Packaging positioning device

Abstract

The utility model provides a packaging positioning device, and relates to the technical field of semiconductor packaging, the packaging positioning device comprises a backflow tray and a bottom plate arranged in the backflow tray, a positioning jig is arranged on the bottom plate, a containing cavity is formed in the positioning jig, a to-be-packaged DBC is placed in the containing cavity, and point contact is formed between the positioning jig and the bottom plate. After the backflow tray, the bottom plate, the positioning jig and the to-be-packaged DBC pass through a vacuum backflow furnace together, the bottom plate and the to-be-packaged DBC form a whole through the soldering flux to serve as a product, the contact area of the positioning jig and the bottom plate is greatly reduced in a point contact mode, the residual amount of the soldering flux is reduced, separation of the positioning jig and the bottom plate after backflow is facilitated, and the production efficiency is improved. The DBC packaging stability can be remarkably improved, the separation time when the positioning jig is separated from the bottom plate is shortened, the separation risk that the to-be-packaged DBC is prone to being damaged is reduced, the follow-up bonding procedure and the shell assembling procedure are facilitated, the product yield and the product production efficiency are improved, and batch production of products is facilitated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging positioning device. Background Art

[0002] The DBC (Direct Bonded Copper) manufacturing process is a technology that directly bonds copper foil to a ceramic substrate. Its purpose is to provide an electronic packaging solution with high reliability and high performance. During the reflow soldering process before packaging, the DBC product is generally placed in a positioning jig. The DBC product and the copper base plate are formed, placed on a reflow tray, and then passed through a vacuum reflow oven together. The existing positioning jig fits completely on the copper base plate of the DBC product. After the positioning jig passes through the vacuum reflow oven along with the copper base plate, DBC product, and reflow tray, the jig becomes firmly attached to the copper base plate, making it difficult to separate. The separation process is cumbersome and can easily damage the DBC product, consuming a lot of time and labor costs, and reducing product output efficiency and yield. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a packaging positioning device that facilitates the separation of the positioning fixture from the base plate, improves the stability of the DBC package, and improves production efficiency and product quality.

[0004] In one aspect of an embodiment of the present application, a packaging positioning device is provided, including a reflow tray and a base plate arranged in the reflow tray, a positioning jig is provided on the base plate, a receiving cavity is formed on the positioning jig, and the receiving cavity is used to place the DBC to be packaged, and point contact is formed between the positioning jig and the base plate.

[0005] Optionally, a plurality of protruding bosses are formed on a side of the positioning fixture facing the base plate, and the base plate is in contact with and cooperates with the plurality of bosses.

[0006] Optionally, the heights of the plurality of bosses are different, and the height of the boss located in the middle of the positioning jig is greater than the height of the boss located on the side of the positioning jig, so as to form a curved contact surface with a high middle and low sides at one end of the plurality of bosses facing the base plate, and the base plate contacts the positioning jig through the curved contact surface, and the curvature of the base plate is adapted to the curvature of the formed curved contact surface.

[0007] Optionally, a positioning groove is provided on the reflow tray, the bottom plate is accommodated in the positioning groove, and the bottom plate and the positioning groove are loosely matched.

[0008] Optionally, the positioning fixture is positioned and connected to the reflow tray.

[0009] Optionally, the positioning fixture is provided with a positioning pin, and the reflow tray is provided with a positioning hole adapted to the positioning pin.

[0010] Optionally, the diameter of the positioning pin is 10 um to 50 um smaller than the diameter of the positioning hole.

[0011] Optionally, a positioning protrusion protruding toward the DBC to be packaged is provided on the peripheral wall of the accommodating cavity, and the DBC to be packaged is positioned in the accommodating cavity by the positioning protrusion.

[0012] Optionally, the end of the positioning protrusion facing the DBC to be packaged is a planar structure that matches the outer wall of the DBC to be packaged.

[0013] Optionally, the end of the positioning protrusion facing the DBC to be packaged is arc-shaped, and the arc protrudes toward the outer wall of the DBC to be packaged and abuts against the outer wall of the DBC to be packaged.

[0014] Beneficial effects of this application:

[0015] The packaging positioning device provided in the embodiment of the present application forms point contact between the base plate and the positioning jig, replacing the contact method of the prior art in which the entire surface of the jig is attached to the base plate. After the reflow tray, base plate, positioning jig and DBC to be packaged pass through the vacuum reflow furnace together, the base plate and the DBC to be packaged are formed into a whole as a product through the flux. The point contact method greatly reduces the contact area between the positioning jig and the base plate, and also reduces the residual flux, which is beneficial to the separation of the positioning jig and the base plate after reflow, can significantly improve the stability of the DBC package, reduce the separation time when the positioning jig is separated from the base plate and the risk of easily damaging the DBC to be packaged, which is beneficial to the subsequent bonding process and the assembly process of the shell, improves the product yield and product production efficiency, and is beneficial to the mass production of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 Schematic diagram of the packaging positioning device provided in this embodiment;

[0018] Figure 2 This is one of the schematic diagrams of the packaging positioning device provided in this embodiment in use;

[0019] Figure 3This is a schematic diagram of the packaging positioning device DBC product provided in this embodiment in the reflow tray;

[0020] Figure 4 This is the second schematic diagram of the packaging positioning device provided in this embodiment in use;

[0021] Figure 5 yes Figure 1 Side view of

[0022] Figure 6 2 is a schematic structural diagram of a reflow tray of a packaging positioning device provided in this embodiment;

[0023] Figure 7 Schematic diagram of the positioning protrusion structure of the packaging positioning device provided in this embodiment.

[0024] Icons: 100-positioning fixture; 101-positioning frame; 102-positioning pin; 103-positioning protrusion; 104-boss; 105-accommodating cavity; 106-curved contact surface; 110-DBC to be packaged; 120-base plate; 130-reflow tray; 131-positioning hole; 132-positioning groove. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0026] In the description of this application, it should be noted that the terms "inner" and "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.

[0027] It should also be noted that, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0028] In the prior art, the positioning jig is completely attached to the copper base plate and the DBC product is connected to the copper base plate via at least one pair of positioning pins, thereby fixing the positioning jig and thus positioning the DBC product, thereby preventing the DBC product from shifting. Furthermore, during the reflow soldering process, the DBC product and the copper base plate are formed by soldering with solder paste. The solder resist in the solder paste will separate from the solder paste and scatter when passing through the vacuum reflow furnace, coating the positioning jig, the copper base plate, the DBC, and the surface of the reflow tray. The positioning jig and the copper base plate have a large contact area, resulting in a large amount of gaps. A large amount of solder resist will remain in the gaps between the positioning pins and the copper base plate holes, and in the gaps between the positioning jig and the copper base plate mating surface. The solder resist has strong adhesion and will firmly adhere the positioning jig and the copper base plate together.

[0029] To solve the above problems, please refer to Figure 1 An embodiment of the present application provides a packaging positioning device, including: a reflow tray 130 and a base plate 120 arranged in the reflow tray 130, a positioning fixture 100 is set on the base plate 120, and a receiving cavity 105 is formed on the positioning fixture 100. The receiving cavity 105 is used to place the DBC 110 to be packaged, and point contact is formed between the positioning fixture 100 and the base plate 120.

[0030] The positioning jig 100 is used to encapsulate the DBC 110 to be encapsulated. The positioning jig 100 includes a structural body - a positioning frame 101. A receiving cavity 105 is formed in the central area of ​​the positioning frame 101. The receiving cavity 105 passes through the positioning frame 101, so that the DBC 110 to be encapsulated can be accommodated in the receiving cavity 105; for example, four receiving cavities 105 are formed on the positioning jig 100 of the present application, which can accommodate four DBCs 110 to be encapsulated.

[0031] The positioning fixture 100 with the DBC 110 to be packaged needs to pass through a vacuum reflow oven during reflow soldering and needs to be used in conjunction with a reflow tray 130. A base plate 120 with the DBC 110 to be packaged is set in the reflow tray 130. Figure 2 The positioning fixture 100 in the Figure 3The base plate 120 shown is placed, and point contact is formed between the base plate 120 and the positioning jig 100. This replaces the contact method of the prior art in which the entire surface of the jig is attached to the base plate. After the reflow tray 130, the base plate 120, the positioning jig 100 and the DBC 110 to be packaged pass through the vacuum reflow furnace together, the base plate 120 and the DBC 110 to be packaged are formed into a whole as a product through the flux. The point contact method greatly reduces the contact area between the positioning jig 100 and the base plate 120, and also reduces the residual flux. It is beneficial to the separation of the positioning jig 100 and the base plate 120 after reflow, which can significantly improve the stability of the DBC package, reduce the separation time when the positioning jig 100 and the base plate 120 are separated, and the risk of easily damaging the separation of the DBC 110 to be packaged, which is beneficial to the subsequent bonding process and the assembly process of the shell, improves the product yield and product production efficiency, and is beneficial to the mass production of the product.

[0032] Specifically, if Figure 4 As shown, a plurality of protruding bosses 104 are formed on the side of the positioning jig 100 facing the base plate 120, wherein the bosses 104 are distributed on the peripheral wall of the accommodating cavity 105 and extend vertically out of the accommodating cavity 105, and the positions of the bosses 104 avoid the area where the DBC to be packaged is placed; the bosses 104 are also distributed on the frame surface of the positioning jig 100 where the accommodating cavity 105 is not provided, and the base plate 120 is in point contact with the plurality of bosses 104.

[0033] The accommodating cavity 105 is used to place the DBC to be packaged. After placement, the surface of the DBC to be packaged is flush with the surface of the positioning jig 100. A plurality of bosses 104 are formed at different positions on the positioning jig 100. The bosses 104 protrude toward the base plate 120, so that when the positioning jig 100 and the base plate 120 are in contact, point contact is formed by the plurality of bosses 104 fitting with the base plate 120, thereby solving the problem in the prior art that the positioning jig and the base plate are stuck together and cannot be separated due to passing through a vacuum reflow furnace.

[0034] Further, if Figure 5 As shown, the heights of the multiple bosses 104 are different. The height of the boss 104 located in the middle of the positioning jig 100 is greater than the height of the boss 104 located on the side of the customized jig, so as to form a curved contact surface 106 with a high middle and low side at one end of the multiple bosses 104 facing the base plate 120. The base plate 120 contacts the positioning jig 100 through the curved contact surface 106, and the curvature of the base plate 120 is adapted to the curvature of the formed curved contact surface 106.

[0035] When multiple bosses 104 are distributed, the boss 104 located in the middle of the positioning jig 100 is higher than the boss 104 located on the side, so that a virtual curved contact surface 106 is formed at one end of the multiple bosses 104 facing the base plate 120. The curved contact surface 106 is higher in the middle and lower on the side, so that the curved contact surface 106 has a certain curvature, and the curvature of the curved contact surface 106 is adapted to the curvature of the base plate 120 due to heat deformation when passing through the vacuum reflow furnace, so that the base plate 120 is adapted to the curved contact surface 106.

[0036] When the base plate 120 is deformed by heat due to temperature changes (peak temperature is between 220°C and 250°C) during the reflow process, the base plate 120 forms a concave warp of varying degrees (depending on the material). Therefore, before reflow, the base plate 120 is designed to have a curved surface with a certain curvature. To maintain a good fit with the base plate 120, the ends of the multiple bosses 104 facing the base plate 120 are also configured as curved contact surfaces 106 that match the curvature of the base plate 120. When the base plate 120 undergoes thermal deformation, the deformation can be offset, making the base plate 120 become approximately flat.

[0037] In this embodiment, the base plate 120 may be a nickel-plated copper base plate with a curvature of 0.3 rad; the end of the boss 104 facing the base plate 120 cooperates with the base plate 120, and the curvature of the curved contact surface 106 formed by the multiple bosses 104 is also 0.3 rad.

[0038] During use, the curved contact surface 106 formed by the multiple bosses 104 fits with the surface of the base plate 120. After entering the reflow furnace, the base plate 120 is subjected to thermal stress and undergoes concave warping. The size of the positioning groove 132 on the reflow tray 130 is smaller than the outer size of the base plate 120, and the base plate 120 and the positioning groove 132 are clearance-matched. This blocks the degree of thermal deformation of the base plate 120, and after passing through the reflow furnace, the pre-made bending curvature is offset, thereby obtaining a base plate 120 that is approximately flat.

[0039] For the positioning jig 100 and the reflow tray 130, the two are positioned and connected; for example, a pair of positioning pins 102 are set at diagonal positions on the positioning jig 100, and corresponding positioning holes 131 are provided on the reflow tray 130 at the positions corresponding to the positioning pins 102, so that the positioning jig 100 and the reflow tray 130 are positioned and connected through the positioning pins 102 and the positioning holes 131.

[0040] Furthermore, the diameter of the positioning pin 102 is smaller than the diameter of the positioning hole 131 by 10 um to 50 um, so that the two can be tightly fitted without gap, thereby achieving a tight connection between the positioning fixture 100 and the reflow tray 130 .

[0041] In this way, the positioning pins 102 on the positioning jig 100 fit into the corresponding positioning holes 131 on the reflow tray 130 without any gap, and the phenomenon in the prior art that a large amount of solder resist remains in the gap between the holes and the pins when the positioning pins 102 of the positioning jig 100 fit into the positioning holes 131 on the base plate 120, making it difficult to separate the positioning jig 100 from the base plate 120, is avoided.

[0042] like Figure 6 As shown, a positioning groove 132 for accommodating the bottom plate 120 is provided on the reflow tray 130 , and the positioning fixture 100 is connected to the bottom plate 120 via the reflow tray 130 .

[0043] In this embodiment, the DBC 110 to be packaged is placed within the accommodating cavity 105 of the positioning jig 100. The accommodating cavity 105 formed by the inner periphery of the positioning jig 100 cooperates with the outer edge of the DBC 110 to define the position of the DBC 110. At the same time, the positioning pins 102 are connected to the positioning holes 131 of the reflow tray 130, and cooperate with the positioning grooves 132 of the reflow tray 130 to lock the relative position of the positioning jig 100 with the base plate 120, ensuring that the position of the DBC 110 to be packaged relative to the base plate 120 remains unchanged during the reflow process. Through the cooperation of the positioning jig 100, the base plate 120, and the reflow tray 130, the DBC 110 to be packaged is limited during the reflow process.

[0044] In addition, a positioning protrusion 103 protruding toward the DBC to be packaged is provided on the peripheral wall of the accommodating cavity 105 , and the DBC 110 to be packaged is positioned in the accommodating cavity 105 through the positioning boss 104 .

[0045] The front end of the positioning protrusion 103, that is, the end facing the DBC 110 to be packaged, forms a receiving cavity 105. The DBC 110 to be packaged is placed in the receiving cavity 105, which saves the material of the positioning fixture 100 and meets the positioning requirements. Figure 1 、 Figure 7 As shown, a plurality of positioning protrusions 103 are provided on the inner periphery of the positioning jig 100. The front end of the positioning protrusion 103 is a planar structure that cooperates with the outer wall of the DBC 110 to be packaged. For example, it can be in the shape of an arc. The arc protrudes toward the outer wall of the DBC to be packaged and abuts against the outer wall of the DBC to be packaged, so that the front end of the positioning protrusion 103 cooperates with and presses against the outer edge of the DBC to be packaged, thereby achieving a tight positioning of the DBC 110 to be packaged in the accommodating cavity 105.

[0046] When the packaging positioning device of the present application is used:

[0047] First, pre-brush solder paste on the corresponding position on the upper surface of the base plate 120;

[0048] Then, the bottom plate 120 is placed in the positioning groove 132 of the reflow tray 130 to position the bottom plate 120;

[0049] The positioning jig 100 is then placed on the base plate 120, with the side of the positioning jig 100 provided with the boss 104 facing the base plate 120 and in contact with the base plate 120. The boss 104 forms a point contact between the positioning jig 100 and the base plate 120. The positioning jig 100 is also positioned by the positioning pins 102 and the positioning holes 131 on the reflow tray 130, which can also reduce the contact area between the positioning jig 100 and the base plate 120, so as to facilitate the separation of the positioning jig 100 and the base plate 120 after exiting the reflow furnace.

[0050] After the positioning jig 100 is placed on the base plate 120 , the DBC to be packaged 110 is placed in the receiving cavity 105 of the positioning jig 100 , and the DBC to be packaged 110 is positioned by the positioning protrusions 103 in the receiving cavity 105 ;

[0051] Finally, the above components are placed together in a reflow oven. After passing through the reflow oven, the solder paste welds the DBC 110 to be packaged and the base plate 120 into a whole as a product. Through the above arrangement, the base plate 120 can be easily separated from the positioning fixture 100 after reflow, thereby solving the problems existing in the prior art.

[0052] The above description is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A packaging positioning device, characterized in that: include: A reflow tray and a base plate arranged in the reflow tray, a positioning fixture is arranged on the base plate, a receiving cavity is formed on the positioning fixture, and the receiving cavity is used to place the DBC to be packaged, and point contact is formed between the positioning fixture and the base plate.

2. The packaging positioning device according to claim 1, characterized in that: The positioning fixture forms a plurality of protruding bosses on one side facing the bottom plate, and the bottom plate is in contact with and cooperates with the plurality of bosses.

3. The packaging positioning device according to claim 2, characterized in that: The heights of the multiple bosses are different. The height of the boss located in the middle of the positioning jig is greater than the height of the boss located on the side of the positioning jig, so as to form a curved contact surface with a high middle and low side at one end of the multiple bosses facing the base plate. The base plate contacts the positioning jig through the curved contact surface, and the curvature of the base plate is adapted to the curvature of the formed curved contact surface.

4. The packaging positioning device according to claim 1, characterized in that: The reflow tray is provided with a positioning groove, the bottom plate is accommodated in the positioning groove, and the bottom plate is loosely matched with the positioning groove.

5. The packaging positioning device according to any one of claims 1 to 4, characterized in that: The positioning fixture is positioned and connected to the reflow tray.

6. The packaging positioning device according to claim 5, characterized in that: The positioning fixture is provided with a positioning pin, and the reflow tray is provided with a positioning hole adapted to the positioning pin.

7. The packaging positioning device according to claim 6, characterized in that: The diameter of the positioning pin is 10 μm to 50 μm smaller than the diameter of the positioning hole.

8. The packaging positioning device according to any one of claims 1 to 4, characterized in that: A positioning protrusion protruding toward the DBC to be packaged is provided on the peripheral wall of the accommodating cavity, and the DBC to be packaged is positioned in the accommodating cavity by the positioning protrusion.

9. The packaging positioning device according to claim 8, characterized in that: The end of the positioning protrusion facing the DBC to be packaged is a planar structure that matches the outer wall of the DBC to be packaged.

10. The packaging positioning device according to claim 8, characterized in that: The end of the positioning protrusion facing the DBC to be packaged is in an arc shape, and the arc protrudes toward the outer wall of the DBC to be packaged and abuts against the outer wall of the DBC to be packaged.

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