Heat insulation device for PCB (Printed Circuit Board) bonding device

Abstract

The utility model provides a heat insulation device for a PCB (printed circuit board) bonding device, which is arranged between a platform and a mechanism, a heat insulation part comprises a heat insulation plate and a plurality of heat insulation blocks, the heat insulation plate is connected with the mechanism, and the heat insulation blocks are positioned between the heat insulation plate and the platform; and a gas channel is arranged on the heat insulation plate. The heat insulation block of the heat insulation part is used for heat insulation, and flowing air is introduced into the gas channel, so that heat insulation and heat dissipation of the heat insulation plate are realized, and the mechanism is protected from being influenced by the temperature of the platform heating body.

Description

Technical Field

[0001] The present application relates to the technical field of PCB pressure bonding, and in particular to a heat insulation device for a PCB pressure bonding device. Background Art

[0002] This lamination process involves laminating the PCB and glass panel together using a press at a specific temperature and pressure. The glass panel is coated with an ACF film on one side of the lamination surface. During the lamination process, the ACF film explodes and solidifies under the preset pressure and temperature, thus creating a conductive circuit.

[0003] At present, the demand for extra-large glass panels is constantly increasing. When pressing larger glass panels, the length of the PCB is long and the temperature required for pressing becomes higher. The platform has to withstand higher temperatures, so the temperature of the platform is easily transmitted to the components below, resulting in a short service life of the components and easy damage. Summary of the Invention

[0004] The utility model provides a heat insulation device for a PCB pressing device, so as to solve the problem that the heat generated by the platform of the pressing device during the production process is transferred to the mechanism to which it is connected, causing high-temperature damage to the electrical components inside the mechanism or shortening the service life.

[0005] In order to solve the above problems, the technical solution adopted by the present invention is:

[0006] The utility model provides a heat insulation device for a PCB pressing device, which is arranged between a platform and a mechanism. The heat insulation part includes a heat insulation board and a plurality of heat insulation blocks. The heat insulation board is connected to the mechanism, and the heat insulation blocks are located between the heat insulation board and the platform. A gas channel is provided on the heat insulation board.

[0007] Furthermore, the heat insulation block is centrally symmetrically arranged between the heat insulation board and the platform.

[0008] Preferably, the heat insulation block is centrally symmetrically arranged between the heat insulation board and the platform.

[0009] Furthermore, the gas channel includes a flow channel opened horizontally and / or longitudinally on the heat insulation board.

[0010] Furthermore, the thermal insulation block is made of ceramic material.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] The utility model provides a heat insulation device for a PCB pressing device, wherein a heat insulation part is arranged under a platform, and the platform and a mechanism are insulated by the heat insulation blocks of the heat insulation part; in addition, a gas channel is provided on the heat insulation board, and flowing air is introduced into the gas channel, so that the heat transferred from the platform to the heat insulation board through the heat insulation blocks or the air is conducted to the flowing air, thereby heating the air. The heated air is sent out from the outlet of the gas channel, thereby quickly taking away the heat from the heat insulation board, dissipating the heat, and protecting the mechanism from the influence of the temperature of the platform heating body. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions proposed in the present invention, they are described in detail below in conjunction with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, these drawings can be changed under the concept of the present invention.

[0014] Figure 1 This is a schematic diagram of the assembly structure of the platform, heat insulation part and rotating mechanism of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the heat insulation part of the utility model;

[0016] 1. Rotating mechanism; 10. First mounting plate; 11. Heat insulation unit; 111. Heat insulation plate; 1111. Air inlet; 1112. Exhaust port; 112. Heat insulation block; 12. Rotating drive unit; 2. Platform; 20. Platform support plate. DETAILED DESCRIPTION

[0017] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0019] Please also refer to Figure 1In this embodiment, a thermal insulation device for a PCB pressing device includes a platform 2 for supporting the PCB. The platform 2 includes a platform support plate 20 and a heater embedded with multiple heating elements, such as heating tubes and thermocouples. The heater is provided with a pressing table for pressing, which includes a pressing surface, which is heated by the heater to a temperature of at least 100 degrees Celsius. A rotating mechanism 1 is provided below the platform support plate 20 to drive the platform 2 in rotation. The rotating mechanism 1 includes a first mounting plate 10, a rotation drive unit 12 disposed in the middle of the first mounting plate 10, and a thermal insulation unit 11 disposed above the rotation drive unit 12.

[0020] Please also refer to Figure 2 Specifically, in this embodiment, the heat insulation part 11 includes a heat insulation board 111 and a plurality of heat insulation blocks 112. The heat insulation blocks 112 are arranged on the four sides of the heat insulation board 111. The heat insulation blocks 112 are fixedly connected to the platform 2. The heat insulation blocks 112 are made of ceramic material, which has excellent heat insulation effect and can reduce the heat conduction of the platform support plate 20 to the heat insulation board 112; the heat insulation board 111 is provided with an air inlet 1111 and an exhaust port 1112 for discharging hot air and a gas channel, so that an air flow state is formed inside the heat insulation board 111 through the gas channel, and the heat of the heat insulation board 111 is taken away by the air flow, thereby realizing heat dissipation and cooling of the heat insulation board 111, thereby preventing the temperature of the platform 2 from being conducted to the rotating mechanism 1, affecting the service life of the rotating mechanism 1.

[0021] It can be considered to form gas flow channels by drilling horizontally or vertically on the insulation board 111; for example, multiple horizontal flow channels are formed by drilling horizontal holes side by side, and then the horizontal flow channels are connected by drilling vertically, and the flow channel ends of several horizontal holes are adaptively closed, so that the air inlet 1111 and the exhaust port 1112 can be formed through the longitudinal flow channel, and then the pressure gas source is connected to the air inlet 1111 through a pipeline, and the air flow will be blown out through the exhaust port 1112 of the gas channel, thereby taking away the heat of the insulation board 111 and achieving rapid heat dissipation and cooling.

[0022] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0023] The above description is a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A heat insulation device for a PCB pressing device, which is arranged between a platform and a mechanism, characterized in that: The heat insulation part includes a heat insulation board and a plurality of heat insulation blocks. The heat insulation board is connected to the mechanism. The heat insulation blocks are located between the heat insulation board and the platform. A gas channel is provided on the heat insulation board.

2. The heat insulation device for a PCB pressure device according to claim 1, characterized in that: The heat insulation block is centrally symmetrically arranged between the heat insulation board and the platform.

3. The heat insulation device for a PCB pressure device according to claim 2, characterized in that: There are four heat insulation blocks, which are adjacent to the four sides of the heat insulation board.

4. The heat insulation device for a PCB pressure device according to claim 1, characterized in that: The gas channel includes a flow channel opened transversely and / or longitudinally on the heat insulation board.

5. The heat insulation device for a PCB pressure device according to any one of claims 1 to 4, characterized in that: The heat insulation block is made of ceramic material.

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