Circuit board assembly and frequency converter

Abstract

The utility model discloses a circuit board assembly and a frequency converter, and relates to the frequency converter technology field, the circuit board assembly comprises a circuit board, an inversion module and a conduction module, the circuit board comprises a substrate, an input conductive layer and an output conductive layer, the input conductive layer and the output conductive layer are arranged on the substrate, and the conduction module is used for being connected with a rectifier bridge. The inverter module comprises three inverter units arranged at intervals and three connecting copper bars arranged in one-to-one correspondence with the three inverter units, each connecting copper bar penetrates through the circuit board and is connected with the output end of the corresponding inverter unit, the positive electrode of each inverter unit is connected to the input conductive layer, and the negative electrode of each inverter unit is connected to the output conductive layer; the conduction module comprises an input copper bar and an output copper bar, the input copper bar is connected to the input conductive layer, and the output copper bar is connected to the output conductive layer. According to the technical scheme provided by the utility model, the technical problems of many structural parts and complex installation existing in the prior art in which a laminated busbar is adopted for conduction can be solved.

Description

Technical Field

[0001] The utility model relates to the field of frequency converters, in particular to a circuit board assembly and a frequency converter. Background Art

[0002] In modern industrial production, frequency converters (VFDs), as an important electrical control device, are widely used in various applications, enabling precise control of motor parameters such as speed and torque. As a key component of VFDs, the quality and performance of laminated busbars directly impact the operational performance and safety of the entire VFD system. Existing laminated busbars are typically constructed by stacking multiple busbars, resulting in numerous structural components and complex installation.

[0003] Therefore, it is necessary to provide a new circuit board assembly and inverter to solve the above technical problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board assembly and a frequency converter, aiming to solve the technical problems of the prior art of using laminated busbars for conduction, which have many structural components and are complex to install.

[0005] To achieve the above objectives, the present invention provides a circuit board assembly, comprising:

[0006] A circuit board, comprising a substrate, an input conductive layer and an output conductive layer provided on the substrate;

[0007] An inverter module, the inverter module comprising a plurality of inverter units arranged at intervals and a plurality of connecting copper bars arranged in a one-to-one correspondence with the plurality of inverter units, each connecting copper bar passing through the circuit board and connected to the output end of the corresponding inverter unit, the positive electrode of each inverter unit being connected to the input conductive layer, and the negative electrode of each inverter unit being connected to the output conductive layer;

[0008] The conduction module is used to connect to the rectifier bridge. The conduction module includes an input copper bar and an output copper bar. The input copper bar is connected to the input conductive layer, and the output copper bar is connected to the output conductive layer.

[0009] In one embodiment, the input conductive layer includes a first conductive sheet, a second conductive sheet, and a third conductive sheet, both of which are electrically connected to the first conductive sheet. The first conductive sheet is provided on one end surface of the substrate, and the second conductive sheet and the third conductive sheet are spaced apart and provided on the other end surface of the substrate. The output conductive layer includes a fourth conductive sheet and a fifth conductive sheet, and the fourth conductive sheet and the fifth conductive sheet are spaced apart and provided between the second conductive sheet and the third conductive sheet.

[0010] The inverter unit is connected to the third conductive plate and the fifth conductive plate, the input copper busbar is connected to the first conductive plate, and the output copper busbar is connected to the fifth conductive plate.

[0011] In one embodiment, the circuit board assembly further includes a capacitor module, and both the second conductive plate and the fourth conductive plate, as well as both the fourth conductive plate and the fifth conductive plate are connected via the capacitor module.

[0012] In one embodiment, a voltage grading resistor is connected between the second conductive plate and the fourth conductive plate, and between the fourth conductive plate and the fifth conductive plate.

[0013] In one embodiment, each of the capacitor modules is provided with two connecting terminals, each of the voltage grading resistors is provided with two wiring terminals, the connecting terminals are connected one-to-one with the wiring terminals, and a movable portion is formed on the substrate at a position corresponding to each of the wiring terminals.

[0014] In one embodiment, the circuit board assembly further includes a mounting seat and a bracket disposed on the mounting seat, the bracket forming a receiving space, the capacitor module being received in the receiving space, and the connecting terminal passing through the bracket and connected to the connecting terminal.

[0015] In one embodiment, an absorption capacitor is provided at a position of the substrate corresponding to each of the inversion units, and the absorption capacitor is connected to the third conductive plate and the fifth conductive plate.

[0016] In one embodiment, the circuit board assembly further includes a relay and a charging terminal, wherein the relay is electrically signal-connected to the output conductive layer, and the charging terminal is electrically signal-connected to the input conductive layer.

[0017] In one embodiment, bus bars are welded to both the input conductive layer and the output conductive layer.

[0018] In addition, the present invention also provides a frequency converter, comprising the circuit board assembly described above.

[0019] The present invention's technical solution achieves electrical signal connection between the inverter module and the rectifier bridge by laying input and output conductive layers on the substrate, replacing existing laminated busbars. This simplifies the structure and reduces manufacturing complexity and cost. In this embodiment, the conduction module connects to the external rectifier bridge via both input and output copper busbars, transmitting DC power rectified by the rectifier bridge to the circuit board assembly. The inverter unit converts DC power into AC power and transmits the converted AC power to an external three-phase motor via the connecting copper busbars. The input and output conductive layers, arranged on the substrate, are used to achieve electrical signal connection between the rectifier bridge and the inverter module. Laying the input and output conductive layers on the substrate, instead of existing laminated busbars, simplifies the structure, reduces manufacturing complexity of the circuit board assembly, and reduces the use of copper busbars, thereby lowering manufacturing cost. Furthermore, the input and output conductive layers laid on the substrate increase the overlap area and reduce the parallel spacing between the laminated busbars compared to existing laminated busbars, thereby reducing stray inductance. The circuit board assembly is used in the technical field of frequency converters. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0021] Figure 1 This is a schematic structural diagram of a circuit board assembly in an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Exploded diagram;

[0023] Figure 3 A schematic structural diagram of a circuit board in an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the connection between the circuit board, relay and charging terminal in the embodiment provided by the utility model;

[0025] Figure 5 for Figure 4 Schematic diagram from another perspective.

[0026] Description of Figure Numbers:

[0027] 1. Circuit board; 11. Substrate; 12. Input conductive layer; 121. First conductive sheet; 122. Second conductive sheet; 123. Third conductive sheet; 13. Output conductive layer; 131. Fourth conductive sheet; 132. Fifth conductive sheet; 14. Equalizing resistor; 141. Terminal block; 15. U-shaped groove; 151. Movable part; 16. Absorption capacitor; 2. Inverter module; 21. Inverter unit; 22. Connecting copper busbar; 3. Conductive module; 31. Input copper busbar; 32. Output copper busbar; 4. Capacitor module; 41. Connecting terminal; 42. Clamp; 5. Mounting base; 51. Bracket; 6. Relay; 7. Charging terminal.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that meet both A and B.

[0032] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0033] As a key component of the inverter, the laminated busbar serves as a conductive element for the rectifier bridge, inverter module, and capacitors. In existing inverters, the laminated busbar primarily consists of a positive busbar, a negative busbar, a neutral busbar, and insulating paper. This complex structure complicates installation, which in turn increases the difficulty and cost of inverter manufacturing. Furthermore, the small overlap area of ​​the laminated busbar leads to high stray inductance.

[0034] The utility model provides a circuit board assembly and a frequency converter, aiming to solve the technical problems of the prior art in which laminated busbar conduction is used, such as having many structural components and complicated installation.

[0035] See also Figures 1 to 3 In one embodiment of the utility model, the circuit board assembly includes a circuit board 1, an inverter module 2 and a conduction module 3. The circuit board 1 includes a substrate 11, an input conductive layer 12 and an output conductive layer 13 arranged on the substrate 11. The conduction module 3 is used to connect to the rectifier bridge. The inverter module 2 includes three inverter units 21 arranged at intervals and three connecting copper bars 22 arranged in a one-to-one correspondence with the three inverter units 21. Each connecting copper bar 22 passes through the circuit board 1 and is connected to the output end of the corresponding inverter unit 21. The positive pole of each inverter unit 21 is connected to the input conductive layer 12, and the negative pole of each inverter unit 21 is connected to the output conductive layer 13. The conduction module 3 includes an input copper bar 31 and an output copper bar 32. The input copper bar 31 is connected to the input conductive layer 12, and the output copper bar 32 is connected to the output conductive layer 13.

[0036] The present invention's technical solution achieves electrical signal connection between the inverter module 2 and the rectifier bridge by laying an input conductive layer 12 and an output conductive layer 13 on the substrate 11, replacing the existing laminated busbars. This simplifies the structure and reduces manufacturing difficulty and cost. In this embodiment, the conduction module 3 connects to the external rectifier bridge via both the input copper busbar 31 and the output copper busbar 32, transmitting the rectified DC power to the circuit board assembly. The inverter unit 21 is used to convert the DC power into AC power and transmit the converted AC power to the external three-phase motor via the connecting copper busbar 22. The input conductive layer 12 and the output conductive layer 13 provided on the substrate 11 are used to achieve electrical signal connection between the rectifier bridge and the inverter module 2. By laying the input conductive layer 12 and the output conductive layer 13 on the substrate 11, replacing the existing laminated busbars, the electrical signal connection between the rectifier bridge and the inverter module 2 is simplified, reducing the manufacturing difficulty of the circuit board assembly, and reducing the use of copper busbars, thereby lowering manufacturing cost. At the same time, compared with existing laminated busbars, the input conductive layer 12 and the output conductive layer 13 laid on the substrate 11 can increase the overlapping area and reduce the parallel spacing of the laminated busbars, thereby reducing stray inductance. The circuit board assembly is applied in the field of inverter technology.

[0037] Specifically, each inverter unit 21 transmits the inverted AC power to the V phase, U phase, and W phase of the external three-phase motor through the corresponding connecting copper busbar 22; the input copper busbar 31 is connected to the positive pole of the external rectifier bridge, and the output copper busbar 32 is connected to the negative pole of the external rectifier bridge. Specifically, the positive pole of each inverter unit 21 is connected to the positive pole of the external rectifier bridge through the input conductive layer 12 and the input copper busbar 31, and the negative pole of each inverter unit 21 is connected to the negative pole of the external rectifier bridge through the output conductive layer 13 and the output copper busbar 32, which enables each inverter unit 21 to be connected to the external rectifier bridge to form a closed loop. In a specific embodiment, the inverter unit 21 can be an insulated gate bipolar transistor (IGBT), which is a composite fully controlled voltage-driven power semiconductor device composed of a bipolar junction transistor (BJT) and an insulated gate field effect transistor (MOS). In this embodiment, an external copper busbar is further provided on the substrate 11, which is connected to the input conductive layer 12. The external copper busbar and the output copper busbar 32 serve as connection ports connected to the positive and negative electrodes of an external device to provide direct current to the external device.

[0038] It should be noted that the substrate 11 is made of an insulating material and does not have conductive properties. The input conductive layer 12 and the output conductive layer 13 are made of a conductive material (for example, copper) and have conductive properties. The overlapping area refers to the size of the overlapping area of ​​two adjacent busbars above and below the laminated busbar; the parallel spacing refers to the distance between the center lines of adjacent busbars when multiple busbars are installed in parallel; and the stray inductance refers to the equivalent inductance presented by conductors in the circuit, such as connecting wires, component leads, and component bodies. It is caused by factors such as the physical layout and connection method of the conductors. Therefore, by providing the input conductive layer 12 and the output conductive layer 13 on the substrate 11, instead of the existing laminated busbar, the overlapping area can be increased and the parallel spacing can be reduced, thereby reducing the stray inductance.

[0039] See also Figure 3In one embodiment of the present invention, the input conductive layer 12 includes a first conductive plate 121, a second conductive plate 122, and a third conductive plate 123, both of which are electrically connected to the first conductive plate 121. The first conductive plate 121 is disposed on one end surface of the substrate 11, and the second conductive plate 122 and the third conductive plate 123 are spaced apart on the other end surface of the substrate 11. The output conductive layer 13 includes a fourth conductive plate 131 and a fifth conductive plate 132, which are spaced apart between the second conductive plate 122 and the third conductive plate 123. The inverter unit 21 is connected to the third conductive plate 123 and the fifth conductive plate 132. The input copper busbar 31 is connected to the first conductive plate 121, and the output copper busbar 32 is connected to the fifth conductive plate 132. In this embodiment, the second conductive plate 122 and the third conductive plate 123 are both electrically connected to the first conductive plate 121, that is, the potential of the second conductive plate 122 and the third conductive plate 123 is equal to the potential of the first conductive plate 121. The inverter unit 21 is connected to the third conductive sheet 123 and the fifth conductive sheet 132, the input copper bar 31 is connected to the first conductive sheet 121, and the output copper bar 31 is connected to the fifth conductive sheet 132. The conduction module 3 is connected to the external rectifier bridge through both the input copper bar 31 and the output copper bar 32. That is, the positive pole of the inverter unit 21 is connected to the external rectifier bridge through the third conductive sheet 123, the first conductive sheet 121 and the conduction module 3, and the negative pole of the inverter unit 21 is connected to the external rectifier bridge through the fifth conductive sheet 132 and the conduction module 3. This enables the inverter module 2 to be connected to the external rectifier bridge to form a closed loop. In a specific embodiment, the second conductive sheet 122, the fourth conductive sheet 131, the fifth conductive sheet 132 and the third conductive sheet 123 are arranged in sequence along the first direction of the substrate 11. The first direction refers to Figure 3 The direction indicated by X.

[0040] See also Figure 1 and Figure 2In one embodiment of the present invention, the circuit board assembly further includes a capacitor module 4, and both the second conductive sheet 122 and the fourth conductive sheet 131, as well as the fourth conductive sheet 131 and the fifth conductive sheet 132, are connected via the capacitor module 4. In this embodiment, the capacitor module 4 is connected to an external rectifier bridge via the second conductive sheet 122, the fourth conductive sheet 131, and the fifth conductive sheet 132, which enables the capacitor module 4 to connect to the external rectifier bridge to form another closed loop. In this case, the capacitor module 4 is connected in parallel with the inverter module 2. The capacitor module 4 can smooth the DC power rectified by the rectifier bridge, reduce the AC component, and provide a relatively pure DC voltage for the inverter module 2. The rectifier bridge and the inverter module 2 are both connected in parallel with the capacitor module 4. The capacitor module 4 is used to store energy and filter out ripple in the voltage to ensure the stability of the current output. In a specific embodiment, the first conductive sheet 121, the second conductive sheet 122, the third conductive sheet 123, the fourth conductive sheet 131, and the fifth conductive sheet 132 can be formed by laying copper foil on the substrate 11.

[0041] In one embodiment of the present invention, busbars are welded to both the input conductive layer 12 and the output conductive layer 13. A busbar is a large conductor used to transmit electrical energy, primarily designed to carry high currents. In this embodiment, by welding busbars to the input conductive layer 12 and the output conductive layer 13, the current carrying capacity of the input conductive layer 12 and the output conductive layer 13 can be increased to meet the current carrying capacity and temperature rise requirements of the inverter. Specifically, busbars are welded to the first conductive sheet 121, the second conductive sheet 122, the third conductive sheet 123, the fourth conductive sheet 131, and the fifth conductive sheet 132. In one specific embodiment, the busbars can be metal sheets. Alternatively, the current carrying capacity of the input conductive layer 12 and the output conductive layer 13 can be increased by methods such as wave soldering to meet the current carrying capacity and temperature rise requirements of the inverter. Furthermore, to better protect the conductive layers, insulating material can be applied to the ends of the conductive layers facing away from the substrate 11.

[0042] In this embodiment, the positive electrode of the capacitor module 4 connecting the second conductive plate 122 and the fourth conductive plate 131 is connected to the external rectifier bridge via the second conductive plate 122, the first conductive plate 121, and the conduction module 3. The negative electrode of the capacitor module 4 connecting the second conductive plate 122 and the fourth conductive plate 131 is connected to the external rectifier bridge via the fourth conductive plate 131, the capacitor module 4 connecting the fourth conductive plate 131 and the fifth conductive plate 132, and the conduction module 3. This enables the capacitor module 4 connecting the second conductive plate 122 and the fourth conductive plate 131 to be connected to the external rectifier bridge. Similarly, the capacitor module 4 connecting the fourth conductive plate 131 and the fifth conductive plate 132 is connected to the external rectifier bridge, which enables the capacitor module 4 to be connected to the external rectifier bridge to form another closed loop. At this time, the capacitor module 4 is connected in parallel with the inverter unit 21 via the second conductive plate 122, the fourth conductive plate 131, and the fifth conductive plate 132. Furthermore, when designing the circuit board assembly, capacitor modules 4 may be added as needed to connect the second conductive sheet 122 and the fifth conductive sheet 132, as well as to connect the fourth conductive sheet 131 and the fifth conductive sheet 132. In a specific embodiment, two capacitor modules are connected between each of the second conductive sheet 122 and the fifth conductive sheet 132, and between each of the fourth conductive sheet 131 and the fifth conductive sheet 132, i.e., the circuit board assembly includes four capacitor modules 4.

[0043] See also Figure 4 In one embodiment of the present invention, a voltage-equalizing resistor 14 is connected between both the second conductive sheet 122 and the fourth conductive sheet 131, as well as between the fourth conductive sheet and the fifth conductive sheet 132. The voltage-equalizing resistor 14 is a resistor used to balance the voltage in the circuit, mainly used to ensure the uniformity of the voltage distribution. In this embodiment, by connecting the voltage-equalizing resistor 14 between both the second conductive sheet 122 and the fourth conductive sheet 131, as well as between the fourth conductive sheet 131 and the fifth conductive sheet 132, that is, providing the voltage-equalizing resistor 14 in parallel with each capacitor module 4, it is possible to make the voltage across the capacitor module 4 substantially equal, thereby preventing voltage imbalance caused by inconsistent capacity of the capacitor module 4, thereby protecting the capacitor module 4 from damage due to excessive voltage. At the same time, the voltage-equalizing resistor 14 can suppress the inrush current to protect components such as the diodes of the rectifier bridge, and can also reduce electromagnetic interference and improve the stability and safety of the entire inverter system.

[0044] See also Figure 2 、 Figure 4 and Figure 5In one embodiment of the present invention, the capacitor modules 4 are each provided with two connecting terminals 41, and each equalizing resistor 14 is each provided with two wiring terminals 141. The connecting terminals 41 are connected to the wiring terminals 141, and a movable portion 151 is formed at a position of the substrate 11 corresponding to each wiring terminal 141. In this embodiment, the connection between the capacitor module 4 and the equalizing resistor 14 is achieved through the connection between the connecting terminal 41 and the wiring terminal 141. The movable portion 151 is a plate-like structure, which can swing up and down within a small range relative to the entire substrate 11. By forming the movable portion 151 at a position of the substrate 11 corresponding to each wiring terminal 141, the tolerance during the installation of the capacitor module 4 can be balanced, thereby avoiding the substrate 11 from warping or even damage. Specifically, when installing the capacitor module 4, it is first necessary to install the capacitor module 4 on the mounting base 5, and then connect the connection terminal 41 of the capacitor module 4 with the connection terminal 141 of the voltage-equalizing resistor 14. Since there are certain tolerances when the capacitor module 4 is manufactured or installed, after the capacitor module 4 is installed on the mounting base 5, its connection terminal 41 may be too high and lift the substrate 11. The formation of a movable portion 151 at the position of the substrate 11 corresponding to each connection terminal 141 can balance the tolerance generated when the capacitor module 4 is installed to avoid the substrate 11 from being lifted or damaged. In a specific embodiment, the movable portion 151 is realized by opening a U-shaped groove 15 on the substrate 11. Specifically, a U-shaped groove 15 is opened at the position of the substrate 11 corresponding to each connection terminal 141. The portion of the substrate 11 surrounded by the U-shaped groove 15 is the movable portion 151 mentioned above. In addition, the movable portion 151 can also be realized by opening a V-shaped groove, an arc groove, etc. on the substrate 11.

[0045] It should be noted that the voltage-equalizing resistor 14 and the capacitor module 4 are respectively arranged on the two end surfaces of the substrate 11, wherein the capacitor module 4 is arranged on the side of the substrate 11 facing the first conductive sheet 121. When designing the first conductive sheet 121, the position of the first conductive sheet 121 corresponding to the terminal 141 of the voltage-equalizing resistor 14 needs to be hollowed out to ensure that the pins of the voltage-equalizing resistor 14 can pass through the substrate 11 and be connected to the fourth conductive sheet 131 or the fifth conductive sheet 132 on the other end surface, instead of being connected to the first conductive sheet 121.

[0046] See also Figure 2In one embodiment of the utility model, the circuit board assembly further includes a mounting seat 5 and a bracket 51 arranged on the mounting seat 5, the bracket 51 forms an accommodating space, the capacitor module 4 is accommodated in the accommodating space, and the connecting terminal 41 passes through the bracket 51 and is connected to the connecting terminal 141. Specifically, the capacitor module 4 is accommodated in the accommodating space of the bracket 51, which can ensure the accuracy of the installation position of the capacitor module 4. In a specific embodiment, a clamp 42 is provided on the capacitor module 4, and a mounting hole is opened on the mounting seat 5, and the capacitor module 4 is installed in the mounting hole through the clamp 42. The bracket 51 includes a top plate and three supporting feet evenly spaced around the circumference of the top plate, the three supporting feet abut against the mounting seat 5, and the top plate abuts against the substrate 11. Furthermore, in order to avoid electrical signal connection between the capacitor module 4 and the substrate 11, an insulating column abutting against the substrate 11 can be provided on the top plate.

[0047] See also Figure 1 and Figure 4 In one embodiment of the present invention, an absorption capacitor 16 is provided at a position corresponding to each inverter unit 21 of the substrate 11, and the absorption capacitor 16 is connected to the third conductive plate 123 and the fifth conductive plate 132. Specifically, the absorption capacitor 16 is a special type of capacitor, which is mainly used in power electronic equipment to suppress voltage spikes and absorb excess energy, thereby protecting sensitive components in the circuit. In this embodiment, the absorption capacitor 16 and the inverter unit 21 are both used to connect the third conductive plate 123 and the fifth conductive plate 132, that is, the absorption capacitor 16 is connected in parallel with the inverter unit 21, wherein the absorption capacitor 16 plays the role of absorbing spike voltage. Connecting the absorption capacitor 16 in parallel with the inverter unit 21 can eliminate the spike voltage caused by the stray inductance of the conductive plate to avoid damage to the inverter unit 21.

[0048] See also Figure 4 In one embodiment of the present invention, the circuit board assembly further includes a relay 6 and a charging terminal 7. The relay 6 is electrically connected to the output conductive layer 13, and the charging terminal 7 is electrically connected to the input conductive layer 12. In this embodiment, the relay 6 is connected to the fifth conductive sheet 132, and the charging terminal 7 is connected to the first conductive sheet 121. The relay 6 is used to control the on and off of the circuit. The relay 6 is connected to an external controller via a control line so that the external controller can transmit signals to the relay 6 and perform regulation. The charging terminal 7 and the relay 6 are connected in parallel to a closed loop through the output conductive layer 13 and the input conductive layer 12. Before the circuit board assembly is turned on, the pre-charging resistor can be connected to the charging terminal 7 to charge the capacitor module 4, thereby preventing damage to the capacitor module 4.

[0049] The present utility model also proposes a frequency converter, which includes the above-mentioned circuit board assembly. The specific structure of the circuit board assembly refers to the above-mentioned embodiment. Since the frequency converter adopts all the technical solutions of the above-mentioned embodiment, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiment, which will not be described one by one here.

[0050] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board, comprising a substrate, an input conductive layer and an output conductive layer provided on the substrate; An inverter module, the inverter module comprising a plurality of inverter units arranged at intervals and a plurality of connecting copper bars arranged in a one-to-one correspondence with the plurality of inverter units, each connecting copper bar passing through the circuit board and connected to the output end of the corresponding inverter unit, the positive electrode of each inverter unit being connected to the input conductive layer, and the negative electrode of each inverter unit being connected to the output conductive layer; The conduction module is used to connect to the rectifier bridge. The conduction module includes an input copper bar and an output copper bar. The input copper bar is connected to the input conductive layer, and the output copper bar is connected to the output conductive layer.

2. The circuit board assembly according to claim 1, wherein: The input conductive layer includes a first conductive sheet, a second conductive sheet and a third conductive sheet both electrically connected to the first conductive sheet, wherein the first conductive sheet is disposed on one end surface of the substrate, and the second conductive sheet and the third conductive sheet are spaced apart and disposed on the other end surface of the substrate; the output conductive layer includes a fourth conductive sheet and a fifth conductive sheet, wherein the fourth conductive sheet and the fifth conductive sheet are spaced apart and disposed between the second conductive sheet and the third conductive sheet; The inverter unit is connected to the third conductive plate and the fifth conductive plate, the input copper busbar is connected to the first conductive plate, and the output copper busbar is connected to the fifth conductive plate.

3. The circuit board assembly according to claim 2, wherein: The circuit board assembly further includes a capacitor module, through which both the second conductive plate and the fourth conductive plate, and both the fourth conductive plate and the fifth conductive plate are connected.

4. The circuit board assembly according to claim 3, wherein: A voltage grading resistor is connected between the second conductive plate and the fourth conductive plate, and between the fourth conductive plate and the fifth conductive plate.

5. The circuit board assembly according to claim 4, wherein: Each of the capacitor modules is provided with two connecting terminals, each of the voltage grading resistors is provided with two wiring terminals, the connecting terminals are connected to the wiring terminals in a one-to-one correspondence, and a movable portion is formed at a position of the substrate corresponding to each of the wiring terminals.

6. The circuit board assembly according to claim 5, wherein: The circuit board assembly further includes a mounting seat and a bracket disposed on the mounting seat, wherein the bracket is formed with an accommodating space, the capacitor module is accommodated in the accommodating space, and the connecting terminal passes through the bracket and is connected to the connecting terminal.

7. The circuit board assembly according to claim 2, wherein: An absorption capacitor is provided at a position of the substrate corresponding to each of the inversion units, and the absorption capacitor is connected to the third conductive sheet and the fifth conductive sheet.

8. The circuit board assembly according to any one of claims 1 to 7, wherein: The circuit board assembly further includes a relay and a charging terminal, wherein the relay is connected to the output conductive layer for electrical signals, and the charging terminal is connected to the input conductive layer for electrical signals.

9. The circuit board assembly according to any one of claims 1 to 7, wherein: The input conductive layer and the output conductive layer are both welded with bus bars.

10. A frequency converter, characterized in that: A circuit board assembly comprising the circuit board assembly according to any one of claims 1 to 9.

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