Heating device with rapid cooling function

Abstract

The utility model provides a heating device with a rapid cooling function, which comprises a base plate, a flow channel supporting assembly, a compression spring, a cooling flow channel assembly and a heating assembly which are sequentially arranged from bottom to top, an air cylinder assembly is further installed on the base plate, and the air cylinder assembly is in signal connection with an external main controller. The air cylinder assembly is used for driving the cooling flow channel assembly to be attached to or away from the heating assembly through the flow channel supporting assembly so as to achieve the heating and rapid cooling functions of the heating assembly on the chip. The compression spring is located between the flow channel supporting assembly and the cooling flow channel assembly. According to the heating device with the rapid cooling function, the temperature of a high-temperature chip jig can be rapidly reduced to the normal temperature under the condition that the heating power is kept unchanged, the cooling efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation processing, in particular to a heating device with a rapid cooling function. Background Art

[0002] Existing chips come in a wide variety of sizes and specifications, each requiring a single chip fixture. Chip fixtures vary depending on the chip type. Chip heating is a common process in chip testing, requiring the chip and fixture to be heated to the test temperature, with cooling primarily occurring through natural cooling. To save time replacing chip fixtures, cooling channels are added to the heating assembly to lower the temperature. However, installing cooling channels directly below the heating assembly removes heat from the heating assembly. To achieve the desired temperature, the heating power of the heating assembly must be increased, resulting in energy loss and increased production costs. Summary of the Invention

[0003] In view of this, the present invention aims to provide a heating device with a rapid cooling function, so as to provide a heating device that can quickly reduce the temperature without increasing the heating power.

[0004] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0005] A heating device with a rapid cooling function includes a substrate, a flow channel support assembly, a compression spring, a cooling flow channel assembly and a heating assembly arranged in sequence from bottom to top. A cylinder assembly is also installed on the substrate. The cylinder assembly signal is connected to an external main controller. The cylinder assembly is used to drive the cooling flow channel assembly to fit into or away from the heating assembly through the flow channel support assembly to achieve the heating and rapid cooling functions of the heating assembly on the chip; the compression spring is located between the flow channel support assembly and the cooling flow channel assembly.

[0006] Furthermore, the flow channel support assembly includes a guide unit and a support unit. One side of the support unit is fixedly connected to the floating joint of the cylinder assembly, and the support unit is also connected to the base plate through the guide unit.

[0007] Furthermore, a guide hole is provided on the base plate, one end of the guide unit is fixedly mounted on the support unit, and the other end is inserted into the guide hole.

[0008] Furthermore, the guide unit is a guide column; and the support unit is a support base plate.

[0009] Furthermore, a temperature sensor is provided inside the heating component.

[0010] Furthermore, the heating component is fixedly connected to the substrate via a fixing bracket.

[0011] Furthermore, the cooling channel assembly includes a cooling channel and a liquid inlet pipe and a liquid outlet pipe respectively connected to the cooling channel on both sides. The base plate is also provided with pipe through holes for passing the liquid inlet pipe and the liquid outlet pipe respectively.

[0012] Furthermore, the cooling channel is a plate-shaped cavity structure, and a limiting screw is installed between the cooling channel and the support unit, and the limiting screw is sleeved inside the compression spring.

[0013] Furthermore, the cylinder body of the cylinder assembly is fixedly installed below the base plate, and the floating joint is located above the base plate.

[0014] Compared with the prior art, the heating device with rapid cooling function described in the present invention has the following advantages:

[0015] (1) The heating device with rapid cooling function described in the present invention can quickly cool the high-temperature chip fixture to room temperature while keeping the heating power unchanged, thereby improving the cooling efficiency and reducing the production cost.

[0016] (2) The heating device with rapid cooling function described in the present invention has a simple structure, a high degree of automation, can be perfectly matched with assembly line operations, and has strong versatility.

[0017] (3) The heating device with rapid cooling function described in the present invention is provided with a compression spring 7, which can ensure that the cooling channel is tightly attached to the bottom of the heating component, and at the same time ensure that the heating component will not be damaged due to excessive output pressure of the cylinder body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of a heating device with a rapid cooling function according to an embodiment of the present utility model;

[0020] Figure 2 This is a side view of a heating device with a rapid cooling function according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of a cooling channel assembly according to an embodiment of the present invention.

[0022] Description of reference numerals:

[0023] 1-heating assembly; 2-fixed bracket; 3-base plate; 4-flow channel support assembly; 41-guide unit; 42-support unit; 5-cooling flow channel assembly; 51-liquid inlet pipe; 52-liquid outlet pipe; 6-cylinder assembly; 61-cylinder floating joint; 7-compression spring; 8-temperature sensor. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0026] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0027] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0028] A heating device with rapid cooling function, such as Figures 1 to 3As shown, it includes a substrate 3, a flow channel support assembly 4, a compression spring 7, a cooling flow channel assembly 5 and a heating assembly 1 arranged in sequence from bottom to top. A temperature sensor 8 is also provided on the heating assembly 1, and a cylinder assembly 6 is also installed on the substrate 3. The controller of the cylinder assembly 6 and the temperature sensor 8 are both connected to the external main controller through signals, participating in the overall control of the assembly line; after the cylinder assembly 6 receives the signal from the main controller, it drives the cooling flow channel assembly 5 to fit or move away from the heating assembly 1 through the flow channel support assembly 4, so as to realize the heating and rapid cooling function of the chip by the heating assembly 1; the compression spring 7 is located between the flow channel support assembly 4 and the cooling flow channel assembly 5, and is used to prevent the cooling flow channel assembly 5 and the heating assembly 1 from being damaged due to excessive pressure from the cylinder assembly 6.

[0029] The heating assembly 1 is a device or apparatus for heating a chip on an assembly line or at a fixed position in the prior art. A temperature sensor 8 is provided inside the heating assembly 1 .

[0030] Preferably, the heating assembly 1 is fixedly connected to the base plate 3 via a fixing bracket 2 .

[0031] In one or more embodiments, the flow channel support assembly 4 includes a guide unit 41 and a support unit 42. One side of the support unit 42 is fixedly connected to the floating joint 61 of the cylinder assembly 6. The support unit 42 is also connected to the base plate 3 through the guide unit 41. Such a structure allows the cylinder assembly 6 to drive the support unit 42 along the guide unit 41 and reduce friction.

[0032] Specifically, a guide hole is provided on the substrate 3, one end of the guide unit 41 is fixedly mounted on the support unit 42, and the other end is inserted into the guide hole, which plays a guiding role and avoids the friction between the flow channel support assembly 4 and the substrate 3, so that the cylinder assembly 6 can drive the support unit 42 to move with less force, saving useless work and thus reducing production costs.

[0033] Furthermore, the guide unit 41 is a guide column, and the support unit 42 is a support base plate.

[0034] The cooling channel assembly 5 includes a cooling channel and a liquid inlet pipe 51 and a liquid outlet pipe 52 connected on both sides thereof. The external pipeline of the liquid inlet pipe 51 is connected to a driving mechanism, which can be a pump or a press, for driving the coolant circulation. Since driving the coolant to participate in the large system circulation is an existing technology, it will not be described here. In order to save space, a pipe through hole is also provided on the base plate 3, which is used to pass through the liquid inlet pipe 51 and the liquid outlet pipe 52 respectively. The cooling channel is a plate-shaped cavity structure, and a limit screw is also installed between the cooling channel and the support unit 42, and the limit screw is sleeved inside the compression spring 7.

[0035] In order to save space and increase the compactness of the device, the cylinder body of the cylinder assembly 6 is fixedly installed below the base plate 3 , and the floating joint 61 is located above the base plate 3 .

[0036] The working principle of the heating device with rapid cooling function is:

[0037] For ease of understanding, this example uses a pump to drive the coolant circulation, and the pump signal is connected to the main control machine as an example.

[0038] Normal heating state: The cylinder body is in the retracted state, and the coolant in the cooling channel selects the working state according to the coolant boiling point and the heating target temperature (if the coolant boiling point is higher than the chip heating temperature, the coolant does not need to circulate; if the coolant boiling point is lower than the chip heating temperature, the coolant needs to be kept in the circulation state);

[0039] Cooling process: Turn off the power to the heating assembly 1, and the temperature of the heating assembly 1 begins to slowly drop. Temperature sensor 8 transmits the acquired signal to the main controller, which controls the pump to circulate coolant within the cooling channel assembly 5. The main controller extends the cylinder's floating joint 61, which drives the support unit 42 and the cooling channel upward until the cooling channel is flush with the bottom of the heating assembly 1. Before the cylinder assembly 6 reaches the end of its stroke, the cylinder body continues to move, and compression spring 7 contracts, ensuring that the cooling channel is flush with the bottom of the heating assembly 1 and preventing damage to the heating assembly 1 due to excessive cylinder output pressure. The cooling channel exchanges heat with the heating assembly 1, and the coolant removes any residual heat from the heating assembly 1, achieving rapid cooling. Once the temperature of the heating assembly 1 reaches normal, temperature sensor 8 transmits the acquired signal to the main controller, which controls the cylinder body to begin retracting. Compression spring 7 begins to return to its normal length. The cylinder body continues to retract, lowering the cooling channel to its starting position.

[0040] This application is not limited to chip testing, and other devices with the same principle can also be used.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heating device with a rapid cooling function, characterized in that: It includes a substrate, a flow channel support assembly, a compression spring, a cooling flow channel assembly and a heating assembly arranged in sequence from bottom to top. A cylinder assembly is also installed on the substrate. The cylinder assembly signal is connected to an external main controller. The cylinder assembly is used to drive the cooling flow channel assembly to fit into or away from the heating assembly through the flow channel support assembly to realize the heating and rapid cooling function of the chip by the heating assembly; the compression spring is located between the flow channel support assembly and the cooling flow channel assembly.

2. The heating device with rapid cooling function according to claim 1, characterized in that: The flow channel support assembly includes a guide unit and a support unit. One side of the support unit is fixedly connected to the floating joint of the cylinder assembly, and the support unit is also connected to the base plate through the guide unit.

3. The heating device with rapid cooling function according to claim 2, characterized in that: A guide hole is provided on the base plate, one end of the guide unit is fixedly mounted on the support unit, and the other end is inserted into the guide hole.

4. The heating device with rapid cooling function according to claim 2, characterized in that: The guide unit is a guide column; the support unit is a support base plate.

5. The heating device with rapid cooling function according to claim 1, characterized in that: A temperature sensor is provided inside the heating component.

6. The heating device with rapid cooling function according to claim 1, characterized in that: The heating assembly is fixedly connected to the base plate via a fixing bracket.

7. The heating device with rapid cooling function according to claim 1, characterized in that: The cooling channel assembly includes a cooling channel and a liquid inlet pipe and a liquid outlet pipe respectively connected to the cooling channel on both sides. The base plate is also provided with pipe through holes for passing the liquid inlet pipe and the liquid outlet pipe respectively.

8. The heating device with rapid cooling function according to claim 7, characterized in that: The cooling channel is a plate-shaped cavity structure. A limit screw is installed between the cooling channel and the support unit, and the limit screw is sleeved inside the compression spring.

9. The heating device with rapid cooling function according to claim 1, characterized in that: The cylinder body of the cylinder assembly is fixedly installed below the base plate, and the floating joint is located above the base plate.

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