Head-up display system and image generation assembly thereof

Abstract

The utility model discloses a head-up display system and an image generation assembly thereof, the image generation assembly comprises a shell and an image generation unit assembled with the shell, the heat dissipation directions of a plurality of heating devices of the image generation unit are the same, and the heat of the heating devices is conducted out through the shell and a plurality of heat dissipation structures on the outer wall of the shell; wherein the distribution orientations of the plurality of heat dissipation structures on the outer wall of the shell are the same, and are in one-to-one correspondence with the heat dissipation orientations of the plurality of heating devices. In the scheme, the plurality of heating devices of the image generation unit dissipate heat in the same direction, and the plurality of heat dissipation structures on the outer wall of the shell are arranged in the same direction matched with the same-direction heat dissipation of the plurality of heating devices, so that the plurality of heat dissipation structures are intensively distributed on the outer wall of the shell, the utilization rate of the enveloping space of a product is improved, and the heat dissipation efficiency of the product is improved. And the shell structure is simplified, and the design difficulty and the processing cost of the shell are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile manufacturing, in particular to a head-up display system and an image generation component thereof. Background Art

[0002] The car's head-up display system is abbreviated as HUD in English. Its function is centered on the driver, projecting important driving information such as speed and navigation onto the windshield in front of the driver, allowing the driver to see important driving information without turning or lowering his head as much as possible.

[0003] The picture generation unit is abbreviated as PGU in English. As an important component of the head-up display system, it can realize optical imaging functions. The total imaging light source it projects is composed of multiple small light sources and is controlled by a light board. During its operation, it will generate various heat sources including radiation heating, control chip heating, and resistance heating. If the heat cannot be effectively discharged or exported, it is easy to cause the internal temperature of the image generation unit to be too high, affecting its service life, or in severe cases causing it to be ablated and damaged, and may even cause thermal deformation of the surrounding optical sensitive parts and cause image dysfunction.

[0004] Currently, the image generation unit (IGE) is mounted opposite the housing, and heat dissipation from the IGE is typically achieved through anisotropic heat dissipation. This means that the multiple heating components within the IGE dissipate heat in different directions, with the heat from these components being conducted through the housing. However, this anisotropic heat dissipation from the multiple heating components consumes more product envelope space and complicates the housing structure, increasing design complexity and manufacturing costs. Utility Model Content

[0005] In view of this, the utility model provides an image generation component, which not only helps to improve the utilization rate of the product envelope space, but also helps to simplify the shell structure and reduce the difficulty of shell design and processing costs.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] An image generation component, applied to a head-up display system, comprises: a housing and an image generation unit assembled with the housing,

[0008] The heat dissipation direction of the multiple heating components of the image generation unit is the same, and the heat is conducted away through the multiple heat dissipation structures of the housing and the outer wall of the housing;

[0009] The plurality of heat dissipation structures are distributed in the same direction on the outer wall of the shell, and correspond one-to-one to the heat dissipation directions of the plurality of heating devices.

[0010] Preferably, the inner wall of the shell is provided with a plurality of heat dissipation areas, and is used for one-to-one contact and heat conduction with the plurality of heating devices.

[0011] Preferably, the heat dissipation area includes a heat dissipation boss.

[0012] Preferably, one of the plurality of heating devices includes an imaging control board and is provided with a hollow structure distributed opposite to its chip;

[0013] One of the plurality of heat dissipation bosses includes a chip heat dissipation boss, which passes through the hollow structure of the imaging control board and contacts the chip for heat conduction.

[0014] Preferably, another one of the plurality of heating devices comprises a three-primary-color lamp bead control board;

[0015] Another one of the plurality of heat dissipation bosses includes a lamp board heat dissipation boss, and is used for heat conduction with the three primary color lamp bead control board.

[0016] Preferably, a first positioning structure and a second positioning structure that cooperate with each other are provided between the shell and the outer shell of the image generating unit, and the first positioning structure is located at the rear side of the lamp tube of the image generating unit.

[0017] Preferably, the first positioning structure includes a first positioning pin hole structure;

[0018] The second positioning structure includes a second positioning pin hole structure.

[0019] Preferably, the first positioning hole of the first positioning pin hole structure is a circular hole;

[0020] The second positioning hole of the second positioning pin hole structure is an elliptical hole, and the major axis of the elliptical hole coincides with a line connecting the center of the elliptical hole and the center of the circular hole.

[0021] Preferably, the material of the image generating unit housing includes thermosetting material.

[0022] A head-up display system includes an image generation component, wherein the image generation component is the image generation component described above.

[0023] It can be seen from the above technical solution that in the image generation component provided by the present invention, the multiple heating devices of the image generation unit dissipate heat in the same direction, and the multiple heat dissipation structures on the outer wall of the shell are arranged in the same direction to match the same direction heat dissipation of the multiple heating devices, which means that the multiple heat dissipation structures are concentratedly distributed on the outer wall of the shell, which not only helps to improve the utilization rate of the product envelope space, but also helps to simplify the shell structure and reduce the difficulty of shell design and processing costs.

[0024] The present invention also provides a head-up display system, which has corresponding beneficial effects due to the adoption of the above-mentioned image generation component. For details, please refer to the above description, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of the assembly of the image generation unit and the housing provided by an embodiment of the present utility model;

[0027] Figure 2 This is another schematic diagram of the image generation unit and the housing provided by an embodiment of the present utility model;

[0028] Figure 3 An exploded schematic diagram of the image generation unit and the housing provided in an embodiment of the present utility model;

[0029] Figure 4 Another exploded schematic diagram of the image generation unit and the housing provided by an embodiment of the present utility model;

[0030] Figure 5 Another exploded schematic diagram of the image generation unit and the housing provided by an embodiment of the present utility model;

[0031] Figure 6 A top view of the image generation unit and the housing provided in an embodiment of the present utility model;

[0032] Figure 7 A schematic diagram showing the distribution of key heating areas of an image generation unit provided by an embodiment of the present utility model;

[0033] Figure 8 A schematic diagram of the heat dissipation area distribution of the image generation unit provided in an embodiment of the present utility model.

[0034] Among them, 1 is the housing, 11 is the heat dissipation boss of the lamp board, 12 is the heat dissipation boss of the chip, 13 is the heat dissipation rib of the lamp board, 14 is the heat dissipation rib of the chip, 15 is the first positioning pin, and 16 is the second positioning pin;

[0035] 2 is the image generation unit, 21 is the three-primary-color lamp bead control board, 22 is the imaging control board, 221 is the frame opening, 23 is the first positioning hole, 24 is the second positioning hole, 25 is the light detection control board, 26 is the lamp tube, and 27 is the housing;

[0036] 3 is the fastening bolt. DETAILED DESCRIPTION

[0037] In the above background technology, it should also be noted that the PGU and the shell are assembled to form an image generation component of the head-up display system; wherein, the multiple heating devices of the PGU are anisotropic heat dissipation, that is, the heat dissipation directions of the multiple heating devices are different. In order to facilitate the heat dissipation of the multiple heating devices of the PGU, it is necessary to add multiple heat dissipation structures (heat dissipation ribs) on the outer wall of the shell corresponding to the heat dissipation directions of the multiple heating components, so that the multiple heat dissipation structures are distributed in different directions on the outer wall of the shell, that is, the multiple heat dissipation structures are distributed in anisotropic directions on the outer wall of the shell; for example, the heat dissipation of one of the multiple heating devices is downward, and the lower outer wall of the shell is provided with a corresponding heat dissipation structure; the heat dissipation of another heating device is toward the right, and the right outer wall of the shell is provided with another corresponding heat dissipation structure, so that the lower outer wall and the right outer wall of the shell are respectively provided with a heat dissipation structure. This will result in the consumption of more product envelope space, and also make the shell structure more complicated, resulting in increased design difficulty and processing cost.

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] The image generation component provided by the embodiment of the present invention is applied to the head-up display system of an automobile, such as Figure 1 and Figure 2 As shown, it includes: a housing 1 and an image generating unit 2 assembled with the housing 1,

[0040] like Figure 3 As shown, the heat dissipation directions of the multiple heating components of the image generation unit 2 are the same, and the heat of the multiple heating components is conducted out through the multiple heat dissipation structures of the housing 1 and its outer wall;

[0041] The multiple heat dissipation structures are distributed in the same direction on the outer wall of the housing 1 and correspond one-to-one to the heat dissipation directions of the multiple heating components.

[0042] It should be noted that the image generation unit 2 is the PGU. Figure 6 As shown, the image generation unit 2 is connected to the housing 1 by a plurality of fastening bolts 3, and the housing 1 is a metal housing to ensure heat conduction; in addition, as shown in FIG. Figure 3As shown, the multiple heating devices of the image generation unit 2 are all main heat dissipation devices, such as the three-primary-color lamp bead control board 21 and the imaging control board 22, and can be arranged downward, so that the multiple heating devices can dissipate heat downward, that is, the multiple heating devices can dissipate heat downward and conduct the heat out through the multiple heat dissipation structures of the shell 1 and its outer wall; wherein, the distribution of the multiple heat dissipation structures on the outer wall of the shell 1 can all be downward, that is, the multiple heat dissipation structures can be evenly distributed on the lower outer wall of the shell 1, and correspond one-to-one with the heat dissipation directions of the multiple heating devices, so that the multiple heat dissipation structures are concentratedly distributed on the outer wall of the shell 1, which not only helps to improve the utilization rate of the product envelope space, but also helps to simplify the shell structure, reduce the design difficulty and processing cost. In addition, as Figure 3 As shown, the heat dissipation structure includes: a plurality of heat dissipation ribs arranged in parallel; of course, this solution can also adopt other heat dissipation structures, such as heat dissipation fins, which will not be described here.

[0043] That is to say, in the image generation component provided by this solution, the multiple heat-generating devices of the image generation unit 2 dissipate heat in the same direction, which can help simplify the heat dissipation path of the image generation unit 2 and improve the heat dissipation performance of the image generation unit 2. Moreover, the multiple heat dissipation structures on the outer wall of the shell 1 are arranged in the same direction to match the same-direction heat dissipation of the multiple heat-generating devices, that is, the multiple heat dissipation structures are concentratedly distributed on the outer wall of the shell 1, which not only helps to improve the utilization rate of the product envelope space, but also helps to simplify the shell structure and reduce the difficulty of shell design and processing costs; in simple terms, it can achieve the effects of simplifying the heat dissipation path, simplifying the shell structure, and saving envelope space.

[0044] It can be seen from the above technical solution that in the image generation component provided by the embodiment of the present invention, the multiple heating devices of the image generation unit dissipate heat in the same direction, and the multiple heat dissipation structures on the outer wall of the shell are arranged in the same direction to match the same direction heat dissipation of the multiple heating devices, which means that the multiple heat dissipation structures are concentratedly distributed on the outer wall of the shell, which not only helps to improve the utilization rate of the product envelope space, but also helps to simplify the shell structure and reduce the difficulty of shell design and processing costs.

[0045] In this solution, the inner wall of the housing 1 is provided with a plurality of heat dissipation areas, and is used for one-to-one contact heat conduction with a plurality of heating devices, thereby facilitating better heat conduction of the plurality of heating devices.

[0046] Specifically, if Figure 4As shown, the heat dissipation area includes a heat dissipation boss. In other words, the heat dissipation area on the inner wall of the housing 1 is the heat dissipation boss. This not only facilitates thermal conduction between the inner wall of the housing 1 and the multiple heating components, but also facilitates the mounting of the image generation unit 2 and the housing 1, that is, the installation of the image generation unit 2 and the housing 1. In addition, to facilitate better heat conduction between the multiple heating components, thermally conductive adhesive is applied between each heating component and the corresponding heat dissipation boss. Of course, other structures can also be used for the heat dissipation area, such as a heat sink or a heat sink block, which will not be described here.

[0047] Further, if Figure 3 As shown, one of the multiple heating devices includes an imaging control board 22 and is provided with a hollow structure distributed opposite to its chip;

[0048] like Figure 4 As shown, one of the plurality of heat dissipation bosses includes a chip heat dissipation boss 12, which passes through the hollow structure of the imaging control board 22 and contacts the chip for heat conduction. Figure 3 As shown, the hollow structure of the imaging control board 22 can be a frame opening 221, which serves as a through-opening for the chip heat dissipation boss 12, and the chip ( Figure 4 The heat dissipation boss 12 passes through the frame opening 221 of the imaging control board 22 and contacts the cover chip for heat conduction. In this way, effective heat conduction to the imaging control board 22 chip can be achieved.

[0049] Furthermore, if Figure 3 As shown, another one of the multiple heating devices includes a three-primary-color lamp bead control board 21; wherein, the three-primary-color lamp bead control board 21 is the so-called lamp board;

[0050] like Figure 4 As shown, another one of the multiple heat dissipation bosses includes a lamp board heat dissipation boss 11, and is used for heat conduction with the three primary color lamp bead control board 21.

[0051] It should be noted that the three-primary-color lamp bead control board 21 generates light sources of different colors in different proportions, and controls and combines them through the imaging control board 22 to form an imaging screen, that is, the control chip of the imaging control board 22 combines light sources of different colors in different proportions to form the required image. These two heating devices are the main heating devices of the image generation unit 2, and need to dissipate heat through heat conduction in contact with the shell; of course, the three-primary-color lamp bead control board 21 is used to fit the heat conduction with the lamp board heat dissipation boss 11, which can facilitate better heat conduction of the three-primary-color lamp bead control board 21, and as Figure 3 As shown, the number of the three primary color lamp bead control boards 21 is three; accordingly, as Figure 4As shown, there are also three heat dissipation bosses 11 on the lamp board, which are used to conduct heat to the three primary color lamp bead control boards 21. In addition, the light detection control board 25 is arranged on the side of the housing of the image generation unit 2 to conduct convection heat exchange with the air medium because it generates less heat.

[0052] That is to say, the main heating components inside the image generation unit 2 all transfer their heat to the corresponding heat dissipation structure outside the shell through contact heat conduction or bonding heat conduction with the corresponding heat dissipation boss. This method also facilitates the matching installation of the image generation unit 2 and the shell 1, which is conducive to the consistent pressing of the thermal adhesive between each heating component and the corresponding heat dissipation boss. In simple terms, the heat dissipation path of the heating components of the image generation unit 2 is: heating component → heat dissipation boss → shell → heat dissipation rib. In addition, if Figure 4 As shown, the three-primary-color lamp bead control board 21 is arranged at a high position in the image generating unit 2, and the imaging control board 22 is arranged at a low position in the image generating unit 2. To achieve adaptive contact heat conduction, the lamp board heat dissipation boss 11 is arranged at a high position on the shell 1, and the chip heat dissipation boss 12 is arranged at a low position on the shell 1.

[0053] In this program, if Figure 5 As shown, a first and a second positioning structure are provided between the housing 1 and the outer shell of the image generating unit 2, with the first positioning structure being located behind the lamp tube 26 of the image generating unit 2. In other words, there are two positioning structures between the housing 1 and the outer shell of the image generating unit 2, one of which is located behind the lamp tube 26 of the image generating unit 2. This ensures the precise positioning of the lamp tube 26 of the image generating unit 2 to the greatest extent possible, and ensures precise contact and heat conduction between the multiple heating components and the multiple heat dissipation bosses.

[0054] Specifically, the first positioning structure includes a first positioning pin hole structure;

[0055] The second positioning structure includes a second positioning pin hole structure. Figure 5 As shown, the first positioning pin hole structure includes: a first positioning pin 15 and a first positioning hole 23 that cooperate with each other. The first positioning pin 15 can be set on the housing 1 (as shown in FIG. Figure 8 As shown), and located at the rear side of the lamp tube 26 of the image generating unit 2, the first positioning hole 23 can be opened in the ear piece of the housing of the image generating unit 2, and the ear piece is located at the rear side of the lamp tube 26; of course, the setting body of the first positioning pin 15 and the first positioning hole 23 can be swapped; in addition, as Figure 5 As shown, the second positioning pin hole structure includes: a second positioning pin 16 and a second positioning hole 24 that cooperate with each other. The second positioning pin 16 can be set on the housing 1 (as shown in FIG. Figure 8As shown), and located on one side of the heat dissipation boss 11 of the lamp board, the second positioning hole 24 can be opened on the ear piece of the housing of the image generating unit 2, and the ear piece is located on one side of the three primary color lamp bead control board 21; similarly, the setting body of the second positioning pin 16 and the second positioning hole 24 can be swapped. In other words, there are two places between the shell 1 and the housing of the image generating unit 2 that use pin holes for positioning, which has the characteristics of simple structure and convenient positioning. Of course, this solution can also adopt other positioning structures, such as positioning protrusions and positioning grooves, which will not be repeated here. In addition, as Figure 5 As shown, the first positioning structure and the second positioning structure are not in the same horizontal plane; wherein the first positioning structure is arranged at a low position and the second positioning structure is arranged at a high position.

[0056] This helps to ensure the installation accuracy of the image generating unit 2 and the housing 1.

[0057] Further, if Figure 5 and Figure 7 As shown, the first positioning hole 23 of the first positioning pin hole structure is a circular hole;

[0058] The second positioning hole 24 of the second positioning pin hole structure is an elliptical hole, and the major axis of the elliptical hole coincides with the line connecting the center of the elliptical hole and the center of the circular hole, that is, the major axis of the elliptical hole and the line connecting the center of the elliptical hole and the center of the circular hole are collinear. Among them, the second positioning hole 24 is also a waist-shaped hole. This design of the present solution can prevent the image generation unit 2 from rotating when installed on the shell 1, and thus has a rotation-stopping effect, thereby facilitating better ensuring the mounting accuracy of the image generation unit 2 and the shell 1. In addition, the first positioning structure serves as the main positioning structure, and the second positioning structure serves as the secondary positioning structure, and the main positioning structure and the secondary positioning structure are located on two parallel surfaces at different heights.

[0059] Furthermore, if Figure 5 The material of the housing 27 of the image generating unit 2 includes a thermosetting material. The use of a thermosetting material for the housing 27 of the image generating unit 2 has the advantages of low material cost, high forming precision, and good temperature resistance. This material prevents the image generating unit 2 from being deformed by temperature increases during operation, thereby ensuring the projection accuracy of the light source of the image generating unit 2 at high temperatures.

[0060] The present invention also provides a head-up display system, including an image generation component, such as the image generation component described above. Because this solution utilizes the aforementioned image generation component, it also exhibits corresponding beneficial effects. For details, please refer to the previous description and will not be repeated here. Of course, the head-up display system described above can be a head-up display system for an automobile or other means of transportation.

[0061] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0062] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An image generation component, applied to a head-up display system, comprising: A housing (1) and an image generating unit (2) assembled with the housing (1), characterized in that: The heat dissipation direction of the multiple heating elements of the image generation unit (2) is the same, and the heat is conducted away through the shell (1) and the multiple heat dissipation structures on the outer wall of the shell (1); The plurality of heat dissipation structures are distributed in the same direction on the outer wall of the housing (1), and correspond one-to-one to the heat dissipation directions of the plurality of heating devices.

2. The image generation component according to claim 1, characterized in that The inner wall of the housing (1) is provided with a plurality of heat dissipation areas, and is used for one-to-one contact and heat conduction with the plurality of heating elements.

3. The image generation component according to claim 2, characterized in that The heat dissipation area includes a heat dissipation boss.

4. The image generation component according to claim 3, characterized in that One of the plurality of heating devices includes an imaging control board (22) and is provided with a hollow structure distributed relative to the chip thereof; One of the plurality of heat dissipation bosses includes a chip heat dissipation boss (12), which passes through the hollow structure of the imaging control board (22) and contacts the chip for heat conduction.

5. The image generation component according to claim 3, characterized in that Another one of the plurality of heating devices comprises a three-primary-color lamp bead control board (21); Another one of the plurality of heat dissipation bosses comprises a lamp board heat dissipation boss (11) and is used for thermally conducting with the three-primary-color lamp bead control board (21).

6. The image generation component according to claim 1, characterized in that A first positioning structure and a second positioning structure are provided between the housing (1) and the outer shell of the image generation unit (2), and the first positioning structure is located at the rear side of the lamp tube (26) of the image generation unit (2).

7. The image generation component according to claim 6, characterized in that The first positioning structure includes a first positioning pin hole structure; The second positioning structure includes a second positioning pin hole structure.

8. The image generation component according to claim 7, characterized in that The first positioning hole (23) of the first positioning pin hole structure is a circular hole; The second positioning hole (24) of the second positioning pin hole structure is an elliptical hole, and the major axis of the elliptical hole coincides with a line connecting the center of the elliptical hole and the center of the circular hole.

9. The image generation component according to claim 1, characterized in that The material of the housing (27) of the image generation unit (2) includes a thermosetting material.

10. A head-up display system, comprising an image generation component, characterized in that: The image generation component is the image generation component according to any one of claims 1 to 9.

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