Chip transfer platform and die bonding equipment

Abstract

The utility model relates to the technical field of die bonders, in particular to a chip transfer platform and die bonder, comprising an adsorption cap used for adsorbing a to-be-transferred chip, the adsorption cap is rotatably installed on a transfer upper seat and the rotation axis is vertical, and a rotation adjusting unit used for driving the adsorption cap. The upper transfer base is arranged on the first transfer translation unit, the first transfer translation unit drives the upper transfer base to translate in the first direction, the first transfer translation unit is installed on the second transfer translation unit, and the second transfer translation unit drives the first transfer translation unit to translate in the second direction. The first direction and the second direction are horizontal and perpendicular to each other, the angle of the chip is accurately adjusted by rotating the adjusting unit, and the position of the chip in the water surface can be accurately adjusted by the first transfer translation unit and the second transfer translation unit, so that secondary positioning of the chip is implemented, and accurate installation of the chip and a printed circuit board can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a chip transfer platform and crystal bonding equipment. Background Art

[0002] Die bonding, also known as chip mounting, uses colloid to bond the chip to the designated area of ​​the bracket to form a thermal or electrical path, providing conditions for subsequent wire bonding. It is mainly used for lead cabinet pressure plates of various gold wire ultrasonic welding equipment and various suction nozzles, ejectors, dispensing heads, porcelain nozzles, through needles, motors, carbon brushes, encoders, transmission belts and various spare parts and instruments of automated robots for various chip mounting equipment.

[0003] In the die bonding equipment, when installing the chip and the printed circuit board, the die bonding adsorption equipment is used to adsorb the chip on the blue film and transfer it to the upper position of the printed circuit board, so as to fit the chip with the glue coating position on the printed circuit board to achieve the installation of the chip and the printed circuit board. During the actual die bonding operation, when the die bonding adsorption equipment adsorbs, picks up and transfers the chip, in order to ensure the accurate installation of the chip and the printed circuit board, the chip needs to be positioned and adjusted. The positioning adjustment mechanism in the existing die bonding equipment has the problems of complex structure and poor precision. Utility Model Content

[0004] The purpose of this utility model is to provide a chip transfer platform and a die bonding device, aiming to solve the above-mentioned technical problems of the complex structure and poor precision of the chip adjustment mechanism, and to perform secondary positioning of the chip, rotate and adjust the chip angle, and improve the precision of the die bonding.

[0005] The following technical solutions are used to solve the technical problems in this utility model:

[0006] Chip transfer platform, including:

[0007] Adsorption cap, used for adsorbing the chip to be transferred;

[0008] A transfer upper seat, wherein the adsorption cap is rotatably mounted on the transfer upper seat with the rotation axis vertical;

[0009] A rotation adjustment unit is used to drive the adsorption cap;

[0010] a first transfer translation unit, the transfer upper seat being arranged on the first transfer translation unit, and the first transfer translation unit driving the transfer upper seat to translate along a first direction;

[0011] a second transfer translation unit, wherein the first transfer translation unit is mounted on the second transfer translation unit, and the second transfer translation unit drives the transfer upper seat to translate along a second direction;

[0012] The first direction and the second direction are horizontal and perpendicular to each other.

[0013] The utility model also has the following technical features:

[0014] In one embodiment of the present invention, it further includes a transfer middle seat and a transfer lower seat, the transfer upper seat and the transfer middle seat form a sliding fit along the first direction, and the transfer middle seat and the transfer lower seat form a sliding fit along the second direction.

[0015] In one embodiment of the present invention, a first measuring unit is provided on the first transfer translation unit, and the first measuring unit is used to measure the sliding displacement of the transfer upper seat located on the transfer middle seat along the first direction. A second measuring unit is provided on the second transfer translation unit, and the second measuring unit is used to measure the sliding displacement of the transfer middle seat located on the transfer lower seat along the second direction.

[0016] In one embodiment of the present invention, the transfer upper seat and the transfer middle seat are slidably fitted together via a first track, the first track is arranged along the first direction, and the transfer middle seat and the transfer lower seat are slidably fitted together via a second track, the second track is arranged along the second direction.

[0017] In one embodiment of the present invention, the first transfer translation unit includes a first motor mover and a first motor stator. The first motor mover is located inside the first motor stator and reciprocates along the first direction. The first motor mover and the first motor stator are respectively disposed on the transfer upper seat and the transfer middle seat.

[0018] The second transfer translation unit includes a second motor mover and a second motor stator. The second motor mover is located in the second motor stator and moves back and forth along the second direction. The second motor mover and the second motor stator are respectively arranged on the transfer middle seat and the transfer lower seat.

[0019] In one embodiment of the present invention, a first mounting block is detachably provided on one side of the transfer upper seat, the first motor mover is fixed to the first mounting block, and the first motor stator is detachably provided on one side of the transfer middle seat.

[0020] In one embodiment of the present invention, a second mounting block is detachably provided on one side of the transfer middle seat, the second motor mover is fixed to the second mounting block, and the second motor stator is detachably provided on one side of the transfer lower seat.

[0021] In one embodiment of the present invention, the first measuring unit includes a first displacement sensor provided on the transfer upper seat, and the first displacement sensor is used to measure the sliding displacement of the transfer upper seat on the transfer middle seat along the first direction.

[0022] In one embodiment of the present invention, the second measuring unit includes a second displacement sensor provided on the transfer middle seat, and the second displacement sensor is used to measure the sliding displacement of the transfer middle seat along the second direction on the transfer lower seat.

[0023] In one embodiment of the present invention, the rotation adjustment unit includes a drive motor arranged on the transfer upper seat, the drive motor is arranged vertically and the drive shaft is provided with an air guide channel, and the adsorption cap is installed at the drive shaft position of the drive motor and is connected to the air guide channel.

[0024] Another object of the present invention is to provide a die bonding device, which includes the above-mentioned chip transfer platform.

[0025] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the transfer platform is used in the solid crystal equipment, when the solid crystal adsorption equipment adsorbs the chip on the blue film and transfers it to the chip transfer platform position, the adsorption cap is used to implement adsorption of the transfer chip, and then the angle of the chip is precisely adjusted by the rotation adjustment unit, and then the position of the chip in the water surface is precisely adjusted by the first transfer translation unit and the second transfer translation unit to implement secondary positioning of the chip, so that the installation position and angle of the chip are in the set position, and then the solid crystal adsorption equipment is used to implement the chip on the transfer platform and the printed circuit board. The glue coating position is fitted, thereby ensuring the precise installation of the chip and the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a chip transfer platform in one embodiment of the present invention;

[0027] Figure 2 This is an exploded view of a chip transfer platform in one embodiment of the present invention;

[0028] Figure 3 and Figure 4 Schematic diagrams of two perspectives of a chip transfer platform in one embodiment of the present invention;

[0029] Description of Figure Numbers:

[0030] 10. Adsorption cap;

[0031] 20. Transfer seat;

[0032] 30, transfer middle seat;

[0033] 40. Get off during transfer;

[0034] 50, first track;

[0035] 60, second track;

[0036] 71. First motor mover; 72. First motor stator; 73. First mounting block;

[0037] 81. Second motor mover; 82. Second motor stator; 83. Second mounting block;

[0038] 90. Drive motor;

[0039] 101. First photoelectric film; 102. First reading head; 103. First origin photoelectric sensor; 104. Second photoelectric film; 105. Second reading head; 106. Second origin photoelectric sensor; 107. First grating scale; 108. Second grating scale. DETAILED DESCRIPTION

[0040] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0041] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0042] It should be noted that the die bonding process is a key step in the semiconductor packaging process, and its main purpose is to accurately place the chip in the designated area of ​​the bracket and bond it through colloid to form a thermal path or an electrical path, providing conditions for subsequent wire bonding. This process is crucial to the fields of LED packaging, chip semiconductor packaging, and camera precision mounting. Taking chip semiconductor packaging as an example, after the existing wafer is produced through the previous cutting process, there will be chips arranged in an array on the blue film. The chip on the blue film can be directly adsorbed by the die bonding adsorption component and then transported to the printed circuit board station. The chip on the die bonding adsorption component can be placed on the glue coating position of the printed circuit board to achieve bonding and fixation of the chip and the printed circuit board. During the actual die bonding operation, when the die bonding adsorption equipment adsorbs, picks up and transports the chip, in order to ensure the accurate installation of the chip and the printed circuit board, the chip needs to be positioned and adjusted. The positioning adjustment mechanism in the existing die bonding equipment has the problems of complex structure and poor precision. In this regard, the utility model proposes a chip The transfer platform includes: an adsorption cap 10 for adsorbing the chip to be transferred; a transfer upper seat 20, on which the adsorption cap 10 is rotatably mounted and the rotation axis is vertical; a rotation adjustment unit for driving the adsorption cap 10; a first transfer translation unit, on which the transfer upper seat 20 is arranged, and the first transfer translation unit drives the transfer upper seat 20 in translation along a first direction; a second transfer translation unit, on which the first transfer translation unit is mounted, and the second transfer translation unit drives the transfer upper seat in translation along a second direction; the first direction and the second direction are horizontal and perpendicular to each other.

[0043] For the convenience of explaining the transfer platform, please refer to Figure 1 As shown, the first direction is defined as the Y-axis direction in the figure, and the second direction is defined as the X-axis direction in the figure. After the solid crystal adsorption component transfers the chip out, the chip is released onto the adsorption cap 10, and the adsorption cap 10 is driven to rotate by the rotation adjustment unit, so that the angle of the chip can be preliminarily adjusted, and then the position of the chip in the first direction and the second direction is adjusted by the first transfer translation unit and the second transfer translation unit, thereby achieving secondary adjustment and positioning of the chip angle and position, and then the solid crystal adsorption component can be started again to pick up the chip on the adsorption cap 10 again, and transfer it to the printed circuit board position, so as to achieve precise installation of the chip and the printed circuit board.

[0044] In one embodiment, in order to enable the chip to be adjusted in the horizontal plane position, that is, the adjustment in the first direction and the second direction mentioned above, it also includes a transfer middle seat 30 and a transfer lower seat 40, and the transfer upper seat 20 and the transfer middle seat 30 form a sliding fit along the first direction, and the transfer middle seat 30 and the transfer lower seat 40 form a sliding fit along the second direction.

[0045] In one embodiment, in order to ensure that the chip is precisely adjusted on the water surface, a first measuring unit is provided on the first transfer translation unit, and the first measuring unit is used to measure the sliding displacement of the transfer upper seat 20 located on the transfer middle seat 30 along the first direction, and a second measuring unit is provided on the second transfer translation unit, and the second measuring unit is used to measure the sliding displacement of the transfer middle seat 30 located on the transfer lower seat 40 along the second direction.

[0046] In a specific embodiment, the sliding displacement of the transfer upper seat 20 located on the transfer middle seat 30 along the first direction can be measured by the first measuring unit and fed back to the control unit of the crystal bonding equipment. The sliding displacement of the transfer middle seat 30 located on the transfer lower seat 40 along the second direction can be measured by the second measuring unit and fed back to the control unit of the crystal bonding equipment. The position of the chip is obtained according to the displacement, and the start and stop of the entire first transfer translation unit and the second transfer translation unit are controlled to adjust the position of the chip located on the adsorption cap 10 in the plane to a set position.

[0047] In one embodiment, the transfer upper seat 20 and the transfer middle seat 30 are slidably fitted together via a first track 50, and the first track 50 is arranged along the first direction; the transfer middle seat 30 and the transfer lower seat 40 are slidably fitted together via a second track 60, and the second track 60 is arranged along the second direction.

[0048] In a specific embodiment, the first rail 50 and the second rail 60 can be linear guide rods or linear guide grooves. The first rail 50 can be set on the transfer upper seat 20, and the transfer middle seat 30 and the first rail 50 form a sliding fit. The first rail 50 can be set on the transfer middle seat 30, and the transfer upper seat 20 and the first rail 50 form a sliding fit. The second rail 60 can be set on the transfer middle seat 30, and the transfer lower seat 40 and the second rail 60 form a sliding fit. The second rail 60 can be set on the transfer lower seat 40, and the transfer middle seat 30 and the second rail 60 form a sliding fit.

[0049] In one embodiment, the first transfer translation unit includes a first motor mover 71 and a first motor stator 72. The first motor mover 71 is located in the first motor stator 72 and moves back and forth along the first direction. The first motor mover 71 and the first motor stator 72 are respectively disposed on the transfer upper seat 20 and the transfer middle seat 30.

[0050] In a specific embodiment, a first mounting block 73 is detachably provided on one side of the transfer upper seat 20 , the first motor mover 71 is fixed to the first mounting block 73 , and the first motor stator 72 is detachably provided on one side of the transfer middle seat 30 .

[0051] In another embodiment, the first motor mover 71 can be fixed on the transfer upper base 30 through a connecting block, and the first motor stator 72 is fixed on one side of the transfer upper base 20 .

[0052] In one embodiment, the first transfer translation unit composed of the first motor stator 72 and the first motor mover 71 can be a voice coil motor. The voice coil motor has the advantages of high precision, high response speed, high reliability, etc., and is suitable for application in the die bonding equipment.

[0053] In a specific embodiment, the second transfer translation unit includes a second motor mover 81 and a second motor stator 82. The second motor mover 81 is located in the second motor stator 82 and moves back and forth along the second direction. The second motor mover 81 and the second motor stator 82 are respectively disposed on the transfer middle seat 30 and the transfer lower seat 40.

[0054] In a specific embodiment, a second mounting block 83 is detachably provided on one side of the transfer middle seat 30 , the second motor mover 81 is fixed to the second mounting block 83 , and the second motor stator 82 is detachably provided on one side of the transfer lower seat 40 .

[0055] In another embodiment, the second motor mover 81 can be fixed on the transfer lower seat 40 through a connecting block, and the second motor stator 82 is fixed on one side of the transfer middle seat 30 .

[0056] In one embodiment, the second transfer translation unit formed by the second motor mover 81 and the second motor stator 82 can be a voice coil motor.

[0057] In a specific embodiment, the first measuring unit includes a first displacement sensor provided on the transfer upper seat 20 , and the first displacement sensor is used to measure the sliding displacement of the transfer upper seat 20 located on the transfer middle seat 30 along the first direction.

[0058] Specifically, the first displacement sensor includes a first reader 102 and a first grating scale 107. The first photoelectric sheet 101 is installed on the transfer upper seat 20. The transfer upper seat 20 is driven to slide in the first direction by the first motor mover 71. The first reader 102 reads the first grating scale 107 and feeds back the signal, so as to adjust the displacement of the transfer platform in the first direction. Specifically, the origin of the first direction is composed of the first origin photoelectric sensor 103 and the first photoelectric sheet 101.

[0059] Similarly, the second measuring unit includes a second displacement sensor provided on the transfer middle seat 30 , and the second displacement sensor is used to measure the sliding displacement of the transfer middle seat 30 along the second direction on the transfer lower seat 40 .

[0060] Specifically, the second displacement sensor includes a second reader 105 and a second grating scale 108. The second photoelectric film 104 is installed on the transfer seat 30 through the origin seat. The second motor mover 81 is installed on the transfer base 50. The transfer seat 40 is driven to slide in the second direction by the second motor mover 81. The second reader 105 reads the second grating scale 108 and feeds back the signal. The displacement of the transfer platform in the second direction can be adjusted. The origin of the second direction is composed of the second origin photoelectric sensor 106 and the second photoelectric film 104.

[0061] Specifically, the rotation adjustment unit includes a drive motor 90 arranged on the transfer upper seat 20, the drive motor 90 is arranged vertically and the drive shaft is provided with an air guide channel, and the adsorption cap 10 is installed at the drive shaft position of the drive motor 90 and is connected to the air guide channel.

[0062] The adsorption cap 10 and the transfer upper seat 20 form a closed air guide cavity. When the solenoid valve is working, the adsorption cap 10 forms a negative pressure environment to adsorb the chip on the chip placement position of the adsorption cap 10.

[0063] In a specific embodiment, the rotating motor 80 should be a direct drive motor (DD motor), which has high accuracy in adjusting the angle of the adsorption cap 10, and an air guide channel is set on the driving shaft of the rotating motor 80, thereby being able to adsorb the chip.

[0064] The present invention also proposes a solid crystal device, which includes a chip transfer platform. The solid crystal device passes through the chip transfer platform. When the chip and the printed circuit board are installed, the solid crystal adsorption device adsorbs and transfers the chip on the blue film to the chip transfer platform position, and uses the adsorption cap 10 to adsorb the transfer chip, and then the angle of the chip is precisely adjusted by the rotation adjustment unit, and then the position of the chip in the water surface is precisely adjusted by the first transfer translation unit and the second transfer translation unit to implement secondary positioning of the chip, so that the installation position and angle of the chip are at the set position, and then the solid crystal adsorption device is used to implement the gluing position of the chip on the transfer platform and the printed circuit board, thereby ensuring the precise installation of the chip and the printed circuit board. The specific structure of the chip transfer platform refers to the above embodiment. Since this solid crystal device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0065] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0066] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. Chip transfer platform, characterized by: include: Adsorption cap, used for adsorbing the chip to be transferred; A transfer upper seat, wherein the adsorption cap is rotatably mounted on the transfer upper seat with the rotation axis vertical; A rotation adjustment unit is used to drive the adsorption cap; a first transfer translation unit, the transfer upper seat being arranged on the first transfer translation unit, and the first transfer translation unit driving the transfer upper seat to translate along a first direction; a second transfer translation unit, wherein the first transfer translation unit is mounted on the second transfer translation unit, and the second transfer translation unit drives the transfer upper seat to translate along a second direction; The first direction and the second direction are horizontal and perpendicular to each other.

2. The chip transfer platform according to claim 1, characterized in that: It also includes a transfer middle seat and a transfer lower seat. The transfer upper seat and the transfer middle seat form a sliding fit along the first direction, and the transfer middle seat and the transfer lower seat form a sliding fit along the second direction.

3. The chip transfer platform according to claim 2, characterized in that: A first measuring unit is provided on the first transfer translation unit, and the first measuring unit is used to measure the sliding displacement of the transfer upper seat on the transfer middle seat along the first direction. A second measuring unit is provided on the second transfer translation unit, and the second measuring unit is used to measure the sliding displacement of the transfer middle seat on the transfer lower seat along the second direction.

4. The chip transfer platform according to claim 2, characterized in that: The transfer upper seat and the transfer middle seat form a sliding fit through a first track, and the first track is arranged along the first direction. The transfer middle seat and the transfer lower seat form a sliding fit through a second track, and the second track is arranged along the second direction.

5. The chip transfer platform according to claim 2, characterized in that: The first transfer translation unit includes a first motor mover and a first motor stator. The first motor mover is located in the first motor stator and reciprocates along the first direction. The first motor mover and the first motor stator are respectively disposed on the transfer upper seat and the transfer middle seat. The second transfer translation unit includes a second motor mover and a second motor stator. The second motor mover is located in the second motor stator and moves back and forth along the second direction. The second motor mover and the second motor stator are respectively arranged on the transfer middle seat and the transfer lower seat.

6. The chip transfer platform according to claim 5, characterized in that: A first mounting block is detachably provided on one side of the transfer upper seat, the first motor mover is fixed to the first mounting block, and the first motor stator is detachably provided on one side of the transfer middle seat.

7. The chip transfer platform according to claim 5, characterized in that: A second mounting block is detachably provided on one side of the transfer middle seat, the second motor mover is fixed to the second mounting block, and the second motor stator is detachably provided on one side of the transfer lower seat.

8. The chip transfer platform according to claim 3, characterized in that: The first measuring unit includes a first displacement sensor arranged on the transfer upper seat, and the first displacement sensor is used to measure the sliding displacement of the transfer upper seat along the first direction when located on the transfer middle seat; the second measuring unit includes a second displacement sensor arranged on the transfer middle seat, and the second displacement sensor is used to measure the sliding displacement of the transfer middle seat along the second direction when located on the transfer lower seat.

9. The chip transfer platform according to claim 1, characterized in that: The rotation adjustment unit includes a drive motor arranged on the transfer upper seat, the drive motor is arranged vertically and the drive shaft is provided with an air guide channel, and the adsorption cap is installed at the drive shaft position of the drive motor and is connected to the air guide channel.

10. Die bonding equipment, characterized by: The die bonding equipment includes the chip transfer platform according to any one of claims 1 to 9.

Images