurality of support legs 13 are respectively installed at the bottom of the first frame 11. The plurality of detection needles 40 are respectively inserted into the plurality of adjustment rods 12 and can be slid and adjusted along the adjustment rods 12. The adjustable sliding adjustment rods 12 and detection needles 40 enable them to be positioned at any detection coordinate, thereby realizing offset detection of blind holes at different positions on different circuit boards.

[0020] The carrier frame 20 includes a second frame 21, two sets of fixed carrier blocks 22, two sets of adjustable carrier blocks 23, and a press-fit cover 24. The second frame 21 is designed in a square frame shape. The two sets of fixed carrier blocks 22 are fixedly mounted on two adjacent inner sides of the second frame 21. The two sets of adjustable carrier blocks 23 are mounted on the other two adjacent inner sides of the second frame 21 and correspond to the two sets of fixed carrier blocks 22. The two sets of adjustable carrier blocks 23 can also be screwed to adjust the spacing with the corresponding fixed carrier blocks 22. The press-fit cover 24 is axially connected to one side of the second frame 21 and can be rotatably covered on the upper end of the second frame 21.

[0021] The adjustable carrier block 23 can adjust the spacing between itself and the fixed carrier block 22, allowing the carrier frame 20 to hold circuit boards of varying lengths and widths for blind via misalignment testing. The press-fit cover 24, in conjunction with the second frame 21, the fixed carrier block 22, and the adjustable carrier block 23, further secures the circuit boards, preventing problems such as slippage, warping, and misalignment that could affect the test results.

[0022] The connecting column 30 includes a support sleeve 31, a second telescopic spring 32, and a support rod 33. The support sleeve 31 is fixedly mounted on the upper end of the detection base 10 and has a hollow structure with an open upper end. The second telescopic spring 32 and the support rod 33 are both mounted in the support sleeve 31, and the support rod 33 can be moved along the support sleeve 31. The upper end of the support rod 33 is also fixed against the bottom of the carrier frame 20. The elastically retractable connecting column 30 can support the upper carrier frame 20 and circuit board downward, thereby contacting the detection pin 40 below to complete the blind hole offset detection.

[0023] The detection needle 40 includes a syringe 41, a needle 42, a first telescopic spring 43 and a detection sensor (not shown). The syringe 41 is installed on the detection base 10. The syringe 41 is designed as a hollow structure with an open upper end. The needle 42, the first telescopic spring 43 and the detection sensor are all mounted in the syringe 41, among which the needle 42 is movable and retractable. The bright spot of the first telescopic spring 43 is respectively against the syringe 41 and the needle 42. The detection sensor can detect the telescopic displacement of the needle 40, and the detection sensor is connected to the detection and analysis system signal.

[0024] When testing for blind hole misalignment, downward pressure is applied to a circuit board with a blind hole at its bottom, slowly bringing it closer to and into contact with the needle tip 42 of the detection needle 40. If the blind hole on the circuit board is not misaligned, the needle tip 42 of the detection needle 40 can penetrate directly into the hole. However, if the blind hole is misaligned, the detection needle 40 will not align with the hole opening and will retract significantly into the needle barrel 41 under the pressure of the circuit board surface. The detection sensor can then detect this and generate a signal. Furthermore, the detection needle 40 can not only detect whether the blind hole is misaligned, but also, by further analyzing the amount of retraction of the needle tip 42, determine whether the blind hole depth meets the required standard.

[0025] The detection and analysis system includes a detection and analysis module (not shown), a display module (not shown) and an alarm module (not shown). The detection and analysis module is respectively connected to the detection sensor signals, and the display module and the alarm module are respectively connected to the detection and analysis module signals. The detection and analysis module can receive the signals emitted by the detection sensors in each detection needle 40 in real time, and analyze and judge whether the blind hole is misaligned and whether the depth of the blind hole meets the standard based on the degree of expansion and contraction of the detection needle 40 measured by the detection sensor. After the detection and analysis module obtains the results, it will transmit the detection results to the display module for display. If there is a misaligned blind hole, it will also send a signal to the alarm module to control it to emit an audible and visual alarm to remind that the detection result is abnormal.

[0026] To sum up, the beneficial effects of the blind hole deviation detection board 100 for a high-density interconnected printed circuit board of the present invention are: by designing a press-fit detection board with a detection probe, the circuit board can not only achieve high accuracy when detecting blind hole deviation, but also the detection operation is very simple, which greatly optimizes the detection efficiency; the detection base 10 is designed with an adjustable structure, so that the detection board can be suitable for blind hole deviation detection in different positions; the supporting frame 20 is designed with an adjustable structure, so that the detection board can be suitable for circuit board detection of different sizes and models; the utility model is highly practical and has strong promotion significance.

[0027] The above-described embodiment merely represents one embodiment of the utility model. While the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the concept of the utility model, and these modifications and improvements fall within the scope of protection of the utility model. Therefore, the scope of protection of the utility model patent shall be determined by the appended claims.

Claims

1. A blind hole deviation detection board for a high-density interconnected printed circuit board, characterized by: It includes a bottom detection base, a carrying frame, several connecting columns, several detection needles and a detection and analysis system. The carrying frame is located above the detection base, and the two ends of several connecting columns are respectively supported against the detection base and the carrying frame. Several detection needles are installed on the detection base and are located below the carrying frame. The detection and analysis system is respectively connected with the detection needle signals; the detection needle includes a syringe, a needle, a first telescopic spring and a detection sensor. The syringe is installed on the detection base. The syringe has a hollow structure with an open upper end. The needle, the first telescopic spring and the detection sensor are all snap-fitted and installed in the syringe, wherein the needle is movable and retractable. The bright spot of the first telescopic spring is respectively against the syringe and the needle. The detection sensor can detect the telescopic displacement of the needle, and the detection sensor is connected with the detection and analysis system signal.

2. The blind hole deviation detection board for a high-density interconnected printed circuit board according to claim 1, characterized in that: The detection base includes a first frame, several adjustment rods and support legs; the first frame is designed as a square frame structure, and adjustment grooves are provided on its two long sides. The two ends of several adjustment rods are respectively engaged in the two adjustment grooves and can be slid and adjusted along the adjustment grooves. Several of the support legs are respectively installed at the bottom of the first frame; several of the detection needles are respectively passed through several adjustment rods and can be slid and adjusted along the adjustment rods.

3. The blind hole deviation detection board for a high-density interconnected printed circuit board according to claim 1, characterized in that: The carrying frame includes a second frame, two groups of fixed carrying blocks, two groups of adjustable carrying blocks and a press-fit cover; the second frame is designed in a square frame shape, the two groups of fixed carrying blocks are respectively fixedly mounted on two adjacent inner sides of the second frame, the two groups of adjustable carrying blocks are respectively mounted on the other two adjacent inner sides of the second frame and respectively correspond to the two groups of fixed carrying blocks, the two groups of adjustable carrying blocks can also be spirally adjusted to the distance with the corresponding fixed carrying blocks, the press-fit cover is axially connected to one side of the second frame and can be rotatably covered on the upper end of the second frame.

4. The blind hole deviation detection board for a high-density interconnected printed circuit board according to claim 1, characterized in that: The connecting column includes a supporting sleeve, a second telescopic spring and a supporting rod. The supporting sleeve is fixedly mounted on the upper end of the detection base. The supporting sleeve is also designed as a hollow structure with an open upper end. The second telescopic spring and the supporting rod are both mounted in the supporting sleeve, and the supporting rod can be movably extended and retracted along the supporting sleeve. The upper end of the supporting rod is also fixed to the bottom of the supporting frame.

5. The blind hole deviation detection board for a high-density interconnected printed circuit board according to claim 1, characterized in that: The detection and analysis system includes a detection and analysis module, a display module and an alarm module; the detection and analysis module is respectively connected to the detection sensor signals, and the display module and the alarm module are respectively connected to the detection and analysis module signals.

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