Integrated ceramic laser

Abstract

The utility model provides an integrated ceramic laser, which comprises a high-temperature co-fired shell, the high-temperature co-fired shell comprises a high-temperature co-fired shell bottom plate and a high-temperature co-fired shell side wall, the high-temperature co-fired shell bottom plate is provided with an optical assembly arrangement groove so as to form a heat sink boss on the high-temperature co-fired shell bottom plate, and the heat sink boss is provided with an optical assembly; a plurality of chip substrate packaging semiconductor lasers are arranged on one end face of the heat sink boss, the side wall of the high-temperature co-fired shell is arranged on the bottom plate of the high-temperature co-fired shell, and the optical assembly arranging groove and the chip substrate packaging semiconductor lasers are enclosed in the high-temperature co-fired shell through the side wall of the high-temperature co-fired shell. The problem that a traditional metal shell is insufficient in the aspects of heat dissipation, miniaturization and the like is solved, powerful support is provided for laser products assembled compactly and modularly, and the assembly cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to an integrated ceramic laser. Background Art

[0002] In today's electronic and optical device manufacturing, the pursuit of high performance, miniaturization, and cost-effectiveness has become a core driver of technological innovation. Traditional lasers, particularly those requiring efficient heat dissipation and compact design, commonly utilize metal housings as external packaging materials. Metal housings have demonstrated widespread applicability in previous applications due to their excellent mechanical strength and moderate thermal conductivity. However, with continuous technological advancements and evolving market demands, metal housings are gradually revealing some limitations in practical applications.

[0003] The primary issue is that while metal housings offer a certain level of heat dissipation, their efficiency is becoming increasingly limited in the face of increasing power density and more stringent miniaturization requirements. This is particularly true in applications involving high-heat-generating components like semiconductor lasers, where the metal housing's heat dissipation capacity becomes a key factor limiting further improvements in device performance.

[0004] Secondly, the manufacturing process of metal housings typically involves complex machining steps, which not only significantly increases manufacturing costs but also greatly limits the flexibility and innovation of housing designs. As market demand for miniaturized and lightweight products continues to rise, the size and weight of metal housings have become a significant obstacle to product development.

[0005] Furthermore, with the increasing performance requirements of optical devices and electronic devices, especially in terms of compact design, traditional laser designs are no longer able to meet current market demands. Such designs often involve complex assembly processes of multiple independent components, which not only increases manufacturing cost and difficulty but also may lead to a series of problems such as inefficient thermal management. Utility Model Content

[0006] In order to solve the technical problems that traditional metal shell packaging methods can no longer meet the current electronic equipment and optical device manufacturing fields' pursuit of heat dissipation, miniaturization and cost-effectiveness, the utility model proposes an integrated ceramic laser, which not only solves the problems of the traditional metal shell's shortcomings in heat dissipation and miniaturization, but also provides strong support for compact and modular assembly of laser products, reducing assembly costs.

[0007] In order to achieve the above object, the technical solution of the utility model is as follows:

[0008] The utility model provides an integrated ceramic laser, comprising: a high-temperature co-fired shell, wherein the high-temperature co-fired shell comprises: a high-temperature co-fired shell bottom plate and a high-temperature co-fired shell side wall, wherein an optical component arrangement groove is provided on the high-temperature co-fired shell bottom plate to form a heat sink boss on the high-temperature co-fired shell bottom plate, wherein a plurality of chip substrate packaged semiconductor lasers are provided on one end surface of the heat sink boss, and the high-temperature co-fired shell side wall is provided on the high-temperature co-fired shell bottom plate and encloses the optical component arrangement groove and the chip substrate packaged semiconductor laser within the high-temperature co-fired shell.

[0009] The utility model proposes an integrated ceramic laser, which not only solves the problems of the traditional metal shell in heat dissipation and miniaturization, but also provides strong support for compact and modular assembly of laser products, reducing assembly costs.

[0010] As a preferred technical solution, the high-temperature co-fired shell side wall and the high-temperature co-fired shell bottom plate are an integrally formed structure.

[0011] As a preferred technical solution, the heat sink boss is externally provided on one end surface of the high-temperature co-fired shell and is further provided with a plurality of electrodes, and the electrodes are connected to the bottom plate of the high-temperature co-fired shell.

[0012] As a preferred technical solution, a plurality of collimating lenses are provided in the optical component arrangement groove, and the collimating lenses are connected to the bottom plate of the high-temperature co-fired shell.

[0013] As a preferred technical solution, in the y-axis direction of the high-temperature co-fired shell, the collimating lens is arranged corresponding to the chip substrate packaged semiconductor laser.

[0014] As a preferred technical solution, a plurality of dichroic mirrors are provided in the optical component arrangement groove, and the dichroic mirrors are connected to the bottom plate of the high-temperature co-fired shell.

[0015] As a preferred technical solution, in the y-axis direction of the high-temperature co-fired shell, the dichroic mirror and the collimating lens are arranged correspondingly.

[0016] As a preferred technical solution, the dichroic mirror is arranged to be inclined at an angle of ≥45° in the x-axis direction of the high-temperature co-fired shell.

[0017] The utility model provides an integrated ceramic laser, which has the following beneficial effects:

[0018] 1) It not only solves the problems of traditional metal housings in heat dissipation and miniaturization, but also provides strong support for compact and modular assembly of laser products, reducing assembly costs;

[0019] 2) The high-temperature co-fired housing can effectively conduct away the heat generated inside the laser, preventing performance degradation or device damage caused by heat accumulation. By forming a heat sink boss on the bottom plate of the high-temperature co-fired housing and arranging multiple chip substrates to package the semiconductor laser, the heat dissipation path can be further optimized and the heat dissipation efficiency can be improved.

[0020] Integrating multiple optical components and semiconductor lasers into a compact high-temperature co-fired housing reduces external connections and assembly parts, thereby achieving miniaturization and compactness of the laser. By precisely designing and optimizing the internal structure of the high-temperature co-fired housing, space utilization can be maximized, further improving the power density and performance of the laser. The use of a high-temperature co-fired ceramic housing allows for modular assembly of laser products, simplifying the assembly process, improving assembly efficiency, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front and side view of an integrated ceramic laser provided by the utility model;

[0022] Figure 2 A top view of the integrated ceramic laser provided by the utility model;

[0023] Figure 3 A bottom view of the integrated ceramic laser provided by the utility model;

[0024] Figure 4 An exploded view of the integrated ceramic laser provided by the utility model;

[0025] Among them, 1-high-temperature co-fired shell; 2-high-temperature co-fired shell bottom plate; 3-high-temperature co-fired shell side wall; 4-optical component setting groove; 5-heat sink boss; 6-chip substrate packaging semiconductor laser; 7-electrode; 8-collimating lens; 9-dichroic mirror. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] It should be noted that the terms "first" and "second" and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than that illustrated or described herein.

[0028] like Figure 1-4The utility model provides an integrated ceramic laser, comprising: a high-temperature co-fired shell 1, wherein the high-temperature co-fired shell 1 comprises: a high-temperature co-fired shell bottom plate 2 and a high-temperature co-fired shell side wall 3, wherein the high-temperature co-fired shell bottom plate 2 is provided with an optical component arrangement groove 4 to form a heat sink boss 5 on the high-temperature co-fired shell bottom plate 2, and a plurality of chip substrate packaged semiconductor lasers 6 are provided on one end surface of the heat sink boss 5, and the high-temperature co-fired shell side wall 3 is provided on the high-temperature co-fired shell bottom plate 2 and encloses the optical component arrangement groove 4 and the chip substrate packaged semiconductor laser 6 within the high-temperature co-fired shell 1.

[0029] The utility model proposes an integrated ceramic laser, which not only solves the problems of the traditional metal shell in heat dissipation and miniaturization, but also provides strong support for compact and modular assembly of laser products, reducing assembly costs.

[0030] Preferably, the high-temperature co-fired shell side wall 3 and the high-temperature co-fired shell bottom plate 2 are an integrally formed structure; this structural design can significantly improve the overall stiffness of the high-temperature co-fired shell 1, enabling it to withstand greater mechanical stress and thermal stress, thereby ensuring the stable operation of the chip substrate packaged semiconductor laser 6 under high power density and complex environments; the integrally formed structure allows heat to be more smoothly conducted from the inside of the integrated ceramic laser through the high-temperature co-fired shell bottom plate 2 and the high-temperature co-fired shell side wall 3 to the external environment, thereby improving heat dissipation efficiency.

[0031] Preferably, the heat sink boss 5 is externally provided on one end surface of the high-temperature co-fired shell 1 and is also provided with a plurality of electrodes 7, and the electrodes 7 are connected to the bottom plate 2 of the high-temperature co-fired shell; the electrodes 7 serve as electrical connection points, providing an electrical interface between the integrated ceramic laser and the external circuit or system to ensure that the integrated ceramic laser can operate normally.

[0032] Preferably, a plurality of collimating lenses 8 are provided in the optical component setting groove 4, and the collimating lenses 8 are connected to the high-temperature co-fired shell bottom plate 2; the main function of the collimating lens 8 is to collimate the light beam emitted by the integrated ceramic laser to make it a parallel light beam; by integrating the collimating lens 8 in the optical component setting groove 4, the modular design of the integrated ceramic laser can be realized, which provides convenience for installation; the collimating lens 8 is connected to the high-temperature co-fired shell bottom plate 2. This design not only helps to reduce the overall temperature of the integrated ceramic laser, but also provides structural support and stability for the collimating lens 8.

[0033] Preferably, in the y-axis direction of the high-temperature co-fired shell 1, the collimating lens 8 is arranged corresponding to the chip substrate packaged semiconductor laser 6; the main function of the collimating lens 8 is to collimate the light beam to make it a parallel light beam; this arrangement can ensure that the light beam emitted by the chip substrate packaged semiconductor laser 6 has better beam quality and consistency after passing through the collimating lens 8; the parallel light beam can reduce the divergence and deformation of the light beam during transmission, thereby improving the performance and accuracy of the laser; by arranging the collimating lens 8 corresponding to the chip substrate packaged semiconductor laser 6, the transmission path of the light beam can be optimized; the light beam may be affected by various factors during transmission, such as diffraction, scattering and absorption; the collimating lens 8 can reduce the influence of these factors, so that the light beam can be transmitted to the target area more stably.

[0034] Preferably, a plurality of dichroic mirrors 9 are provided in the optical component setting groove 4, and the dichroic mirrors 9 are connected to the high-temperature co-fired shell bottom plate 2; the integration of the dichroic mirrors 9 in the optical component setting groove 4 also helps to realize the modular and compact design of the laser, and facilitates the installation of the dichroic mirrors 9. The dichroic mirrors 9 are connected to the high-temperature co-fired shell bottom plate 2. This design not only helps to reduce the overall temperature of the integrated ceramic laser, but also ensures that the dichroic mirrors 9 are provided with structural support and stability.

[0035] Preferably, in the y-axis direction of the high-temperature co-fired shell 1, the dichroic mirror 9 is arranged corresponding to the collimating lens 8; the dichroic mirror 9 can selectively reflect or transmit light of different wavelengths, while the collimating lens 8 can collimate the light into a parallel light beam; when the two are arranged correspondingly, it can be ensured that the parallel light beam after passing through the collimating lens 8 can be accurately irradiated onto the dichroic mirror 9, and split or combine the light according to the characteristics of the dichroic mirror 9; this precise splitting and combining effect is crucial to achieving the versatility of the integrated ceramic laser and improving the flexibility of laser output; by arranging the dichroic mirror 9 and the collimating lens 8 correspondingly, the optical path design of the integrated ceramic laser can be further optimized; this layout can reduce the loss and interference of light during transmission, and improve the output efficiency and beam quality of the laser; at the same time, it can also provide more flexibility and freedom for the optical path adjustment of the integrated ceramic laser to adapt to different application scenarios and needs.

[0036] Preferably, the dichroic mirror 9 is tilted at an angle of 45° or greater in the x-axis direction of the high-temperature co-fired shell 1. The main function of the dichroic mirror 9 is to selectively reflect or transmit light according to its wavelength. The tilted dichroic mirror 9 can allow light to have a larger incident angle when incident, thereby more fully utilizing the spectroscopic characteristics of the dichroic mirror 9. This helps to improve the spectroscopic efficiency, so that light of different wavelengths can be separated or combined more accurately.

[0037] The tilted dichroic mirror 9 can make more efficient use of space and optimize the optical path layout; by tilting the dichroic mirror 9, light can be incident and emitted at more appropriate angles, avoiding interference and collision between light rays, and improving the efficiency and stability of the optical path; when light is incident on the dichroic mirror 9 at a certain angle, reflection and transmission will occur; the tilted dichroic mirror 9 can separate the reflected light and the transmitted light at a more appropriate angle, reducing the loss of light during transmission.

[0038] It will be understood that the present invention is described through some embodiments, and it will be appreciated by those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the guidance of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all changes or equivalent substitutions may be made within the scope of the claims of this application. In addition, under the guidance of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope protected by the present invention.

Claims

1. An integrated ceramic laser, characterized in that: include: A high-temperature co-fired housing, comprising: a high-temperature co-fired housing bottom plate and a high-temperature co-fired housing side wall. The high-temperature co-fired housing bottom plate is provided with an optical component placement groove to form a heat sink boss on the high-temperature co-fired housing bottom plate. A plurality of chip substrate packaged semiconductor lasers are provided on one end surface of the heat sink boss. The high-temperature co-fired housing side wall is provided on the high-temperature co-fired housing bottom plate and encloses the optical component placement groove and the chip substrate packaged semiconductor laser within the high-temperature co-fired housing.

2. The integrated ceramic laser according to claim 1, characterized in that: The high-temperature co-fired shell side wall and the high-temperature co-fired shell bottom plate are an integrally formed structure.

3. The integrated ceramic laser according to claim 1, characterized in that: The heat sink boss is externally arranged on one end surface of the high-temperature co-fired shell and is also provided with a plurality of electrodes, and the electrodes are connected to the bottom plate of the high-temperature co-fired shell.

4. The integrated ceramic laser according to claim 1, characterized in that: A plurality of collimating lenses are arranged in the optical component arrangement groove, and the collimating lenses are connected to the bottom plate of the high-temperature co-fired shell.

5. The integrated ceramic laser according to claim 4, characterized in that: In the y-axis direction of the high-temperature co-fired shell, the collimating lens is arranged corresponding to the chip substrate packaged semiconductor laser.

6. The integrated ceramic laser according to claim 5, characterized in that: A plurality of dichroic mirrors are arranged in the optical component arrangement groove, and the dichroic mirrors are connected to the bottom plate of the high temperature co-fired shell.

7. The integrated ceramic laser according to claim 6, characterized in that: In the y-axis direction of the high-temperature co-fired shell, the dichroic mirror and the collimating lens are arranged correspondingly.

8. The integrated ceramic laser according to claim 7, characterized in that: The dichroic mirror is arranged to be tilted at an angle of ≥45° in the x-axis direction of the high-temperature co-fired shell.

Images