Surface-mounted temperature sensor

Abstract

The embodiment of the utility model provides a surface-mounted temperature sensor. The surface-mounted temperature sensor comprises a shell, a temperature sensing element, a first lead, a second lead and a plastic package body, the shell is a hollow shell with an opening in the bottom wall, and the top wall of the shell is used for being attached to a measured piece so that the temperature sensor can be attached to the measured piece. The temperature sensing element is arranged in the shell; the first lead and the second lead are arranged at an interval, the first ends of the first lead and the second lead are connected with the temperature sensing element, and the second ends of the first lead and the second lead extend out of the bottom wall of the shell and are welded on the surface of a substrate, so that the temperature sensor is welded on the surface of the substrate; the plastic package body is filled in the shell so as to wrap the temperature sensing element, part of the first lead and part of the second lead. According to the temperature sensor, automatic mounting can be met, hole-aligning mounting is not needed, mounting is more efficient, damage to the temperature sensor caused by pulling and displacement in the mounting process can be avoided, and the requirements for automatic production and mounting reliability improvement are met.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of sensor technology, and specifically relate to a patch-type temperature sensor. Background Art

[0002] To improve safety, the State Grid requires that some electric energy meters have the function of detecting the temperature of the copper strip at the current terminals. Figure 1 As shown, most existing temperature sensors use plug-in temperature sensors. The lead wires 2 of the plug-in temperature sensor 1 are inserted into the substrate 3, and the temperature sensor 1 is inserted into the hole of the copper bar 4. This can even cause damage to the sensor due to pulling or displacement during installation. To address these issues, it is necessary to propose a patch-type temperature sensor with a reasonable design that can effectively improve these issues. Utility Model Content

[0003] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide a patch-type temperature sensor.

[0004] The embodiment of the present disclosure provides a patch-type temperature sensor, comprising a housing, a temperature sensing element, a first lead, a second lead, and a plastic package;

[0005] The housing is a hollow shell with an open bottom wall, and the top wall of the housing is used to be mounted on the device under test so that the temperature sensor can be mounted on the device under test;

[0006] The temperature sensing element is disposed in the housing;

[0007] The first ends of the first lead and the second lead are connected to the temperature sensing element, and the second ends of the first lead and the second lead extend out of the bottom wall of the housing and are used to be welded to the surface of the substrate, so as to weld the temperature sensor to the surface of the substrate;

[0008] The plastic package is filled in the housing to wrap the temperature sensing element and a portion of the first lead and a portion of the second lead.

[0009] Optionally, the second end of the first lead and the second end of the second lead extend out of the bottom wall of the shell and bend and extend along the bottom wall toward the side walls on both sides thereof.

[0010] Optionally, the bottom wall of the housing is provided with a first groove and a second groove which are relatively distributed; wherein,

[0011] The second end of the first lead is located in the first groove and extends out of the housing side wall along the first groove;

[0012] The second end of the second lead is located in the second groove and extends out of the housing side wall along the second groove.

[0013] Optionally, the bottom wall of the second end of the first lead protrudes from the bottom wall of the first groove, and the bottom wall of the second end of the second lead protrudes from the bottom wall of the second groove.

[0014] Optionally, the first groove and the second groove are symmetrically distributed.

[0015] Optionally, the temperature sensing element is located at the top of the shell.

[0016] Optionally, a heat-conducting adhesive layer is further included, and the heat-conducting adhesive layer is arranged on the top wall outside the shell.

[0017] Optionally, the first ends of the first lead and the second lead are both connected to the bottom of the temperature sensing element.

[0018] Optionally, the first ends of the first lead and the first ends of the second lead are respectively connected to two oppositely distributed side walls of the temperature sensing element.

[0019] Optionally, the temperature sensing element is a PTC thermistor or an NTC thermistor.

[0020] The patch-type temperature sensor of the embodiment of the present disclosure has a shell top wall that can be used to be mounted on the object under test, so that the temperature sensor can be mounted on the object under test without inserting the sensor into the object under test; the second ends of the first lead and the second lead of the temperature sensor extend out of the shell bottom wall and are used to be welded to the substrate, so that the temperature sensor can be welded to the surface of the substrate without inserting the two leads into the substrate; it can meet the requirements of automated mounting, does not require hole installation, and is more efficient in installation. It can avoid damage to the temperature sensor caused by pulling or shifting during installation, meeting the requirements of automated production and improving installation reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the assembly method of the temperature sensor, the device under test and the substrate in the prior art;

[0022] Figure 2 This is a schematic structural diagram of a patch-type temperature sensor according to one embodiment of the present disclosure;

[0023] Figure 3 This is a schematic structural diagram of a patch-type temperature sensor according to another embodiment of the present disclosure;

[0024] Figure 4 A schematic structural diagram of the first groove or the second groove in an embodiment of the present disclosure;

[0025] Figure 5Schematic diagram of the assembly structure of the chip temperature sensor, the device under test, and the substrate in the embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0027] like Figure 2 and Figure 3 As shown, an embodiment of the present disclosure provides a patch temperature sensor 100 , which includes a housing 110 , a temperature sensing element 120 , a first lead 130 , a second lead 140 and a plastic package 150 .

[0028] The housing 110 is a hollow shell with an open bottom wall. Figure 5 As shown, the top wall of the housing 110 is used to attach to the device under test 200, thereby attaching the temperature sensor to the device under test 200. In this embodiment, the device under test is a copper strip of the current terminal of an electric energy meter. In other words, the top wall of the housing 110 of the temperature sensor is attached to the copper strip with a measuring tape.

[0029] It should be noted that the housing 110 may be a ceramic housing or a high-thermal-conductivity, high-temperature-resistant plastic housing. The material of the housing 110 is not specifically limited in this embodiment and may be selected according to actual needs.

[0030] It should be further explained that the shape of the housing 110 can be a cuboid or a cylinder. This embodiment does not specifically limit the specific shape of the housing 110 and can be selected according to actual needs.

[0031] The temperature sensing element 120 is disposed in the housing 110 and is used to detect the temperature signal of the device under test. In other words, the temperature sensing element 120 can detect the temperature signal of the copper strip.

[0032] It should be noted that in this embodiment, the temperature sensing element 120 can be either a PTC thermistor or an NTC thermistor. Preferably, the temperature sensing element 120 is an NTC thermistor. Of course, the temperature sensing element 120 can also be other temperature measuring elements, such as a thermocouple, etc. The specific type of temperature sensing element can be selected according to actual needs and is not specifically limited in this embodiment.

[0033] The first lead 130 and the second lead 140 are spaced apart from each other, and the first ends of the first lead 130 and the second lead 140 are connected to the temperature sensing element 120. Figure 5As shown, the second ends of the first lead 130 and the second lead 140 extend out of the bottom wall of the housing 110 and are used to be welded to the surface of the substrate 300, thereby welding the temperature sensor to the surface of the substrate 300. In other words, the first lead 130 and the second lead 140 electrically connect the temperature sensing element 120 to the circuit of the substrate 300.

[0034] The plastic package 150 is filled in the housing 110 to wrap the temperature sensing element 120 and a portion of the first lead 130 and a portion of the second lead 140 , thereby protecting the temperature sensing element 120 and the first lead 130 and the second lead 140 located in the housing 110 .

[0035] It should be noted that the material of the plastic package 150 can be silicone or resin, preferably, silicone is used as the material of the plastic package 150. The material of the plastic package 150 is not specifically limited in this embodiment and can be selected according to actual needs.

[0036] The patch-type temperature sensor of the embodiment of the present disclosure has a shell top wall that can be used to be mounted on the object under test, so that the temperature sensor can be mounted on the object under test without inserting the sensor into the object under test; the second ends of the first lead and the second lead of the temperature sensor extend out of the shell bottom wall and are used to be welded to the surface of the substrate, so that the temperature sensor can be welded to the surface of the substrate without inserting the two leads into the substrate; it can meet the requirements of automated mounting, does not require hole installation, and is more efficient in installation. It can avoid damage to the temperature sensor caused by pulling or shifting during installation, meeting the requirements of automated production and improving installation reliability.

[0037] For example, Figure 2 and Figure 3 As shown, the second end of the first lead 130 and the second end of the second lead 140 extend out of the bottom wall of the housing 110 and bend along the bottom wall toward the side walls on both sides thereof.

[0038] Specifically, if Figures 2 to 4 As shown, in this embodiment, the first lead 130 and the second lead 140 can be spaced apart along the length direction of the shell 110, and the second ends of the first lead 130 and the second lead 140 extend out of the bottom wall of the shell 110 and bend horizontally along the bottom wall toward the side walls on its left and right sides respectively.

[0039] In this embodiment, the second end of the first lead and the second end of the second lead extend out of the bottom wall of the shell and bend and extend along the bottom wall toward the side walls on both sides thereof. By welding the second end of the bent and extended first lead and the second end of the second lead, the temperature sensor can be welded to the surface of the substrate. There is no need to insert the two leads into the substrate, and there is no need to install them in the holes. The installation is more efficient and can avoid damage to the temperature sensor caused by pulling or shifting during the installation process, meeting the needs of automated production and improving installation reliability.

[0040] For example, Figures 2 to 4 As shown, the bottom wall of the housing 110 is provided with a first groove 111 and a second groove 112 that are arranged opposite to each other. The second end of the first lead 130 is located in the first groove 111 and extends leftward along the first groove 111 out of the side wall of the housing 110. The second end of the second lead 140 is located in the second groove 112 and extends rightward along the second groove 112 out of the side wall of the housing 110.

[0041] In this embodiment, by arranging the second end of the first lead and the second end of the second lead in the corresponding first groove and the second groove, and the ends of the first lead and the second end of the first lead both extend out of the side wall of the shell, the first lead and the second lead in the horizontal distribution portion can be conveniently welded to the substrate.

[0042] For example, Figures 2 to 4 As shown, the bottom of the second end of the first lead 130 can slightly protrude from the bottom wall of the first groove 111, and the bottom of the second end of the second lead 140 can slightly protrude from the bottom wall of the second groove 112. This facilitates welding of the first lead 130 and the second lead 140 without affecting the stability of the temperature sensor housing 110 on the substrate 300.

[0043] It should be noted that the bottom wall of the second end of the first lead 130 can be flush with the bottom wall of the first groove 111, and the bottom wall of the second end of the second lead 140 can be flush with the bottom wall of the second groove 112. In this way, when the first lead 130 and the second lead 140 are welded to the substrate 300, the bottom of the housing 110 can abut against the substrate 300, thereby increasing the stability of the temperature sensor housing 110 on the substrate 300.

[0044] For example, the first groove 111 and the second groove 112 are symmetrically distributed. Figure 2 and Figure 3 As shown, in this embodiment, the first groove 111 and the second groove 112 are axially symmetrically distributed on the left and right sides of the bottom wall of the housing 110 .

[0045] For example, Figure 2 and Figure 3 As shown, the temperature sensing element 120 is located at the top of the interior of the housing 110 . Specifically, the top of the temperature sensing element 120 abuts against the top of the interior of the housing 110 .

[0046] In this embodiment, the top wall of the shell 110 is used to connect with the device under test 200. Therefore, the temperature sensing element 120 is set at the top position inside the shell 110, which allows the temperature sensing element 120 to better detect the temperature signal of the device under test 200, making the temperature measurement more accurate.

[0047] For example, Figures 2 to 5 As shown, the surface mount temperature sensor 100 further includes a thermal conductive adhesive layer 160 , which is disposed on the top wall outside the housing 110 .

[0048] In this embodiment, the top of the entire temperature sensor is mounted on the device under test through the thermal conductive adhesive layer 160 , which can make the contact between the temperature sensor and the device under test closer and the temperature measurement more accurate.

[0049] like Figure 2 and Figure 3 As shown, the first lead 130 and the second lead 140 each include a connection portion connected to the temperature sensing element 120 , a lead portion connected to the connection portion, and a welding portion connected to the lead portion.

[0050] Among them, such as Figure 2 As shown, in one embodiment, the first ends of the first lead 130 and the second lead 140 are both connected to the bottom of the temperature sensing element 120. In other words, the first lead 130 and the second lead 140 are unidirectionally led out, and are both led out along the bottom direction of the temperature sensing element 120.

[0051] Specifically, in one embodiment, Figure 2 As shown, the connecting portions of the first lead 130 and the second lead 140 are both tilted outward toward the bottom wall of the housing 110; the lead-out portions of the two leads are both vertically arranged; and the welding portions of the two leads are both horizontally arranged along the bottom wall of the housing 110 toward the left and right side walls thereof. In this embodiment, the longitudinal cross-section of the temperature sensing element 120 is circular.

[0052] For example, Figure 3 As shown, in another embodiment, the first ends of the first lead 130 and the second lead 140 are respectively connected to two opposite side walls of the temperature sensing element 120. In other words, the first lead 130 and the second lead 140 are bidirectionally led out, and are respectively led out along the left and right side walls of the temperature sensing element 120.

[0053] Specifically, in another embodiment, Figure 3 As shown, the connecting portions of the first lead 130 and the second lead 140 are connected to the left and right side walls of the temperature sensing element 120, respectively, and are arranged horizontally on the left and right sides. The lead-out portions of both leads are arranged vertically. The welding portions of both leads are arranged horizontally along the bottom wall of the housing 110 toward the left and right side walls. In this embodiment, the longitudinal cross-section of the temperature sensing element 120 is rectangular.

[0054] It should be noted that the embodiment does not specifically limit the way the first lead 130 and the second lead 140 are led out, and can be selected according to actual needs. In addition, the shape of the temperature sensing element 120 is not specifically limited, and can be selected according to actual needs.

[0055] like Figure 5 As shown, when the chip temperature sensor 100 of the embodiment of the present disclosure is used to measure the temperature of the device under test 200, the second ends of the first lead 130 and the second lead 140 of the chip temperature sensor 100 are welded to the substrate 300, and then the chip temperature sensor 100 is mounted on the device under test 200 through the thermal conductive adhesive layer 160 provided on the top wall of the shell 110, and the temperature signal of the device under test 200 is detected by the temperature sensing element 120.

[0056] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and essence of the embodiments of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the embodiments of the present disclosure.

Claims

1. A patch temperature sensor, characterized in that: It includes a shell, a temperature sensing element, a first lead, a second lead and a plastic package; The housing is a hollow shell with an open bottom wall, and the top wall of the housing is used to be mounted on the device under test so that the temperature sensor can be mounted on the device under test; The temperature sensing element is disposed in the housing; The first ends of the first lead and the second lead are connected to the temperature sensing element, and the second ends of the first lead and the second lead extend out of the bottom wall of the housing and are used to be welded to the surface of the substrate, so as to weld the temperature sensor to the surface of the substrate; The plastic package is filled in the housing to wrap the temperature sensing element and a portion of the first lead and a portion of the second lead.

2. The patch temperature sensor according to claim 1, characterized in that: The second end of the first lead and the second end of the second lead extend out of the bottom wall of the housing and bend along the bottom wall toward the side walls on both sides thereof.

3. The patch temperature sensor according to claim 2, characterized in that: The bottom wall of the housing is provided with a first groove and a second groove which are relatively distributed; wherein, The second end of the first lead is located in the first groove and extends out of the housing side wall along the first groove; The second end of the second lead is located in the second groove and extends out of the housing side wall along the second groove.

4. The patch temperature sensor according to claim 3, characterized in that: The bottom wall of the second end of the first lead protrudes from the bottom wall of the first groove, and the bottom wall of the second end of the second lead protrudes from the bottom wall of the second groove.

5. The patch temperature sensor according to claim 3, characterized in that: The first grooves and the second grooves are symmetrically distributed.

6. The patch temperature sensor according to any one of claims 1 to 4, characterized in that: The temperature sensing element is located at the top of the housing.

7. The patch temperature sensor according to any one of claims 1 to 4, characterized in that: It also includes a heat-conducting adhesive layer, which is arranged on the top wall outside the shell.

8. The patch temperature sensor according to any one of claims 1 to 4, characterized in that: The first ends of the first lead and the second lead are both connected to the bottom of the temperature sensing element.

9. The patch temperature sensor according to any one of claims 1 to 4, characterized in that: The first ends of the first lead and the first ends of the second lead are respectively connected to two oppositely distributed side walls of the temperature sensing element.

10. The patch temperature sensor according to any one of claims 1 to 4, characterized in that: The temperature sensing element is a PTC thermistor or an NTC thermistor.

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