Packaging body of high-power bridge rectifier

Abstract

The utility model discloses a packaging body of a high-power bridge rectifier, and relates to the technical field of bridge rectifiers. The packaging frame comprises a chip base island used for bearing a chip and a pin base island which does not bear the chip, and the chip base island and the pin base island extend out of the packaging body to form pins used for external connection; the chip base island is provided with a right-angle structure at a corner close to the pin base island; and the plastic packaging black adhesive is used for packaging the chip in the packaging body in a plastic mode. The device can effectively improve the power of the original bridge rectifier.

Description

Technical Field

[0001] The utility model relates to the technical field of bridge rectifiers, and more particularly to a package of a high-power bridge rectifier. Background Art

[0002] The traditional bridge rectifier products, the design structure of the package and lead frame, the chip size is small, the product power is low, and the heat dissipation of the four internal chips is poor, which cannot meet some of the needs of the existing application market. This is because the design structure of the original product package frame has a small carrying area of ​​​​the four chips 01 (structure such as Figures 1 to 3 As shown, it includes a first solder pad 02, a second solder pad 03, a third solder pad 04, a pin island 05, and a chip 01. Pins 07 remain after chip 01 is packaged. Each of the first, second, and third solder pads 02, 03, and 04 has chamfered corners 06. The inclusion of multiple chamfers 06 reduces pad size, copper usage, and costs. However, the large size of the pin island 05 results in a maximum size of 120 mils for the four chips 01, significantly different from the supporting area of ​​other non-chips. This results in a small supporting area for the chips 01 within the original product, limiting product power. Compared to similar traditional bridge rectifiers, this product suffers from design limitations in chip size and chip-supporting pad layout. This leads to uneven heat dissipation among the four chips 01 during operation, resulting in low product power and excessive manufacturing costs. Further improvements are needed.

[0003] In summary, how to provide a bridge rectifier structure that can improve the power of the original bridge rectifier is a problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a package for a high-power bridge rectifier, which can effectively improve the power of the original bridge rectifier.

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] A package of a high-power bridge rectifier, comprising:

[0007] chip;

[0008] A package frame comprising a chip base island for carrying the chip and a pin base island not carrying the chip, wherein the chip base island and the pin base island extend pins for external connection outside the package body; the chip base island has a right-angle structure at a corner adjacent to the pin base island;

[0009] Plastic encapsulation black glue is used to encapsulate the chip in the package body.

[0010] In one embodiment, the chip base island includes a first pad, a second pad, and a third pad, and the chip is soldered onto the first pad, the second pad, and the third pad.

[0011] In one embodiment, it also includes connecting wires, which are used to connect the chip on the second pad and the first pad, connect the chip on the second pad and the third pad, connect the chip on the first pad and the pin base island, and connect the chip on the third pad and the pin base island, and each of the connecting wires is connected to the lead frame of the packaging frame during the packaging process.

[0012] In one embodiment, the chip has a size of 130 mils to 140 mils.

[0013] In one embodiment, the width of the pin island is greater than or equal to the maximum width of the pin.

[0014] In one embodiment, the plastic sealing black glue is black glue with a thermal conductivity coefficient of 3.0-4.0.

[0015] In one embodiment, the third pad is provided below the first pad, the second pad is provided on one side of the first pad and the third pad, the side of the first pad and the side of the second pad are matched, and the pin base island is provided on the other side of the first pad and the third pad;

[0016] The upper left corner structure, the lower left corner structure and the upper right corner structure of the first pad are all right-angle structures, and the upper left corner structure of the third pad is also a right-angle structure.

[0017] In one embodiment, the upper left corner structure of the second pad is the right-angle structure.

[0018] In one embodiment, the upper right corner structure of the pin island is the right-angle structure.

[0019] In one embodiment, the connecting wires and the chip are connected by soldering with solder paste.

[0020] When using the high-power bridge rectifier package provided by the present invention, the chip island, which supports the chip and generates relatively high heat, can be expanded by configuring the chip island at a right angle at the corner adjacent to the pin island. This increase in chip island space allows for a larger maximum chip size. The specific chip size can be selected by the customer, and the specific space dimensions of the chip island and pin island can be adjusted based on the chip size. Increasing chip size effectively increases product power.

[0021] In summary, the package of the high-power bridge rectifier provided by the present invention can effectively improve the power of the original bridge rectifier. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0023] Figure 1 Schematic diagram of the appearance of a bridge rectifier in the prior art;

[0024] Figure 2 Schematic diagram of the pad of a bridge rectifier in the prior art;

[0025] Figure 3 Schematic diagram of the internal structure of a bridge rectifier in the prior art;

[0026] Figure 4 This is a schematic diagram of the appearance of the package of the high-power bridge rectifier provided by the utility model;

[0027] Figure 5 A schematic diagram of the soldering pads of the package of the high-power bridge rectifier provided by the present invention;

[0028] Figure 6 A schematic diagram of the internal structure of the package of the high-power bridge rectifier provided by the utility model;

[0029] Figure 7 for Figure 6 side view.

[0030] Reference numerals:

[0031] 01-chip; 02-first pad; 03-second pad; 04-third pad; 05-pin island; 06-chamfered structure; 07-pin;

[0032] 1-Chip; 2-Package frame; 21-First pad; 22-Second pad; 23-Third pad; 24-Pin base island; 25-Right-angle structure; 26-Chip base island; 3-Connecting wire; 4-Package; 5-Solder paste; 6-Pin. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] The core of the utility model is to provide a package of a high-power bridge rectifier, which can effectively improve the power of the original bridge rectifier.

[0035] Please refer to Figures 4 to 7 ,in, Figure 4 This is a schematic diagram of the appearance of the package of the high-power bridge rectifier provided by the utility model; Figure 5 A schematic diagram of the soldering pads of the package of the high-power bridge rectifier provided by the present invention; Figure 6 A schematic diagram of the internal structure of the package of the high-power bridge rectifier provided by the utility model; Figure 7 for Figure 6 side view.

[0036] This specific embodiment provides a package of a high-power bridge rectifier, including:

[0037] Chip 1;

[0038] The package frame 2 includes a chip island 26 for carrying the chip 1 and a pin island 24 that does not carry the chip 1. The chip island 26 and the pin island 24 extend pins 6 for external connection outside the package (i.e., the package of the high-power bridge rectifier). The chip island 26 has a right-angle structure 25 at the corner adjacent to the pin island 24.

[0039] The plastic sealing black glue 4 is used to plastic seal the chip 1 in the package body.

[0040] It should be noted that a larger chip island 26 will result in a larger chip 1 area, greater power, and a larger heat dissipation area for chip 1, resulting in better heat dissipation. The right-angle structure 25 provided at the corner of chip island 26 adjacent to pin island 24 increases the area of ​​chip island 26 and leads to increased copper usage. However, this also increases the power and quality of chip 1, contributing to higher chip 1 pricing. The resulting profit far outweighs the increased cost of increased copper usage. Therefore, by optimizing the structure of chip island 26 and increasing its size, the quality of chip 1 can be improved.

[0041] It should also be noted that after the chip 1 is packaged with plastic encapsulation black glue 4, pins 6 will be formed, which are the parts that the user can directly see. These pins 6 are physical connection points after packaging and are used to electrically connect to external devices. Inside the chip 1, the pins 6 are connected to the network inside the chip 1 through a section of connecting wire 3. These connecting wires 3 are connected to the lead frame of the packaging frame 2 during the packaging process, thereby realizing the electrical connection between the chip 1 and the external environment. In other words, the pins 6 are the external connection points of the chip 1 after packaging, and the pads are the structures inside the chip 1 used to support and strengthen welding. The pins 6 and the pads play different roles in the chip 1 packaging process, and together ensure that the chip 1 can stably and reliably be electrically connected to the external environment.

[0042] When using the high-power bridge rectifier package provided by the present invention, the chip island 26, which supports the chip 1 and generates relatively high heat, is configured as a right-angle structure 25 at the corner of the chip island 26 adjacent to the pin island 24. This increases the space available for the chip island 26. With this increased space available for the chip island 26, the maximum size of the chip 1 can be expanded. The specific size of the chip 1 can be selected by the customer, and the specific space available for the chip island 26 and the pin island 24 can be adjusted based on the size of the chip 1. As the size of the chip 1 increases, the product power can be effectively increased.

[0043] In summary, the package of the high-power bridge rectifier provided by the present invention can effectively improve the power of the original bridge rectifier.

[0044] In one embodiment, the chip island 26 includes a first pad 21 , a second pad 22 and a third pad 23 , and the chip 1 is soldered onto each of the first pad 21 , the second pad 22 and the third pad 23 .

[0045] It should be noted that chips 1 are soldered onto the first pad 21, the second pad 22, and the third pad 23. Each chip 1 is a square structure with the same structural dimensions. The chip 1 size of 130 mils-140 mils in this application means that the length of the chip 1 is 130 mils-140 mils. In the field of bridge rectifiers, the maximum chip size is 140 mils. By using the structural optimization solution of this application, the size of the chip 1 can be maximized. The function of each pad is to connect the circuit inside the chip 1 to the external package of the chip 1 to achieve the normal operation of the chip 1 function.

[0046] During the chip 1 packaging process, a bonding wire connects the pad to the package pin 6. The size of the pad is closely related to the bonding wire used, as it needs to be able to withstand the pressure of soldering. Furthermore, pads are divided into pin pads and surface mount pads. Pin pads have solder holes and are primarily used for soldering pin components, while surface mount pads do not have solder holes and are primarily used for soldering surface mount components.

[0047] It should also be noted that the chips 1 can be welded at the upper and lower ends of the second pad 22, so that four chips 1 can be placed through the first pad 21, the second pad 22 and the third pad 23. Figure 2 And the pad schematic of this application Figure 5 As can be seen, by reducing the width of the pin island 24, the supporting area of ​​the first and third pads 21, 23 is expanded to accommodate larger chips 1. This allows the size of all four chips 1 to be increased from 120 mils to 140 mils. If the size of the four chips 1 is 140 mils, the product power can be increased to 30A, a significant improvement compared to existing products.

[0048] In one embodiment, a connecting wire 3 is also included, which is used to connect the chip 1 on the second pad 22 and the first pad 21, connect the chip 1 on the second pad 22 and the third pad 23, connect the chip 1 on the first pad 21 and the pin base island 24, and connect the chip 1 on the third pad 23 and the pin base island 24, and each connecting wire 3 is connected to the lead frame of the packaging frame 2 during the packaging process.

[0049] In one embodiment, the size of chip 1 is 130-140 mils. That is, by increasing the space between one or more of the first pad 21, the second pad 22, and the third pad 23, the original maximum size of chip 1 can be expanded from 120 mils to 130-140 mils. The specific size of chip 1 can be selected by the customer, and the specific spatial dimensions of the first pad 21, the second pad 22, the third pad 23, and the lead island 24 can be allocated and adjusted based on the size of chip 1.

[0050] In one embodiment, the width of the pin island 24 is greater than or equal to the maximum width of the pin 6 to avoid affecting the connection between the pin island 24 and the pin 6 .

[0051] In one embodiment, the plastic encapsulation black glue 4 is a black glue with a thermal conductivity coefficient of 3.0-4.0. That is, after the chip 1 is soldered to the first pad 21, the second pad 22, and the third pad 23, and the connection wires 3 are completed, the black glue can be used to encapsulate the chip 1. In addition, since the chip 1 of the present application is large in size and has a high power, the heat dissipation requirement of the chip 1 is also increased. By using a black glue with a thermal conductivity coefficient of 3.0-4.0 for packaging, the heat dissipation effect of the product can be effectively improved, and the heat dissipation requirement of the chip 1 can be met.

[0052] For example, a black plastic with a thermal conductivity coefficient of 3.5 can be used to package the chip 1, and the data of the product of the present application is compared with the original product. Table 1 is shown below:

[0053] Table 1

[0054]

[0055] The improvement rate is the ratio of the difference between the structural parameters of the present application and the original structural parameters to the original structural parameters. As can be seen from the data in Table 1, the present application optimizes the structure of the first pad 21, the second pad 22, the third pad 23, and the pin base island 24, increasing the maximum size of the chip 1 to 140 mils. Furthermore, the chip 1 is packaged with black plastic with a thermal conductivity coefficient of 3.5, ultimately increasing the power of this product to twice that of the original product.

[0056] In one embodiment, a third solder pad 23 is provided below the first solder pad 21, a second solder pad 22 is provided on one side of the first solder pad 21 and the third solder pad 23, the side of the first solder pad 21 and the side of the second solder pad 22 are matched with each other, and a pin base island 24 is provided on the other side of the first solder pad 21 and the third solder pad 23; the upper left corner structure, the lower left corner structure and the upper right corner structure of the first solder pad 21 are all right-angle structures 25, and the upper left corner structure of the third solder pad 23 is a right-angle structure 25, that is, the chip base island 26 has a right-angle structure 25 at the corner adjacent to the pin base island 24.

[0057] It should be noted that the upper left corner structure, the lower left corner structure and the upper right corner structure of the first pad 21 are all right-angle structures 25. Figure 2 and Figure 5 As can be seen, the present application replaces the upper left corner, lower left corner, and upper right corner structures of the first solder pad 21 from the original chamfered structure 06 with a right-angle structure 25. This increases the copper content on the first solder pad 21 to dissipate heat from the chip 1, helping to improve the product's heat dissipation and meet its heat dissipation requirements. Furthermore, reconfiguring the chamfered structure 06 of the first solder pad 21 to a right-angle structure 25 facilitates soldering operations on the chip 1 and helps protect the chip 1, preventing the edge of the chip 1 from exceeding the edge of the first solder pad 21 and being easily damaged.

[0058] It should also be noted that, in conjunction with the Figure 2 and Figure 5 As can be seen, the present application replaces the upper left corner structure of the third pad 23 from the original chamfered structure 06 with a right-angle structure 25. This increases the copper content on the third pad 23 for heat dissipation of the chip 1, helping to improve the product's heat dissipation effect and meet the product's heat dissipation requirements. Furthermore, reconfiguring the chamfered structure 06 of the third pad 23 to a right-angle structure 25 facilitates soldering operations on the chip 1 and helps protect the chip 1, preventing the edge of the chip 1 from extending beyond the edge of the third pad 23 and becoming easily damaged.

[0059] In one embodiment, the upper left corner structure of the second pad 22 is a right angle structure 25. Figure 2 and Figure 5 As can be seen, the present application replaces the upper left corner of the second pad 22 from the original chamfered structure 06 with a right-angle structure 25 to increase the copper content on the second pad 22 for heat dissipation from the chip 1. This is because the product's power has been significantly increased, necessitating a simultaneous improvement in the device's heat dissipation to meet the product's heat dissipation requirements. Furthermore, reconfiguring the chamfered structure 06 of the second pad 22 to a right-angle structure 25 facilitates soldering operations on the chip 1 and helps protect the chip 1, preventing damage to the chip 1 from extending beyond the edge of the second pad 22.

[0060] In one embodiment, the upper right corner structure of the pin base island 24 is a right-angle structure 25. Figure 2 and Figure 5 As can be seen, the present application replaces the upper right corner of pin island 24 from the original chamfered structure 06 with a right-angle structure 25. This increases the copper content on pin island 24 for heat dissipation from chip 1, helping to improve the product's heat dissipation and meet its heat dissipation requirements. Furthermore, reconfiguring pin island 24's chamfered structure 06 to a right-angle structure 25 facilitates soldering operations on chip 1 and helps protect chip 1, preventing the edge of chip 1 from extending beyond the edge of pin island 24 and becoming easily damaged.

[0061] In one embodiment, the connection wires 3 and the chip 1 are connected by solder paste 5. The solder paste 5 is similar to a melted solder wire. The solder paste 5 is placed on the pad for placing the chip 1, and then the chip 1 is placed on the solder paste 5. The solder paste 5 is then cooled and solidified to ensure a secure connection between the pad and the chip 1.

[0062] It should be noted that, in the present invention, the first pad 21 , the second pad 22 , and the third pad 23 are mentioned, wherein the first, second, and third are only used to distinguish the positions, and there is no order of precedence.

[0063] In addition, it should be noted that the directions or positional relationships indicated by "up and down", "left and right", etc. in the present invention are based on the directions or positional relationships shown in the accompanying drawings, and are only for the purpose of simplifying the description and facilitating understanding, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, it cannot be understood as a limitation on the present invention.

[0064] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. Any combination of all the embodiments provided by this utility model is within the scope of protection of this utility model and will not be described in detail here.

[0065] The above describes in detail the package of the high-power bridge rectifier provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above examples is intended only to facilitate understanding of the method and core concept of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A package of a high-power bridge rectifier, characterized in that: At least: Chip (1); A packaging frame (2), comprising a chip base island (26) for carrying the chip (1), and a pin base island (24) not carrying the chip (1), wherein the chip base island (26) and the pin base island (24) extend pins (6) for external connection outside the package body; the chip base island (26) has a right-angle structure (25) at a corner adjacent to the pin base island (24); Plastic encapsulation black glue (4) is used to plastic encapsulate the chip (1) in the package body.

2. The package of the high-power bridge rectifier according to claim 1, characterized in that: The chip base island (26) comprises a first pad (21), a second pad (22) and a third pad (23), and the chip (1) is soldered onto the first pad (21), the second pad (22) and the third pad (23).

3. The package of the high-power bridge rectifier according to claim 2, characterized in that: It also includes connecting wires (3) for connecting the chip (1) on the second pad (22) and the first pad (21), connecting the chip (1) on the second pad (22) and the third pad (23), connecting the chip (1) on the first pad (21) and the lead island (24), and connecting the chip (1) on the third pad (23) and the lead island (24), and each of the connecting wires (3) is connected to the lead frame of the packaging frame (2) during the packaging process.

4. The package of the high-power bridge rectifier according to any one of claims 1 to 3, characterized in that: The size of the chip (1) is 130 mils-140 mils.

5. The package of the high-power bridge rectifier according to any one of claims 1 to 3, characterized in that: The width of the pin base island (24) is greater than or equal to the maximum width of the pin (6).

6. The package of the high-power bridge rectifier according to any one of claims 1 to 3, characterized in that: The plastic-sealed black glue (4) is a black glue with a thermal conductivity coefficient of 3.0-4.

0.

7. The package of the high-power bridge rectifier according to claim 2 or 3, characterized in that: The third pad (23) is provided below the first pad (21), the second pad (22) is provided on one side of the first pad (21) and the third pad (23), the side of the first pad (21) and the side of the second pad (22) are arranged in coordination, and the lead base island (24) is provided on the other side of the first pad (21) and the third pad (23); The upper left corner structure, the lower left corner structure and the upper right corner structure of the first pad (21) are all the right-angle structures (25), and the upper left corner structure of the third pad (23) is the right-angle structure (25).

8. The package of the high-power bridge rectifier according to claim 7, characterized in that: The upper left corner structure of the second pad (22) is the right-angle structure (25).

9. The package of the high-power bridge rectifier according to claim 7, characterized in that: The upper right corner structure of the pin base island (24) is the right-angle structure (25).

10. The package of the high-power bridge rectifier according to claim 3, characterized in that: The connecting wire (3) and the chip (1) are connected by welding with solder paste (5).

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