Device for detecting connection quality of SSOP (Small Small Outline Package) pins

Abstract

The utility model relates to the field of SSOP packaging, in particular to an SSOP packaging pin connection quality detection device, which comprises four shells, an SSOP packaging structure is arranged among inner cavities of the four shells, and a pin body is arranged on the surface of the SSOP packaging structure; the auxiliary assembly is arranged on the surface of the shell; through cooperation of the auxiliary assembly and the reset assembly, a worker can conveniently position and protect SSOP packaging structures of different models and sizes, and when space expansion is carried out on the SSOP packaging structures, the sliding shell and the limiting plate can correspondingly extend the length, so that pin bodies of the SSOP packaging structures are supported, and the service life of the pin bodies of the SSOP packaging structures is prolonged. According to the invention, the pin body can be conveniently pressed and detected by a contact piece of a subsequent detection device, adaptive positioning can be conveniently carried out on SSOP packaging structures with different models and sizes, meanwhile, the high-density pin body can be supported and limited, and the overall practicability of the detection device can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of SSOP packaging, in particular to a device for detecting the connection quality of SSOP packaging pins. Background Art

[0002] SSOP (Shrink Small Outline Package) is a common integrated circuit package with a small footprint and pin spacing. It is commonly used in surface mount technology (SMT) and is suitable for high-density circuit board designs. The pins of the SSOP package are typically located on both sides of the package. Compared to traditional packages, SSOP offers significant advantages in space savings and improved circuit performance. It is widely used in consumer electronics, communications equipment, and industrial control.

[0003] A search revealed a Chinese patent application titled "A Pin Body Detection Device for GaN-Based Chip Packaging," with authorization publication number CN217385575U. This utility model discloses a pin body detection device for GaN-based chip packaging, comprising a base with a positioning groove that engages with the chip. The base's front and rear sidewalls define mounting grooves, in which a pin body locating seat is fixedly mounted. The upper end surface of the pin body locating seat is provided with a set of pin body grooves for locating the pin body. The base is made of mold steel, and the pin body locating seat is made of nylon. This utility model features a rational design, convenient operation, and excellent protection.

[0004] Although the above-mentioned pin body detection device can position the chip and limit the pin body through the base and positioning groove to facilitate subsequent detection operations, it is well known that the pin body of the SSOP package is usually arranged in a high-density manner. The number of pin bodies of the SSOP package structure to be detected for different signals will also be different. Therefore, the above-mentioned method of positioning the pin body by opening a pin body groove has certain limitations and is not conducive to use.

[0005] Therefore, a SSOP package pin connection quality detection device is proposed to solve the above problems. Utility Model Content

[0006] The purpose of the present invention is to provide a SSOP package pin connection quality detection device in order to solve the above problems, thereby improving the problems that the traditional pin body quality detection device has certain limitations and low applicability.

[0007] The utility model achieves the above-mentioned object through the following technical solutions: a SSOP package pin connection quality detection device, comprising: a housing, wherein the number of the housings is four, an SSOP package structure is arranged between the inner cavities of the four housings, and a pin body is arranged on the surface of the SSOP package structure;

[0008] an auxiliary component, wherein the auxiliary component is arranged on the surface of the shell;

[0009] The auxiliary component includes a sliding shell fixedly connected to the surface of the housing, the inner cavity of the sliding shell is provided with a sliding groove, and the inner cavity of the sliding groove is slidably connected to a limit plate;

[0010] A reset component, the reset component being arranged on the surface of the housing;

[0011] Among them, the reset assembly includes a connecting seat fixedly connected to the surface of the shell, the inner cavity of the connecting seat is slidably connected to a sliding rod, the end of the sliding rod away from the connecting seat is fixedly connected to a positioning seat, and the positioning seat is fixedly connected to the shell on the side close to the shell.

[0012] Preferably, a limiting groove is provided on the surface of the limiting plate, and the inner cavity of the limiting groove is slidably connected to the inner cavity of the sliding shell. By providing the limiting groove, the limiting plate can be limited to prevent the limiting plate from slipping out of the sliding shell.

[0013] Preferably, there are two sliding shells, the limit plate is located between the inner cavities of the two sliding shells, and the plane height of the sliding shell is level with the plane height of the sliding shell. Through the above description, the pin body can be supported, which is conducive to the subsequent detection device to perform compression detection on it.

[0014] Preferably, a first spring is fixedly connected between the connecting seat and the opposite side of the positioning seat. The first spring is located on the surface of the sliding rod. Through the first spring, the shell can be reset through the connecting seat.

[0015] Preferably, a synchronization rod is slidably connected between the inner cavities of the two shells, wherein a second spring is fixedly provided on one side of the synchronization rod, and both ends of the second spring are fixedly connected to the shell. The shell can be limited and reset through the synchronization rod and the second spring.

[0016] Preferably, the front view shape of the shell is a horizontal L-shaped setting, and the inner cavities of the four shells are surrounded by a design. Through the above description, the SSOP packaging structure can be clamped and positioned as a whole, and at the same time, it can also have a certain protective effect.

[0017] Preferably, the surface of the housing is provided with an inclined portion, and the inclined angle of the inclined portion is forty-five degrees. The inclined portion can facilitate workers to squeeze the SSOP packaging structure into the four housings for positioning.

[0018] The beneficial effects of the utility model are:

[0019] 1. Through the combination of auxiliary components and reset components, it is convenient for workers to position and protect SSOP package structures of different models and sizes. When the SSOP package structure is expanded, the sliding shell and the limit plate will extend to a corresponding length to support the pin body of the SSOP package structure, which is conducive to the subsequent detection device's contact piece to perform compression detection on it. While facilitating the adaptive positioning of SSOP package structures of different models and sizes, it can also support and limit the high-density pin body, which can effectively improve the overall practicality of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural diagram of the utility model;

[0021] Figure 2 This is a schematic structural diagram of the reset assembly of the present utility model;

[0022] Figure 3 This is a schematic structural diagram of the auxiliary components of the present utility model;

[0023] Figure 4 This is a schematic diagram of the internal structure of the shell of the present utility model.

[0024] In the figure: 1. Shell; 2. SSOP package structure; 3. Pin body; 4. Auxiliary component; 401. Sliding shell; 402. Slide groove; 403. Limit plate; 404. Limit groove; 5. Inclined portion; 6. Second spring; 7. Synchronous rod; 8. Reset assembly; 801. Connecting seat; 802. Slide rod; 803. First spring; 804. Positioning seat. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] When implementing: Figure 1-4As shown, a SSOP package pin body 3 connection quality detection device includes: a housing 1, the number of housings 1 is four, an SSOP package structure 2 is arranged between the inner cavities of the four housings 1, and the pin body 3 is arranged on the surface of the SSOP package structure 2; an auxiliary component 4, the auxiliary component 4 is arranged on the surface of the housing 1; and a reset component 8, the reset component 8 is arranged on the surface of the housing 1;

[0027] The methods used by staff to inspect the connection quality of the SSOP package pin body 3 generally include visual inspection, electrical testing using a multimeter or dedicated test equipment, internal solder joint inspection using X-ray equipment, comprehensive electrical performance testing using automatic test equipment (ATE), and temperature cycling testing to evaluate solder joint strength and reliability.

[0028] like Figure 1 、 Figure 2 and Figure 3 As shown, the auxiliary component 4 includes a sliding shell 401 fixedly connected to the surface of the housing 1. The inner cavity of the sliding shell 401 is provided with a sliding groove 402, and the inner cavity of the sliding groove 402 is slidably connected to the limiting plate 403; the surface of the limiting plate 403 is provided with a limiting groove 404, and the inner cavity of the limiting groove 404 is slidably connected to the inner cavity of the sliding shell 401; there are two sliding shells 401, and the limiting plate 403 is located between the inner cavities of the two sliding shells 401. The plane height of the sliding shell 401 is the same as the plane height of the sliding shell 401;

[0029] When the staff needs to inspect the connection quality of the pin bodies 3 of the SSOP package structure 2, they first place the SSOP package structure 2 above the four shells 1, and then squeeze the SSOP package structure 2 into the shell 1. First, the two sides of the bottom end of the SSOP package structure 2 contact the inclined parts 5 of the shell 1. At this time, the two groups of shells 1 are displaced to the opposite sides. At the same time, the two sliding shells 401 will also move to the opposite sides on the surfaces of the two limiting plates 403. Since the plane height of the sliding shell 401 is consistent with the plane height of the limiting plates 403, the high-density pin bodies 3 on the surface of the SSOP package structure 2 can be supported and limited, so that the multiple pin bodies 3 are kept at the same level, which is convenient for the contact pieces of the subsequent detection device to detect them.

[0030] like Figure 1 and Figure 2 As shown, the reset assembly 8 includes a connecting seat 801 fixedly connected to the surface of the housing 1, a sliding rod 802 is slidably connected to the inner cavity of the connecting seat 801, and an end of the sliding rod 802 away from the connecting seat 801 is fixedly connected to a positioning seat 804, and the side of the positioning seat 804 close to the housing 1 is fixedly connected to the housing 1; a first spring 803 is fixedly connected between the connecting seat 801 and the opposite side of the positioning seat 804, and the first spring 803 is located on the surface of the sliding rod 802;

[0031] If a larger SSOP package structure 2 is encountered, the connector 801 in the reset assembly 8 will also press against the two first springs 803 as the two shells 1 separate. The rebound effect of the first springs 803 will bring the shells 1 closer together to clamp and position the SSOP package structure 2, effectively stabilizing the SSOP package structure 2 and the pin bodies 3 on its surface, thereby improving the accuracy of the detection data.

[0032] A synchronization rod 7 is slidably connected between the inner cavities of the two housings 1. A second spring 6 is fixedly installed on one side of the synchronization rod 7, and both ends of the second spring 6 are fixedly connected to the housing 1. The housing 1 has a horizontal L-shaped configuration when viewed from the front, and the inner cavities of the four housings 1 are surrounded by each other. The surface of the housing 1 is provided with an inclined portion 5, and the inclined portion 5 has an inclination angle of 45 degrees.

[0033] When the present invention is in use, when the staff needs to test the connection quality of the pin body 3 of the SSOP package structure 2, first the SSOP package structure 2 is placed above the four housings 1, and then the SSOP package structure 2 is squeezed into the housing 1. First, the two sides of the bottom end of the SSOP package structure 2 are in contact with the inclined portion 5 of the housing 1. At this time, the two groups of housings 1 are displaced to the opposite side. At the same time, the two sliding shells 401 will also move to the opposite side on the surface of the two limiting plates 403. Since the plane height of the sliding shell 401 is consistent with the plane height of the limiting plate 403, the SSOP package structure 2 can be tested. The high-density pin body 3 on the surface of the P package structure 2 is supported and limited, which is conducive to the subsequent detection device's contact piece to press it for detection, and then the second spring 6 is stretched. Similarly, if some larger SSOP package structures 2 are encountered, the connecting seat 801 in the reset component 8 will also be squeezed toward the two first springs 803 as the two shells 1 separate, and the rebound effect of the first spring 803 will make the shells 1 move closer to each other to clamp and position the SSOP package structure 2, which can effectively keep the SSOP package structure 2 and the pin body 3 on its surface stable, thereby improving the accuracy of the detection data.

[0034] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A SSOP package pin connection quality detection device, characterized in that: include: A housing (1), wherein the number of the housings (1) is four, an SSOP packaging structure (2) is provided between the inner cavities of the four housings (1), and a pin body (3) is provided on the surface of the SSOP packaging structure (2); an auxiliary component (4), the auxiliary component (4) being arranged on a surface of the housing (1); The auxiliary component (4) includes a sliding shell (401) fixedly connected to the surface of the housing (1), the inner cavity of the sliding shell (401) is provided with a sliding groove (402), and the inner cavity of the sliding groove (402) is slidably connected to a limit plate (403); A reset component (8), wherein the reset component (8) is arranged on the surface of the housing (1); The reset assembly (8) includes a connecting seat (801) fixedly connected to the surface of the shell (1), an inner cavity of the connecting seat (801) is slidably connected to a slide rod (802), an end of the slide rod (802) away from the connecting seat (801) is fixedly connected to a positioning seat (804), and the positioning seat (804) is fixedly connected to the shell (1) on a side close to the shell (1).

2. The SSOP package pin connection quality detection device according to claim 1, wherein: A limiting groove (404) is provided on the surface of the limiting plate (403), and the inner cavity of the limiting groove (404) is slidably connected to the inner cavity of the sliding shell (401).

3. The SSOP package pin connection quality detection device according to claim 1, wherein: There are two sliding shells (401), the limiting plate (403) is located between the inner cavities of the two sliding shells (401), and the plane height of the sliding shell (401) is the same as the plane height of the sliding shell (401).

4. The SSOP package pin connection quality detection device according to claim 1, wherein: A first spring (803) is fixedly connected between the connecting seat (801) and the opposite side of the positioning seat (804), and the first spring (803) is located on the surface of the sliding rod (802).

5. The SSOP package pin connection quality detection device according to claim 1, wherein: A synchronization rod (7) is slidably connected between the inner cavities of the two shells (1), wherein a second spring (6) is fixedly provided on one side of the synchronization rod (7), and both ends of the second spring (6) are fixedly connected to the shell (1).

6. The SSOP package pin connection quality detection device according to claim 1, wherein: The housing (1) is in a horizontal L-shaped configuration when viewed from the front, and the inner cavities of the four housings (1) are designed to be surrounded.

7. The SSOP package pin connection quality detection device according to claim 1, wherein: The surface of the housing (1) is provided with an inclined portion (5), and the inclined angle of the inclined portion (5) is forty-five degrees.

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