Power module with novel heat dissipation structure

Abstract

The utility model belongs to the field of semiconductor power module heat radiation, and provides a power module with a novel heat radiation structure, which mainly comprises a heat radiator provided with a cooling cavity, the cooling cavity is internally provided with a first partition plate, and the first partition plate divides the cooling cavity into a first cooling layer and a second cooling layer which are distributed from top to bottom; the first baffles are arranged on the first partition plates, and the first cooling layer is divided into a plurality of cooling areas by the first baffles; the cooling holes are formed in the first partition plate, and the multiple cooling holes communicate with the first cooling layer and the second cooling layer; the cooling substance inlet and the cooling substance outlet are both formed in the side wall of the radiator, and the cooling substance inlet is communicated with the second cooling layer; and the cooling substance outlet is communicated with the first cooling layer. The cooling cavities are arranged in a layered mode, the cooling holes are formed in the first partition plate, synchronous cooling of the chips at the positions of the cooling areas is achieved, the temperature difference between the cooling areas is reduced, and the heat dissipation capacity and the heat reliability of the radiator are improved.

Description

Technical Field

[0001] The utility model belongs to the field of heat dissipation of semiconductor power modules, in particular to a power module with a novel heat dissipation structure. Background Art

[0002] With the rapid development of electric vehicles in recent years, high power and long driving range have become the current focus, and high voltage and high current have become the new trend in the development of power modules, which has put forward more stringent requirements on the thermal reliability of power modules.

[0003] During power module operation, the chip generates a large amount of heat, which is ultimately transferred to the heat sink. If this heat is not dissipated promptly and effectively from the heat sink, the device will overheat, affecting its performance and even potentially damaging it. Therefore, the heat dissipation performance of the heat sink is extremely important to the thermal reliability of the power module.

[0004] In the existing technology, the heat dissipation structure is mainly set at the bottom of the copper-clad ceramic substrate, and the heat generated by the chip is removed by circulating coolant in a through cooling channel. When the power module adopts a multi-chip design to meet multi-functional requirements, if the traditional heat dissipation channel structure is used, the temperature near the water inlet is lower, and the temperature away from the water inlet is higher, and balanced heat dissipation cannot be achieved. It is easy for the chip temperature away from the water outlet to not be effectively reduced, resulting in excessively high temperatures at the chip away from the water outlet, reducing the heat dissipation capacity and reliability of the heat dissipation system, or causing the chip's capacity to be unable to be fully utilized. As high voltage and high current become the new trend in the development of power modules, higher requirements are placed on the heat dissipation capacity and reliability of power modules. Therefore, the heat dissipation capacity and reliability of traditional power modules can no longer meet the new requirements. Utility Model Content

[0005] The utility model provides a power module with a novel heat dissipation structure, which solves the problem that the traditional heat dissipation structure cannot achieve balanced heat dissipation in the above background.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A power module with a novel heat dissipation structure, characterized by comprising:

[0008] A copper-clad ceramic substrate, on which a plurality of chips are provided, wherein the chips are arranged on a first surface above the copper-clad ceramic substrate;

[0009] A radiator comprising a heat sink and a cooling chamber, wherein the heat sink is disposed on the second surface below the copper-clad ceramic substrate, and the cooling chamber covers the heat dissipation surface of the heat sink, wherein a first partition is disposed in the cooling chamber, the first partition dividing the cooling chamber into a first cooling layer and a second cooling layer, and the first cooling layer is disposed above the second cooling layer;

[0010] a plurality of first baffles, disposed on the first partition, the plurality of first baffles dividing the first cooling layer into a plurality of cooling areas, the positions of the plurality of cooling areas corresponding to the positions of the plurality of chips;

[0011] Cooling holes are provided on the first partition plate, and each cooling area is provided with at least one cooling hole; a plurality of the cooling holes connect the first cooling layer and the second cooling layer;

[0012] A cooling material inlet and a cooling material outlet are both arranged on the side wall of the cooling cavity. The cooling material inlet is communicated with the second cooling layer; and the cooling material outlet is communicated with the first cooling layer.

[0013] In some embodiments, multiple cooling areas of the first cooling layer are each provided with a plurality of heat dissipation columns, preset gaps are provided between the multiple heat dissipation columns, and one end of the multiple heat dissipation columns is connected to the inner wall of the first cooling layer close to the copper-clad ceramic substrate.

[0014] In some embodiments, a plurality of first baffles are vertically arranged on the first partition plate, and one end of the first partition plate is connected to the inner wall of the first cooling layer on a side close to the copper-clad ceramic substrate.

[0015] In some embodiments, a preset distance is set between the first end and / or the second end of the plurality of first baffles and the inner wall of the first cooling layer to form a guide channel.

[0016] In some embodiments, a second baffle is provided at the first end and / or the second end of the first baffle, the second baffle separates the cooling area from the guide channel, and a plurality of second guide holes are provided on the second baffle, the plurality of guide holes connect the first cooling layer and the guide channel.

[0017] In some embodiments, sealing rings are provided at both the cooling material inlet and the cooling material outlet.

[0018] In some embodiments, at least one cooling hole in each cooling zone corresponds to a position of the chip.

[0019] Compared with the prior art, the beneficial effects brought by the present invention are:

[0020] The present application sets a first partition in the cooling cavity, and the first partition sets the cooling cavity into a first cooling layer and a second cooling layer of an upper and lower structure. A plurality of first baffles are set on the first partition to form a plurality of cooling areas, so that one or more chips correspond to a cooling area, and at least one cooling hole is set on the first partition corresponding to each cooling area. The shape, size, position and shape of the cooling hole are not restricted. The cooling hole connects the first cooling layer and the second cooling layer. The cooling material can enter the first cooling layer at the same time as the second cooling layer through the plurality of cooling holes to synchronously cool the chip, so that the temperature of the coolant contacted by one or more chips is the same, thereby achieving the purpose of balanced cooling and thus achieving better heat dissipation effect.

[0021] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a partial cross-sectional view of the internal structure of a power module with a novel heat dissipation structure according to the present invention;

[0023] Figure 2 This is a top view of a power module with a novel heat dissipation structure according to the present invention;

[0024] Figure 3 This is a schematic diagram of the internal structure of the first cooling layer of a power module with a novel heat dissipation structure according to the present invention;

[0025] Figure 4 This is a partial cross-sectional view of a power module with a novel heat dissipation structure according to the present invention, in which a first baffle is provided on the first cooling layer;

[0026] Figure 5 for Figure 4 Schematic diagram of the second form structure of the middle cooling hole;

[0027] Figure 6 for Figure 4 Schematic diagram of the third form structure of the middle cooling hole.

[0028] Figure 7 This is a schematic diagram of the position distribution of heat dissipation columns of a power module with a novel heat dissipation structure according to the present invention. DETAILED DESCRIPTION

[0029] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0030] like Figure 1 and Figure 2 As shown, a power module with a novel heat dissipation structure provided by the present invention mainly includes a copper-clad ceramic substrate 2, on which multiple groups of chips 1 are arranged at intervals. The multiple groups of chips 1 are arranged on the first surface above the copper-clad ceramic substrate 2. In this embodiment, the upper surface is Figure 1 The upper side of the direction shown; a heat sink is arranged on the second surface below the copper-clad ceramic substrate 2 and is arranged opposite to the chip 1. The heat sink is mainly formed by a heat sink 3 and a cooling cavity. The cooling cavity is a cavity formed by several baffles. The heat sink 3 is arranged on the second surface below the copper-clad ceramic substrate 2, and the cooling cavity covers the heat dissipation surface of the heat sink 3. In this embodiment, the heat dissipation surface is the side of the heat sink 3 away from the chip 1, wherein a first partition 8 is arranged in the cooling cavity, dividing the cooling cavity into a first cooling layer 21 and a second cooling layer 22 distributed up and down, and the first cooling layer 21 is arranged above the second cooling layer 22; in this embodiment, the heat sink 3 is one of the side plates of the cooling cavity. Optionally, the cooling cavity can also be a separate complete cavity, which is fixedly connected to the heat dissipation surface of the heat sink 3.

[0031] A plurality of first baffles 10 are provided within the first cooling layer 21, dividing the first cooling layer 21 into a plurality of cooling zones. The locations of the plurality of cooling zones correspond one-to-one with the locations of the plurality of groups of chips 1. In this embodiment, the first baffles 10 are provided on the first partition plate 8 and integrally connected to the heat sink 3 to achieve a better separation effect and prevent convection of coolant between adjacent cooling zones, which would reduce cooling efficiency. Alternatively, the first baffles 10 may be provided only on the first partition plate 8.

[0032] The cooling holes 9 are provided on the first partition 8, wherein at least one cooling hole 9 is provided on the first partition 89 corresponding to each cooling area, so that the first cooling layer 21 and the second cooling layer 22 are connected. In this embodiment, the first cooling layer 21 and the second cooling layer 22 are connected only through the cooling holes 9, so that the coolant reaches each cooling area synchronously, and the chips 1 at corresponding positions of multiple cooling areas are cooled synchronously. In this embodiment, Figure 4As shown, the number of cooling holes 9 is 1. It should be noted that when there is only one cooling hole 9, in order to improve the cooling efficiency, the cooling hole 9 corresponds to the position of the chip 1, that is, the cooling hole 9 is located directly below the chip 1. Figure 5 and Figure 6 The number of cooling holes 9 can be 2, 3 or 4, etc. It can be known that the number and shape of the cooling holes 9 are not limited by the present invention.

[0033] A cooling material inlet 5 is provided on the side wall of the cooling cavity and communicates with the second heat dissipation layer 22 for the inflow of the cooling material. A cooling material outlet 6 is provided on the side wall of the cooling cavity and communicates with the first heat dissipation layer 21 for the outflow of the cooling material after absorbing heat, thereby promptly removing heat transferred from the chip 1 to the copper-clad ceramic substrate 2. In this embodiment, the cooling material is a coolant or relatively low-temperature liquid water.

[0034] In one embodiment, to improve heat dissipation efficiency, as Figure 7 As shown, a plurality of heat dissipation columns 7 are provided in the first cooling layer 21, and preset gaps are provided between the plurality of heat dissipation columns 7 to facilitate the flow of the cooling material. Specifically, one end of the plurality of heat dissipation columns 7 is provided on the heat dissipation surface of the heat dissipation plate 3 on the side of the first cooling layer 21 close to the copper-clad ceramic substrate 2, that is, Figure 1 In the heat sink 3 shown, the heat generated by the chip 1 is transferred to the copper-clad ceramic substrate 2, and the copper-clad ceramic substrate 2 then transfers the heat to the heat sink 3, and the heat sink 3 then transfers the heat to the heat dissipation column 7. By providing the heat dissipation column 7 to increase the contact area between the heat sink 3 and the coolant, the cooling efficiency can be effectively improved. In this embodiment, the heat dissipation column 7 is a cylindrical structure. Optionally, the heat dissipation column 7 can also be a prismatic structure, such as a triangular prism, a square prism, or an elliptical cylindrical structure. In this embodiment, a distance is provided between the heat dissipation column 7 and the first partition 8. Optionally, one end of the heat dissipation column 7 can also be fixedly connected to the first partition 8.

[0035] In one embodiment, since the cooling material needs to flow, in the aforementioned embodiment, multiple first baffles 10 are provided to separate two adjacent cooling areas to prevent the cooling liquid from absorbing heat and causing convection to reduce the heat dissipation efficiency. In this embodiment, in order to facilitate the outflow of the cooling material after absorbing heat, Figure 3As shown, a preset distance is set between the first and / or second ends of the first baffle 10 and the inner wall of the first cooling layer 21 to form a guide channel 211. The heat-absorbing cooling material is transferred through the guide channel 211 to the cooling material outlet 6 for outflow. Compared with traditional heat dissipation structures, the heat-absorbing cooling material in this embodiment does not pass through adjacent or other cooling areas, preventing convection from reducing heat dissipation efficiency. In this embodiment, both ends of the multiple first baffles 10 are set at a preset distance from the inner wall of the first cooling layer 21, forming two guide channels 211. Optionally, the guide channel 211 can also be set only at the first or second end of the multiple first baffles 10.

[0036] Furthermore, to better direct the cooling material, after absorbing heat, out through the guide channel 211 and prevent it from flowing into other cooling areas, a second baffle 81 is provided at the first and / or second ends of the first baffle 10. The second baffle 81 isolates the cooling area from the guide channel 211. Multiple guide holes 82 are provided on the second baffle 81, corresponding to the positions of the multiple cooling areas. By providing multiple guide holes 82, the multiple cooling areas are connected to the guide channel 211. After absorbing heat, the cooling material in each cooling area enters the guide channel 211 through the corresponding guide hole 82, and then flows to the cooling material outlet 6 for outflow. This further prevents convection of the cooling material absorbing heat from adjacent or multiple cooling areas, further improving cooling efficiency. In this embodiment, the second baffle 81 is provided at both ends of the first baffle 10; alternatively, the second baffle 81 may be provided only at the first or second end of the first baffle 8.

[0037] In one embodiment, in order to prevent liquid leakage at the cooling material inlet 5 and the cooling material outlet 6, a sealing ring 11 is provided at the cooling material inlet 5 and the cooling material outlet 6 to further seal the pipe at the connection between the two.

[0038] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A power module with a novel heat dissipation structure, characterized in that: include: A copper-clad ceramic substrate, on which a plurality of chips are provided, wherein the chips are arranged on a first surface above the copper-clad ceramic substrate; A radiator comprising a heat sink and a cooling chamber, wherein the heat sink is disposed on the second surface below the copper-clad ceramic substrate, and the cooling chamber covers the heat dissipation surface of the heat sink, wherein a first partition is disposed in the cooling chamber, the first partition dividing the cooling chamber into a first cooling layer and a second cooling layer, and the first cooling layer is disposed above the second cooling layer; a plurality of first baffles, disposed on the first partition, the plurality of first baffles dividing the first cooling layer into a plurality of cooling areas, the positions of the plurality of cooling areas corresponding to the positions of the plurality of chips; Cooling holes are provided on the first partition plate, and each cooling area is provided with at least one cooling hole; a plurality of the cooling holes connect the first cooling layer and the second cooling layer; A cooling material inlet and a cooling material outlet are both arranged on the side wall of the cooling cavity. The cooling material inlet is communicated with the second cooling layer; and the cooling material outlet is communicated with the first cooling layer.

2. The power module with a novel heat dissipation structure according to claim 1, characterized in that: A plurality of heat dissipation columns are provided in the plurality of cooling areas of the first cooling layer, preset gaps are provided between the plurality of heat dissipation columns, and one end of the plurality of heat dissipation columns is connected to the inner wall of the first cooling layer on a side close to the copper-clad ceramic substrate.

3. The power module with a novel heat dissipation structure according to claim 1, characterized in that: A plurality of first baffles are vertically arranged on the first partition plate, and one end of the first baffle plate is connected to the upper inner wall of the first cooling layer on a side close to the copper-clad ceramic substrate.

4. The power module with a novel heat dissipation structure according to claim 3, characterized in that: A preset distance is set between the first end and / or the second end of the plurality of first baffles and the inner wall of the first cooling layer to form a guide channel.

5. The power module with a novel heat dissipation structure according to claim 4, characterized in that: A second baffle is provided at the first end and / or the second end of the first baffle, the second baffle separates the cooling area from the guide channel, and a plurality of second guide holes are provided on the second baffle, the plurality of guide holes connect the first cooling layer and the guide channel.

6. The power module with a novel heat dissipation structure according to claim 1, characterized in that: Sealing rings are provided at the cooling material inlet and the cooling material outlet.

7. The power module with a novel heat dissipation structure according to claim 1, characterized in that: At least one cooling hole in each cooling area corresponds to the chip position.

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